JPS6210940B2 - - Google Patents

Info

Publication number: JPS6210940B2
Authority: JP; Japan
Prior art keywords: glass; composition; powder; cao; zno
Prior art date: 1979-02-22
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired

Application number

JP54019089A

Other languages

English (en)

Japanese (ja)

Other versions

JPS55113641A (en

Inventor

Yoshinori Kokubu

Jiro Chiba

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

AGC Inc

Original Assignee

Asahi Glass Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1979-02-22

Filing date

1979-02-22

Publication date

1987-03-09

1979-02-22 Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd

1979-02-22 Priority to JP1908979A priority Critical patent/JPS55113641A/ja

1980-09-02 Publication of JPS55113641A publication Critical patent/JPS55113641A/ja

1987-03-09 Publication of JPS6210940B2 publication Critical patent/JPS6210940B2/ja

Status Granted legal-status Critical Current

Links

239000011521 glass Substances 0.000 claims description 55
239000000203 mixture Substances 0.000 claims description 29
239000000843 powder Substances 0.000 claims description 22
239000000945 filler Substances 0.000 claims description 17
238000010438 heat treatment Methods 0.000 claims description 16
PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 14
229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 10
LTPBRCUWZOMYOC-UHFFFAOYSA-N Beryllium oxide Chemical compound O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 claims description 10
229910004298 SiO 2 Inorganic materials 0.000 claims description 9
229910010413 TiO 2 Inorganic materials 0.000 claims description 7
239000013078 crystal Substances 0.000 claims description 7
MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 6
238000002156 mixing Methods 0.000 claims description 5
229910015902 Bi 2 O 3 Inorganic materials 0.000 claims description 4
229910006404 SnO 2 Inorganic materials 0.000 claims description 4
229910052661 anorthite Inorganic materials 0.000 claims description 3
229910052878 cordierite Inorganic materials 0.000 claims description 3
GWWPLLOVYSCJIO-UHFFFAOYSA-N dialuminum;calcium;disilicate Chemical compound [Al+3].[Al+3].[Ca+2].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] GWWPLLOVYSCJIO-UHFFFAOYSA-N 0.000 claims description 3
JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 claims description 3
229910052845 zircon Inorganic materials 0.000 claims description 3
GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 claims description 3
239000002244 precipitate Substances 0.000 claims 2
239000010410 layer Substances 0.000 description 12
238000002425 crystallisation Methods 0.000 description 11
230000008025 crystallization Effects 0.000 description 11
238000010304 firing Methods 0.000 description 10
239000004020 conductor Substances 0.000 description 9
GWEVSGVZZGPLCZ-UHFFFAOYSA-N titanium dioxide Inorganic materials O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 5
239000002245 particle Substances 0.000 description 4
MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
239000011248 coating agent Substances 0.000 description 3
238000000576 coating method Methods 0.000 description 3
238000007639 printing Methods 0.000 description 3
239000000758 substrate Substances 0.000 description 3
238000004017 vitrification Methods 0.000 description 3
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
230000000694 effects Effects 0.000 description 2
230000004907 flux Effects 0.000 description 2
MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 description 2
238000004519 manufacturing process Methods 0.000 description 2
238000000034 method Methods 0.000 description 2
239000002002 slurry Substances 0.000 description 2
230000007704 transition Effects 0.000 description 2
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 1
VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
239000001856 Ethyl cellulose Substances 0.000 description 1
ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
239000000020 Nitrocellulose Substances 0.000 description 1
FJWGYAHXMCUOOM-QHOUIDNNSA-N [(2s,3r,4s,5r,6r)-2-[(2r,3r,4s,5r,6s)-4,5-dinitrooxy-2-(nitrooxymethyl)-6-[(2r,3r,4s,5r,6s)-4,5,6-trinitrooxy-2-(nitrooxymethyl)oxan-3-yl]oxyoxan-3-yl]oxy-3,5-dinitrooxy-6-(nitrooxymethyl)oxan-4-yl] nitrate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O)O[C@H]1[C@@H]([C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@@H](CO[N+]([O-])=O)O1)O[N+]([O-])=O)CO[N+](=O)[O-])[C@@H]1[C@@H](CO[N+]([O-])=O)O[C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O FJWGYAHXMCUOOM-QHOUIDNNSA-N 0.000 description 1
239000002253 acid Substances 0.000 description 1
OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 1
229940088601 alpha-terpineol Drugs 0.000 description 1
239000011230 binding agent Substances 0.000 description 1
239000000919 ceramic Substances 0.000 description 1
239000003795 chemical substances by application Substances 0.000 description 1
239000011247 coating layer Substances 0.000 description 1
229910052681 coesite Inorganic materials 0.000 description 1
238000000748 compression moulding Methods 0.000 description 1
238000007796 conventional method Methods 0.000 description 1
229910052593 corundum Inorganic materials 0.000 description 1
229910052906 cristobalite Inorganic materials 0.000 description 1
230000006866 deterioration Effects 0.000 description 1
229920001249 ethyl cellulose Polymers 0.000 description 1
235000019325 ethyl cellulose Nutrition 0.000 description 1
229960004667 ethyl cellulose Drugs 0.000 description 1
230000009477 glass transition Effects 0.000 description 1
230000017525 heat dissipation Effects 0.000 description 1
239000011810 insulating material Substances 0.000 description 1
229940117955 isoamyl acetate Drugs 0.000 description 1
238000002844 melting Methods 0.000 description 1
230000008018 melting Effects 0.000 description 1
239000006060 molten glass Substances 0.000 description 1
229920001220 nitrocellulos Polymers 0.000 description 1
229940079938 nitrocellulose Drugs 0.000 description 1
235000006408 oxalic acid Nutrition 0.000 description 1
238000001556 precipitation Methods 0.000 description 1
238000010298 pulverizing process Methods 0.000 description 1
239000002994 raw material Substances 0.000 description 1
230000009257 reactivity Effects 0.000 description 1
238000007650 screen-printing Methods 0.000 description 1
239000000377 silicon dioxide Substances 0.000 description 1
235000012239 silicon dioxide Nutrition 0.000 description 1
229910002076 stabilized zirconia Inorganic materials 0.000 description 1
229910052682 stishovite Inorganic materials 0.000 description 1
239000000126 substance Substances 0.000 description 1
230000003746 surface roughness Effects 0.000 description 1
238000002076 thermal analysis method Methods 0.000 description 1
229910052905 tridymite Inorganic materials 0.000 description 1
230000004580 weight loss Effects 0.000 description 1
229910001845 yogo sapphire Inorganic materials 0.000 description 1

Landscapes

Glass Compositions (AREA)
Non-Metallic Protective Coatings For Printed Circuits (AREA)
Structure Of Printed Boards (AREA)
Inorganic Insulating Materials (AREA)

JP1908979A 1979-02-22 1979-02-22 Insulating glass composition Granted JPS55113641A (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
JP1908979A JPS55113641A (en)	1979-02-22	1979-02-22	Insulating glass composition

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP1908979A JPS55113641A (en)	1979-02-22	1979-02-22	Insulating glass composition

Publications (2)

Publication Number	Publication Date
JPS55113641A JPS55113641A (en)	1980-09-02
JPS6210940B2 true JPS6210940B2 (ru)	1987-03-09

Family

ID=11989721

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP1908979A Granted JPS55113641A (en)	1979-02-22	1979-02-22	Insulating glass composition

Country Status (1)

Country	Link
JP (1)	JPS55113641A (ru)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4349635A (en) *	1981-10-26	1982-09-14	Motorola, Inc.	Lower temperature glass and hermetic seal means and method
US4417913A (en) *	1981-10-26	1983-11-29	Motorola, Inc.	Lower temperature glass and hermetic seal means and method
JPS59130005A (ja) *	1983-01-18	1984-07-26	旭硝子株式会社	厚膜回路絶縁層用組成物
JPS60235744A (ja) *	1984-05-04	1985-11-22	Asahi Glass Co Ltd	セラミック基板用組成物
US4863517A (en) *	1987-08-20	1989-09-05	General Electric Company	Via fill ink composition for integrated circuits
US4788163A (en) *	1987-08-20	1988-11-29	General Electric Company	Devitrifying glass frits
JPH07101774B2 (ja) *	1988-09-21	1995-11-01	日本電装株式会社	集積回路装置
KR100592603B1 (ko) *	2002-05-20	2006-06-23	엔지케이 스파크 플러그 캄파니 리미티드	유전체 자기
JP7185181B2 (ja) *	2018-10-04	2022-12-07	日本電気硝子株式会社	半導体素子被覆用ガラス及びこれを用いた半導体被覆用材料

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS4962526A (ru) *	1972-06-14	1974-06-18

1979
- 1979-02-22 JP JP1908979A patent/JPS55113641A/ja active Granted

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS4962526A (ru) *	1972-06-14	1974-06-18

Also Published As

Publication number	Publication date
JPS55113641A (en)	1980-09-02

Publication	Publication Date	Title
US3848079A (en)	1974-11-12	Pointed circuits with crystallized glass low k crossover dielectrics
JPH03197333A (ja)	1991-08-28	結晶化可能なガラス及びその厚膜組成物
JPS6331422B2 (ru)	1988-06-23
US3950174A (en)	1976-04-13	Electrically insulating coating glass
US3816172A (en)	1974-06-11	Nonreducible partially crystallized crossover dielectrics
JPS6218494B2 (ru)	1987-04-23
JPS6210940B2 (ru)	1987-03-09
JP2521124B2 (ja)	1996-07-31	電子パッキング用のガラス−セラミックス、それに用いる熱的に結晶可能なガラス、および同ガラス−セラミックスを用いた基板
US3684536A (en)	1972-08-15	Bismuthate glass-ceramic precursor compositions
US3741780A (en)	1973-06-26	Metallizing compositions containing bismuthate glass-ceramic conductor binder
JP3096136B2 (ja)	2000-10-10	低温焼成基板用ガラス組成物およびそれから得られる基板
JPS59207851A (ja)	1984-11-26	多層回路内の誘電ガラス及びそれを含む厚膜回路
JPS62278145A (ja)	1987-12-03	ガラスセラミツク焼結体
JPS636499B2 (ru)	1988-02-10
JPS58156552A (ja)	1983-09-17	絶縁性セラミツクペ−スト用無機組成物
JPS63107838A (ja)	1988-05-12	ガラスセラミツク焼結体
JPS5983957A (ja)	1984-05-15	結晶化ガラス体
JP2713376B2 (ja)	1998-02-16	絶縁層用ガラス組成物
JPH01141837A (ja)	1989-06-02	回路基板用誘電体材料
JPS62137897A (ja)	1987-06-20	絶縁層用組成物
JPH0452561B2 (ru)	1992-08-24
JPS6379739A (ja)	1988-04-09	ガラスセラミツク焼結体
JPS6350345A (ja)	1988-03-03	ガラスセラミツク焼結体
JPS6243937B2 (ru)	1987-09-17
JPS6221739B2 (ru)	1987-05-14