JPS55113641A - Insulating glass composition - Google Patents
Insulating glass compositionInfo
- Publication number
- JPS55113641A JPS55113641A JP1908979A JP1908979A JPS55113641A JP S55113641 A JPS55113641 A JP S55113641A JP 1908979 A JP1908979 A JP 1908979A JP 1908979 A JP1908979 A JP 1908979A JP S55113641 A JPS55113641 A JP S55113641A
- Authority
- JP
- Japan
- Prior art keywords
- glass
- insulating glass
- calcination
- cao
- zno
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To obtain insulating glass with superior electrical properties by low temp. calcination by adding a refractory filler to SiO2-Al2O3-CaO-ZnO-TiO2-B2O3 type glass of a specified compsn. with respect to a glass compsn. for crossing over a thick film integrated circuit.
CONSTITUTION: 15wt% or less of powder of one or more kinds of refractory fillers selected from alumina, zirconium, cordierite, zirconia and beryllia is mixed into glass powder consisting of, by weight, SiO2 20W45%, Al2O3 5W25%, CaO 5W25%, ZnO 15.5W30%, TiO2 5W20%, B2O3 1W8%, BaO 0W10%, SrO 0W10%, Sb2O3 0W3%, SnO2 0W3% and Bi2O3 0W3% and capable of being crystallized by heat treatment at below 850°C. Thus, by low temp. calcination insulating glass is obtd. which is excellent in electric resistance, dielectric constant, dielectric loss, etc. and has high heat conductivity.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1908979A JPS55113641A (en) | 1979-02-22 | 1979-02-22 | Insulating glass composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1908979A JPS55113641A (en) | 1979-02-22 | 1979-02-22 | Insulating glass composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55113641A true JPS55113641A (en) | 1980-09-02 |
JPS6210940B2 JPS6210940B2 (en) | 1987-03-09 |
Family
ID=11989721
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1908979A Granted JPS55113641A (en) | 1979-02-22 | 1979-02-22 | Insulating glass composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55113641A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4349635A (en) * | 1981-10-26 | 1982-09-14 | Motorola, Inc. | Lower temperature glass and hermetic seal means and method |
US4417913A (en) * | 1981-10-26 | 1983-11-29 | Motorola, Inc. | Lower temperature glass and hermetic seal means and method |
JPS59130005A (en) * | 1983-01-18 | 1984-07-26 | 旭硝子株式会社 | Composition for thick film circuit insulating layer |
JPS60235744A (en) * | 1984-05-04 | 1985-11-22 | Asahi Glass Co Ltd | Composition for ceramic base |
US4788163A (en) * | 1987-08-20 | 1988-11-29 | General Electric Company | Devitrifying glass frits |
US4863517A (en) * | 1987-08-20 | 1989-09-05 | General Electric Company | Via fill ink composition for integrated circuits |
JPH0284795A (en) * | 1988-09-21 | 1990-03-26 | Nippon Denso Co Ltd | Integrated circuit device |
EP1364920A1 (en) * | 2002-05-20 | 2003-11-26 | Ngk Spark Plug Co., Ltd | Dielectric ceramic |
WO2020071093A1 (en) * | 2018-10-04 | 2020-04-09 | 日本電気硝子株式会社 | Semiconductor element coating glass and semiconductor coating material using same |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4962526A (en) * | 1972-06-14 | 1974-06-18 |
-
1979
- 1979-02-22 JP JP1908979A patent/JPS55113641A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4962526A (en) * | 1972-06-14 | 1974-06-18 |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4349635A (en) * | 1981-10-26 | 1982-09-14 | Motorola, Inc. | Lower temperature glass and hermetic seal means and method |
WO1983001442A1 (en) * | 1981-10-26 | 1983-04-28 | Motorola Inc | Lower temperature glass and hermetic seal means and method |
US4417913A (en) * | 1981-10-26 | 1983-11-29 | Motorola, Inc. | Lower temperature glass and hermetic seal means and method |
JPH0452561B2 (en) * | 1983-01-18 | 1992-08-24 | Asahi Glass Co Ltd | |
JPS59130005A (en) * | 1983-01-18 | 1984-07-26 | 旭硝子株式会社 | Composition for thick film circuit insulating layer |
JPS60235744A (en) * | 1984-05-04 | 1985-11-22 | Asahi Glass Co Ltd | Composition for ceramic base |
JPH0411495B2 (en) * | 1984-05-04 | 1992-02-28 | ||
US4788163A (en) * | 1987-08-20 | 1988-11-29 | General Electric Company | Devitrifying glass frits |
US4863517A (en) * | 1987-08-20 | 1989-09-05 | General Electric Company | Via fill ink composition for integrated circuits |
JPH0284795A (en) * | 1988-09-21 | 1990-03-26 | Nippon Denso Co Ltd | Integrated circuit device |
EP1364920A1 (en) * | 2002-05-20 | 2003-11-26 | Ngk Spark Plug Co., Ltd | Dielectric ceramic |
EP1498396A1 (en) * | 2002-05-20 | 2005-01-19 | Ngk Spark Plug Co., Ltd | Dielectric ceramic |
US6852655B2 (en) * | 2002-05-20 | 2005-02-08 | Ngk Spark Plug Co., Ltd. | Dielectric ceramic |
WO2020071093A1 (en) * | 2018-10-04 | 2020-04-09 | 日本電気硝子株式会社 | Semiconductor element coating glass and semiconductor coating material using same |
Also Published As
Publication number | Publication date |
---|---|
JPS6210940B2 (en) | 1987-03-09 |
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