JPS6473696A - Printed-circuit board - Google Patents

Printed-circuit board

Info

Publication number
JPS6473696A
JPS6473696A JP22862187A JP22862187A JPS6473696A JP S6473696 A JPS6473696 A JP S6473696A JP 22862187 A JP22862187 A JP 22862187A JP 22862187 A JP22862187 A JP 22862187A JP S6473696 A JPS6473696 A JP S6473696A
Authority
JP
Japan
Prior art keywords
lands
solder resist
solder
width
gap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22862187A
Other languages
Japanese (ja)
Inventor
Hiroshi Chiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP22862187A priority Critical patent/JPS6473696A/en
Publication of JPS6473696A publication Critical patent/JPS6473696A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PURPOSE:To prevent a solder bridge from being caused by a method wherein a solder resist whose width is narrower than that between lands is formed between the lands and another solder resist whose width is wider than that between the lands is formed between the lands in such a way that an effective area for a soldering operation can be secured. CONSTITUTION:A width (p) of a gap between lands 2 for soldering use is 0.25-0.3mm; a width (q) of a solder resist installed in the gap is narrower than the (p). Even when an error is caused in a pattern of the solder resist, the solder resist is never formed on the lands; this is effective in preventing that a protruding part 5 from the surface of a printed-circuit board 1 is formed due to the solder resist 3. Even in a process to feed a creamy solder, the overflowed creamy solder first flows into a gap between the land 2 and the solder resist 3; and has an effect as an overflow. In order to obtain this effect, it is desirable to set a ratio of the between-lands distance (p) to the width (q) of the solder resist at 1:0.2-1:0.5.
JP22862187A 1987-09-14 1987-09-14 Printed-circuit board Pending JPS6473696A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22862187A JPS6473696A (en) 1987-09-14 1987-09-14 Printed-circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22862187A JPS6473696A (en) 1987-09-14 1987-09-14 Printed-circuit board

Publications (1)

Publication Number Publication Date
JPS6473696A true JPS6473696A (en) 1989-03-17

Family

ID=16879209

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22862187A Pending JPS6473696A (en) 1987-09-14 1987-09-14 Printed-circuit board

Country Status (1)

Country Link
JP (1) JPS6473696A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03112188A (en) * 1989-09-27 1991-05-13 Hitachi Ltd Semiconductor device
JPH0476987A (en) * 1990-07-19 1992-03-11 Matsushita Electric Ind Co Ltd Bonding method for electronic component
JP2006501661A (en) * 2002-10-01 2006-01-12 インターナショナル・ビジネス・マシーンズ・コーポレーション Substrate for connecting integrated circuits
CN111447740A (en) * 2019-01-17 2020-07-24 日本特殊陶业株式会社 Package with a metal layer

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03112188A (en) * 1989-09-27 1991-05-13 Hitachi Ltd Semiconductor device
JPH0476987A (en) * 1990-07-19 1992-03-11 Matsushita Electric Ind Co Ltd Bonding method for electronic component
JP2006501661A (en) * 2002-10-01 2006-01-12 インターナショナル・ビジネス・マシーンズ・コーポレーション Substrate for connecting integrated circuits
CN111447740A (en) * 2019-01-17 2020-07-24 日本特殊陶业株式会社 Package with a metal layer
JP2020113722A (en) * 2019-01-17 2020-07-27 日本特殊陶業株式会社 package
US11551984B2 (en) 2019-01-17 2023-01-10 Ngk Spark Plug Co., Ltd. Package

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