JPS6156769A - Reflow soldering device - Google Patents
Reflow soldering deviceInfo
- Publication number
- JPS6156769A JPS6156769A JP17803784A JP17803784A JPS6156769A JP S6156769 A JPS6156769 A JP S6156769A JP 17803784 A JP17803784 A JP 17803784A JP 17803784 A JP17803784 A JP 17803784A JP S6156769 A JPS6156769 A JP S6156769A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- furnace
- section
- preheating
- respective parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、各種回路部品をプリント基板上に実装するの
に用いるり７０−半田付は装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a soldering device 70 used for mounting various circuit components on a printed circuit board.
樹脂封止型フラット・パッケージ等の各種回路部品を、
リフロー半田付は装置を用いてプリント基板上に実装す
る場合、リフロー炉内を搬送される各部品に与えられる
温度負荷プロファイルの最適化は、プリント基板上に実
装された各部品の信頼性向上にとって極めて重要な問題
である。Various circuit components such as resin-sealed flat packages,
When reflow soldering is mounted on a printed circuit board using equipment, optimizing the temperature load profile given to each component transferred through the reflow oven is important for improving the reliability of each component mounted on the printed circuit board. This is an extremely important issue.
従来のリフロー半田付は装着におけるリフロー炉１０６
は、基本的には第４図に示すように予熱用ヒーター１０
１を設置した予熱部１０７、本加熱用ヒーター１０２を
設置した本加熱部１０８、冷却用ファン１０３を設置し
た冷却部１０９から構成されている。Conventional reflow soldering is done in a reflow oven 106 during installation.
Basically, as shown in Fig. 4, the preheating heater 10
1, a main heating section 108 where a main heating heater 102 is installed, and a cooling section 109 where a cooling fan 103 is installed.
１０４はプリント基板搬送用ベルトである。104 is a belt for conveying printed circuit boards.
しかしながら、炉内各部の空間が連続しているため、炉
内各部の温度分布は完全に独立とは成シ得ず、炉内温度
の制御及び温度プロファイルの設定が著しく制限されて
しまうという欠点があった。However, since the spaces in each part of the furnace are continuous, the temperature distribution in each part of the furnace cannot be completely independent, which has the disadvantage that controlling the temperature inside the furnace and setting the temperature profile are severely restricted. there were.
本発明は前記問題点を解決したリフロー半田付は装置を
提供するものである。The present invention provides a reflow soldering device that solves the above problems.
本発明はリフロー炉２１１内に形成された予熱部２０５
、本加熱部２０６、冷却部２０７０間に耐熱性断熱材を
配設して各部間を熱的に隔離したものであるＯ
〔作用〕
す７０−炉内の各部同士の熱干渉が断熱材で遮断される
から、炉内各部の温度分布は完全に独立し、炉内温度の
制御及び温度プロファイルの設定が容易にできる。The present invention provides a preheating section 205 formed in a reflow oven 211.
, a heat-resistant insulating material is placed between the main heating section 206 and the cooling section 2070 to thermally isolate each section. Since it is shut off, the temperature distribution in each part of the furnace is completely independent, making it easy to control the temperature inside the furnace and set the temperature profile.
以下に、本発明の一実施例を図によシ説明する。 An embodiment of the present invention will be explained below with reference to the drawings.
第１図において、リフロー炉２１１は、予熱用ヒーター
２０１を設置した予熱部２０５、本加熱用ヒーター２０
２を設置した本加熱部２０６、冷却用ファン２０９を設
置した冷却部２０７から構成されている。In FIG. 1, a reflow oven 211 includes a preheating section 205 in which a preheating heater 201 is installed, a main heating heater 20
The main heating section 206 is equipped with a cooling fan 209, and the cooling section 207 is equipped with a cooling fan 209.
本発明装置はリフロー炉２１１に形成された予熱部２０
５、本加熱部２０６、冷却部２０７の間に熱反射板２０
３で被覆された板状の耐熱性断熱材２０４を配設して各
部間を熱的に隔離する。また、プリント基板搬送用ベル
ト２１０は各断熱材２０４を水平方向に貫通して張設し
である。The device of the present invention has a preheating section 20 formed in a reflow oven 211.
5. A heat reflecting plate 20 is installed between the main heating section 206 and the cooling section 207.
A plate-shaped heat-resistant heat insulating material 204 coated with No. 3 is disposed to thermally isolate each part. Further, the printed circuit board conveying belt 210 extends horizontally through each heat insulating material 204 .
本発明によれば、予熱部２０５、本加熱部２０６、）（
冷却部２０７のそれぞれの空間が断熱材２０４にて区画
されるため、各部同士の熱作用が遮断される。According to the present invention, the preheating section 205, the main heating section 206, )(
Since each space of the cooling section 207 is divided by the heat insulating material 204, thermal effects between the respective sections are cut off.
第２図（ａ） 、 （ｂ）図は、第４図及び第１図に示
した装置を用いた場合に得られる温度プロファイルの例
である。どの場合も、ガラス・エビキン基板上に、アル
メル・クロメル熱電対を取シ付けて温式測定を行なった
Ｏ第４図に示した従来の装置では、第２図（ａ） 、
（ｂ）に破線で示しだ曲線の様に、予熱部分が本加熱用
ヒーターの影響を強く受けてしまうために、同図の実線
で示す様な曲線は得られなかった。ところが、本発明に
よれば、耐熱性断熱材の存在によシ、本加熱用ヒーター
の影響を遮断でき、実線で示すプロファイルを実現する
ことが可能となった。FIGS. 2(a) and 2(b) are examples of temperature profiles obtained when the apparatuses shown in FIGS. 4 and 1 are used. In each case, temperature measurements were carried out by mounting an alumel/chromel thermocouple on a glass/ebikin substrate.
As shown by the broken line in (b), the preheating portion was strongly influenced by the main heating heater, so a curve as shown by the solid line in the figure could not be obtained. However, according to the present invention, the influence of the main heating heater can be blocked due to the presence of the heat-resistant heat insulating material, making it possible to realize the profile shown by the solid line.
第３図は本発明の第２の実施例である。本実細例では、
リフロー炉４０１内に複数個のヒーター４０２ 、４０
２・・・を設置し各々のヒーター４０２間を熱反射板４
０３及び耐熱性断熱材４０４によって遮断し、予熱部、
本加熱部内の温度プロファイルをよシ細かく精密に色々
と選択することができるようにしたものでおる。４０６
は冷却用ファン、４０７はプリント基板搬送用ベルトで
ある。FIG. 3 shows a second embodiment of the invention. In this working example,
A plurality of heaters 402 and 40 are provided in the reflow oven 401.
2... is installed, and a heat reflecting plate 4 is installed between each heater 402.
03 and a heat-resistant insulating material 404, the preheating section,
This allows the temperature profile within the heating section to be selected in a variety of ways with greater precision. 406
407 is a cooling fan, and 407 is a printed circuit board conveyance belt.
また第１図、第３図に示す様に、排気用ダクト２０８
、４０５を仕切られた各空間内に接続して設置し、各部
でのヒーターによる加熱に加えてダクト２０８ 、４０
５ による排気を併用することによシ耐熱性断熱材４
０４によって分離された各部の温度分布の独立性をより
向上させるようにしても良い。In addition, as shown in FIGS. 1 and 3, an exhaust duct 208
, 405 are connected and installed in each partitioned space, and in addition to heating by heaters in each part, ducts 208 , 40
5 Heat-resistant insulation material 4
The independence of the temperature distribution of each part separated by 04 may be further improved.
また、熱反射板、耐熱性断熱材の種類、形状。Also, the type and shape of heat reflectors and heat-resistant insulation materials.
寸法や排気方法及びり７０−炉の寸法等は特に限定され
るものではない。The dimensions, evacuation method, dimensions of the furnace 70, etc. are not particularly limited.
本発明は以上説明したように、リフロー炉内を耐熱性断
熱材にて複数個に区画して、その内部の予熱部、本加熱
部、冷却部を熱的に隔離したので、各部同士の熱作用を
断熱材にて遮断してリフロー炉内の各部の温度分布をほ
ぼ自由に制御、選択することができ、温度プロファイル
の選択の自由度を著しく大きくでき、したがって、プリ
ント基板上に実装された各回路部品の信頼性をよシ高く
維持することができる効果を有するものである。As explained above, the present invention divides the inside of the reflow oven into a plurality of sections using heat-resistant heat insulating material, and thermally isolates the preheating section, main heating section, and cooling section within the reflow oven. It is possible to almost freely control and select the temperature distribution in each part of the reflow oven by blocking the action with a heat insulating material, which greatly increases the degree of freedom in selecting the temperature profile. This has the effect of maintaining high reliability of each circuit component.
第１図は本発明の一実施例を示す構成図、第２図（ａ）
、 （ｂ）は本発明と従来装置とにおける温度プロフ
ァイルを示す特性図、第３図は本発明の他の実施例を示
す構成図、第４図は従来装置の例を示す構成図である。
２１１ 、４０１・・・リフロー炉 ２０１ 、２０２
、４０２・・・加熱用ヒーター ２０５・・・予熱部
２０６・・・本加熱部２０７・・・冷却部 ２０４
、４０４・・・耐熱性断熱材特許出願人 日本電気株
式会社
代 理 人 弁理士菅野 中：；）
第４図
第１区
尾２図
（α）Fig. 1 is a configuration diagram showing an embodiment of the present invention, Fig. 2(a)
, (b) is a characteristic diagram showing temperature profiles in the present invention and the conventional device, FIG. 3 is a block diagram showing another embodiment of the present invention, and FIG. 4 is a block diagram showing an example of the conventional device. 211, 401... Reflow oven 201, 202
, 402... Heating heater 205... Preheating section 206... Main heating section 207... Cooling section 204
, 404... Heat-resistant insulation material patent applicant NEC Corporation Representative Patent attorney Naka Kanno: ;) Figure 4, Section 1, Figure 2 (α)
Claims (1)
却部の間に耐熱性断熱材を配設して各部間を熱的に隔離
したことを特徴とするリフロー半田付け装置。(1) A reflow soldering apparatus characterized in that a heat-resistant insulating material is provided between a preheating section, a main heating section, and a cooling section formed in a reflow oven to thermally isolate each section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17803784A JPS6156769A (en) | 1984-08-27 | 1984-08-27 | Reflow soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17803784A JPS6156769A (en) | 1984-08-27 | 1984-08-27 | Reflow soldering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6156769A true JPS6156769A (en) | 1986-03-22 |
Family
ID=16041480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17803784A Pending JPS6156769A (en) | 1984-08-27 | 1984-08-27 | Reflow soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6156769A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01215462A (en) * | 1988-02-23 | 1989-08-29 | Eiteitsuku Tekutoron Kk | Method and device for reflow soldering |
| JPH01278965A (en) * | 1988-04-30 | 1989-11-09 | Nippon Dennetsu Keiki Kk | Reflow soldering device |
| CN1051493C (en) * | 1995-03-31 | 2000-04-19 | 东洋钢钣株式会社 | Handling method and robot used for same |
| JP2003515910A (en) * | 1999-12-03 | 2003-05-07 | ユーティーシー フューエル セルズ，エルエルシー | Fuel cell power plant with integrated manifold device |
| US7413825B2 (en) | 2002-05-21 | 2008-08-19 | Honda Giken Kogyo Kabushiki Kaisha | Fuel cell |
| CN102717163A (en) * | 2011-03-28 | 2012-10-10 | 株式会社田村制作所 | Reflow soldering device |
| CN111465183A (en) * | 2020-03-30 | 2020-07-28 | 宁波市富来电子科技有限公司 | PCB with flat welding spots and welding method |
-
1984
- 1984-08-27 JP JP17803784A patent/JPS6156769A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01215462A (en) * | 1988-02-23 | 1989-08-29 | Eiteitsuku Tekutoron Kk | Method and device for reflow soldering |
| JPH01278965A (en) * | 1988-04-30 | 1989-11-09 | Nippon Dennetsu Keiki Kk | Reflow soldering device |
| CN1051493C (en) * | 1995-03-31 | 2000-04-19 | 东洋钢钣株式会社 | Handling method and robot used for same |
| JP2003515910A (en) * | 1999-12-03 | 2003-05-07 | ユーティーシー フューエル セルズ，エルエルシー | Fuel cell power plant with integrated manifold device |
| US7413825B2 (en) | 2002-05-21 | 2008-08-19 | Honda Giken Kogyo Kabushiki Kaisha | Fuel cell |
| CN102717163A (en) * | 2011-03-28 | 2012-10-10 | 株式会社田村制作所 | Reflow soldering device |
| CN111465183A (en) * | 2020-03-30 | 2020-07-28 | 宁波市富来电子科技有限公司 | PCB with flat welding spots and welding method |
| CN111465183B (en) * | 2020-03-30 | 2023-03-17 | 宁波市富来电子科技有限公司 | PCB with flat welding spots and welding method |
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