JPS61295034A - Copper lined laminated board - Google Patents

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 ［発明の技術分野］ 本発明は小径のドリル加工をするに際し、ドリルの軸ぶ
れがなく、したがってドリルスミアや内壁粗さの改善さ
れた銅張、積層板に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a copper-clad, laminated board that is free from axial runout of the drill during small-diameter drilling, and therefore has improved drill smear and inner wall roughness.

［発明の技術的背景どその問題点］ 近年産業用電子機器の分野においては配線の高密度化が
急速に進んでおり、最近特にＬＳＩの集積疾の向上によ
りそのパッケージも従来のデユアルーイン−ライン型パ
ッケージから多端子のフラットパック型パッケージへと
変化してきている。[Technical Background of the Invention and Problems] In recent years, the density of wiring has been rapidly increasing in the field of industrial electronic equipment, and with the recent improvement in the integration speed of LSIs, the packaging has also changed from the conventional dual-in-line type. Packages are changing to multi-terminal flat pack packages.

ところでこのようなフラットパック型パッケージ搭載用
のプリント配線基板では、従来のデユアルーイン−ライ
ン型パッケージ搭載用のプリント配線基板ど異なりスル
ーホール穴に部品を搭載する必要がないので、小径スル
ーホールとすることにより配線密度を高めることが行な
われている。By the way, in a printed wiring board for mounting a flat pack type package like this, unlike a conventional printed wiring board for mounting a dual-in-line type package, there is no need to mount components in the through-hole hole, so small-diameter through holes are used. Efforts are being made to increase wiring density.

小径のスルーホールとするのに必要な小径ドリル加工に
は、ドリルスミアや内壁粗さの良好な穴あけが必要どさ
れているが、従来の７６２８タイプのような厚さの大ぎ
なガラスクロスを銅箔のすぐ下に配置した銅張積層板で
は、銅箔表面が粗く、ドリルの軸ぶれが起こり、ドリル
穴のドリルスミアや内壁粗さが問題となっていた。The small-diameter drilling required to make small-diameter through-holes requires drill smearing and drilling with good inner wall roughness. In the copper-clad laminate placed directly below the copper foil, the surface of the copper foil was rough, causing drill shaft runout, and problems such as drill smear in the drill hole and roughness of the inner wall.

［発明の目的］ 本発明は上記の欠点を解消するためになされたもので、
銅箔表面が平滑で、小径のドリル加工をした場合にドリ
ル加工性の良好な銅張積層板を提供することを目的とす
る。[Object of the invention] The present invention has been made in order to eliminate the above-mentioned drawbacks,
The purpose of the present invention is to provide a copper-clad laminate having a smooth copper foil surface and good drillability when drilled into a small diameter.

［発明の概要］ すなわち本発明の銅張積層板は、銅箔とガラス紙布基材
のプリプレグとの間に、銅箔と接触させて厚さ０．１ｍ
ｍ以下のガラスクロスを１枚以上配置することににす、
銅箔表面を平滑化さけ、かつ小径のドリル加工をした場
合にドリル加工性を改善したものである。[Summary of the Invention] That is, the copper-clad laminate of the present invention has a thickness of 0.1 m between the copper foil and the glass paper cloth base material prepreg in contact with the copper foil.
I decided to arrange one or more pieces of glass cloth with a size of m or less,
This method avoids smoothing the copper foil surface and improves drilling workability when drilling small diameters.

本発明にＪ：る銅張積層板は、カラス紙イ１ｉ塁Ｈに熱
硬化性樹脂を、塗布、含浸し乾燥させてなるプリプレグ
と銅箔を重ねて熱ＩＴＥ着するに際し、厚さ０．１脂ｍ
以下のカラスクロスに熱硬化性樹脂を塗布、含浸し乾燥
させたプリプレグの１枚以上を他のプリプレグの上下に
配回し、その両面もしくは片面に銅箔を重ねて熱圧着す
ることににって製造される。The copper-clad laminate according to the present invention has a thickness of 0.5 mm when a prepreg made by coating and impregnating and drying a thermosetting resin on glass paper and copper foil is laminated and bonded by thermal ITE. 1 fat m
One or more of the prepregs shown below are coated with thermosetting resin, impregnated with thermosetting resin, and dried, arranged above and below other prepregs, and then copper foil is layered on both or one side of the prepregs and bonded by thermocompression. Manufactured.

本発明に用いる熱硬化性樹脂どしては、エポキシ樹脂、
ポリイミド樹脂等一般に使用されるものが応用できる。Thermosetting resins used in the present invention include epoxy resins,
Commonly used materials such as polyimide resin can be used.

本発明に使用できる銅箔下に配置するガラスクロスは厚
さが０．１ｍｍ以下のものであり、ガラスクロスを構成
する原糸のストランド径が１００μｍ以下で原糸密度が
１インチ当たり経緯ども５０本以北のものがりＹましい
。The glass cloth to be placed under the copper foil that can be used in the present invention has a thickness of 0.1 mm or less, the strand diameter of the yarn constituting the glass cloth is 100 μm or less, and the yarn density is 50 mm per inch. The stories from the north are so interesting.

厚さ０．１１Ｉｍ以下のガラスフ１］スからなるプリプ
１ノグの内側に重ねるプリプレグとして（５１５、カラ
スクロス、ガラスペーパー、ガラス不織布等に熱硬化す
（１樹脂を塗布、含浸し乾燥さけてなるプリプレグが挙
げられる、１ ［発明の実施例］ 次に本発明を実施例ににって説明する。A prepreg made of glass cloth with a thickness of 0.11 Im or less (1) As a prepreg to be layered on the inside of a nog (515, heat cured on glass cloth, glass paper, glass non-woven fabric, etc.) Examples include prepreg.1 [Examples of the Invention] Next, the present invention will be described with reference to Examples.

実施例１ 厚さ０．０５　ｍｍのガラスフ［１ス１０８０　、／△
５４５０（旭シュエーベルネ１製、商品名）に「Ｒ−４
用エポキシ樹脂を塗布、含浸ざμ、加熱乾燥して半硬化
状態の樹脂含有率４３％、大きさ１０６０ｍ口ｌＸ１０
６０ｎ＋０１のプリプレグ０．１８　ｍｍのガラスクロ
ス７６２８／Δ５４５０（旭シュニーベル？Ｊ　Ｈ１１
脂名）にＦＲ−４用エポキシ樹脂を塗布、含浸さｌ、加
熱乾燥して、半硬化状態の樹脂含有率４３％、大きさ１
０６０１０６Ｏ０６０ｍｍのプリプレグ（Ｂ）を得た。Example 1 Glass film with a thickness of 0.05 mm [1 square 1080, /△
5450 (manufactured by Asahi Schweberne 1, product name) "R-4"
Apply epoxy resin, impregnate, heat dry and semi-cure resin content 43%, size 1060m x 10
60n+01 prepreg 0.18 mm glass cloth 7628/Δ5450 (Asahi Schniebel? J H11
Apply epoxy resin for FR-4 to the surface (name of oil), impregnate it, heat dry it, and make a semi-cured resin with a resin content of 43% and a size of 1.
A prepreg (B) of 060106O060 mm was obtained.

このプリプレグ（Ｂ）を７枚重ね、その上下にプリプレ
グ（△）をそれぞれ２枚ずつ重ね、ざらにその上下に厚
さ１８μｍの銅箔を配胃ｌノで１組とし、これどステン
レス鏡面板どを組合けて８絹まで重ねた。そしてその上
下にリンター紙（厚ざ０．１５ｍｍ）を６枚ずつおいて
クッション材どし、これを加熱１７５℃×１１０分間、
冷ム１６０分間、圧力４０ｋ（Ｊｆ　／　ｃＪの条（’
＋で加熱加圧成形を行い、厚さ１．６關の両面銅張積層
板を製造した。7 sheets of prepreg (B) are stacked, 2 sheets of prepreg (△) are stacked on top and bottom of the prepreg (△), and copper foil with a thickness of 18 μm is roughly placed on top and bottom of the top and bottom to make one set. The layers were combined to make up to 8 layers of silk. Then, place 6 sheets of linter paper (0.15 mm thick) on top and bottom of the cushioning material, and heat this at 175°C for 110 minutes.
Cold heating for 160 minutes, pressure 40k (Jf/cJ)
A double-sided copper-clad laminate with a thickness of 1.6 mm was produced by heating and press forming.

実施例２ 厚さ０．１ｍｍのガラスクロス２１６／　Ａ　Ｓ　４５
０　（旭シュニーベル社製、商品名）にＦＲＩ用エポキ
シ樹脂を塗布、含浸させ、加熱乾燥して、半硬化状態の
樹脂含有率４３％、大きさ１０６１０６Ｏ１０６０ｍｍ
のプリプレグ（Ｃ）を得た。Example 2 Glass cloth 216/A S 45 with a thickness of 0.1 mm
0 (manufactured by Asahi Schniebel Co., Ltd., trade name) is coated and impregnated with epoxy resin for FRI, heated and dried to a semi-cured state with a resin content of 43% and a size of 106106O1060mm.
A prepreg (C) was obtained.

実施例１によるプリプレグ（Ｂ）を７枚重ね、その上下
にプリプレグ（Ｃ）を１枚ずつ重ねさらにその上下に厚
さ１８μｍ銅箔を配置して１組とし、これとステンレス
鏡面板とを交互に組み合せて８組まで重ねた。そしてそ
の上下にリンター紙（厚さ０．１５　ｍｍ）を６枚ずつ
おいてクッション材とし、これを加熱１７５℃で１１０
分間、冷ｆＩＩ６０分間、圧力４０Ｊｆ／ｃＪの条件で
加熱加圧成形を行い、厚さ１．６ｍｍの両面銅張積層板
を製造した。Seven prepregs (B) according to Example 1 were stacked, one prepreg (C) was stacked on top and bottom of the prepregs (C), and 18 μm thick copper foil was placed above and below to form a set, and this and stainless steel mirror plate were alternately stacked. They were combined into 8 sets. Six sheets of linter paper (thickness 0.15 mm) were placed on top and bottom of the paper as cushioning material, and this was heated to 110℃ at 175℃.
A double-sided copper-clad laminate having a thickness of 1.6 mm was produced by heating and pressing under the conditions of 60 minutes of cold fII and 40 Jf/cJ of pressure.

４　一 実施例３ 坪ｍ６０ｇ／ＩＩ’のガラスペーパー（本州製紙社製）
にＦＲ−４用エポキシ（か１脂を塗布、含浸させ、１Ｉ
ＩＩ熱乾燥して、半硬化状態の樹脂含有率８０％、大き
さ１０１０６Ｏ＋ｘ　１０６０ｍｍのプリプレグ（Ｄ）
を得た。4 Example 3 Glass paper of 60 g/II' (manufactured by Honshu Paper Industries)
Apply and impregnate FR-4 epoxy (1I) onto
II Heat-dried semi-cured prepreg with resin content of 80% and size 10106O+x 1060mm (D)
I got it.

このプリプレグ（Ｄ＞を６枚重ね、その上下に実施例１
ににるプリプレグ（Ａ）を２枚ずつ重ね、さらにその上
下に厚さ１８μｍの銅箔を配回して１組とし、これとス
テンレス鏡面板とを交互に組み合せて８組まで重ねた。Layer 6 sheets of this prepreg (D>) and place Example 1 above and below it.
Two Niniru prepregs (A) were stacked one on top of the other, copper foil with a thickness of 18 μm was placed above and below it to form one set, and this and stainless steel mirror plates were alternately combined to stack up to eight sets.

そしてその上下にリンター紙（厚さ０．１５　ｍｍ）を
６枚ずつおいてクッション材とし、これを加熱１７５℃
×１１０分間、冷７１Ｉ］６０分間、圧力４０ｋＣＪ＋
’　／ｃｌの条件で加熱加圧成形を行い、厚さ　ｉ、６
ｍｍの両面銅張積層板を製造した。Six pieces of linter paper (thickness 0.15 mm) were placed on top and bottom of the paper as cushioning material, and this was heated to 175℃.
x 110 minutes, cold 71I] 60 minutes, pressure 40kCJ+
' / cl.
A double-sided copper-clad laminate of mm was manufactured.

比較例 実施例１によるプリプレグ（Ｂ）を８枚重ね、その上下
に厚さ１８ｆ１ｍの銅箔を配回して１１１とし、これと
ステンレス鏡面板どを交互に絹み合せて８組まで重ねた
。そしてその上下にリンター紙（厚さ０．１５　ｍｍ）
を６枚ずつおいてクッション材どし、これを加熱１７５
℃×１１０分間、冷却６０分間、圧力４０ｋｉｌｆ／’
Ｃ１にの条件で加熱加圧成形を行い、厚さ１．６ｍｍの
両面５１・ｉ偏積層板を製造した。Comparative Example Eight sheets of prepreg (B) according to Example 1 were stacked, copper foil with a thickness of 18 f1 m was placed above and below it to form 111, and this and mirror-finished stainless steel plates were alternately sewn together to stack up to 8 sets. And linter paper (0.15 mm thick) above and below.
Place 6 pieces of cushion material and heat them to 175
°C x 110 minutes, cooling 60 minutes, pressure 40kilf/'
Heat and pressure molding was performed under the conditions of C1 to produce a double-sided 51-i uneven laminate with a thickness of 1.6 mm.

実施例１〜実施例３および比較例に」；って製造した銅
張積層板を３枚１重ね、直径０．５ｍｍのドリルを使用
し、回転数７０，０ＯＯｒ、ｐ、ｍ　、送り速度３ｍ　
７分で５，０００穴までドリル穴あけを行った。そして
スルーホールメッキの後、１０００穴ごとにクロスセク
ションを行い、内壁粗さとドリルスミアを評価した。そ
の結果を第１表および第２表に示ず。In Examples 1 to 3 and Comparative Examples, three copper-clad laminates manufactured by the above method were stacked one on top of the other, and a drill with a diameter of 0.5 mm was used to rotate at a rotation speed of 70.0 OOr, p, m, and a feed rate of 3 m.
Drilled up to 5,000 holes in 7 minutes. After through-hole plating, cross sections were performed every 1000 holes to evaluate inner wall roughness and drill smear. The results are not shown in Tables 1 and 2.

なおドリルスミアの評価は厚さ１８μｍの銅箔について
次の式により行った。Note that the drill smear was evaluated using the following formula for a copper foil having a thickness of 18 μm.

ドリルスミアの大きさく％）　− スミアの長さくμｍ＞／１８（μｍ　）　ｘ　　１ｏ。Drill smear size%) - Smear length μm>/18 (μm) x 1o.

第１表 第２表 （以下余白） ８一 本発明は比較例に比べ内壁粗さ、ドリルスミアとも優れ
ており、本発明の顕著な効果が認められた。Table 1, Table 2 (blank below) 81 The present invention was superior to the comparative examples in terms of inner wall roughness and drill smear, and the remarkable effects of the present invention were recognized.

［発明の効果］ 以上説明したように、本発明の銅張積層板は従来のもの
に比べ内壁粗さおよびドリルスミアのドリル加工性が優
れているので、特に小径スルーホールが必要な平面実装
用銅張積層板として最適である。[Effects of the Invention] As explained above, the copper-clad laminate of the present invention has superior inner wall roughness and drill smear workability compared to conventional ones, so it can be used especially for flat-mount copper that requires small-diameter through holes. Ideal for tension laminates.

Claims (1)

【特許請求の範囲】[Claims] （１）銅箔とガラス紙布基材のプリプレグとの間に、銅
箔と接触させて厚さ０．１ｍｍ以下のガラスクロスを１
枚以上配置することを特徴とする銅張積層板。(1) Place a piece of glass cloth with a thickness of 0.1 mm or less between the copper foil and the glass paper fabric base prepreg in contact with the copper foil.
A copper-clad laminate characterized by having more than one copper clad laminate.