JPS6157715B2 - - Google Patents
Info
- Publication number
- JPS6157715B2 JPS6157715B2 JP3822779A JP3822779A JPS6157715B2 JP S6157715 B2 JPS6157715 B2 JP S6157715B2 JP 3822779 A JP3822779 A JP 3822779A JP 3822779 A JP3822779 A JP 3822779A JP S6157715 B2 JPS6157715 B2 JP S6157715B2
- Authority
- JP
- Japan
- Prior art keywords
- chips
- same
- semiconductor device
- sample
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 34
- 230000010355 oscillation Effects 0.000 claims description 16
- 238000010586 diagram Methods 0.000 description 9
- 230000005669 field effect Effects 0.000 description 8
- 238000005259 measurement Methods 0.000 description 6
- 239000008186 active pharmaceutical agent Substances 0.000 description 5
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 230000000644 propagated effect Effects 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
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Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Junction Field-Effect Transistors (AREA)
- Wire Bonding (AREA)
Description
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Claims (1)
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Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3822779A JPS55130178A (en) | 1979-03-30 | 1979-03-30 | Semiconductor device |
DE8080300869T DE3068001D1 (en) | 1979-03-30 | 1980-03-20 | A semiconductor device having a plurality of semiconductor chip portions |
EP19800300869 EP0018091B1 (en) | 1979-03-30 | 1980-03-20 | A semiconductor device having a plurality of semiconductor chip portions |
US06/135,182 US4359754A (en) | 1979-03-30 | 1980-03-28 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3822779A JPS55130178A (en) | 1979-03-30 | 1979-03-30 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55130178A JPS55130178A (en) | 1980-10-08 |
JPS6157715B2 true JPS6157715B2 (ja) | 1986-12-08 |
Family
ID=12519413
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3822779A Granted JPS55130178A (en) | 1979-03-30 | 1979-03-30 | Semiconductor device |
Country Status (4)
Country | Link |
---|---|
US (1) | US4359754A (ja) |
EP (1) | EP0018091B1 (ja) |
JP (1) | JPS55130178A (ja) |
DE (1) | DE3068001D1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0195826U (ja) * | 1987-12-17 | 1989-06-26 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56147461A (en) * | 1980-04-17 | 1981-11-16 | Nec Corp | Semiconductor device |
US4518982A (en) * | 1981-02-27 | 1985-05-21 | Motorola, Inc. | High current package with multi-level leads |
US4536469A (en) * | 1981-11-23 | 1985-08-20 | Raytheon Company | Semiconductor structures and manufacturing methods |
JPH0758782B2 (ja) * | 1986-03-19 | 1995-06-21 | æ ªåŒäŒç€Ÿæ±è | åå°äœè£ 眮 |
JPH088269B2 (ja) * | 1986-10-22 | 1996-01-29 | ã·ãŒã¡ã³ã¹ãã¢ã¯ããšã³ã²ãŒã«ã·ã€ãã | åå°äœããã€ã¹ |
US5060048A (en) * | 1986-10-22 | 1991-10-22 | Siemens Aktiengesellschaft & Semikron GmbH | Semiconductor component having at least one power mosfet |
US5283452A (en) * | 1992-02-14 | 1994-02-01 | Hughes Aircraft Company | Distributed cell monolithic mircowave integrated circuit (MMIC) field-effect transistor (FET) amplifier |
JP3287279B2 (ja) | 1997-09-25 | 2002-06-04 | æ¥æ¬é»æ°æ ªåŒäŒç€Ÿ | åå°äœããããããã³è©²åå°äœããããå®è£ ãããåå°äœè£ 眮 |
US5998817A (en) * | 1997-11-03 | 1999-12-07 | Raytheon Company | High power prematched MMIC transistor with improved ground potential continuity |
US6169331B1 (en) | 1998-08-28 | 2001-01-02 | Micron Technology, Inc. | Apparatus for electrically coupling bond pads of a microelectronic device |
US6873044B2 (en) | 2000-09-11 | 2005-03-29 | Xytrans, Inc. | Microwave monolithic integrated circuit package |
US6770982B1 (en) | 2002-01-16 | 2004-08-03 | Marvell International, Ltd. | Semiconductor device power distribution system and method |
US8258616B1 (en) | 2002-01-16 | 2012-09-04 | Marvell International Ltd. | Semiconductor dice having a shielded area created under bond wires connecting pairs of bonding pads |
US6861762B1 (en) | 2002-05-01 | 2005-03-01 | Marvell Semiconductor Israel Ltd. | Flip chip with novel power and ground arrangement |
JP5497985B2 (ja) * | 2004-09-13 | 2014-05-21 | ã€ã³ã¿ãŒãã·ã§ãã« ã¬ã¯ãã£ãã£ã¢ãŒ ã³ãŒãã¬ã€ã·ã§ã³ | åå°äœããã±ãŒãž |
US11574854B2 (en) | 2020-04-08 | 2023-02-07 | National Research Council Of Canada | Distributed inductance integrated field effect transistor structure |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3336508A (en) * | 1965-08-12 | 1967-08-15 | Trw Semiconductors Inc | Multicell transistor |
US3893159A (en) * | 1974-02-26 | 1975-07-01 | Rca Corp | Multiple cell high frequency power semiconductor device having bond wires of differing inductance from cell to cell |
US4107728A (en) * | 1977-01-07 | 1978-08-15 | Varian Associates, Inc. | Package for push-pull semiconductor devices |
US4236171A (en) * | 1978-07-17 | 1980-11-25 | International Rectifier Corporation | High power transistor having emitter pattern with symmetric lead connection pads |
-
1979
- 1979-03-30 JP JP3822779A patent/JPS55130178A/ja active Granted
-
1980
- 1980-03-20 EP EP19800300869 patent/EP0018091B1/en not_active Expired
- 1980-03-20 DE DE8080300869T patent/DE3068001D1/de not_active Expired
- 1980-03-28 US US06/135,182 patent/US4359754A/en not_active Expired - Lifetime
Non-Patent Citations (3)
Title |
---|
ELECTRONICS LETTERS=1928 * |
ELECTRONICS LETTERS=1978 * |
IEEE TRANSACTIONS ON ELECTRON DEVICES=1977 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0195826U (ja) * | 1987-12-17 | 1989-06-26 |
Also Published As
Publication number | Publication date |
---|---|
JPS55130178A (en) | 1980-10-08 |
DE3068001D1 (en) | 1984-07-05 |
EP0018091B1 (en) | 1984-05-30 |
US4359754A (en) | 1982-11-16 |
EP0018091A1 (en) | 1980-10-29 |
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