JPH0166763U - - Google Patents
Info
- Publication number
- JPH0166763U JPH0166763U JP16205087U JP16205087U JPH0166763U JP H0166763 U JPH0166763 U JP H0166763U JP 16205087 U JP16205087 U JP 16205087U JP 16205087 U JP16205087 U JP 16205087U JP H0166763 U JPH0166763 U JP H0166763U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- terminal
- board
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Description
第１図は本考案の一実施例を示す斜視図、第２
図は本考案の端子盤のプリント基板への実装状態
を示す側断面図、第３図は従来の端子盤の斜視図
、第４図は従来の端子盤の実装状態を示す側断面
図である。
１……半田付け端子（接続端子）、２……プリ
ント基板、３……スルーホール、４……外部端子
、５……リード、５ａ……突起部、６……端子盤
母体。
Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is a side sectional view showing the terminal board of the present invention mounted on a printed circuit board, FIG. 3 is a perspective view of a conventional terminal board, and FIG. 4 is a side sectional view showing the conventional terminal board mounted. . 1...Soldering terminal (connection terminal), 2...Printed circuit board, 3...Through hole, 4...External terminal, 5...Lead, 5a...Protrusion, 6...Terminal board base.
Claims (1)
る端子盤において、外部への接続端子一つにつき
、プリント基板へ接続する接続端子先端のリード
を複数設け、該複数のリードを端子盤のプリント
基板への実装面の略中央より突出させると共に、
上記少なくとも一つのリードの先端にプリント基
板のスルーホールに係合する突起部を設けたこと
を特徴とするプリント基板用端子盤。 In a terminal board used for electrical connection to the outside of a printed circuit board, for each external connection terminal, multiple leads are provided at the tip of the connection terminal that connects to the printed circuit board, and the multiple leads are connected to the printed circuit board of the terminal board. protrudes from approximately the center of the mounting surface, and
A terminal board for a printed circuit board, characterized in that the tip of at least one lead is provided with a protrusion that engages with a through hole of the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16205087U JPH0166763U (en) | 1987-10-23 | 1987-10-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16205087U JPH0166763U (en) | 1987-10-23 | 1987-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0166763U true JPH0166763U (en) | 1989-04-28 |
Family
ID=31445527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16205087U Pending JPH0166763U (en) | 1987-10-23 | 1987-10-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0166763U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0350761U (en) * | 1989-09-25 | 1991-05-17 |
-
1987
- 1987-10-23 JP JP16205087U patent/JPH0166763U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0350761U (en) * | 1989-09-25 | 1991-05-17 |