JPS62145827A - Connecting method for electronic component part - Google Patents
Connecting method for electronic component partInfo
- Publication number
- JPS62145827A JPS62145827A JP28822785A JP28822785A JPS62145827A JP S62145827 A JPS62145827 A JP S62145827A JP 28822785 A JP28822785 A JP 28822785A JP 28822785 A JP28822785 A JP 28822785A JP S62145827 A JPS62145827 A JP S62145827A
- Authority
- JP
- Japan
- Prior art keywords
- solvent
- conductive adhesive
- anisotropic conductive
- wiring pattern
- overcoat layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、異方性導電接着剤を用いて回路基板上に形成
された配線パターンと電子部品の接続部とを接続する電
子部品の接続方法に関する。Detailed Description of the Invention (Industrial Application Field) The present invention relates to a connection method for electronic components that connects a wiring pattern formed on a circuit board and a connecting portion of an electronic component using an anisotropic conductive adhesive. Regarding the method.
（従来の技術）
従来、ＡｕメッキやＳｎメッキ等の表面処理を施すこと
により、回路基板上に形成された配線パターンの接点や
接続端子の信顧性を向」二させたものがある。また、最
近では、第３図および第４図に示すように、回路基板ａ
ｌｌに形成された配線パターンｂ上に導電性のインク
フィルム（オーバーコート層）Ｃを印刷して該配線パタ
ーンｂをオーバーコートすることにより、前記メッキ処
理と同様な効果を得るものがある。そして、インクフィ
ルムＣを印刷した回路基板ａ上に異方性導電接着剤ｄを
塗布し、この異方性導電接着剤ｄ上に電子部品ｅを実装
して、配線パターンｂと電子部品ｅのリード端子ｆとを
接続している。(Prior Art) Conventionally, there are devices that improve the reliability of contacts and connection terminals of wiring patterns formed on circuit boards by applying surface treatments such as Au plating and Sn plating. In addition, recently, as shown in FIGS. 3 and 4, circuit boards a
By printing a conductive ink film (overcoat layer) C on the wiring pattern b formed on the wiring pattern b to overcoat the wiring pattern b, an effect similar to that of the plating process described above can be obtained. Then, an anisotropic conductive adhesive d is applied on the circuit board a printed with the ink film C, and an electronic component e is mounted on the anisotropic conductive adhesive d, leading to the wiring pattern b and the electronic component e. It is connected to terminal f.
（発明が解決しようとする問題点）
しかしながら、上記した接続方法では、配線パターンｂ
とオーバーコート層Ｃの界面で抵抗が増大し、配線パタ
ーンｂと電子部品ｅのリード端子ｆとの電気的接続の信
顛性が低下するという問題があった。(Problem to be solved by the invention) However, in the above connection method, the wiring pattern b
There was a problem in that resistance increased at the interface between the wiring pattern b and the overcoat layer C, and the reliability of the electrical connection between the wiring pattern b and the lead terminal f of the electronic component e decreased.
（問題点を解決するための手段）
本発明に係る電子部品の接続方法は、回路基板上に配線
パターンを形成し、この配線パターン上に導電性のオー
バーコート層を形成し、このオーバーコート層を被う回
路基板の上面に異方性導電接着剤を塗布し、この異方性
導電接着剤上に電子部品を熱圧着により実装して、該電
子部品の接続部と前記配線パターンを電気的に接続する
接続方法において、前記異方性導電接着剤として前記オ
ーバーコート層を溶融させる溶剤が添加された異方性導
電接着剤を用いるものである。(Means for Solving the Problems) A method for connecting electronic components according to the present invention includes forming a wiring pattern on a circuit board, forming a conductive overcoat layer on the wiring pattern, and forming a conductive overcoat layer on the wiring pattern. An anisotropic conductive adhesive is applied to the upper surface of the circuit board that covers the circuit board, and electronic components are mounted on the anisotropic conductive adhesive by thermocompression bonding, and the connection parts of the electronic components and the wiring pattern are electrically connected. In the connection method, an anisotropic conductive adhesive to which a solvent for melting the overcoat layer is added is used as the anisotropic conductive adhesive.
（作用）
異方性導電接着剤を配線パターンおよびオーバーコート
層を含む回路基板の上面に塗布すると、異方性導電接着
剤中に添加された溶剤によってオーバーコート層が溶融
、軟化し、異方性導電接着剤中の異方導電性フィシがオ
ーバーコート層中に浸透する。この状態で電子部品を熱
圧着により実装すると、オーバーコート層が軟化して電
子部品の接続部と配線パターンとが前記異方導電性フィ
シで直接接続される。(Function) When an anisotropic conductive adhesive is applied to the top surface of a circuit board including a wiring pattern and an overcoat layer, the overcoat layer is melted and softened by the solvent added to the anisotropic conductive adhesive, and the anisotropic conductive adhesive is melted and softened by the solvent added to the anisotropic conductive adhesive. The anisotropic conductive fibers in the conductive adhesive penetrate into the overcoat layer. When an electronic component is mounted in this state by thermocompression bonding, the overcoat layer is softened and the connecting portion of the electronic component and the wiring pattern are directly connected by the anisotropically conductive fin.
（実施例）
以下、本発明の一実施例を第１図および第２図を参照し
て説明する。(Example) An example of the present invention will be described below with reference to FIGS. 1 and 2.
第１図において、■はソリッドもしくはフレキシブルな
回路基板で、この回路基板ｌ上にＣｕ、ＡＩ、Ａｇ等の
金属からなる配線パターン２を形成し、この配線パター
ン２上にアセテート系またはケトン系等の溶剤に溶融し
易い導電性のオーバーコート層３を形成する。In Fig. 1, ■ is a solid or flexible circuit board, on which a wiring pattern 2 made of metal such as Cu, AI, Ag, etc. is formed, and on this wiring pattern 2, acetate-based or ketone-based etc. A conductive overcoat layer 3 that is easily melted in a solvent is formed.
オーバーコート層３としては、カーボン等の導電性フィ
シをバインダ中に分散させ、溶剤を予め含んだペースト
状のものを用いて形成する。また、バインダとしては熱
可塑性樹脂で構成することが望ましい。この導電性ペー
ストを印刷等の方式で配線パターン２上に塗布し、その
後乾燥させて溶剤を揮発させ、オーバーコート層３を形
成する。The overcoat layer 3 is formed by dispersing conductive fibers such as carbon in a binder and using a paste containing a solvent in advance. Further, it is desirable that the binder is made of thermoplastic resin. This conductive paste is applied onto the wiring pattern 2 by a method such as printing, and then dried to volatilize the solvent to form an overcoat layer 3.
次に、配線パターン２およびオーバーコート層３を含む
回路基板１上に異方性導電接着剤４を塗布する。ここで
、異方性導電接着剤４とは、横方向には導電性を持たず
縦方向のみ導電性を程する特性を持ったもので、一般に
熱圧着により接着させる材料のものをいう。Next, an anisotropic conductive adhesive 4 is applied onto the circuit board 1 including the wiring pattern 2 and the overcoat layer 3. Here, the anisotropic conductive adhesive 4 is a material that has a property of having no conductivity in the horizontal direction but is conductive only in the vertical direction, and is generally a material that is bonded by thermocompression bonding.
異方性導電接着剤４には、オーバーコート層３を溶融さ
せ易い溶剤、例えばオーバーコート層３に含まれていた
ものと同系の溶剤が３０〜６０％添加されている。この
ため、この異方性導電接着剤４は印刷等の方式で回路基
板１上に塗布することができる。なお、異方性導電接着
剤４は熱可塑性タイプ、熱硬化性タイプのどちらでもよ
い。The anisotropic conductive adhesive 4 contains 30 to 60% of a solvent that easily melts the overcoat layer 3, such as a solvent of the same type as that contained in the overcoat layer 3. Therefore, this anisotropic conductive adhesive 4 can be applied onto the circuit board 1 by a method such as printing. Note that the anisotropic conductive adhesive 4 may be either a thermoplastic type or a thermosetting type.
このようにして、異方性導電接着剤４が塗布されると、
一度は溶剤が揮発したオーバーコート層３に再度溶剤が
触れることになり、オーバーコート層３が溶融、軟化し
、異方性導電接着剤４中の異方性の導電性フィシがオー
バーコート層３に浸透した状態となる。この状態で乾燥
することにより接着に不要な溶剤は揮発除去され、第２
図に示す構造の回路基板１が形成される。When the anisotropic conductive adhesive 4 is applied in this way,
The overcoat layer 3 from which the solvent has evaporated once comes into contact with the solvent again, and the overcoat layer 3 is melted and softened, and the anisotropic conductive fibers in the anisotropic conductive adhesive 4 are transferred to the overcoat layer 3. It becomes a state where it permeates. By drying in this state, the solvent unnecessary for adhesion is removed by volatilization, and the second
A circuit board 1 having the structure shown in the figure is formed.
この回路基板１上に、例えば液晶表示素子、フラットパ
ッケージＬＳｉＬＢＤ、コンデンサ等の各種電子部品５
を実装する。すなわち、回路基板１上の配線パターン２
と電子部品５の接続端子６との位置を合わせ、熱圧着に
よって接着する。On this circuit board 1, various electronic components 5 such as a liquid crystal display element, a flat package LSiLBD, a capacitor, etc.
Implement. That is, the wiring pattern 2 on the circuit board 1
and the connecting terminals 6 of the electronic component 5 are aligned and bonded by thermocompression bonding.
このようにすると、異方性導電接着剤４中の異方性の導
電性フィシが浸入したオーバーコート層３は、熱圧着に
よりバインダが軟化し、これに圧力が加わるため、電子
部品５の接続端子６がこのオーバーコート層３内に浸入
する形で圧縮され、接続端子６と配線パターン２とが異
方性の導電性フィシを介して直接接続された構造となる
。この構造を第１図に示す。In this way, the overcoat layer 3 into which the anisotropic conductive fibers in the anisotropic conductive adhesive 4 have penetrated can be bonded to the electronic component 5 by softening the binder by thermocompression bonding and applying pressure to it. The terminals 6 are compressed so as to penetrate into the overcoat layer 3, resulting in a structure in which the connection terminals 6 and the wiring pattern 2 are directly connected via the anisotropic conductive fiber. This structure is shown in FIG.
この方法によって得られた電気的接続構造は、低抵抗で
信頼性の高いものとなる。また、電子部品５を回路基板
１上に実装するのに、半田付けを必要としないので、ポ
リエステル基材のような耐熱性の低い回路基板あるいは
カーボン印刷基板に電子部品を実装することも可能で、
コストの低減化を図ることができる。The electrical connection structure obtained by this method has low resistance and high reliability. Furthermore, since soldering is not required to mount the electronic component 5 on the circuit board 1, it is also possible to mount the electronic component on a circuit board with low heat resistance such as a polyester base material or a carbon printed board. ,
Cost reduction can be achieved.
（発明の効果）
以上説明したように、本発明に係る電子部品の接続方法
によれば、低抵抗で信転性の高い電子部品の電気的接続
構造を得ることができる。(Effects of the Invention) As explained above, according to the method for connecting electronic components according to the present invention, it is possible to obtain an electrical connection structure for electronic components with low resistance and high reliability.
第１図および第２図は本発明に係る電子部品の接続方法
の一例を示し、第１図は本方法によって回路基板上に電
子部品を実装した状態の縦断面図、第２図は配線パター
ンおよびオーバーコート層を形成した回路基板上に異方
性導電接着剤を塗布した状態の縦断面図、第３図および
第４図は従来の電子部品の接続方法の一例を示し、第３
図は配線パターンおよびオーバーコート層を形成した回
路基板上に異方性導電接着剤を塗布した状態の縦断面図
、第４図はこの回路基板上に電子部品を実装した状態の
縦断面図である。
１・・・回路基板 ２・・・配線パターン３・
・・オーバーコート層 ４・・・異方性導電接着剤５・
・・電子部品 ６・・・接続端子第７図
処２図1 and 2 show an example of the method for connecting electronic components according to the present invention, FIG. 1 is a longitudinal cross-sectional view of electronic components mounted on a circuit board by this method, and FIG. 2 is a wiring pattern. 3 and 4 show an example of a conventional method for connecting electronic components, and FIGS.
The figure is a vertical cross-sectional view of an anisotropic conductive adhesive coated on a circuit board on which wiring patterns and overcoat layers have been formed, and Figure 4 is a vertical cross-sectional view of electronic components mounted on this circuit board. be. 1... Circuit board 2... Wiring pattern 3.
...Overcoat layer 4...Anisotropic conductive adhesive 5.
...Electronic components 6...Connection terminals Figure 7 Figure 2
Claims (1)
ーン上に導電性のオーバーコート層を形成し、このオー
バーコート層を被う回路基板の上面に異方性導電接着剤
を塗布し、この異方性導電接着剤上に電子部品を熱圧着
により実装して、該電子部品の接続部と前記配線パター
ンを電気的に接続する接続方法において、 前記異方性導電接着剤として前記オーバーコート層を溶
融させる溶剤が添加された異方性導電接着剤を用いるこ
とを特徴とする電子部品の接続方法。[Claims] 1) A wiring pattern is formed on a circuit board, a conductive overcoat layer is formed on the wiring pattern, and anisotropic conductive adhesive is applied to the upper surface of the circuit board covering the overcoat layer. In the connection method, the anisotropic conductive adhesive is coated with an anisotropic conductive adhesive, an electronic component is mounted on the anisotropic conductive adhesive by thermocompression bonding, and the connecting portion of the electronic component and the wiring pattern are electrically connected. A method for connecting electronic components, characterized in that an anisotropic conductive adhesive to which a solvent for melting the overcoat layer is added is used as an agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28822785A JPS62145827A (en) | 1985-12-20 | 1985-12-20 | Connecting method for electronic component part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28822785A JPS62145827A (en) | 1985-12-20 | 1985-12-20 | Connecting method for electronic component part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62145827A true JPS62145827A (en) | 1987-06-29 |
| JPH0424859B2 JPH0424859B2 (en) | 1992-04-28 |
Family
ID=17727475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28822785A Granted JPS62145827A (en) | 1985-12-20 | 1985-12-20 | Connecting method for electronic component part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62145827A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5386624A (en) * | 1993-07-06 | 1995-02-07 | Motorola, Inc. | Method for underencapsulating components on circuit supporting substrates |
| US5918363A (en) * | 1996-05-20 | 1999-07-06 | Motorola, Inc. | Method for marking functional integrated circuit chips with underfill material |
| JP2005093826A (en) * | 2003-09-18 | 2005-04-07 | Ricoh Co Ltd | Connection structure using conductive adhesive and manufacturing method therefor |
-
1985
- 1985-12-20 JP JP28822785A patent/JPS62145827A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5386624A (en) * | 1993-07-06 | 1995-02-07 | Motorola, Inc. | Method for underencapsulating components on circuit supporting substrates |
| US5918363A (en) * | 1996-05-20 | 1999-07-06 | Motorola, Inc. | Method for marking functional integrated circuit chips with underfill material |
| JP2005093826A (en) * | 2003-09-18 | 2005-04-07 | Ricoh Co Ltd | Connection structure using conductive adhesive and manufacturing method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0424859B2 (en) | 1992-04-28 |
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