JPS62177039U - - Google Patents
Info
- Publication number
- JPS62177039U JPS62177039U JP6598786U JP6598786U JPS62177039U JP S62177039 U JPS62177039 U JP S62177039U JP 6598786 U JP6598786 U JP 6598786U JP 6598786 U JP6598786 U JP 6598786U JP S62177039 U JPS62177039 U JP S62177039U
- Authority
- JP
- Japan
- Prior art keywords
- convex portion
- taking out
- utility
- insulating material
- scope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011810 insulating material Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000919 ceramic Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａは本考案の一実施例の側面図、第１図
ｂはその底面図、第２図ａは従来のセラミツクケ
ースの側面図、第２図ｂはその底面図である。
１１，２１…外部リード、１２，２２…セラミ
ツクケース、１３…絶縁物による凸部、１４，２
４…外部リード取出し用メタライズ電極。
FIG. 1a is a side view of one embodiment of the present invention, FIG. 1b is a bottom view thereof, FIG. 2a is a side view of a conventional ceramic case, and FIG. 2b is a bottom view thereof. 11, 21... External lead, 12, 22... Ceramic case, 13... Convex portion made of insulator, 14, 2
4...Metallized electrode for taking out external leads.
Claims (1)
凸部を形成したことを特徴とする半導体容器。 A semiconductor container characterized in that a convex portion of an insulating material is formed between metallized layers for taking out external leads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6598786U JPS62177039U (en) | 1986-04-28 | 1986-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6598786U JPS62177039U (en) | 1986-04-28 | 1986-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62177039U true JPS62177039U (en) | 1987-11-10 |
Family
ID=30903568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6598786U Pending JPS62177039U (en) | 1986-04-28 | 1986-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62177039U (en) |
-
1986
- 1986-04-28 JP JP6598786U patent/JPS62177039U/ja active Pending