JPS62180957U

JPS62180957U -

Info

Publication number: JPS62180957U
Application number: JP6901886U
Authority: JP
Priority date: 1986-05-06
Filing date: 1986-05-06
Publication date: 1987-11-17

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図ａ，ｂはこの考案の一実施例を示す樹脂
封止絶縁形半導体装置の平面図および側面図、第
２図は支持リード部の切断の一例を説明するため
の拡大断面図、第３図は支持リード部の切断前の
フレーム部分の平面図、第４図は支持リード部の
切断後に絶縁樹脂を塗布した部分拡大断面図、第
５図ａ，ｂは従来の樹脂封止絶縁形半導体装置の
平面図および側面図、第６図は従来の支持リード
部の切断前のフレーム部分の平面図、第７図は従
来の樹脂封止絶縁形半導体装置を放熱板へ取り付
けた状態を示す側面図、第８図は従来の支持リー
ド部の切断後に絶縁樹脂を塗布した拡大図、第９
図は従来の欠点を説明するための拡大図である。図において、１はモールド樹脂、２は半導体チ
ツプ、３は放熱フイン、４ａ〜４ｃは電極リード
端子、５は支持リード部、５ａは支持リード部の
切断部、７は絶縁樹脂である。なお、各図中の同
一符号は同一または相当部分を示す。 1A and 1B are a plan view and a side view of a resin-sealed insulated semiconductor device showing an embodiment of this invention, FIG. Figure 3 is a plan view of the frame portion before cutting the support lead part, Figure 4 is a partially enlarged cross-sectional view of the support lead part coated with insulating resin after cutting it, and Figures 5a and b are the conventional resin-sealed insulation type. A plan view and a side view of a semiconductor device, FIG. 6 is a plan view of a conventional frame portion before cutting the support lead part, and FIG. 7 shows a conventional resin-sealed insulated semiconductor device attached to a heat sink. A side view, Fig. 8 is an enlarged view of the conventional support lead part coated with insulating resin after cutting, and Fig. 9
The figure is an enlarged view for explaining the conventional drawbacks. In the figure, 1 is a molding resin, 2 is a semiconductor chip, 3 is a heat dissipation fin, 4a to 4c are electrode lead terminals, 5 is a support lead portion, 5a is a cut portion of the support lead portion, and 7 is an insulating resin. Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims

【実用新案登録請求の範囲】[Scope of utility model registration request]

半導体チツプが載置固定される放熱フインに対
し電極リード端子と対向側に、支持リード部を備
えた樹脂封止絶縁形半導体装置において、樹脂モ
ールド終了後電解研磨法にてモールド樹脂内部に
おいて選択的に切断可能な断面極小の切断部を前
記支持リード部に形成したことを特徴とする樹脂
封止絶縁形半導体装置。 In a resin-sealed insulated semiconductor device that has a support lead portion on the opposite side of the electrode lead terminal to the heat dissipation fin on which the semiconductor chip is placed and fixed, after resin molding is completed, the inside of the mold resin is selectively polished using electrolytic polishing. 1. A resin-sealed insulated semiconductor device, characterized in that a cutting portion having an extremely small cross section that can be cut into a shape is formed in the support lead portion.