JPH045280B2 - - Google Patents
Info
- Publication number
- JPH045280B2 JPH045280B2 JP59031645A JP3164584A JPH045280B2 JP H045280 B2 JPH045280 B2 JP H045280B2 JP 59031645 A JP59031645 A JP 59031645A JP 3164584 A JP3164584 A JP 3164584A JP H045280 B2 JPH045280 B2 JP H045280B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive circuit
- layer
- layer conductive
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
- 229910052799 carbon Inorganic materials 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 238000003780 insertion Methods 0.000 description 8
- 230000037431 insertion Effects 0.000 description 8
- 238000005476 soldering Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000009413 insulation Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Description
【発明の詳細な説明】
産業上の利用分野
本発明は各種電子機器に利用されているプリン
ト基板に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to printed circuit boards used in various electronic devices.
従来例の構成とその問題点
近年プリント基板は各種電子機器に利用され、
年々に応用範囲も拡大されている。プリント基板
のコストダウンと実装方法の工夫により一段とプ
リント基板の価値は向上している。そのプリント
基板の中でも民生機器分野で片面銅張積層板を利
用した複合基板の利用範囲が急速に拡大されつつ
ある。Conventional configurations and their problems In recent years, printed circuit boards have been used in various electronic devices.
The scope of application is expanding year by year. The value of printed circuit boards is increasing further due to reduced costs and improved mounting methods. Among these printed circuit boards, the scope of use of composite boards using single-sided copper-clad laminates is rapidly expanding in the field of consumer electronics.
以下、従来例について図面にもとづき説明す
る。 Hereinafter, a conventional example will be explained based on the drawings.
第１図ａ，ｂは従来のプリント基板の構成を示
すものである。第１図において、１は絶縁基板、
２は銅箔よりなる第１層導電回路で、３は絶縁層
で、４は導電ペーストよりなる第２層の導電回路
で構成されている。 FIGS. 1a and 1b show the structure of a conventional printed circuit board. In FIG. 1, 1 is an insulating substrate;
2 is a first layer conductive circuit made of copper foil, 3 is an insulating layer, and 4 is a second layer conductive circuit made of conductive paste.
第１図ａ，ｂに示したように従来のプリント基
板は銅箔でできた第１層の導電回路２とカーボン
レジン等でできた第２層の導電回路４との接続部
は部品挿入孔もあいていないので第１層の導電回
路２の延長上に部品挿入のためのランドを設けな
ければならない。そのためにプリント基板の実装
密度があがらないという欠点を有していた。 As shown in FIGS. 1a and 1b, in a conventional printed circuit board, the connection part between the first layer conductive circuit 2 made of copper foil and the second layer conductive circuit 4 made of carbon resin etc. is the component insertion hole. Since there is no space, a land for inserting the component must be provided on the extension of the conductive circuit 2 on the first layer. Therefore, it has the disadvantage that the mounting density of the printed circuit board cannot be increased.
発明の目的
本発明は上記欠点に鑑み第１層の導電回路と第
２層の導電回路の接続部に部品実装のためのラン
ドおよび挿入孔を設け実装密度を一段と高めたプ
リント基板を提供するものである。Purpose of the Invention In view of the above-mentioned drawbacks, the present invention provides a printed circuit board that further increases the mounting density by providing lands and insertion holes for mounting components at the connecting portion between the first layer conductive circuit and the second layer conductive circuit. It is.
発明の構成
この目的を達成するために本発明のプリント基
板は絶縁基板上に銅箔よりなる第１層の導電回路
を設けるとともに、その上に第１層の導電回路の
接続ランドを残して絶縁層を設け、この第１層の
導電回路のランド部および絶縁層上にカーボンレ
ジンよりなる第２層の導電回路を設け、かつその
第２層の導電回路において上記第１層の導電回路
の接続ランド部上の部分に第１層の導電回路の半
田付ランド部を形成する開口を設けたことによ
り、従来例のように部品挿入孔を他の場所に設け
なくてもよいので、単位面積当り実装密度が向上
されることになる。Structure of the Invention In order to achieve this object, the printed circuit board of the present invention provides a first layer conductive circuit made of copper foil on an insulating substrate, and leaves a connecting land of the first layer conductive circuit on the insulating substrate for insulation. A second layer of conductive circuit made of carbon resin is provided on the land portion of the first layer of conductive circuit and the insulating layer, and the second layer of conductive circuit is connected to the first layer of conductive circuit. By providing an opening above the land portion to form the soldering land portion of the first layer conductive circuit, there is no need to provide a component insertion hole elsewhere as in the conventional example, so the per unit area The packaging density will be improved.
実施例の説明
以下本発明の一実施例について、図面を参照し
ながら説明する。第２図ａ，ｂは本発明の一実施
例におけるプリント基板の断面図である。第２図
ａ，ｂにおいて、５は絶縁基板、６は銅箔よりな
る第１層の導電回路、７は絶縁レジストの印刷に
よる絶縁層、８はカーボンレジンの導電ペースト
よりなる第２層の導電回路、９は部品挿入孔を示
す。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIGS. 2a and 2b are cross-sectional views of a printed circuit board in an embodiment of the present invention. In Figures 2a and b, 5 is an insulating substrate, 6 is a first layer conductive circuit made of copper foil, 7 is an insulating layer printed with insulation resist, and 8 is a second layer conductive circuit made of carbon resin conductive paste. In the circuit, 9 indicates a component insertion hole.
以下、その製造方法について説明する。 The manufacturing method will be explained below.
銅張積層基板を通常の方法でパターン形成を行
い銅箔による第１層の導電回路６を得る。次に第
１層の導電回路６と第２層の導電ベーストによる
導電回路８の接続部を残し他の部分に絶縁レジス
トとしてエポキシ系樹脂等で絶縁層７を設ける。 A pattern is formed on the copper-clad laminate board using a conventional method to obtain a first layer of conductive circuit 6 made of copper foil. Next, an insulating layer 7 is formed using an epoxy resin or the like as an insulating resist, leaving only the connecting portion between the first layer conductive circuit 6 and the second layer conductive base plate, and leaving the other portions.
次に第１層の導電回路６との接続部および絶縁
層７上にカーボンレジンからなる導電ペーストを
印刷し導電ペーストによる第２層の導電回路８を
設ける。この第２層の導電回路８の第１層の導電
回路６との接続部においては、第１層の導電回路
６としての半田付ランド部１０を残すような開口
８′を有している。その後通常の方法で部品挿入
孔９をパンチングする。 Next, a conductive paste made of carbon resin is printed on the connection portion with the first layer conductive circuit 6 and on the insulating layer 7, and a second layer conductive circuit 8 made of the conductive paste is provided. At the connection portion of the second layer conductive circuit 8 with the first layer conductive circuit 6, an opening 8' is provided to leave a soldering land portion 10 as the first layer conductive circuit 6. Thereafter, the component insertion hole 9 is punched in the usual manner.
以上のように構成されたプリント基板につい
て、以下その動作を説明する。 The operation of the printed circuit board configured as described above will be described below.
以上のように本実施例によれば第１層の導電回
路６と第２層のカーボンレジンの導電ペーストに
よる導電回路８の接続部を第１層の導電回路６の
接続ランドの円周にそつた形状でカーボンレジン
の導電ベーストによる第２層の導電回路８を接続
する。このことにより第１層の導電回路６の接続
ランドは部品挿入孔９はもちろんのこと、半田付
ランド部１０も残り、第１層目と第２層目の接続
の目的と第３図に示すように部品１１の挿入もで
き実装密度の高いプリント基板とすることができ
る。 As described above, according to this embodiment, the connection portion between the first layer conductive circuit 6 and the second layer conductive circuit 8 made of carbon resin conductive paste is arranged along the circumference of the connection land of the first layer conductive circuit 6. A second layer conductive circuit 8 made of a conductive base made of carbon resin is connected in the same shape. As a result, the connection land of the conductive circuit 6 in the first layer remains not only the component insertion hole 9 but also the soldering land portion 10, and the purpose of connecting the first layer and the second layer is shown in FIG. In this way, the components 11 can be inserted, and a printed circuit board with high mounting density can be obtained.
なお、実施例では片面のプリント基板について
説明したが、両面プリント基板でも同様の効果が
得られることはいうまでもない。 In the embodiment, a single-sided printed circuit board has been described, but it goes without saying that the same effect can be obtained with a double-sided printed circuit board.
発明の効果
以上のように本発明は第１層目の導電回路と第
２層目の導電回路の接続部に部品挿入孔を設けら
れるように安価なカーボンレジンによる第２層の
導電ペーストによる導電回路を形成することによ
り、部品挿入もでき第１層目と第２層目の導電回
路の接続もできる。またカーボンレジンは半田付
けすることができないのでいわゆるソルダーレジ
ストの役割も果し半田付け時に接続ランドが近接
していても半田ブリツジが発生することもなく高
密度なプリント基板の設計が可能となり、半田付
け時の半田量も少なくすることができてコスト面
でも有利となり、この実用的効果は大なるものが
ある。Effects of the Invention As described above, the present invention provides conductivity using a second layer conductive paste made of inexpensive carbon resin so that a component insertion hole can be provided at the connection portion between the first layer conductive circuit and the second layer conductive circuit. By forming a circuit, components can be inserted and conductive circuits in the first and second layers can be connected. In addition, since carbon resin cannot be soldered, it also plays the role of a so-called solder resist, making it possible to design high-density printed circuit boards without causing solder bridging even when the connecting lands are close to each other during soldering. The amount of solder during attachment can be reduced, which is advantageous in terms of cost, and this has great practical effects.
第１図ａ，ｂは従来例のプリント基板の断面図
と平面図、第２図ａ，ｂは本発明のプリント基板
の一実施例における断面図と平面図、第３図は本
発明の部品実装をした断面図である。
５…絶縁基板、６…第１層の導電回路、７…絶
縁レジスト、８…第２層の導電回路、８′…開口、
９…部品挿入孔、１０…半田付ランド部、１１…
部品。
Figures 1a and b are a cross-sectional view and a plan view of a conventional printed circuit board, Figures 2 a and b are a cross-sectional view and a plan view of an embodiment of the printed circuit board of the present invention, and Figure 3 is a component of the present invention. FIG. 3 is a cross-sectional view of the mounted device. 5... Insulating substrate, 6... First layer conductive circuit, 7... Insulating resist, 8... Second layer conductive circuit, 8'... Opening,
9...Component insertion hole, 10...Soldering land portion, 11...
parts.
Claims (1)
を設けるとともに、その上に第１層の導電回路の
接続ランドを残して絶縁層を設け、上記第１層の
導電回路の接続ランドおよび絶縁層上にカーボン
レジンよりなる第２層の導電回路を設け、かつそ
の第２層の導電回路において上記第１層の導電回
路の接続ランド部上の部分に第１層の導電回路の
半田付ランド部を形成する開口を設けたことを特
徴とするプリント基板。1. A first layer conductive circuit made of copper foil is provided on an insulating substrate, and an insulating layer is provided thereon leaving the connection land of the first layer conductive circuit, and the connection land of the first layer conductive circuit and A second layer conductive circuit made of carbon resin is provided on the insulating layer, and the first layer conductive circuit is soldered to a portion above the connection land portion of the first layer conductive circuit in the second layer conductive circuit. A printed circuit board characterized by having an opening that forms a land portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3164584A JPS60180186A (en) | 1984-02-22 | 1984-02-22 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3164584A JPS60180186A (en) | 1984-02-22 | 1984-02-22 | Printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60180186A JPS60180186A (en) | 1985-09-13 |
| JPH045280B2 true JPH045280B2 (en) | 1992-01-30 |
Family
ID=12336927
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3164584A Granted JPS60180186A (en) | 1984-02-22 | 1984-02-22 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60180186A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0347341Y2 (en) * | 1985-12-18 | 1991-10-08 | ||
| JPS62211994A (en) * | 1986-03-13 | 1987-09-17 | 三井金属鉱業株式会社 | Multilayer circuit board and manufacture of the same |
| JP2635847B2 (en) * | 1991-04-26 | 1997-07-30 | 古河電気工業株式会社 | Large current circuit board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4889353A (en) * | 1972-02-29 | 1973-11-22 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49121063U (en) * | 1973-02-12 | 1974-10-17 |
-
1984
- 1984-02-22 JP JP3164584A patent/JPS60180186A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4889353A (en) * | 1972-02-29 | 1973-11-22 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60180186A (en) | 1985-09-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |