JPS62117761A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS62117761A JPS62117761A JP60256538A JP25653885A JPS62117761A JP S62117761 A JPS62117761 A JP S62117761A JP 60256538 A JP60256538 A JP 60256538A JP 25653885 A JP25653885 A JP 25653885A JP S62117761 A JPS62117761 A JP S62117761A
- Authority
- JP
- Japan
- Prior art keywords
- conductive layer
- conductor layer
- layer
- thermal head
- corrosion resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims abstract description 92
- 238000005260 corrosion Methods 0.000 claims abstract description 19
- 230000007797 corrosion Effects 0.000 claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 238000005530 etching Methods 0.000 claims abstract description 9
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 8
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 8
- 239000011241 protective layer Substances 0.000 claims abstract description 5
- 239000004020 conductor Substances 0.000 claims description 58
- 229910000838 Al alloy Inorganic materials 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 4
- 230000003647 oxidation Effects 0.000 abstract description 3
- 238000007254 oxidation reaction Methods 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Adjustable Resistors (AREA)
- Electronic Switches (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の概要〕
本発明は抵抗体を加熱するための導体に高耐食性材料及
び低比抵抗材料を用いた高耐食性のサーマルヘッドを提
供する。DETAILED DESCRIPTION OF THE INVENTION [Summary of the Invention] The present invention provides a highly corrosion-resistant thermal head using a highly corrosion-resistant material and a low resistivity material for a conductor for heating a resistor.
本発明は熱記録装置あるいは熱転写記録装置に用いられ
るサーマルヘッドに関する。The present invention relates to a thermal head used in a thermal recording device or a thermal transfer recording device.
サーマルヘッドは主に基板、発熱用抵抗体及び該発熱用
抵抗体加熱用の導体（ソード線）からなる。The thermal head mainly includes a substrate, a heat generating resistor, and a conductor (sword wire) for heating the heat generating resistor.
第３図は従来のサーマルヘッドの要部断面図である。FIG. 3 is a sectional view of a main part of a conventional thermal head.
第３図に示すように、アルミナ等め絶縁基板１上に断熱
グレーズ（ガラス）層２、更にＴａｚＮ等からなる発熱
用抵抗体層３、そしてその上に主にｆｉ、ｌからなる導
体層（リード線）４、更に例えば５ｉｎ２、ＴａｚＯｓ
２層膜からなる保護層５が設けられている。As shown in FIG. 3, on an insulating substrate 1 made of alumina or the like, there is a heat insulating glaze (glass) layer 2, a heating resistor layer 3 made of TazN or the like, and on top of that a conductor layer (mainly made of fi, l). Lead wire) 4, further for example 5in2, TazOs
A protective layer 5 made of a two-layer film is provided.
導体として用いられるＡｆは高温、高湿下での耐食性に
劣り記録のために電圧を印加すると例えば７ａ 、７ｂ
、で示すような腐食現象を生ずる。Af used as a conductor has poor corrosion resistance under high temperature and high humidity, and when a voltage is applied for recording, for example, 7a, 7b
Corrosion phenomena as shown in , occur.
そのため導体層４下方の発熱用抵抗体層３が酸化し断線
クランク等の問題を生じていた。As a result, the heating resistor layer 3 below the conductor layer 4 is oxidized, causing problems such as disconnection of the crank.
本発明は単純な構造でしかも実用上問題のない耐食性を
有するサーマルヘッドを提供するこ゛とを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to provide a thermal head that has a simple structure and has corrosion resistance that causes no problems in practical use.
上記問題点は本発明によれば絶縁基板と、該絶縁基板上
に形成された断熱層と、該断熱層上に形成されたストラ
イプ状抵抗体層と該抵抗体層上に形成された保護層と、
該抵抗体層に電力を供給するためのストライプ状導体層
とを具備するサーマルヘッドにおいて、
前記導体層が耐食性に優れた第１導体層と、該第１導体
層上に形成され該第１導体よりも耐食性は劣るが比抵抗
が低い第２導体からなり、しかもストライプ状の第１導
体層と第２導体層の一部を除去することを特徴とするサ
ーマルヘッドによって解決される。According to the present invention, the above problems are solved by an insulating substrate, a heat insulating layer formed on the insulating substrate, a striped resistor layer formed on the heat insulating layer, and a protective layer formed on the resistor layer. and,
A thermal head comprising a striped conductor layer for supplying power to the resistor layer, wherein the conductor layer includes a first conductor layer having excellent corrosion resistance, and a first conductor layer formed on the first conductor layer and having a striped conductor layer. The problem can be solved by a thermal head which is made of a second conductor having a lower specific resistance but less corrosion resistance than the first conductor layer, and which is characterized by removing a part of the striped first conductor layer and second conductor layer.
すなわち本発明では従来のＡ１等の耐食性の問題を除去
するためにＡｌとＡｆ塩以外高耐食性材料を組み合せて
改良されたサーマルヘッドを得るものである。That is, in the present invention, an improved thermal head is obtained by combining highly corrosion resistant materials other than Al and Af salts in order to eliminate the problems with corrosion resistance of conventional A1 and the like.
耐食性の高い金属である例えばＷ、Ｔｉ等はＡｎに比較
して比抵抗が高いためにワイヤポンディグができず、ま
た比抵抗が高い。そこで耐食性が高いＷあるいはＴｉ上
に耐食性は劣るが比抵抗が低いＡＪを重ねた導体層を形
成すればたとえＡＪ２が腐食したとしてもＷあるいはＴ
ｉが残るため耐食性はほぼ満足されかつＡ１が配設され
ているためボンディングが容易となる。Metals with high corrosion resistance, such as W and Ti, have a higher resistivity than An, so wire bonding is not possible, and the resistivity is also high. Therefore, if a conductor layer is formed by layering AJ, which has poor corrosion resistance but low specific resistance, on top of W or Ti, which has high corrosion resistance, even if AJ2 corrodes, W or Ti
Since i remains, the corrosion resistance is almost satisfied, and since A1 is provided, bonding becomes easy.
以下上記本発明に係るＷあるいはＴｉ等の第１導体層と
ＡＪ等の第２導体層の配設法を第２Ａ図、第２Ｂ図を用
いて説明する。Hereinafter, a method of disposing a first conductor layer such as W or Ti and a second conductor layer such as AJ according to the present invention will be explained with reference to FIGS. 2A and 2B.
第２Ａ図において絶縁基板１上に、順に断熱グレーズ層
２、抵抗体層３、第１導体層４ａ（−１Ｔｉ）、第２導
体層４ｂ（、ｌ）そして保護層５が配設されている。In FIG. 2A, a heat insulating glaze layer 2, a resistor layer 3, a first conductor layer 4a (-1Ti), a second conductor layer 4b (, l), and a protective layer 5 are disposed in this order on an insulating substrate 1. .
従来のエツチング工程に準するならば第２導体１４ｂを
エツチングした後、第１導体層４ａをエツチングするの
で第２Ａ図に示すように第１導体層４ａは第２導体層４
ｂに比較してエツジが後退（＾）している。もしも第２
導体ＩＪ４ｂが第２８図Ｂのように腐食されると発熱ド
ツトのエツジ部の抵抗体が酸化され断線不良となる場合
がある。このＢ部は動作時に高温となるために酸化が著
しく早い。According to the conventional etching process, the first conductor layer 4a is etched after the second conductor 14b is etched, so that the first conductor layer 4a becomes the second conductor layer 4 as shown in FIG. 2A.
The edges are retreating (^) compared to b. If the second
If the conductor IJ4b corrodes as shown in FIG. 28B, the resistor at the edge of the heating dot may be oxidized, resulting in disconnection. Since this part B reaches a high temperature during operation, oxidation is extremely rapid.
従ってこのようなエツジ部Ｂの酸化を防止するために後
述する第１図に示すように第１導体層のエツジを第２導
体層のエツジより少し延伸させることが好ましい。この
構造は第１導体層をエツチングした後に第２導体層をエ
ツチングすることにより可能である。Therefore, in order to prevent such oxidation of the edge portion B, it is preferable to extend the edge of the first conductor layer a little more than the edge of the second conductor layer, as shown in FIG. 1, which will be described later. This structure is possible by etching the first conductor layer and then etching the second conductor layer.
以下本発明の実施例を図面に基づいて説明する。 Embodiments of the present invention will be described below based on the drawings.
第１図は本発明の詳細な説明するための断面図である。FIG. 1 is a sectional view for explaining the present invention in detail.
第１図に示すようにグレーズドアルミナ絶縁基板１上に
断熱グレーズ（ガラス）層２を約５０μｍの厚さに配設
し、更に抵抗体層３としてＴａｔＮを約３００人の厚さ
に、そして第１導体層４ａとしてＷを約４０００人の厚
さに、またその上に第２導体層４ｂとしてＡＩ！を約３
μｍの厚さにそれぞれスパツタ法によって形成した。第
２導体層４ａ、第１導体層４ｂそして抵抗体３を順にス
トライプ状にパターニングした後、一部の第１導体層と
第２導体層４ｂをエツチングして発熱ドツトを形成した
。As shown in FIG. 1, a heat insulating glaze (glass) layer 2 with a thickness of about 50 μm is disposed on a glazed alumina insulating substrate 1, and a TatN layer 3 with a thickness of about 300 μm is further formed as a resistor layer 3. The first conductor layer 4a is made of W to a thickness of approximately 4000 mm, and the second conductor layer 4b is made of AI! about 3
Each layer was formed to a thickness of μm by a sputtering method. After sequentially patterning the second conductor layer 4a, first conductor layer 4b, and resistor 3 into a stripe shape, a portion of the first conductor layer and second conductor layer 4b was etched to form heating dots.
この発熱ドツトの形成に際し第２導体層４ｂであるＡｊ
２又はＡ１合金、第１導体層４ａであるＷ又はＴｉ又は
ＷとＴｉをエツチングした後、再びＡｌをエツチングし
Ａｌのエツジを３〜５μｍ後退させた。When forming this heating dot, Aj, which is the second conductor layer 4b,
After etching W or Ti, or W and Ti, which is the first conductor layer 4a, Al was etched again, and the edge of the Al was recessed by 3 to 5 μm.
以上説明したように本発明によれば単純な構成でしかも
耐食性に優れたサーマルヘッドを得ることができる。As explained above, according to the present invention, it is possible to obtain a thermal head with a simple structure and excellent corrosion resistance.
第１図は本発明の一実施例を説明するための要部断面図
であり、第２Ａ図、及び第２Ｂ図は導体層のエツジ部の
エツチング方法を説明するための要部断面図であり、第
３図は従来のサーマルヘッドの要部断面図である。
１・・・絶縁基板、 ２・・・断熱グレーズ層３
・・・抵抗体層、 ４・・・導体層、４ａ・・・
第１導体層、 ４ｂ・・・第２導体層、５・・・保ＩＬFIG. 1 is a cross-sectional view of a main part for explaining one embodiment of the present invention, and FIGS. 2A and 2B are cross-sectional views of a main part for explaining a method of etching an edge portion of a conductor layer. , FIG. 3 is a sectional view of a main part of a conventional thermal head. 1... Insulating substrate, 2... Heat insulating glaze layer 3
...Resistor layer, 4...Conductor layer, 4a...
1st conductor layer, 4b... 2nd conductor layer, 5... protection IL
Claims (1)
該断熱層上に形成されたストライプ状抵抗体層と該抵抗
体層上に形成された保護層と、該抵抗体層に電力を供給
するためのストライプ状導体層とを具備するサーマルヘ
ッドにおいて、前記導体層が耐食性に優れた第１導体層
と、該第１導体層上に形成され該第１導体層よりも耐食
性は劣るが比抵抗が低い第２導体からなり、しかもスト
ライプ状の第１導体層と第２導体層の一部を除去するこ
とを特徴とするサーマルヘッド。 ２、前記第１導体層が前記第２導体層より１〜１０μｍ
延伸するように除去される特許請求の範囲第１項記載の
サーマルヘッド。 ３、前記第１導体層と第２導体層の一部の除去が該第２
導体層そして該第１導体層を順にエッチングした後、再
び該第２導体層をエッチングすることにより行なう特許
請求の範囲第１項記載のサーマルヘッド。 ４、前記第１導体層がタングステン、チタンのうちの少
なくとも１つからなる特許請求の範囲第１項記載のサー
マルヘッド。 ５、前記第２導体層がアルミニウム又はアルミニウム合
金である特許請求の範囲第１項記載のサーマルヘッド。[Claims] 1. An insulating substrate, a heat insulating layer formed on the insulating substrate,
A thermal head comprising a striped resistor layer formed on the heat insulating layer, a protective layer formed on the resistor layer, and a striped conductor layer for supplying power to the resistor layer, The conductor layer includes a first conductor layer having excellent corrosion resistance, and a second conductor formed on the first conductor layer and having lower resistivity but inferior corrosion resistance than the first conductor layer. A thermal head characterized in that a conductor layer and a part of a second conductor layer are removed. 2. The first conductor layer is 1 to 10 μm wider than the second conductor layer.
The thermal head according to claim 1, which is removed in a stretching manner. 3. Removal of a portion of the first conductor layer and the second conductor layer
2. The thermal head according to claim 1, wherein said thermal head is etched by sequentially etching said conductor layer and said first conductor layer, and then etching said second conductor layer again. 4. The thermal head according to claim 1, wherein the first conductor layer is made of at least one of tungsten and titanium. 5. The thermal head according to claim 1, wherein the second conductor layer is made of aluminum or an aluminum alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60256538A JPS62117761A (en) | 1985-11-18 | 1985-11-18 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60256538A JPS62117761A (en) | 1985-11-18 | 1985-11-18 | Thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62117761A true JPS62117761A (en) | 1987-05-29 |
| JPH0434945B2 JPH0434945B2 (en) | 1992-06-09 |
Family
ID=17294016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60256538A Granted JPS62117761A (en) | 1985-11-18 | 1985-11-18 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62117761A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54125044A (en) * | 1978-03-22 | 1979-09-28 | Matsushita Electric Ind Co Ltd | Thin film type thermal head |
| JPS59156764A (en) * | 1983-02-25 | 1984-09-06 | Tdk Corp | Thermal head |
-
1985
- 1985-11-18 JP JP60256538A patent/JPS62117761A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54125044A (en) * | 1978-03-22 | 1979-09-28 | Matsushita Electric Ind Co Ltd | Thin film type thermal head |
| JPS59156764A (en) * | 1983-02-25 | 1984-09-06 | Tdk Corp | Thermal head |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0434945B2 (en) | 1992-06-09 |
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