JPS62139894A - Partial plating device - Google Patents
Partial plating deviceInfo
- Publication number
- JPS62139894A JPS62139894A JP28121685A JP28121685A JPS62139894A JP S62139894 A JPS62139894 A JP S62139894A JP 28121685 A JP28121685 A JP 28121685A JP 28121685 A JP28121685 A JP 28121685A JP S62139894 A JPS62139894 A JP S62139894A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- support
- contact material
- plating solution
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 121
- 239000000463 material Substances 0.000 claims abstract description 43
- 239000007788 liquid Substances 0.000 claims abstract description 23
- 238000004804 winding Methods 0.000 claims abstract description 8
- 238000009713 electroplating Methods 0.000 claims abstract 2
- 239000000758 substrate Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 230000000740 bleeding effect Effects 0.000 abstract 1
- 238000002386 leaching Methods 0.000 abstract 1
- 239000010970 precious metal Substances 0.000 description 7
- 238000012546 transfer Methods 0.000 description 4
- 239000007921 spray Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002730 additional effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
この発明は部分メッキ装置、特にメッキ物のフォーク状
先端部に左右一対対向しているメッキ対象部に部分メッ
キを施すに好適な部分メッキ装置に関する。[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a partial plating apparatus, particularly a partial plating apparatus suitable for partially plating a pair of left and right plating target parts on the fork-shaped tip of a plated object. Regarding.
〈従来の技術〉
従来より、第４図に示すようなメッキ物１の「フォーク
状先端部」としてのコネクタ端子２のメッキ対象部〔後
述〕に、部分メッキを施す場合、種々の技術が採用され
てきた。<Prior art> Conventionally, various techniques have been adopted when partially plating the part to be plated (described later) of the connector terminal 2 as the "fork-shaped tip" of the plated object 1 as shown in FIG. It has been.
このコネクタ端子２は、連続帯状部３に所定間隔で櫛歯
状に複数本形成されているもので、このコネクタ端子２
に於けるメッキ対象部４とは、端部５に所定の間隙を隔
て左右一対相対向して形成されている凸状部６の側面を
いうものである。A plurality of connector terminals 2 are formed in a comb-like shape at predetermined intervals on a continuous band-shaped portion 3.
The part 4 to be plated refers to the side surfaces of a convex part 6 formed on the end part 5 in a pair of left and right opposite positions with a predetermined gap therebetween.
このメッキ対象部４に部分メッキを施す従来の技術とし
ては、凸状部６を含む端部５全体をメッキ槽に浸漬し液
面制御によってメッキ液の施す部位を特定しメッキする
浸漬装置、或いはメッキを必要としない部分をマスクに
て覆い露出された部分にメッキ液を噴射して施す噴射メ
ッキ装置〔特開昭５９年−１２６７８４号、、特開昭５
７年−１６１０８４号及び特開昭５５年−８３１８０号
公報参照〕が参照的に部分メッキ装置として知られてい
る。Conventional techniques for partially plating the part 4 to be plated include an immersion device that immerses the entire end 5 including the convex part 6 in a plating tank and specifies the part to be applied with the plating solution by controlling the liquid level and plating it; Spray plating device that covers parts that do not require plating with a mask and sprays plating solution onto the exposed parts [JP-A-59-126784, JP-A-5
7-161084 and Japanese Patent Laid-Open No. 1983-83180] is known as a partial plating apparatus.
〈発明が解決しようとする問題点〉
しかしながら、このような従来の部分メッキ装置にあっ
て、浸漬メッキ装置では、コネクタ端子２のつ：）１部
５の周囲が一様にメッキされ、メッキ対象部４に比較し
て、メッキ対象部４の周辺部が厚くメッキされてしまう
ため、メンキエリアの明確な限定が困難で、そのために
貴金属メッキを行うと、貴金属が必要以上に消費されて
しまうものである。<Problems to be Solved by the Invention> However, in such conventional partial plating equipment, in the immersion plating equipment, the periphery of one part 5 of the connector terminal 2 is uniformly plated, and the plating target is Compared to part 4, the peripheral part of part 4 to be plated is plated thicker, so it is difficult to clearly define the coating area, and if precious metal plating is performed for this reason, precious metal will be consumed more than necessary. be.
一方、マスクを使用する噴射メッキ装置では、一般的に
メッキ対象部４が微小化するにつれて、又メッキ対象部
４の形状が複雑化するにつれて、マスク加工と、メッキ
時に於けるマスク状態の完全な維持が困難となり、上記
と同様に貴金属が必要以上に消費されるものであった。On the other hand, in spray plating equipment that uses a mask, as the plating target part 4 becomes smaller and the shape of the plating target part 4 becomes more complicated, mask processing and perfect mask state during plating are required. It became difficult to maintain, and like the above, precious metals were consumed more than necessary.
そのため、より少ない貴金属消費量で所望の部分メッキ
が行える部分メッキ装置が望まれているものであった。Therefore, there is a need for a partial plating apparatus that can perform desired partial plating with less precious metal consumption.
そこで、この発明は、部分メッキを高精度で且つ効率良
く行うことにより貴金属消費量を低減し得る部分メッキ
装置を提供することを目的としている。Therefore, an object of the present invention is to provide a partial plating apparatus that can reduce precious metal consumption by performing partial plating with high precision and efficiency.
く問題点を解決するための手段〉
上記の目的を達成するためのこの発明の構成を、実施例
に対応する第１図乃至第３図を用いて説明する。Means for Solving the Problems> The structure of the present invention for achieving the above object will be explained using FIGS. 1 to 3 corresponding to the embodiment.
この発明にかかる部分メッキ装置１０に於いてメッキ対
象部４のパスライン〔図中矢示ＰＬ方向〕に沿い且つ左
右一対の両メッキ対象部４間に介在して配されたメッキ
液供給体１１は、基板としてのカバープレー１・１７に
立設されている支持体１４と、支持体１４の通路２１内
又は通路２１の入口２２近辺に配されているか若しくは
支持体１４そのものを形成しているアノード２３と、こ
の支持体１４の長手交差方向〔矢示Ａ方向〕より導入さ
れ支持体１４を被覆しつつ移動し、パスライン対応部位
１２にメッキ液の受渡し部１３を形成して、支持体１４
上から導出されて巻取り自在とされる接触材１５と、か
ら形成されているもので、更にこのメッキ液供給体１１
には、接触材１５を支持体１４の長手交差方向より支持
体１４上へ導入、導出する入側ローラ２６、出側ローラ
２７を有し、この両ローラ２６．２７間で接触材１５に
テンションを付与する巻取り手段２８が組合わされたも
のとされている。In the partial plating apparatus 10 according to the present invention, the plating liquid supply body 11 is disposed along the pass line of the plating target part 4 [direction of arrow PL in the figure] and interposed between the pair of left and right plating target parts 4. , a support 14 erected on a cover plate 1/17 as a substrate, and an anode disposed within the passage 21 of the support 14 or near the entrance 22 of the passage 21, or forming the support 14 itself. 23 and the support 14 are introduced from the longitudinal cross direction [direction of arrow A] and move while covering the support 14, forming a plating solution delivery section 13 in the pass line corresponding region 12,
A contact material 15 that is led out from above and can be wound up freely,
has an inlet roller 26 and an outlet roller 27 that introduce and guide the contact material 15 onto and from the support 14 from the longitudinal direction of the support 14, and tension is applied to the contact material 15 between these rollers 26 and 27. A winding means 28 for imparting this is combined.
又、この支持体１４は、頂部１８の上端１９又は上端近
辺にメッキ液滲出用の開口２０を有し、該開口２０に連
通するメッキ液供給用の通路２１を内部に有しているも
のである。Further, this support 14 has an opening 20 for seeping out the plating solution at or near the upper end 19 of the top portion 18, and has a passage 21 for supplying the plating solution communicating with the opening 20 inside. be.
接触材１５は、導入される時から導出される迄の間、２
つ折りで且つ逆Ｕ字形状とされ、支持体１４を被覆する
と共に該支持体１４に導かれつつ支持体１４の長手方向
に移動し、メッキ液１６の受渡し部１３を形成する。The contact material 15 is 2
It is folded in half and has an inverted U-shape, and covers the support 14 and moves in the longitudinal direction of the support 14 while being guided by the support 14 to form a delivery section 13 for the plating solution 16.
〈作用〉
そしてこの発明は前記の手段により、メッキされるべき
メッキ物ｌの左右一対の両メッキ対象部４間で該メッキ
対象部４のパスライン（図中矢示ＰＬ）に沿ってメッキ
液供給体１１が介在して配された状態に於いて、メッキ
液１６が圧送されると通電されているアノード２３に触
れつつ通路２１を経て、頂部１８の上端１９或いは上端
近辺に設けられた開口２０より滲出し、支持体１４を覆
っている接触材１５に吸収されて該接触材１５を浸潤さ
せる。<Function> According to the above-mentioned means, the present invention supplies a plating solution between a pair of left and right plating target parts 4 of a plating object l to be plated along the pass line (arrow PL in the figure) of the plating target parts 4. With the body 11 interposed therebetween, when the plating liquid 16 is pumped, it passes through the passage 21 while touching the energized anode 23, and passes through the opening 20 provided at or near the upper end 19 of the top portion 18. It oozes out more and is absorbed into the contact material 15 covering the support 14 to wet the contact material 15.
この接触材１５は、入側ローラ２６にて移動方向が変換
され、支持体１４の長手交差方向（矢示Ａ方向）より導
入されては支持体１４を被覆しつつ移動せしめられるが
、この時接触材１５は巻取り手段２８の入側、出側の両
ローラ２６．２７間で引張されテンションが付与されて
いるため、いわゆる「たるみ」が発生することなく適度
な張力を以て支持体１４の上面を被覆し、接触材１５の
パスライン対応部位１２に、新鮮なメッキ液１６を常時
適量供給し得る、メッキ液の「受渡し部」１３を形成し
ているものである。The moving direction of the contact material 15 is changed by the entrance roller 26, and the contact material 15 is introduced from the direction crossing the length of the support 14 (direction of arrow A) and is moved while covering the support 14. Since the contact material 15 is stretched and tensioned between the rollers 26 and 27 on the inlet and outlet sides of the winding means 28, the upper surface of the support 14 is stretched with appropriate tension without causing so-called "sag". This forms a plating solution delivery section 13 that can constantly supply an appropriate amount of fresh plating solution 16 to the pass line corresponding portion 12 of the contact material 15.
メッキ対象部４は、この「受渡し部」１３に接触し或い
は近接することで、メッキ液１６がこのメッキ対象部４
の全体のみに均等に受は渡されるもので、このメッキ液
１６の受は渡された部位が「メッキエリア」として特定
されたことになる。The plating target part 4 comes into contact with or comes close to this "delivery part" 13, so that the plating liquid 16 is transferred to the plating target part 4.
The area where the plating solution 16 is passed is specified as the "plating area".
そして、接触材１５は、出側のローラ２７により移動方
向が変換され、支持体１４の長手交差方向〔矢示Ａ方向
〕に移動して適宜長さ巻き取られて導出され、入側、出
側の両ローラ２６．２７間で、その都度新たな［受渡し
部Ｊ１３を構成するＹＪ（Ｉｉを行うことになり、接触
材１５の特定部分のみが磨耗することがないように配慮
されている。Then, the moving direction of the contact material 15 is changed by the roller 27 on the exit side, and the contact material 15 is moved in the longitudinal cross direction of the support body 14 [direction of arrow A], wound up to an appropriate length, and led out. Between the two rollers 26 and 27 on the side, a new [YJ (Ii) constituting the transfer section J13 is performed each time, and care is taken to prevent only specific parts of the contact material 15 from being worn out.
〈実施例〉
以下、この発明の一実施例を第１図乃至第３図を参照し
て説明する。<Embodiment> An embodiment of the present invention will be described below with reference to FIGS. 1 to 3.
尚、従来と共通する部分は同一符号を用いることとし、
重複説明を省略する。In addition, the same symbols are used for parts that are common to the conventional one,
Omit duplicate explanations.
まず、この部分メッキ装置１０に於けるメッキ液供給体
１１は、支持体１４と、アノード２３と、接触材１５と
から形成されており、更にこのメッキ液供給体１１には
該接触材１５を支持体１４の長手交差方向〔矢示Ａ方向
〕より支持体１４上に導入・導出し接触材１５にテンシ
ョンを付与する入側、出側双方のローラ２６．２７から
なる巻取り手段２８が組合わせられている。First, the plating liquid supply body 11 in this partial plating apparatus 10 is formed from a support body 14, an anode 23, and a contact material 15. A winding means 28 is assembled which includes rollers 26 and 27 on both the entry and exit sides that are introduced and led out onto the support 14 from the longitudinal direction of the support 14 (in the direction of arrow A) and apply tension to the contact material 15. It is matched.
上記の支持体１４は、メッキボックス３０の上部を覆う
「基板」としてのカバープレート１７に立設されている
もので、この支持体１４はメッキ対象部４間の間隙に相
応する程度の幅狭のサイズに形成され、接触材１５移動
時のガイドであり、且つメッキ）反供給手段としてこの
支持体１４の頂部１８の上端１９にメッキ液滲出用の開
口２０を設け、内部には開口２０へ連通ずるメッキ液供
給用の通路２１を備えている。この通路２１はメンキボ
ックス３０のカバープレート１７に形成されている供給
開口３２と連通している。The above-mentioned support body 14 is installed upright on a cover plate 17 serving as a "substrate" that covers the upper part of the plating box 30, and this support body 14 has a narrow width corresponding to the gap between the parts 4 to be plated. The upper end 19 of the top part 18 of this support body 14 is provided with an opening 20 for the plating solution to seep out, which serves as a guide when the contact material 15 is moved and as a counter-supply means for plating. A passage 21 for supplying a plating solution is provided. This passage 21 communicates with a supply opening 32 formed in the cover plate 17 of the maintenance box 30.
そしてこの支持体１４の底部３１で通路２１の入口２２
近辺にはメッキ液１６の流通を阻害しないメツシュ状の
アノード２３が配されている。And at the bottom 31 of this support 14 the entrance 22 of the passage 21
A mesh-shaped anode 23 that does not obstruct the flow of the plating solution 16 is arranged nearby.
接触材１５は、合成樹脂性のメソシュ或いはメツシュ状
の多孔体にて形成されているもので、上記巻取り手段２
８０入側のローラ２６により支持体１４の長手交差方向
から、２つ折り且つ逆Ｕ字形状の状態にして導入される
。そして、支持体１４を被覆しつつ支持体１４に沿って
移動して、その間に接触材１５のパスライン対応部位１
２にはメッキ液１６の受渡し部１３が形成されるもので
あり、２つ折りで逆Ｕ字形状のまま出側ローラ２７によ
り再び移動方向が変換され支持体１４上から導出され巻
取られてゆくようにしてあり、このことによって接触材
１５の特定部分の磨耗を防止するものである。そして、
入側・出側の両ローラ２６．２７間で接触材１５にメッ
キを施す有効スパージャ部２９が形成さ・れるものであ
る。The contact material 15 is formed of a synthetic resin mesh or a mesh-like porous body, and is connected to the winding means 2.
The roller 26 on the entry side of the support 80 introduces the support 14 from the longitudinal direction in a direction that is folded in half and into an inverted U-shape. Then, it moves along the support 14 while covering the support 14, and in the meantime, the pass line corresponding portion 1 of the contact material 15 is moved.
2 is formed with a delivery part 13 for the plating solution 16, and the plating solution 16 is folded in half and remains in an inverted U-shape, and the moving direction is changed again by the exit roller 27, and the plating solution is led out from the support 14 and wound up. This prevents wear of specific parts of the contact material 15. and,
An effective sparger portion 29 for plating the contact material 15 is formed between the inlet and outlet rollers 26, 27.
そして、巻取り手段２８は、入側ローラ２６、出側ロー
ラ２７からなり、両ローラ２６．２７は、各々支持体１
４と干渉しない位置で配されており、入側のローラ２６
は巻出しリール３３から巻出された接触材１５を移動方
向を変換させつつ２つ折りで逆Ｕ字形状の状態にして支
持体１４上へ導入し、出側ローラ２７は再び移動方向を
変換することで接触材１５を導出し巻取り自在としてい
るものである。そして入側・出側側ローラ２６．２７間
で接触材１５に適度のテンションを付与すると共に出側
のローラ２７より導出した接触材１５を支持体１４の長
手交差方向に予め配したモータ３４付きの巻取りリール
３５にて巻き取るものである。The winding means 28 consists of an inlet roller 26 and an outlet roller 27, and both rollers 26 and 27 are connected to the support 1, respectively.
4, and is placed in a position that does not interfere with roller 26 on the entry side.
The contact material 15 unwound from the unwinding reel 33 is changed in its moving direction, folded in half into an inverted U-shape, and introduced onto the support 14, and the output roller 27 changes the moving direction again. This allows the contact material 15 to be drawn out and wound up. The motor 34 is equipped with a motor 34 that applies appropriate tension to the contact material 15 between the entry and exit rollers 26 and 27, and has the contact material 15 led out from the exit roller 27 arranged in advance in the longitudinal direction of the support 14. It is wound up with a take-up reel 35.
尚、３６はポンプ、３７はパイプであり、共に図示せぬ
メッキ液管理槽に接続され、メッキ液１６を圧送し循環
させるためのものであり、又３９はメッキ処理槽である
。Note that 36 is a pump, and 37 is a pipe, both of which are connected to a plating solution management tank (not shown), for pumping and circulating the plating solution 16, and 39 is a plating treatment tank.
次に、使用状態を説明する。Next, the usage status will be explained.
モータ３４の回転で出側のローラ２７が回転し、これに
より接触材１５が支持体１４に沿って移動すると共に入
側ローラ２６により接触材１５が２つ折りで逆Ｕ字形状
にされて支持体１４上に導入され且つ出側では、出側ロ
ーラ２７の回転にて接触材１５を適宜長さ支持体１４上
より導出し２つ折りで逆Ｕ字形状の状態を解除して巻取
リリール３５に巻取り、この導入・導出の操作により新
たな「受渡し部」１３が連続的に形成されるものである
。The rotation of the motor 34 causes the output roller 27 to rotate, thereby causing the contact material 15 to move along the support 14, and the contact material 15 to be folded in half into an inverted U-shape by the input roller 26 and attached to the support. 14 and on the exit side, the contact material 15 is led out from the support 14 to an appropriate length by rotation of the exit roller 27, is folded in half to release the inverted U-shaped state, and is transferred to the take-up reel 35. A new "delivery section" 13 is continuously formed by winding and the introduction/removal operations.
そして、メッキされるべきコネクタ端子２が図示せぬ手
段でカソード化されて移動し入側、出側の両ローラ２６
．２７間の有効スパージャ部２９間に位置した状態で、
コネクタ端子２を下降させて左右一対のメッキ対象部４
間にメッキ液供給体１１を介在させた状態にする。Then, the connector terminal 2 to be plated is made into a cathode by a means not shown and moved to the rollers 26 on the inlet side and the outlet side.
．． In a state where the effective sparger part 29 is located between 27 and 29,
By lowering the connector terminal 2, a pair of left and right parts to be plated 4
A plating liquid supply body 11 is interposed between them.
ポンプ３６により圧送されたメッキ液１６は通電されて
いるアノード２３に触れつつ流れ、供給開口３２、通路
２１を経て開口２０より滲出する。そこでメッキ？ｆｊ
、１６は、入側、出側側ローラ２６．２７によりテンシ
ョンの付与されている状態で支持体１４を覆っている接
触材１５に吸収され、接触材１５を浸潤させる。The plating liquid 16 pumped by the pump 36 flows while touching the energized anode 23, passes through the supply opening 32, the passage 21, and oozes out from the opening 20. Plating there? fj
, 16 are absorbed into the contact material 15 covering the support 14 under tension by the inlet and outlet rollers 26, 27, causing the contact material 15 to wet out.
このようにして新鮮なメッキ液１６が常時、適量供給さ
れ滲出している「受渡し部１３」とされている。In this way, a suitable amount of fresh plating solution 16 is constantly supplied and exuded into the "delivery section 13".
この接触材１５、即ちメッキ液供給体１１には、適度の
テンションが加えられていることでいわゆる「たるみ」
がなく、テンションによる張力を以て支持体１４の頂部
１８の形状に良く馴染み、該メッキ対象部４は受渡し部
１３に接触し或いは近接してメッキ液供給体１１の表面
３８（接触材１５の表面）に滲出しているメッキ液１６
を受取り、それがメッキエリアとしてのメッキ対象部４
の全体に均等に施されるものとなる。This contact material 15, that is, the plating liquid supply body 11, has a so-called "sag" due to the application of appropriate tension.
There is no tension, and the shape of the top part 18 of the support body 14 is well adapted to the shape of the top part 18 of the support body 14 due to the tension, and the part to be plated 4 comes into contact with the delivery part 13 or comes close to the surface 38 of the plating liquid supply body 11 (the surface of the contact material 15). Plating solution 16 seeping out
It receives plating target part 4 as plating area.
It will be applied evenly over the entire area.
そして、メッキが終了すると、コネクタ端子２は上昇し
て所定ピンチ移動し、次にメッキされるべきコネクタ端
子２を有効スパージャ部２９間に位置させた後下降させ
再びメッキを施すものである。When plating is completed, the connector terminal 2 is raised and moved by a predetermined pinch, and the connector terminal 2 to be plated next is positioned between the effective sparger portions 29, and then lowered and plated again.
このようにして、接触材１５の上記導入・導出の操作を
行うことにより、メッキ液供給体１１はその特定部分の
みがメッキ対象部４と接触して磨耗することがなく、常
に良好なメッキ液１６の滲出状態を維持し得るものであ
る。In this way, by carrying out the above-mentioned operation of introducing and drawing out the contact material 15, the plating liquid supply body 11 is prevented from being worn out due to only a specific part of the plating liquid supply body 11 coming into contact with the plating target part 4, and a good plating liquid is always maintained. It is possible to maintain the exudation state of 16.
尚、この実施例に於いて、アノード２３は、通路２１の
入口２２近辺に配されている状態のものを説明したが、
これに限定されるものではなく、通路２１内に配しても
、或いは支持体１４そのものをアノード２３としてもよ
いものであり、父上記メッキ液供給体１１の導入・導出
の操作及び新たな「受渡し部Ｊ １３の形成は、常時連
続して行わせても、或いはコネクタ端子２の間欠的移動
に応じて断続的に行わせても良い。In this embodiment, the anode 23 has been described as being disposed near the entrance 22 of the passage 21.
The anode 23 is not limited to this, and may be arranged in the passage 21 or the support 14 itself may be used as the anode 23. The formation of the transfer portion J 13 may be performed continuously at all times, or may be performed intermittently according to the intermittent movement of the connector terminal 2.
〈効 果〉
この発明に係る部分メッキ装置は、以上説明してきた如
き内容のものなので、多くの効果が期待でき、その内の
主なものを列挙すれば以下の通りである。<Effects> Since the partial plating apparatus according to the present invention has the content as described above, many effects can be expected, and the main ones are listed below.
（イ）メッキ対象部のパスラインに対応してテンション
の付与されたメッキ液の受は渡し部が形成され、そこに
は新鮮なメッキ液が常に適量供給されているため、メッ
キ対象部にのみメッキ液を受は渡して、その他の部分に
メッキを施すことがなく、
（ロ）またメッキ対象部にあってもメッキ液供給体を介
して滲出している適量のメッキ液を受取るだけなので、
必要厚さ以上にメッキが施されることがなくその分必要
以上に貴金属を使用することがなく、フォーク状先端部
の左右一対のメッキ対象部それも側面部位のみ意図する
メッキ対象部を含めその近辺までもメッキ液が付着して
メッキ処理が行われてしまう従来技術に比べて、貴金属
の使用量を低減できてコストの低減が達成でき、（ハ）
メッキ液供給体が支持体の長手方向に移動して適宜長さ
巻き取られ、新たなメッキ液の受は渡し部が、その都度
形成されるため、メッキ液供給体の特定部分の磨耗が防
止でき、常に良好なメッキ液の滲出状態を維持し得る、
という効果があり、そして更に各実施例によれば、
（ニ）入側、出側側ローラによるテンションの強さを調
整することで、接触材の内メッキ液の受渡し部となる部
分の「張力」と「厚さ」を調整でき、メッキ対象部間が
微少な間隙であっても、メッキ液供給体がその間に入り
込めるように十分に対応でき、
（ホ）支持体のサイズ、メッキ液供給体の幅サイズ、そ
して更に有効スパージャ部の長さ等の条件を各種、変え
ることにより多様な形状、サイズを有するメッキ物に対
して適用でき、汎用性があるという付随的な効果もある
。(b) The plating solution is tensioned in accordance with the pass line of the part to be plated, and a transfer part is formed there, where an appropriate amount of fresh plating solution is always supplied, so that only the part to be plated is The receiver does not pass the plating solution and plate other parts, and (b) it only receives the appropriate amount of plating solution that has oozed out through the plating solution supply body even if it is on the part to be plated.
Since the plating is not applied to a thickness greater than the required thickness, there is no need to use more precious metal than necessary. Compared to conventional technology, in which the plating process is performed with plating liquid adhering to the surrounding areas, the amount of precious metals used can be reduced and costs can be reduced (c).
The plating solution supply body moves in the longitudinal direction of the support and is wound up to an appropriate length, and a transfer section is formed each time a new plating solution is received, preventing wear on specific parts of the plating solution supply body. can maintain a good plating solution oozing condition at all times.
Furthermore, according to each embodiment, (d) By adjusting the strength of the tension by the inlet and outlet rollers, the "tension" of the inner part of the contact material, which is the delivery part of the plating solution, is reduced. ” and “thickness” can be adjusted, and even if there is a small gap between the parts to be plated, the plating solution supply body can be sufficiently accommodated so that it can fit between them. (e) Size of the support body, plating solution supply body By changing various conditions such as the width of the sparger and the length of the effective sparger part, it can be applied to plated objects having various shapes and sizes, and has the additional effect of being versatile.
第１図は、本発明に係る部分メッキ装置の作動状況を示
す全体斜視断面図、
第２図は、第１図中、矢示■方向よりみた部分断面拡大
図、
第３図は、第１図に於いてメッキ液供給体（接触材）が
２つ折りで且つ逆Ｕ字形状にされ移動する状態を示す概
略平面説明図、そして
第４図は、従来例に於けるメッキ物の概略斜視拡大説明
図である。
１・・・・・・・・メッキ物
２・・・・・・・・フォーク状先端部
（コネクタ端子）
３・・・・・・・・連続帯状部
４・・・・・・・・メッキ対象部
１０・・・・・・・・部分メッキ装置
１１・・・・・・・・メッキ液供給体
１２・・・・・・・・パスライン対応部位１３・・・・
・・・・受渡し部
１４・・・・・・・・支持体
１５・・・・・・・・接触材
１６・・・・・・・・メッキ液
１７・・・・・・・・基板
１８・・・・・・・・頂部
１９・・・・・・・・上端
２０・・・・・・・・開口
２１・・・・・・・・通路
２２・・・・・・・・入口
２３・・・・・・・・アノード
２６・・・・・・・・入側ローラ
２７・・・・・・・・出側ローラ
ＰＬ・・・・・・・パスライン
Ａ・・・・・・・・長手交差方向
第３図FIG. 1 is an overall perspective sectional view showing the operating status of the partial plating apparatus according to the present invention, FIG. 2 is an enlarged partial sectional view of FIG. The figure is a schematic plan view showing a state in which the plating liquid supply body (contact material) is folded in half and moved in an inverted U-shape, and FIG. 4 is a schematic perspective enlarged view of the plated object in the conventional example. It is an explanatory diagram. 1...Plated item 2...Fork-shaped tip (connector terminal) 3...Continuous band-shaped part 4...Plating Target part 10...Partial plating device 11...Plating liquid supply body 12...Pass line corresponding part 13...
...Delivery section 14...Support body 15...Contact material 16...Plating solution 17...Substrate 18 ......Top 19...Top end 20...Opening 21...Passage 22...Entrance 23 ......Anode 26...Inlet roller 27...Outlet roller PL...Pass line A... ...Longitudinal cross direction Figure 3
Claims (1)
右一対の対向するメッキ対象部を有するメッキ物に対し
、そのメッキ対象部のパスラインに沿い且つ左右一対の
両メッキ対象部間に介在させた状態でメッキ液供給体を
配し、そしてこのメッキ液供給体と接触又は近接状態で
移動してゆくメッキ物の各メッキ対象部に電気メッキを
施す部分メッキ装置に於いて、 上記メッキ液供給体は、 頂部の上端又は上端近辺にメッキ液滲出用の開口を有し
、内部にこの開口ヘ連通するメッキ液供給用の通路を有
し基板上に立設されている支持体と、 通路内又は通路の入口近辺に配されているか、若しくは
支持体そのものを形成しているアノードこの支持体に対
し、その長手交差方向より２つ折りで逆Ｕ字形状の状態
で導入され、支持体を被覆しつつその長手方向に移動し
、パスライン対応部位にメッキ液の受渡し部を形成し、
２つ折りで逆Ｕ字形状のまま支持体上から導出されて巻
取り自在とされる接触材と、から形成され、 そして、この接触材を支持体の長手交差方向より支持体
上へ導入・導出する入側及び出側の各ローラを有し入側
・出側各ローラ間で接触材にテンションを付与する巻取
り手段が、メッキ液供給体に組合わせてあることを特徴
とする部分メッキ装置。[Claims] For a plated article having a pair of left and right opposing plating target parts on a fork-shaped tip formed from a plurality of continuous band parts, both the left and right plating parts are plated along the pass line of the plating target part. In a partial plating device, a plating solution supply body is arranged between the target parts, and electroplating is applied to each plating target part of the plating object that moves in contact with or in close proximity to the plating solution supply body. The plating solution supply body has an opening for seeping out the plating solution at or near the upper end of the top part, has a plating solution supply passage communicating with this opening inside, and is erected on the substrate. A support body, and an anode disposed within the passageway or near the entrance of the passageway, or forming the support body itself, are introduced into the support body in an inverted U-shape by being folded in half from the longitudinal direction thereof. , moves in the longitudinal direction of the support while covering it, and forms a plating solution delivery portion at a portion corresponding to the pass line;
A contact material that is folded in half and guided out from above the support in an inverted U-shape and can be freely rolled up, and this contact material is introduced and led out onto the support from the longitudinal direction of the support. A partial plating device comprising a plating liquid supply body and a winding means for applying tension to a contact material between the inlet and outlet rollers. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28121685A JPS62139894A (en) | 1985-12-16 | 1985-12-16 | Partial plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28121685A JPS62139894A (en) | 1985-12-16 | 1985-12-16 | Partial plating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62139894A true JPS62139894A (en) | 1987-06-23 |
| JPH0140116B2 JPH0140116B2 (en) | 1989-08-25 |
Family
ID=17635980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28121685A Granted JPS62139894A (en) | 1985-12-16 | 1985-12-16 | Partial plating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62139894A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011256410A (en) * | 2010-06-07 | 2011-12-22 | Takemi Akimoto | Plating liquid for preventing sulfuration discoloration on silver surface |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101598254B1 (en) * | 2013-11-14 | 2016-02-26 | 이성호 | Sweeping Robot for Outdoor |
| JP7321860B2 (en) | 2019-09-26 | 2023-08-07 | 株式会社マキタ | battery pack |
-
1985
- 1985-12-16 JP JP28121685A patent/JPS62139894A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011256410A (en) * | 2010-06-07 | 2011-12-22 | Takemi Akimoto | Plating liquid for preventing sulfuration discoloration on silver surface |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0140116B2 (en) | 1989-08-25 |
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