JPH0267279U - - Google Patents

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例を示す図であり、第
１図ａはステツクの上面図、第１図ｂは第１図ａ
のＡ―Ａ′断面図、第１図ｃは第１図ａのＢ―Ｂ
′断面図である。第２図は本考案の他の実施例を
示す図であり、第２図ａはステツクの上面図、第
２図ｂは第２図ａのＡ―Ａ′断面図、第２図ｃは
第２図ａのＢ―Ｂ′断面図である。第３図は従来
の半導体素子梱包用ステツクの一例を示す図であ
り、第３図ａは上面図、第３図ｂは第３図ａのＡ
―Ａ′断面図、第３図ｃは第３図ａのＢ―Ｂ′断
面図である。 １……半導体素子、２……外部リード端子、３
……梱包用ステツク、４……上ブタ、５……電極
、６……金綿付電極。 Fig. 1 is a diagram showing an embodiment of the present invention, Fig. 1a is a top view of the stick, and Fig. 1b is a top view of the stick.
A-A' sectional view of Figure 1c is B-B of Figure 1a
'It is a sectional view. Fig. 2 is a diagram showing another embodiment of the present invention, in which Fig. 2a is a top view of the stick, Fig. 2b is a sectional view taken along line A-A' in Fig. 2a, and Fig. 2c is a cross-sectional view of the stick. FIG. 2 is a sectional view taken along line BB' in FIG. 2a. FIG. 3 is a diagram showing an example of a conventional semiconductor device packaging stick, with FIG. 3a being a top view and FIG. 3b being a top view of FIG.
-A' sectional view, FIG. 3c is a BB' sectional view of FIG. 3a. 1... Semiconductor element, 2... External lead terminal, 3
...Packaging stick, 4...Top lid, 5...Electrode, 6...Electrode with gold cotton.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子梱包用ステツクにおいて、前記半導
体素子の外部リード端子と接触し、前記梱包用ス
テツクの外面に露出する電極を有することを特徴
とする半導体素子梱包用ステツク。 1. A stick for packaging semiconductor devices, comprising an electrode that contacts an external lead terminal of the semiconductor device and is exposed on an outer surface of the packaging stick.