JPS59111068U - Printed board - Google Patents

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図面はこの考案の一実施例を示し、第１〜４図はプリン
ト基板の作り方の一例を示すものであって、第１図は基
板貼合せ前の要部の斜視図、第２図は第１図のものの貼
合せ後の断面図、第３図は第２図のものの凹所に無電解
銅めっきを施した状態の断面図、第４図は第３図の無電
解銅めっきの表面にクリームはんだを印刷してはんだ付
は用ランドを形成した状態の断面図、第５図は第４図の
プリント基板の使用状態を示す断面図である。 １．３：絶縁基板、２：孔、４：凹所、５：無電解銅め
っき、６：めっきレジスト、７：クリームはんだ、８：
はんだ付は用ランド、９：端子、１０：隔壁。The drawings show one embodiment of this invention, and Figs. 1 to 4 show an example of how to make a printed circuit board. Fig. 1 is a perspective view of the main part before bonding the board, and Fig. Figure 1 is a cross-sectional view of the item in Figure 2 after lamination, Figure 3 is a cross-sectional view of the item in Figure 2 with electroless copper plating applied to the recess, and Figure 4 is a cross-sectional view of the item in Figure 3 with electroless copper plating applied to the surface. FIG. 5 is a cross-sectional view showing a state in which cream solder is printed to form soldering lands, and FIG. 5 is a cross-sectional view showing the printed circuit board of FIG. 4 in use. 1.3: Insulating substrate, 2: Hole, 4: Recess, 5: Electroless copper plating, 6: Plating resist, 7: Cream solder, 8:
Land for soldering, 9: terminal, 10: bulkhead.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] フラットパック部品等の端子のはんだ付は用ランドが、
前記端子を位置決め可能に凹設されてなるプリント基板
。The land used for soldering terminals of flat pack parts, etc.
A printed circuit board having a recess that allows the terminal to be positioned.