JPS62156282A - Pretreating solution for electroless plating - Google Patents
Pretreating solution for electroless platingInfo
- Publication number
- JPS62156282A JPS62156282A JP29931685A JP29931685A JPS62156282A JP S62156282 A JPS62156282 A JP S62156282A JP 29931685 A JP29931685 A JP 29931685A JP 29931685 A JP29931685 A JP 29931685A JP S62156282 A JPS62156282 A JP S62156282A
- Authority
- JP
- Japan
- Prior art keywords
- degreasing
- solution
- soln
- pretreatment
- electroless plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1837—Multistep pretreatment
- C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、無′屯解めっきの前処理故に関するものであ
ジ、特に印刷配線板の無電′JIs銅めっきの前処理液
に関するものである。Detailed Description of the Invention (Industrial Application Field) The present invention relates to a pretreatment solution for electroless JIs copper plating of printed wiring boards, and in particular to a pretreatment solution for electroless JIs copper plating of printed wiring boards. be.
(従来の技術)
印刷配線板は、銅張り又は銅のない積層板を穴明は後、
無電解めっきを行うことによって製造さ几る。従来、無
電解鋼めっきの前処理としては、アルカリ脱脂工程、コ
ンディショニング工程、表向鋼箔のノットエツチング工
程、酸洗い工程、増感工程(触媒付与)、密層促進工程
等があり、脱脂とコンディショニングを2工程て行りて
いる。(Prior art) Printed wiring boards are produced by drilling holes in copper-clad or copper-free laminates.
Manufactured by electroless plating. Conventionally, pre-treatments for electroless steel plating include an alkaline degreasing process, a conditioning process, a knot etching process for the surface steel foil, a pickling process, a sensitization process (catalyst application), a dense layer promotion process, etc. There are two stages of conditioning.
無電解めっき前処理としての脱脂の1#、+きは、掖め
っき物表面にある加工油、牛あぶら、その他の育成物等
の汚rLを洗浄することであり、従来、アルカリ性浴液
によって行われていた。コンディショニングの働きは、
親油性である被めっき物の表面を界面活性剤等により、
親水性にしてぬれ易くシ、後に行わ几る謂感工性での触
媒の吸着効果を促進させることにある。Degreasing as a pretreatment for electroless plating is to clean dirt such as processing oil, cow oil, and other grown products on the surface of the plated object, and conventionally, it is carried out using an alkaline bath solution. I was worried. The function of conditioning is
The surface of the object to be plated, which is lipophilic, is treated with a surfactant, etc.
The purpose is to make it hydrophilic so that it is easy to wet, and to promote the adsorption effect of the catalyst in the so-called sensitizing process that will be carried out later.
(発明が解決しようとする問題点)
しかし、脱脂とコンディショニングを2工程で行う無1
解めっき1栓は、作条工程が多く、設備費が高くなる。(Problem to be solved by the invention) However, there is no method that performs degreasing and conditioning in two steps.
One deplating stopper requires many steps to create strips, which increases equipment costs.
本発明は脱脂とコンディショニングの2工a k l
PN、1液で行うことができる#1解めっきの前処理液
を彷供フ゛るものである。The present invention consists of two processes: degreasing and conditioning.
It is similar to the pretreatment solution for #1 deplating, which can be performed with PN and one solution.
(問題点を解決するための手段)
本発明を1シランカップリング剤、非イオン界面活性剤
及びエチレンジアミンテトラ酢酸又はその虫又はその訪
畳体を言む水溶性より成る無電解ぬっきの前処理教であ
る。(Means for Solving the Problems) The present invention is a pretreatment for electroless plating consisting of a silane coupling agent, a nonionic surfactant, and a water-soluble substance such as ethylenediaminetetraacetic acid or its insects or their visiting bodies. It is a teaching.
シランカップリング剤は積層板の晶相であるガラス表面
に単分子膜を形成し、その末端基は観4水注であるので
後に行わnる増感工程で、触媒(例えばPd )が付
き易くなると考えらrLる。The silane coupling agent forms a monomolecular film on the glass surface, which is the crystalline phase of the laminate, and its terminal group is aqueous, so it is easy to attach a catalyst (for example, Pd) during the subsequent sensitization process. I thought it would happen.
シランカップリング剤としては、一般式Xk−5i((
CH2)l−Y)m (但し、X ; 0CnH2
n++。As a silane coupling agent, general formula Xk-5i ((
CH2)l-Y)m (However, X; 0CnH2
n++.
−0COCH3,−0(CH2)nOcHs、 CI、
Br、 I 。-0COCH3, -0(CH2)nOcHs, CI,
Br, I.
Y ; H,−CH:CH2,−NH2,−NH(CH
*ハNH2。Y; H, -CH:CH2, -NH2, -NH(CH
*HaNH2.
k= 1〜5 、e= 1〜7 、m= 1〜5 )で
示さnるものが好fしく、具体的には次のものが李げら
nる。CHz=CH3i(OC2Hs)s、Ckh=C
H8i(OCH2CH2OCHす2. CHz=CH5
iC6a、 NH2(C1(2)3Si(OC2Hsハ
、 NH2(C1hハNH(Ckh)s S 1(OC
H3)3゜NH2C0NH(CIh)ss 1(OCH
s)s、 NH2(CH2)2NH(CHzJxS t
cHs(OCRs)z。k=1-5, e=1-7, m=1-5) are preferred, and specifically the following are preferred. CHz=CH3i(OC2Hs)s, Ckh=C
H8i(OCH2CH2OCH2.CHz=CH5
iC6a, NH2(C1(2)3Si(OC2Hsha, NH2(C1hhaNH(Ckh)s S 1(OC
H3) 3゜NH2C0NH(CIh)ss 1(OCH
s)s, NH2(CH2)2NH(CHzJxS t
cHs(OCRs)z.
非イオン界面活性剤としては、H,L、B。Examples of nonionic surfactants include H, L, and B.
(Hydrophile Lipophile B
a1ance)刀111〜16のものが良く、このもの
は、親水性の度合が脱脂を行う上で迩し、また、被めっ
き物の水ねれ性ゲ良くすると考えらr、る。こrしらは
、−fi式RO(CHzCH2O)nH(但し、R;
−CnH2n+x。(Hydrophile Lipophile B
a1ance) Those of Nos. 111 to 16 are good, and their hydrophilicity is considered to be suitable for degreasing, and also to improve the water-wetting property of the plated object. These are -fi formula RO(CHzCH2O)nH (however, R;
-CnH2n+x.
−CnH2n+l〈=Σ)で示さn、るものが好几く、
具体的にはポリオキシエチレンラウリルエーテル、ポリ
オキシエチレンセチルエーテル、ポリオキシエチレンオ
レイルエーテル、ポリオキシエチレンステアリルエーテ
ル、ポリオキシエチレンオクチルフェールエーテル、ポ
リオキシエチレンノニルフェニルエーテルが使用さrl
、る。−CnH2n+l〈=Σ) is good,
Specifically, polyoxyethylene lauryl ether, polyoxyethylene cetyl ether, polyoxyethylene oleyl ether, polyoxyethylene stearyl ether, polyoxyethylene octyl phenyl ether, and polyoxyethylene nonylphenyl ether are used.
,ru.
エチレンジアミンテトラ酢酸、又はその騙(ナトリウム
遺ン又はその紡碑
体は、被めっき物が銅等の金属である場合、その金4に
作用し、錯塩を作り、金属の酸化物除去を行うと考えら
n、る。具体的にはエチレンジアミンテトラ酢酸、エチ
レンジアミンテトラ酢酸2ナトリウム墳、エチレンジア
ミンテトラ酢酸4ナトリウム塩、ヒトミキシエチルエチ
レンジアミントリ酢tll15ナトリウム!:Mが使用
さ几る。Ethylenediaminetetraacetic acid, or its derivative (sodium residue) or its spindle is thought to act on gold 4 when the object to be plated is a metal such as copper, create a complex salt, and remove metal oxides. Specifically, ethylenediaminetetraacetic acid, ethylenediaminetetraacetic acid disodium salt, ethylenediaminetetraacetic acid tetrasodium salt, human mixyethylethylenediaminetriacetic acid tll15 sodium!:M are used.
シランカップリングjl14!0.1〜I G g#I
、非イオン界面活性剤は0.1〜50g#1、エチレン
ジアミンテトラrnrHm hlα2〜l Og/lの
水溶液として使用する。Silane coupling jl14!0.1~I G g#I
, the nonionic surfactant is used as an aqueous solution of 0.1 to 50 g #1 of ethylenediaminetetra rnrHm hlα2 to l Og/l.
基板を無゛(〃tめっき処理液に浸漬(温度40〜70
℃、時間1〜10分)後水洗を行う。The substrate is immersed in a plating solution (temperature 40-70℃).
℃, time 1 to 10 minutes) and then washing with water.
(実施例〉
実施例1゜
両面鋼張りガラスエポキシ槓)fII仮をメチルエチル
ケトンで希釈したオイルに反漬し11i、燥して、こn
、を汚nた基板とする。汚71.た:!に叛1、A−1
100(r−アミノプロピルエトキシ7ラン。(Example) Example 1 (double-sided steel-clad glass epoxy mold) fII temporary was soaked in oil diluted with methyl ethyl ketone for 11 days, dried, and then
, is a dirty substrate. Dirt 71. Ta:! Ni Rebellion 1, A-1
100 (r-aminopropylethoxy7 run.
日本ユニカー社IK)2 g/1.ノニオンH8−21
0(ポリオキシエチレンオクチルフェニルエーテル、日
本油8fJH)2OI?/1%クレワッ)OH#500
(ヒドロキシエチレン7アミン三酢e増、帝国化学産
業表)4g/’l全言む水溶液の前処J!l液で60℃
、4分処理(脱脂を行う)し、水洗後エツチング液(1
50g/#過伽I#Rアンモニウム沿)に一定時1市浸
頂(匍勤セす)して、銅の溶解前を沖1足し、酸2督→
iの多いもの程、脱脂力が良いと判定した。Nippon Unicar Co., Ltd. IK) 2 g/1. Nonion H8-21
0 (Polyoxyethylene octylphenyl ether, Japan Oil 8fJH)2OI? /1% Krewat) OH#500
(Hydroxyethylene 7 amine triacetate e increase, Teikoku Kagaku Sangyo table) 4g/'l pre-preparation for aqueous solution J! 60℃ for l solution
, treated for 4 minutes (degreasing), washed with water, and then added etching solution (1
50g/#Gaga I#R ammonium) for a certain period of time, add 1 to 1, add 1 to the amount before dissolving the copper, and add 2 to acid →
It was determined that the greater the number of i, the better the degreasing power.
実施例2゜
実施例1と同じ汚n、た眉板金、A−11001g/1
%ノニオンH5−2101g/l、フレワット0141
500 2g#l會含む前処理液で60℃4分処理し、
実施例1と同様にjlpiの浴M′Bkと求め、脱脂力
を判定した。Example 2゜Same stain as Example 1, eyebrow sheet metal, A-11001g/1
%Nonion H5-2101g/l, Flewat 0141
Treated for 4 minutes at 60°C with a pretreatment solution containing 500 2g #l,
The jlpi bath M'Bk was determined in the same manner as in Example 1, and the degreasing power was determined.
実Mr4例五
実施例1と同じ汚n、た基板をA−M2O(β−アミノ
エチル−T−アミノプロピルトリメトキシシラン、日本
ユニカーa4J)5g/LノニオンNS−22O(ポリ
オキシエチレンノニルフェニルエーテル、日本油脂社製
)5g/e、フレワットOH#500 (ヒドロキシエ
チレンジアミン三酢tII塩、帝国化学産業社製)5g
ZEを含む前処理液で60℃、4分処理し。Actual Mr. 4 Examples 5 The same contaminated substrate as in Example 1 was used with A-M2O (β-aminoethyl-T-aminopropyltrimethoxysilane, Nippon Unicar a4J) 5 g/L nonionic NS-22O (polyoxyethylene nonylphenyl ether). , manufactured by Nihon Yushi Co., Ltd.) 5 g/e, Flewat OH#500 (Hydroxyethylenediamine triacetate tII salt, manufactured by Teikoku Kagaku Sangyo Co., Ltd.) 5 g
Treated with a pretreatment solution containing ZE at 60°C for 4 minutes.
実施例1と同様に銅の溶解−fitを求め、脱脂力を判
定した。The copper dissolution-fit was determined in the same manner as in Example 1, and the degreasing power was determined.
比較?01゜
実施例1と同じ汚n、た基板會HCR−2O1(アルカ
リ脱脂液、日立化成工朶社裂)で60℃、4分処理し、
実施例1と同様に銅の浴屏檜を求め、脱脂力を判定した
。Comparison? 01゜The same contaminated substrate as in Example 1 was treated with HCR-2O1 (alkaline degreasing liquid, Hitachi Chemical Co., Ltd.) at 60°C for 4 minutes,
Copper bath screens were obtained in the same manner as in Example 1, and the degreasing power was determined.
比較?lJ 2゜
実施例1と同じ汚r1.た基板’kcOND−2O1(
コンディショナー(界面活性剤う日立化成工業社製)で
60℃、4分処理し、実施例1と同種に銅の浴解量を求
め、脱脂力全判定した。Comparison? lJ 2゜Same stain as in Example 1 r1. Board 'kcOND-2O1 (
It was treated with a conditioner (manufactured by Hitachi Chemical Co., Ltd. containing a surfactant) at 60°C for 4 minutes, and the amount of copper dissolved in the bath was determined in the same manner as in Example 1, and the total degreasing power was evaluated.
実施例46
両面銅張りカラスエポキシ槓盾仮に直径1.0市のドリ
ルにて尺明けしたものを実施例1と同じ前処理液60℃
の中に静かT/C欣囲に対し、垂1αに入j1、穴中の
空気の抜ける時間を測定し、時間が短いほど、水ぬrし
注が良いと判定した。Example 46 Double-sided copper-clad crow epoxy shield prepared by drilling with a 1.0 mm diameter drill at 60°C with the same pretreatment solution as in Example 1.
The hole was placed in a quiet T/C box, and the time taken for the air to escape from the hole was measured, and it was determined that the shorter the time, the better the water was poured.
実施例5、
両面鋼張りガラスエポキシ槓層板に直径1.0mmのド
リルにて穴明けしたものを実施例2と同じ前処理液(6
0℃)で実施例4と同様に人中の空気の抜ける時間を測
定し、水ぬ7’Lff−に@定した。Example 5 A hole was drilled in a double-sided steel-clad glass epoxy laminated plate using a drill with a diameter of 1.0 mm, and the same pretreatment liquid as in Example 2 (6
The time for air to escape from the philtrum was measured in the same manner as in Example 4 at 0°C), and was determined to be 7'Lff-.
実施例6゜
両面鋼張りガラスエポキシ積増&に、直径1゜0順のド
リルにて穴明けしたものに4施例6と同じ前処理液(6
0℃)で実施例4と1勺様に大中の空気の抜ける時間を
副足し、水ぬn、注を判定した。Example 6 Double-sided steel-clad glass epoxy stacking & was drilled with a drill with diameters of 1° and 4. The same pretreatment solution as in Example 6 (6
At 0°C), the time for air to escape from the large medium was added as in Example 4 and 1, and the water content was determined.
比較例&
両面鋼張りガラスエポキシ積増仮に直径1.0mmのド
リルにて穴明けしたもの’kHcR−2O1(60℃)
で実施例4と同様に人中の空気の抜ける時間を測定し、
水ぬj注を1J定した。Comparative example & Double-sided steel clad glass epoxy stacking hole drilled with a 1.0mm diameter drill'kHcR-2O1 (60℃)
In the same manner as in Example 4, the time for air to escape from the human body was measured,
I fixed 1J of water.
比較例4゜
両面銅張りカラスエポキシ槓/it!仮に直往1.0市
のドリルにて穴明けしたものをC0ND−2O1(60
℃)で実施例4と同様に大中の空気の抜ける時間全測定
し、水ぬ1注を判定した。Comparative Example 4゜Double-sided copper-clad glass epoxy shell/it! If the hole was drilled with a direct 1.0 city drill, it would be C0ND-2O1 (60
℃), the entire time for the air to escape from the large medium was measured in the same manner as in Example 4, and the water level was determined.
実施例乙
両面銅ケにりガラスエポキシ績ノー板に直径1.0mm
のドリルにて大明けし、パフ研摩(エメリープラスト使
用)、ホーニング(トサエメリー#280便用)処理し
たもの金サンプルとした。Example B: Double-sided copper plated glass epoxy plate with a diameter of 1.0 mm.
The gold sample was prepared using a drill, puff-polished (using Emery Plast), and honed (for Tosa Emery #280).
このサンプルを実施世11の前処理液で60℃、4分処
理し、水洗後、2O0g/l過硫酸アンモニウム液(ソ
フトエツチング1OL)、10%H2S04(酸洗いg
!i)、270 g/l PD−2O1(ブリディップ
、日立化成工栗表ン、H8−2O1B(増感剤1日立化
成工業製)、ADP−2O1(密着促進剤、日立化成1
兼製)の無電解めっき前処!全行い、CUST−2O1
(無電解銅めっき液、日立化成1栗製)で2O分y)つ
き彼、ピロリン酸鋼めっさ’に5A/drn’。This sample was treated for 4 minutes at 60°C with a pretreatment solution of 11th generation, and after washing with water, 2O0g/l ammonium persulfate solution (soft etching 1OL), 10% H2S04 (pickling
! i), 270 g/l PD-2O1 (Bridip, Hitachi Chemical Co., Ltd.), H8-2O1B (sensitizer 1 manufactured by Hitachi Chemical Co., Ltd.), ADP-2O1 (adhesion promoter, Hitachi Chemical Co., Ltd.)
Electroless plating pretreatment from (also manufactured by)! All operations, CUST-2O1
(Electroless copper plating solution, manufactured by Hitachi Chemical Co., Ltd.) for 20 minutes, and 5 A/drn for pyrophosphate steel plating.
64分を行い、スルーホールボイドの有無を検討した。The test was carried out for 64 minutes, and the presence or absence of through-hole voids was examined.
実施例a
実施例7と同じサンプルを用い、実施例2と同じ前処理
液で60℃、4分処理し、水洗後、実施例7と同じ前゛
電解めつき前処理及び無電解銅めっき及びピロリン酸鋼
めっき全行い、スルーホールボイドの有無を検討した。Example a The same sample as in Example 7 was used, treated with the same pretreatment solution as in Example 2 at 60°C for 4 minutes, washed with water, and then subjected to the same pretreatment as in Example 7: pretreatment for electrolytic plating and electroless copper plating. All pyrophosphate steel plating was performed and the presence or absence of through-hole voids was examined.
実施例9
実施例7と同じサンプルを用い、実施例3と同じ前処理
液で60℃、4分処理し、水洗後、実施例7と同じ無電
解めっき前処理及び無電解銅ぬっき及びピロリン酸鋼め
っきを行いスルーホールボイドの有無を検討した。Example 9 Using the same sample as in Example 7, treated with the same pretreatment solution as in Example 3 at 60°C for 4 minutes, washed with water, and then subjected to the same electroless plating pretreatment as in Example 7, electroless copper plating, and pyrroline. Acid steel plating was performed to examine the presence or absence of through-hole voids.
実施例1〜3と比較例1の結果を表1に示す。The results of Examples 1 to 3 and Comparative Example 1 are shown in Table 1.
表1.脱脂力
表1に示すように、実施例1〜3の前処理液の脱脂力は
良い。C0ND=2O1は、脱脂剤ではないので脱脂力
は低い。Table 1. Degreasing Power As shown in Table 1, the pretreatment liquids of Examples 1 to 3 had good degreasing powers. Since C0ND=2O1 is not a degreasing agent, its degreasing power is low.
実施例4〜6と比較例2〜6の帖果を表2に示す。Table 2 shows the results of Examples 4 to 6 and Comparative Examples 2 to 6.
表2. 水ぬ11件 表2に示すよりに実施例1〜5の前も埋叡は。Table 2. Miznu 11 items As shown in Table 2, the results for Examples 1 to 5 were also the same.
HCR−2O1、C0ND−2O1に比べ大中の空気が
すばやく抜け、水ぬn、aが良いが、HCR−2O1は
コンディシヲナーでにないので、水ぬr性が低い。Compared to HCR-2O1 and C0ND-2O1, the air in the medium escapes quickly and the water resistance is good, but since HCR-2O1 is not a conditioner, its water resistance is low.
実施f117〜90品朱葡表6に示す。Implementation f117-90 items are shown in Table 6.
表五 スルーホールへのめっさ注 表3に示すように%実施例1へ30牙処理液は。Table 5: Measuring notes for through holes As shown in Table 3, the ratio of the tusk treatment solution to Example 1 was 30%.
スルーホールへのめっき性も良い。Good plating properties for through holes.
実施例1〜9の結果より、HCR−2O1は脱#L C
0ND−2O1はコンディショニングの効果しかないか
、不発明の1処meは、両力の効果のあることがわかる
。From the results of Examples 1 to 9, HCR-2O1 is free of #L C
It can be seen that 0ND-2O1 only has a conditioning effect, and the uninvented 1st me has both effects.
(発明の効果)
本発明により、無m!4めりき前処理Vこおける脱脂と
コンディショニングを1液で処理することができ1作条
工数削減がなさj、た。(Effect of the invention) According to the present invention, no m! 4. Degreasing and conditioning in the 4-milling pre-treatment process can be done in one solution, so there is no reduction in the number of man-hours required for one row.
Claims (1)
チレンジアミンテトラ酢酸又はその塩又はその誘導体を
含む水溶液より成る無電解めっきの前処理液。 2、シランカップリング剤が一般式(Xk・Si((C
H_2)l・Y)m(但し、X;−OCnH_2_n_
+_1、−OCOCH_3、−O(CH_2)nOCH
_3、Cl、Br、I、Y;H、−CH=CH_2、−
NH_2、−NH(CH_2)_2NH_2、k:1〜
3、l=1〜7、m=1〜3)で示され、非イオン界面
活性剤が一般式RO(CH_2CH_2O)nH(但し
、R:−CnH_2_n_+_1、CnH_2_n_+
_1■)で示される特許請求の範囲第1項記載 の無電解めっきの前処理液。[Claims] 1. A pretreatment solution for electroless plating comprising an aqueous solution containing a silane coupling agent, a nonionic surfactant, and ethylenediaminetetraacetic acid or a salt thereof or a derivative thereof. 2. The silane coupling agent has the general formula (Xk・Si((C
H_2)l・Y)m (However, X;-OCnH_2_n_
+_1, -OCOCH_3, -O(CH_2)nOCH
_3, Cl, Br, I, Y; H, -CH=CH_2, -
NH_2, -NH(CH_2)_2NH_2, k: 1~
3, l = 1 to 7, m = 1 to 3), and the nonionic surfactant has the general formula RO(CH_2CH_2O)nH (where R: -CnH_2_n_+_1, CnH_2_n_+
_1■) A pretreatment liquid for electroless plating according to claim 1.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29931685A JPS62156282A (en) | 1985-12-27 | 1985-12-27 | Pretreating solution for electroless plating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29931685A JPS62156282A (en) | 1985-12-27 | 1985-12-27 | Pretreating solution for electroless plating |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62156282A true JPS62156282A (en) | 1987-07-11 |
JPH0475319B2 JPH0475319B2 (en) | 1992-11-30 |
Family
ID=17870958
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP29931685A Granted JPS62156282A (en) | 1985-12-27 | 1985-12-27 | Pretreating solution for electroless plating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62156282A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0290679A (en) * | 1988-09-28 | 1990-03-30 | Matsushita Electric Ind Co Ltd | Very thin metal film and manufacture thereof |
JPH03217078A (en) * | 1990-01-22 | 1991-09-24 | Mitsubishi Electric Corp | Surface treatment of internal-layer base material for multilayer copper-clad laminated board |
JP2006249520A (en) * | 2005-03-11 | 2006-09-21 | Hitachi Chem Co Ltd | Pretreatment liquid for electroless plating and electroless plating method using the same |
JP2006291244A (en) * | 2005-04-06 | 2006-10-26 | Hitachi Chem Co Ltd | Pre-treatment liquid for electroless plating, and electroless plating method using the same |
CN106676552A (en) * | 2016-12-30 | 2017-05-17 | 宁波际超新材料科技有限公司 | Phosphorus-free degreasant and manufacturing method thereof |
-
1985
- 1985-12-27 JP JP29931685A patent/JPS62156282A/en active Granted
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0290679A (en) * | 1988-09-28 | 1990-03-30 | Matsushita Electric Ind Co Ltd | Very thin metal film and manufacture thereof |
JPH03217078A (en) * | 1990-01-22 | 1991-09-24 | Mitsubishi Electric Corp | Surface treatment of internal-layer base material for multilayer copper-clad laminated board |
JP2006249520A (en) * | 2005-03-11 | 2006-09-21 | Hitachi Chem Co Ltd | Pretreatment liquid for electroless plating and electroless plating method using the same |
JP2006291244A (en) * | 2005-04-06 | 2006-10-26 | Hitachi Chem Co Ltd | Pre-treatment liquid for electroless plating, and electroless plating method using the same |
JP4640586B2 (en) * | 2005-04-06 | 2011-03-02 | 日立化成工業株式会社 | Pretreatment liquid for electroless plating and electroless plating method using the same |
CN106676552A (en) * | 2016-12-30 | 2017-05-17 | 宁波际超新材料科技有限公司 | Phosphorus-free degreasant and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
JPH0475319B2 (en) | 1992-11-30 |
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