JPS61221301A - Composition for metallic green compact - Google Patents
Composition for metallic green compactInfo
- Publication number
- JPS61221301A JPS61221301A JP60062665A JP6266585A JPS61221301A JP S61221301 A JPS61221301 A JP S61221301A JP 60062665 A JP60062665 A JP 60062665A JP 6266585 A JP6266585 A JP 6266585A JP S61221301 A JPS61221301 A JP S61221301A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- metal
- binder
- green compact
- ceramic powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 27
- 239000000843 powder Substances 0.000 claims abstract description 148
- 239000000919 ceramic Substances 0.000 claims abstract description 49
- 239000011230 binding agent Substances 0.000 claims abstract description 45
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000008119 colloidal silica Substances 0.000 claims abstract description 10
- 150000005846 sugar alcohols Polymers 0.000 claims abstract description 3
- 229910052751 metal Inorganic materials 0.000 claims description 70
- 239000002184 metal Substances 0.000 claims description 70
- 239000002245 particle Substances 0.000 claims description 37
- 239000003607 modifier Substances 0.000 claims description 4
- 150000004760 silicates Chemical class 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 abstract description 12
- 238000002156 mixing Methods 0.000 abstract description 12
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 abstract description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052742 iron Inorganic materials 0.000 abstract description 2
- 229910052725 zinc Inorganic materials 0.000 abstract description 2
- 229910052593 corundum Inorganic materials 0.000 abstract 1
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 34
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 15
- 239000004115 Sodium Silicate Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 13
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 13
- 229910052911 sodium silicate Inorganic materials 0.000 description 13
- 239000011812 mixed powder Substances 0.000 description 12
- 239000011701 zinc Substances 0.000 description 12
- 229910000831 Steel Inorganic materials 0.000 description 11
- 239000002002 slurry Substances 0.000 description 11
- 239000010959 steel Substances 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 10
- 239000002932 luster Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 239000004570 mortar (masonry) Substances 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 9
- 239000003921 oil Substances 0.000 description 8
- 238000012545 processing Methods 0.000 description 8
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 7
- 238000000465 moulding Methods 0.000 description 7
- 239000011734 sodium Substances 0.000 description 7
- 229910052708 sodium Inorganic materials 0.000 description 7
- 239000004111 Potassium silicate Substances 0.000 description 5
- 239000011195 cermet Substances 0.000 description 5
- 239000004927 clay Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 description 5
- 229910052913 potassium silicate Inorganic materials 0.000 description 5
- 235000019353 potassium silicate Nutrition 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000004898 kneading Methods 0.000 description 4
- 238000003754 machining Methods 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000001879 gelation Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000011259 mixed solution Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 229920002472 Starch Polymers 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 235000013339 cereals Nutrition 0.000 description 2
- 239000011362 coarse particle Substances 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000009760 electrical discharge machining Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 235000019698 starch Nutrition 0.000 description 2
- 239000008107 starch Substances 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 229910001339 C alloy Inorganic materials 0.000 description 1
- HSRJKNPTNIJEKV-UHFFFAOYSA-N Guaifenesin Chemical compound COC1=CC=CC=C1OCC(O)CO HSRJKNPTNIJEKV-UHFFFAOYSA-N 0.000 description 1
- 206010064127 Solar lentigo Diseases 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- ILRRQNADMUWWFW-UHFFFAOYSA-K aluminium phosphate Chemical compound O1[Al]2OP1(=O)O2 ILRRQNADMUWWFW-UHFFFAOYSA-K 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000001112 coagulating effect Effects 0.000 description 1
- 238000005345 coagulation Methods 0.000 description 1
- 230000015271 coagulation Effects 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- OHZZTXYKLXZFSZ-UHFFFAOYSA-I manganese(3+) 5,10,15-tris(1-methylpyridin-1-ium-4-yl)-20-(1-methylpyridin-4-ylidene)porphyrin-22-ide pentachloride Chemical compound [Cl-].[Cl-].[Cl-].[Cl-].[Cl-].[Mn+3].C1=CN(C)C=CC1=C1C(C=C2)=NC2=C(C=2C=C[N+](C)=CC=2)C([N-]2)=CC=C2C(C=2C=C[N+](C)=CC=2)=C(C=C2)N=C2C(C=2C=C[N+](C)=CC=2)=C2N=C1C=C2 OHZZTXYKLXZFSZ-UHFFFAOYSA-I 0.000 description 1
- 238000003913 materials processing Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- -1 polyethylene lauryl ether Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 239000006188 syrup Substances 0.000 description 1
- 235000020357 syrup Nutrition 0.000 description 1
- BPJYAXCTOHRFDQ-UHFFFAOYSA-L tetracopper;2,4,6-trioxido-1,3,5,2,4,6-trioxatriarsinane;diacetate Chemical compound [Cu+2].[Cu+2].[Cu+2].[Cu+2].CC([O-])=O.CC([O-])=O.[O-][As]1O[As]([O-])O[As]([O-])O1.[O-][As]1O[As]([O-])O[As]([O-])O1 BPJYAXCTOHRFDQ-UHFFFAOYSA-L 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Powder Metallurgy (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
この発明は、金属単独または金属とセラミックスとを含
む金属圧粉体組成物に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application This invention relates to a metal compact composition containing a metal alone or a metal and ceramics.
従来の技術
従来より、欧米諸国では、焼入れ硬化した材質を金型に
使用しているが、故障を起さず耐久性のある金型をつく
るには、型彫後焼入れ硬化するか、焼入れ硬化済みの材
料を型彫するかして、行われている。Conventional technology Conventionally, in Western countries, quench-hardened materials have been used for molds, but in order to create durable molds that do not cause failure, it is necessary to quench-harden them after die carving or quench-harden them. It is done by mold engraving pre-finished materials.
しかし、これだと硬い材質だけに型彫するのに時間がか
かり、後処理にしても歪の問題、加工費の上昇などがあ
るため我国ではプラスチック用金型などの９０％近くが
焼入れしない材質を使用しており、必要に応じて焼入れ
した材質のものを使用しているにすぎない。また、一般
の金型加工についてはキャビティの相違によるが、製造
に長時間を要し高度な技術を必要とするので、必然的に
高価なものとなるが、最近金型の量産化、すなわち迅速
加工によって加工費を低減し、高速度に金型を得る方法
が開発され、実用化されている。例えば、コールドボビ
ングと呼ばれる冷間加工、ショープロセス法、放電加工
、電鋳法、さらに人手を要しない全自動ならいフライス
盤、全自動ボール盤等が開発され、経済性の向上を図っ
ている。However, with this, it takes time to carve only hard materials, and post-processing causes problems with distortion and increases in processing costs, so in Japan, nearly 90% of molds for plastics are made of materials that are not hardened. We only use hardened materials when necessary. In addition, general mold processing depends on the differences in cavities, but it takes a long time to manufacture and requires advanced technology, so it is inevitably expensive. A method to reduce processing costs and obtain molds at high speed has been developed and put into practical use. For example, cold working called cold bobbing, the show process method, electrical discharge machining, electroforming, fully automatic profile milling machines, fully automatic drilling machines, etc. that do not require human labor have been developed to improve economic efficiency.
しかしながら、金型加工法の変遷はこれを利用する金型
鋼材の変化を伴ない、コールドボビング法では低炭素合
金鋼が用いられ、放電加工法ではその型鋼が焼入れ焼戻
し済みの高硬度であってもよく超硬合金の加工も可能で
ある。また簡易な鋳造法による材質としては亜鉛合金（
ＺＡＳ）、あるいはベリリウム銅が用いられ、金型の一
部に利用されている。However, changes in mold machining methods have been accompanied by changes in the mold steel materials used, with cold bobbing methods using low-carbon alloy steel, and electrical discharge machining methods using high-hardness mold steel that has been quenched and tempered. It is also possible to process cemented carbide. In addition, zinc alloy (
ZAS) or beryllium copper is used in some of the molds.
サーメットはセラミック粉末と金属粉末とからなる耐熱
性複合材料としてよく知られている。かかるサーメット
を得るには、セラミック粉末と金属粉末とを混合し、圧
縮成形したのち、これを焼結する方法が一般に用いられ
る。得られたサーメットは、セラミックスの有する硬さ
、耐食性、耐熱性と、金属の有する強度等の特徴が組入
れられた性質を有する。このようなサーメットを金型に
使用すれば、従来のように金属を焼入れして硬度を高め
る必要がなくなり、金型加工が簡易化される。Cermet is well known as a heat-resistant composite material consisting of ceramic powder and metal powder. To obtain such a cermet, a method is generally used in which ceramic powder and metal powder are mixed, compression molded, and then sintered. The obtained cermet has properties that incorporate the hardness, corrosion resistance, and heat resistance of ceramics, and the strength of metals. If such a cermet is used in a mold, there is no need to harden the metal to increase its hardness as in the past, and mold processing is simplified.
発明が解決しようとする問題点
かかるサーメットにおける問題点は、セラミック粉末と
金属粉末との混合物の圧縮成形および焼結において多大
の熱と圧力を必要とすることである。このため、金型（
ダイス、パンチ）、型取りの原型（マスターピース）の
寿命に悪影響を与えるという問題がある。Problems to be Solved by the Invention A problem with such cermets is that a large amount of heat and pressure is required in compression molding and sintering of the mixture of ceramic powder and metal powder. For this reason, the mold (
There is a problem in that it adversely affects the lifespan of the master piece (dies, punches) and molding master pieces.
また、サーメットは、セラミック粉末を混入した焼結体
であるために、切断、切削等の機械的加工が困難であっ
た。Further, since cermet is a sintered body mixed with ceramic powder, mechanical processing such as cutting and cutting is difficult.
問題点を解決するための手段
前記曲１点を解決するために、この発明が講じた技術的
手段（発明の構成）は、つぎのとおりである。Means for Solving the Problems The technical means (structure of the invention) taken by the present invention to solve the above-mentioned one problem are as follows.
すなわち、この発明の金属圧粉体組成物は、金属粉末の
１種もしくは２種以上または金属粉末の１種もしくは２
種以上とセラミック粉末との混合物と、無機結合剤と、
要すれば結合調整剤とを含み、前記無機結合剤がケイ酸
塩類、アモルファスシリカおよびコロイダルシリカから
なることを特徴とするものである。That is, the metal compact composition of the present invention comprises one or more metal powders or one or two metal powders.
a mixture of at least one seed and a ceramic powder; an inorganic binder;
It is characterized in that it contains a bonding regulator if necessary, and the inorganic binder consists of silicates, amorphous silica, and colloidal silica.
このように、この発明によれば、金属粉末または金属粉
末とセラミック粉末との混合物に特定の無機結合剤を加
えたので、ことさら焼結することなく比較的低温度でか
つ低圧力で成形することができる。また、金属粉末とセ
ラミック粉末の粒度や金属粉末、セラミック粉末および
結合剤の配合割合、さらに結合剤の組成割合を変えるこ
とにより、硬度１機械的加工性（切断、切削、研摩、穿
孔等）、熱伝導性、導電性等の物性が異なる種々の圧粉
体を容易につくることができる。As described above, according to the present invention, since a specific inorganic binder is added to the metal powder or the mixture of metal powder and ceramic powder, it is possible to mold the product at relatively low temperature and low pressure without sintering. I can do it. In addition, by changing the particle size of metal powder and ceramic powder, the mixing ratio of metal powder, ceramic powder, and binder, and the composition ratio of binder, we can improve hardness 1 mechanical workability (cutting, grinding, polishing, drilling, etc.). Various green compacts with different physical properties such as thermal conductivity and electrical conductivity can be easily produced.
この発明における圧粉体は、その製造の容易さおよび諸
物性からプラスチック、ゴム等の成形用金型として好適
に使用しうるちのであり、とくに機械的加工性にすぐれ
た圧粉体を用いることにより複雑な形状の金型をも容易
につくることができる。また、耐熱性、熱伝導性、導電
性等を必要とするその他の用途にも好適に使用しうるも
のである。The green compact according to the present invention can be suitably used as a mold for molding plastics, rubber, etc. because of its ease of manufacture and various physical properties. This makes it possible to easily create molds with complex shapes. Moreover, it can be suitably used in other applications requiring heat resistance, thermal conductivity, electrical conductivity, and the like.
前記金属粉末としては、たとえばＺｎ、ＡＩ。Examples of the metal powder include Zn and AI.
Ｆｅ、Ｎｉ等の金属粉末があげられる。これらの金属粉
末は１種または２種以上を混合して使用するが、必要に
応じてそれらにセラミック粉末を混合して複合化するこ
とができる。セラミック粉末は、硬度が高く、耐食性、
耐熱性にすぐれていることから、金属のみからなる圧粉
体の改質を目的として使用されるものである。かかるセ
ラミック粉末としては、Ｓ ｒ Ｃ，Ａ １２０３ 、
Ｔ ＋ Ｃ。Examples include metal powders such as Fe and Ni. These metal powders may be used alone or in combination of two or more, but if necessary, they may be mixed with ceramic powder to form a composite. Ceramic powder has high hardness, corrosion resistance,
Because it has excellent heat resistance, it is used for the purpose of modifying green compacts made only of metal. Such ceramic powders include S r C, A 1203 ,
T+C.
Ｂｅｄ、ＴｉＯ２，５ｉ０２．ＺｒＯ２等があげられる
。このうち、ＳｉＣはＢｅＯについで熱伝導性が高くか
つ硬度も高いことから、金型等の用途に好適に採用しう
るちのである。Bed, TiO2,5i02. Examples include ZrO2. Among these, SiC has the second highest thermal conductivity and hardness after BeO, so it can be suitably used for molds and the like.
使用する金属粉末の粒度は、得られる圧粉体の物性に大
きな影響を与える。すなわち、金属粉末の粒度が高いと
多孔質で接着強度の高い圧粉体が得られる。一方、粒度
が小さいと、粒子間の接着強度が低くかつ硬度も低い圧
粉体が得られる。そのため、多孔質でなくしかも接着強
度や硬度が高い圧粉体を得るためには、粒度の大きい金
属粉末と粒度の小さい金属粉末とを混合して使用する。The particle size of the metal powder used has a large effect on the physical properties of the resulting green compact. That is, when the particle size of the metal powder is high, a green compact that is porous and has high adhesive strength can be obtained. On the other hand, when the particle size is small, a green compact with low adhesive strength between particles and low hardness can be obtained. Therefore, in order to obtain a green compact that is not porous and has high adhesive strength and hardness, metal powder with large particle size and metal powder with small particle size are mixed and used.
金属粉末の使用可能な粒度範囲としては、１００メツシ
ユ（ＡＳＴＭ単位、以下同様）以下で０．０５ｍμ以上
であるのが好ましく、粒度がそれより大なるときは表面
が凹凸状になった多孔質の圧粉体となり平滑な金属光沢
のある表面が得られず、また粒度がそれより小なるとき
は接着強度に劣る圧粉体しか得ることができない。さら
に粒度の大きい金属粉末と粒度の小さい金属粉末との割
合は重量比で約３：１−１：３であるのが適当である。The usable particle size range of the metal powder is preferably 100 mesh (ASTM unit, the same shall apply hereinafter) or less and 0.05 mμ or more. When the particle size is smaller than this, only a green compact with poor adhesive strength can be obtained. Furthermore, it is appropriate that the ratio of metal powder with large particle size to metal powder with small particle size is about 3:1 to 1:3 by weight.
また、これらの金属粉末の一方または一部をセラミック
粉末で置き換えてもよく、あるいはこれらの金属粉末の
混合物にさらにセラミック粉末を加えるようにしてもよ
い。Further, one or a portion of these metal powders may be replaced with a ceramic powder, or a ceramic powder may be further added to the mixture of these metal powders.
金属粉末にセラミック粉末を混合する場合、セラミック
粉末は粒度が０．５〜１０ｍμ程度の微粉末状であるの
が、圧粉体の表面に金属光沢色を与えかつ機械的加工性
を付与するうえで好ましい。When mixing ceramic powder with metal powder, the ceramic powder is in the form of a fine powder with a particle size of about 0.5 to 10 mμ, which gives a metallic luster color to the surface of the green compact and provides mechanical workability. It is preferable.
セラミック粉末の粒度が１０ｍμより大きいときは硬度
が高くなりすぎて切削等の機械的加工ができなくなる。When the particle size of the ceramic powder is larger than 10 mμ, the hardness becomes too high and mechanical processing such as cutting becomes impossible.
また、金属粉末：セラミック粉末の配合割合は重量比で
１００：３〜１００：３０であるのが好ましく、セラミ
ック粉末がそれより大なるときは、圧粉体の機械的加工
性が困難となり、導電性にも劣ってくることとなり、ま
たそれより小なるときは金属粉末のみからなる圧粉体の
改質効果が不十分となる。金属粉末とセラミック粉末と
を前記範囲内で結合剤と一体に混練し成形すると、金属
粉末がセラミック粉末を被覆する形となり、熱、電気に
対して不導体であるセラミック粉末の性質を改善するこ
とができ、金属とほぼ同等の熱伝導性、導電性を示すよ
うになる。セラミック粉末と混合する金属粉末は、硬質
なセラミックスを被覆しやすいように軟い金属粉末（た
とえば亜鉛粉末等）を用いるのが好ましい。In addition, the mixing ratio of metal powder:ceramic powder is preferably 100:3 to 100:30 by weight; if the ceramic powder is larger than this, the mechanical workability of the green compact becomes difficult and the conductivity increases. If it is smaller than this, the modification effect of the green compact made only of metal powder will be insufficient. When metal powder and ceramic powder are kneaded together with a binder within the above range and molded, the metal powder coats the ceramic powder, improving the properties of the ceramic powder, which is a non-conductor to heat and electricity. It becomes possible to exhibit thermal conductivity and electrical conductivity almost equivalent to metals. As the metal powder to be mixed with the ceramic powder, it is preferable to use a soft metal powder (for example, zinc powder, etc.) so that it can easily coat hard ceramics.
この発明における結合剤は、たとえば特公昭５５−１８
６７３号公報、特公昭５６−５１）５０号公報に記載の
結合剤が使用可能であり、ケイ酸ソーダやケイ酸カリウ
ム等のケイ酸塩類、アモルファスシリカおよびコロイダ
ルシリカからなる。ケイ酸ソーダとしては、たとえば３
号ケイ酸ソーダ、２号ケイ酸ソーダのいずれか一方また
はそれらの混合物が使用可能である。アモルファスシリ
カは普通のシリカと異なる活性の強い非晶質無定形シリ
カを約７５〜８５％含んだ鉱石の粉末で、この鉱石は水
成岩であり、灰黒色で組成の大部分を占るケイ酸分と微
量の炭素分はＸ″４ｉＡ的に無定形でいわゆる膠性質シ
リカである。The binder in this invention is, for example, Japanese Patent Publication No. 55-18
The binders described in Japanese Patent Publication No. 673 and Japanese Patent Publication No. 56-51)50 can be used, and are composed of silicates such as sodium silicate and potassium silicate, amorphous silica, and colloidal silica. As the sodium silicate, for example, 3
Either one of sodium silicate No. 2 and sodium silicate No. 2 or a mixture thereof can be used. Amorphous silica is an ore powder that contains about 75 to 85% amorphous silica, which is highly active and different from ordinary silica. The trace amount of carbon is amorphous in terms of X″4iA and is so-called glue silica.
その分析値を下記に示す。The analytical values are shown below.
Ｓｉｎｇ Ａ７！ｚ０３ ＦｅｚＯ３ＣＣａＯＭｇ
Ｏその他８２．５ ２．０６ ４．９６ ２３．１
２ １．８８ ０．４にのアモルファスシリカとケイ酸
ソーダを混合すると、ケイ酸ソーダのアルカリによって
アモルファスシリカの組成分である７５〜８５％の無定
形可溶性ケイ酸分と炭素とが溶解され、高耐熱性の特異
質なケイ酸ソーダが生成される。さらに、耐熱度を高め
るためにコロイダルシリカが用いられる。前記ケイ酸ソ
ーダはアモルファスシリカを溶解するほか、接着強度を
高める働きをするために加えられるもので、結合剤にお
ける割合が３０〜５０部（重量部、以下同様）であるの
が好ましい。またケイ酸カリウムは結合剤の結合強度を
高めるために加えられるもので、５〜１０部が適当であ
る。また、アモルファスシリカは３０〜５０部でまたコ
ロイダルシリカは９〜１）部でそれぞれ用いることがで
きる。さらに、結合剤の耐水性を高めるために、硬化剤
としてケイフッ化ソーダ。Sing A7! z03 FezO3CCaOMg
O Others 82.5 2.06 4.96 23.1
2 1.88 When the amorphous silica and sodium silicate in 0.4 are mixed, 75 to 85% of amorphous soluble silicic acid and carbon, which are the components of the amorphous silica, are dissolved by the alkali of the sodium silicate, A unique sodium silicate with high heat resistance is produced. Furthermore, colloidal silica is used to increase heat resistance. The sodium silicate is added to dissolve the amorphous silica and also serve to increase adhesive strength, and its proportion in the binder is preferably 30 to 50 parts (parts by weight, hereinafter the same). Potassium silicate is added to increase the bonding strength of the binder, and is suitably added in an amount of 5 to 10 parts. Further, amorphous silica can be used in an amount of 30 to 50 parts, and colloidal silica can be used in an amount of 9 to 1) parts. Additionally, sodium silicofluoride as a hardening agent to increase the water resistance of the binder.
ケイ酸マグネシウム５塩化カリウム、リン酸アルミニウ
ムの１種または２種以上を少量添加するようにしてもよ
い。結合剤の好ましい配合例を以下に示す。A small amount of one or more of potassium silicate pentachloride and aluminum phosphate may be added. Preferred blending examples of the binder are shown below.
３号ケイ酸ソーダ １２０ｇ
２号ケイ酸ソーダ ５０ｇ
ケイ酸カリウム １０ｇ
アモルファスシリカ１２０ｇ
コロイダルシリカ ４５ｇ
その他（硬化剤）約Ｌｏｇ（ただし、使用時に添加）
（ＰＨ約１））
これらの結合剤成分は、十分に撹拌混合し、室温下で１
２時間放置して上層液と下層液とに分離させる。これら
の上層液および下層液はゾルである。No. 3 Sodium Silicate 120g No. 2 Sodium Silicate 50g Potassium Silicate 10g Amorphous Silica 120g Colloidal Silica 45g Other (hardening agent) approx. Log (added at time of use) (PH approx. 1)) These binder components are sufficient Stir and mix to 1 at room temperature.
Leave to stand for 2 hours to separate into an upper layer liquid and a lower layer liquid. These upper and lower layer liquids are sol.
上層液はケイ酸塩とゾル状シリカ（コロイダルシリカと
アモルファスシリカを含む）が主成分であり、うすねず
み色の粘性のある透明な液体である。この液から水分を
とばすと弾力性のある緻密な膜をつくる。この点は普通
のケイ酸ソーダと全く異なる。The upper layer liquid is mainly composed of silicate and sol-like silica (including colloidal silica and amorphous silica), and is a light gray, viscous and transparent liquid. When the water is removed from this liquid, a dense, elastic film is formed. This point is completely different from ordinary sodium silicate.
下層液は灰黒色無定形の濃度の高いゾル状のケイ酸分が
主成分であり、この液を上層液と同様に水分をとばした
後は弾力性のある緻密な膜をつくる。この膜は上層液の
膜より柔軟さをもち衝撃を緩和する作用が強いが、接着
強度は上層液よりも劣る。また硬化剤の作用により、上
層液は次第に粘度を増し水アメ状のねばねばした液状と
なるが、それ単独ではゾルからゲル状にはなりにくい。The main component of the lower layer liquid is gray-black, amorphous, highly concentrated sol-like silicic acid, and like the upper layer liquid, after the water is removed from this liquid, an elastic and dense film is formed. This film is more flexible than the upper layer liquid and has a stronger effect of mitigating impact, but its adhesive strength is inferior to that of the upper layer liquid. Also, due to the action of the curing agent, the upper layer liquid gradually increases in viscosity and becomes a sticky liquid like starch syrup, but it is difficult to change the sol from a gel by using the curing agent alone.
しかし、上層液に下層液を添加し混合液をつくると、粘
度を増し水アメ状を越して直ちにゲル状態になる。上層
液と下層液との配合割合は、必要とする圧粉体間の粒子
間の接着強度、硬度、脆さ等に影響することから、これ
らの緒特性に応じて配合割合を適宜決定する０通常は上
層液と下層液とを５：１〜１：５（重量比）の範囲内で
配合するのが好ましい、上層液と下層液とを混合し、こ
れに金属粉末または金属粉末とセラミック粉末とを加え
、十分に混練し、室温下で放置すると約３０〜６０分で
ゲル化が進み、熱圧成形が可能となる。However, when the lower layer liquid is added to the upper layer liquid to create a mixed liquid, the viscosity increases and goes beyond the starch syrup-like state to a gel state immediately. The blending ratio of the upper layer liquid and the lower layer liquid affects the adhesive strength, hardness, brittleness, etc. between particles between the required powder compacts, so the blending ratio is determined as appropriate according to these properties. Usually, it is preferable to mix the upper layer liquid and the lower layer liquid within the range of 5:1 to 1:5 (weight ratio).The upper layer liquid and the lower layer liquid are mixed, and metal powder or metal powder and ceramic powder When these are added, sufficiently kneaded, and left at room temperature, gelation progresses in about 30 to 60 minutes, making hot-press molding possible.
結合剤は、金属粉末単独または金属粉末とセラミック粉
末との混合物１００部に対して５〜２５部の割合で配合
するのが好ましく、結合剤の配合量がそれより大なると
きは密着強度が低下し金属またはセラミックスの特性が
失われ、またそれより小なるときは粒子間の結合が弱く
詭くこわれやすい圧粉体となる。It is preferable to mix the binder in a ratio of 5 to 25 parts per 100 parts of the metal powder alone or a mixture of metal powder and ceramic powder. If the amount of the binder is larger than that, the adhesion strength will decrease. If the particles are smaller, the properties of the metal or ceramic will be lost, and if the particles are smaller, the bonds between the particles will be weak and the compact will become fragile.
前記結合調整剤は、金属粉末等の粒子を結合剤でぬれや
すくするためと、粒子が凝結して固い小塊状となるのを
防止するためのものである。金属粉末やセラミック粉末
、とくに微粉末状のセラミック粉末は、水やその他の液
体にぬれにくり、粒子が細かくなればなるほど、メリケ
ン粉のように凝集しやすくなる。これを成形容器内に投
入し、加熱加圧して圧粉体を作成すると、圧粉体の表面
および内部に結合剤が浸透せずに粒子同士が凝結してで
きたざらざらした固いつぶが散在する０表面のつぶを除
去すると、金属光沢のある面となるが、つぶを除去した
凹陥部が残り、表面の平滑さが損なわれる。そこで、金
属粉末およびセラミ７り粉末と結合剤とのぬれ性の改善
と金属との反応を防止するために、結合調整剤として油
（鉱油等）やエチレングリコール、グリセリン等の多価
アルコールを用いる。これらの結合調整剤は、必らず使
用しなければならないものではなく、粒子と結合剤との
ぬれあるいは粒子間の凝結が問題とならない場合には使
用する必要がない。また、これら結合調整剤とともに、
界面活性剤を少量使用してもよい、この界面活性剤も粒
子と結合剤とのぬれを改善するために使用され、一般に
は結合剤と反応せず熱分解しやすいエーテル型の界面活
性剤、例えばポリエチレンラウリルエーテル等を用いる
ことができる。結合調整剤は金属粉末または金属粉末と
セラミック粉末との混合物１００部に対して０〜２０部
の割合で使用するのが好ましく、結合調整剤の配合量が
それより大なるときは粒子間の密着強度が低下すること
になる。The bonding regulator is used to make it easier for particles such as metal powder to be wetted with a binder, and to prevent particles from coagulating into hard lumps. Metal powders and ceramic powders, especially finely powdered ceramic powders, are difficult to wet with water and other liquids, and the finer the particles, the more likely they are to agglomerate like American flour. When this is put into a molding container and heated and pressurized to create a green compact, the binder does not penetrate into the green compact and the particles coagulate together, causing rough, hard lumps to be scattered on the surface and inside of the green compact. 0 If the grains are removed from the surface, the surface will have a metallic luster, but a concave portion will remain where the grains were removed, impairing the smoothness of the surface. Therefore, in order to improve the wettability of the metal powder and ceramic powder with the binder and to prevent the reaction with the metal, oil (mineral oil, etc.) or polyhydric alcohol such as ethylene glycol or glycerin is used as a bond modifier. . These bond modifiers do not necessarily have to be used, and do not need to be used if wetting of particles and binder or coagulation between particles is not a problem. In addition, along with these binding regulators,
A small amount of surfactant may be used. This surfactant is also used to improve the wetting of the particles with the binder, and is generally an ether-type surfactant that does not react with the binder and is easily decomposed by heat. For example, polyethylene lauryl ether or the like can be used. It is preferable to use the bonding regulator in a ratio of 0 to 20 parts per 100 parts of the metal powder or the mixture of metal powder and ceramic powder, and if the amount of the bonding regulator is larger than that, the adhesion between particles The strength will be reduced.
これらの各成分を用いて圧粉体を製造する方法を第１図
に基づいて説明する。第１図は金属粉末とセラミック粉
末とを混合して圧粉体をつくる工程図である。まず、金
属粉末とセラミック粉末とを所定量ずつ十分に混合する
。これに、前述のようにして調製した結合剤および結合
調整剤の所定量を加え、混練すると、泥状物となる。こ
の泥状物を室温下で放置すると、約３０〜６０分でゲル
化が進む。その際、表面から滲出した液はろ紙などで吸
い取って除去する。この状態で泥状物を成形容器内に充
填し、加熱加圧して圧粉体を得る。A method for producing a green compact using each of these components will be explained based on FIG. 1. FIG. 1 is a process diagram for producing a green compact by mixing metal powder and ceramic powder. First, metal powder and ceramic powder are thoroughly mixed in predetermined amounts. To this, predetermined amounts of the binder and bond modifier prepared as described above are added and kneaded to form a slurry. When this slurry is left at room temperature, gelation progresses in about 30 to 60 minutes. At that time, remove the liquid that seeps from the surface by absorbing it with filter paper or the like. In this state, the slurry is filled into a molding container and heated and pressed to obtain a green compact.
加熱は常温以上の温度であればよく、とくに加熱温度が
限定されるものではないが、成形に使用するダイス、パ
ンチおよび型取りの原型の損傷を少なくする上で通常の
焼結温度に達しない温度であるのが好ましく、一般には
約４００〜４５０°Ｃ以下であるのが適当である。また
、同様の理由から、加圧もできるだけ低圧であるのが好
ましく、一般には１トン／−程度が適当である。以上の
製造手順および条件は金属粉末を単独で用いた場合も同
様である。Heating may be done at a temperature above room temperature, and there are no particular restrictions on the heating temperature, but in order to reduce damage to the dies, punches, and molding masters used for molding, it is important that the temperature does not reach the normal sintering temperature. Preferably, the temperature is generally below about 400-450°C. Further, for the same reason, it is preferable that the pressure is as low as possible, and generally about 1 ton/- is appropriate. The above manufacturing procedure and conditions are the same even when metal powder is used alone.
このようにして製造された圧粉体はセラミック粉末を含
有するにもかかわらず、金属光沢色を有し、熱伝導性、
導電性にすぐれるとともに、セラミック粉末により硬度
、耐摩耗性、耐食性等が著しく改善される。また、金属
粉末、セラミック粉末の粒度や配合量を適宜決定するこ
とにより、粒子間の接着強度が高く、かつ切削、切断、
研摩。Although the powder compact produced in this way contains ceramic powder, it has a metallic luster color, thermal conductivity,
In addition to having excellent electrical conductivity, the ceramic powder significantly improves hardness, wear resistance, corrosion resistance, etc. In addition, by appropriately determining the particle size and blending amount of metal powder and ceramic powder, we can achieve high adhesive strength between particles and
Polishing.
穿孔等の加工が可能となり、圧粉体を任意の形状に加工
することができる。Processing such as perforation becomes possible, and the green compact can be processed into any shape.
実施例
実施例１ （金属粉末とセラミック粉末との複合化圧粉
体）：超微粉末状の硬質ＳｉＣ粉末（平均粒子径０．７
ｍμ、昭和電工■製のＡ−２タイプ）の２０８とＺｎ粉
末（３５０メソシｓ Ａ Ｓ Ｔ Ｍ ）の２０ｇとを
自動乳鉢で約５日間にわたって機械混合した。さらに、
この混合粉末から１５．５ ｇをとり、３００メソシユ
のＺｎ粉末と混合して６０ｇとし、再び自動乳鉢で２時
間混合して混合粉末を得た（混合粉末中のＳｉＣ粉末含
量は約１３％となる）。Examples Example 1 (Composite green compact of metal powder and ceramic powder): Hard SiC powder in the form of ultrafine powder (average particle size 0.7
mμ, A-2 type manufactured by Showa Denko Corporation) and 20 g of Zn powder (350 meso s ASTM) were mechanically mixed in an automatic mortar for about 5 days. moreover,
15.5 g of this mixed powder was taken and mixed with 300 mesoyu of Zn powder to make 60 g, and mixed again in an automatic mortar for 2 hours to obtain a mixed powder (the SiC powder content in the mixed powder was approximately 13%). Become).
一方、３号ケイ酸ソーダ１２０ｇ、２号ケイ酸ソーダ５
０ｇ、ケイ酸カリウム１０ｇ、アモルファスシリカ１２
０ｇ、コロイダルシリカ３５ｇを混合して混合液をつく
った。この混合液を約１２時間室温下で放置し上層液と
下層液とに分離させた。ついで、上層液と下層液とを３
：ｌの割合で混合し、結合剤を得た。この結合剤の液２
０ｇに硬化剤（ケイフン化ソーダ＞０．５ｇを添加し、
乳鉢でよく混練りした後、この混練りした液から８ｇを
とりこれに結合調整液であるエチレングリコールの２０
％水溶液４ｃｃと、沸点が約１５０〜２００℃の油２ｇ
を添加し、撹拌して油を十分に分散させた。これに上述
の混合粉末５０ｇを撹拌しながら徐々に加え、どろどろ
の泥状混合物を得た。この泥状物をヘラでよく練ってか
ら約２時間放置した。On the other hand, 120 g of No. 3 sodium silicate, 5 g of No. 2 sodium silicate
0g, potassium silicate 10g, amorphous silica 12
A mixed solution was prepared by mixing 0g of colloidal silica and 35g of colloidal silica. This mixed solution was left at room temperature for about 12 hours to separate into an upper layer liquid and a lower layer liquid. Next, the upper layer liquid and the lower layer liquid were
:1 to obtain a binder. This binder liquid 2
Add hardening agent (sodium silica >0.5g to 0g,
After kneading well in a mortar, take 8 g of this kneaded liquid and add 20 g of ethylene glycol, which is a binding adjustment liquid.
% aqueous solution and 2 g of oil with a boiling point of about 150-200℃
was added and stirred to thoroughly disperse the oil. 50 g of the above-mentioned mixed powder was gradually added to this while stirring to obtain a mushy mud-like mixture. This slurry was thoroughly kneaded with a spatula and then left to stand for about 2 hours.
この間、泥状物の表面に余分な液が滲み出てきたので、
これをろ紙で吸いとった。最終的には内部に結合剤の液
を含んだ粘土状態となる。充填用の成形容器は材質がＳ
Ｋ３の鋼材で、長さ５０ｉ■。During this time, excess liquid oozed out on the surface of the muddy material, so
This was absorbed with filter paper. Eventually, it becomes a clay state containing a binder liquid inside. The material of the molded container for filling is S.
Made of K3 steel, length 50i.
直径３０＋ｎ、肉厚５龍の中空円筒と厚さ５龍直径約２
０龍の円板形上下ラムからなり、この容器中に上述の粘
土状態となった混合物を叩いて充填した。この充填され
た容器を小型電気炉内で５トン用の小型油圧機に装着し
た。ついで、昇温速度０．８℃／分で温度４００℃程度
まで徐々に加熱加圧して圧粉体を作成した。この圧粉体
を自動鋸で切断し、旋盤で切削すると表面は銀白色の金
属光沢をもった凹凸のない平滑な切断面となった。この
表面の密着強度をみるため材質がＳＫ３の鋼材で直径２
０１．高さ２５ｓｓの円柱の表面を基準として、同じ条
件でグラインダ（関東機器型のミニ・ハンド・グライン
ダ）で表面の切削を繰返した。A hollow cylinder with a diameter of 30+n and a wall thickness of 5 dragons and a thickness of about 2 dragons in diameter.
The container consisted of an upper and lower disk-shaped ram, and the above-mentioned clay mixture was pounded and filled into this container. This filled container was attached to a small hydraulic machine for 5 tons in a small electric furnace. Then, the powder was gradually heated and pressed at a heating rate of 0.8° C./min to a temperature of about 400° C. to produce a green compact. When this powder compact was cut with an automatic saw and then cut with a lathe, the surface became a smooth cut surface with a silvery white metallic luster and no irregularities. In order to check the adhesion strength of this surface, the material is SK3 steel and the diameter is 2.
01. Using the surface of a cylinder with a height of 25 ss as a reference, the surface was repeatedly cut using a grinder (Kanto Kiki type mini hand grinder) under the same conditions.
この結果、表面が銀白色の光沢のある圧粉体は切削した
屑の粉体はごく少量であった。一方ＳＫ３の鋼材からな
る円柱の表面を同じグラインダで切削したが切削粉は殆
ど出なかった。また、圧粉体表面のショア硬度計による
硬度は３５〜４ｏでＳＫ３鋼材で作った円柱の硬度３０
〜３５と殆ど変らなかった。さらにテスターによる電気
抵抗はＳＫ３の鋼材と殆んど同程度であった。また種々
な機械加工はいずれも可能であった。As a result, the green compact with a silvery-white and glossy surface contained only a small amount of cutting waste powder. On the other hand, when the surface of a cylinder made of SK3 steel was cut using the same grinder, almost no cutting powder was produced. In addition, the hardness of the surface of the compact by the Shore hardness tester is 35 to 4o, and the hardness of the cylinder made of SK3 steel is 30o.
~35, which was almost unchanged. Furthermore, the electrical resistance measured by a tester was almost the same as that of SK3 steel. Also, various machining processes were possible.
実施例２：ＳｉＣ粉末（平均粒子径６ｍμ、昭和電工■
製のＡ４タイプ）３０ｇとＺｎ粉末（３５゜メソシェＡ
ＳＴＭ）６０ｇとを自動乳鉢で約２日間にわたって機械
混合した。さらに、この混合粉末から１２ｇをとり、３
００メツシユのＺｎ粉末と混合して６０ｇとし、再び自
動乳鉢で２時間混合して混合粉末を得た（混合粉末中の
ＳｉＣ粉末含量は約６．７％となる）。この混合粉末６
０ｇを実施例１と同じ結合剤８ｇとエチレングリコール
の２０％水溶液４ｃｃと油２ｇを添加した液に徐々に加
えると、ドロドロの泥状物となった。この泥状物をヘラ
で十分に練り、以下実施例１と同様にして加熱、加圧し
て圧粉体を得た。Example 2: SiC powder (average particle size 6 mμ, Showa Denko ■
30g of Zn powder (35゜Mesoche A)
60 g of STM) were mechanically mixed in an automatic mortar for about 2 days. Furthermore, take 12g of this mixed powder and
The mixture was mixed with Zn powder of 0.00 mesh to give a total weight of 60 g, and mixed again in an automatic mortar for 2 hours to obtain a mixed powder (the SiC powder content in the mixed powder was about 6.7%). This mixed powder 6
When 0 g was gradually added to a solution containing 8 g of the same binder as in Example 1, 4 cc of a 20% aqueous solution of ethylene glycol, and 2 g of oil, a thick slurry formed. This slurry was thoroughly kneaded with a spatula, and then heated and pressed in the same manner as in Example 1 to obtain a green compact.
この圧粉体はＳｉＣ粉末含を量が約６．７％であり、実
施例１の約半分であるにもかかわらず、硬度はショア硬
度計で３０〜３５で、ＳＫ３鋼材でつくった円柱の硬度
３５に近いものであった。また、機械加工性については
実施例１より容易であった。Although this powder compact has a SiC powder content of about 6.7%, which is about half of that in Example 1, its hardness is 30 to 35 on the Shore hardness tester, which is comparable to that of a cylinder made of SK3 steel. The hardness was close to 35. Furthermore, machinability was easier than in Example 1.
実施例３：ＳｉＣ粉末として粒度の粗いもの（昭和電工
■製のＧＣ＃２２０．粒度１００ｍ、ｃ＋。Example 3: SiC powder with coarse particle size (GC#220 manufactured by Showa Denko ■, particle size 100 m, c+.
ＪＩＳ Ｒ６００１）を用い、このＳｉＣ粉末２０ｇ
と３５０メツシユのＺｎ粉末７ｇとを自動乳鉢で約３日
間機械的に混合し、さらにこれから４ｇをとり、３００
メツシユのＺｎ粉末５６ｇと自動乳鉢で２時間混合した
。この混合粉末を実施例１と同じ結合剤８ｇと水６ｃｃ
とエチレングリコールＩｇとを混合した液に徐々に加え
、撹拌すると、どろどろの泥状物となった。この泥状物
をヘラで十分に練り、以下実施例１と同様にして加熱加
圧して圧粉体を得た。JIS R6001), 20g of this SiC powder
and 7 g of 350 mesh Zn powder were mechanically mixed in an automatic mortar for about 3 days, and then 4 g of this was taken and 300 mesh
It was mixed with 56 g of mesh Zn powder in an automatic mortar for 2 hours. This mixed powder was mixed with 8 g of the same binder as in Example 1 and 6 cc of water.
and ethylene glycol Ig were gradually added to the mixed solution and stirred, resulting in a thick slurry. This slurry was sufficiently kneaded with a spatula, and heated and pressed in the same manner as in Example 1 to obtain a green compact.
この圧粉体はＳｉＣ粉末含有量が約５％であり、実施例
１より約７％減少しているにもかかわらず、自動鋸や旋
盤では切断、切削ができなかった。そのため、容器を切
断し圧粉体を銅ハンマで叩き割った。割れ口は凹凸の形
となり、実施例１と同じグラインダで切削すると、切削
粉は殆ど発生せず、粒子間の接着強度が高いことが確認
された。また、引掻き抵抗は実施例１より強く、熱、電
気の伝導性では実施例１と変らなかったが、機械加工で
は従来の硬度の刃では不可能であった。Although this green compact had a SiC powder content of about 5%, which was about 7% lower than that of Example 1, it could not be cut or cut with an automatic saw or lathe. Therefore, the container was cut and the green compact was smashed with a copper hammer. The cracks had an uneven shape, and when cut with the same grinder as in Example 1, almost no cutting powder was generated, and it was confirmed that the adhesive strength between the particles was high. In addition, the scratch resistance was stronger than in Example 1, and the thermal and electrical conductivity were the same as in Example 1, but machining was impossible with a blade of conventional hardness.
実施例４；セラミック粉末としてＳｉＣ粉末に代えてア
ルミナ粉末（平均粒子径０．７ｍμ）を用いたほかは実
施例１と同様にして圧粉体を得た。Example 4: A green compact was obtained in the same manner as in Example 1, except that alumina powder (average particle size: 0.7 mμ) was used as the ceramic powder instead of SiC powder.
この圧粉体を自動鋸で切断し、あるいは旋盤で切削する
と、表面は銀白色の金属光沢をもった切断面となった。When this compact was cut with an automatic saw or a lathe, the cut surface had a silvery white metallic luster.
また、表面の密着強度、熱、電気の伝導性、硬度は実施
例１と殆んど変らなかった。Furthermore, the surface adhesion strength, thermal and electrical conductivity, and hardness were almost the same as in Example 1.
実施例５ （金属粉末の圧粉体）：Ｚｎ粉末（３５０メ
ツシユ）８０ｇを実施例１と同じ結合剤１５ｇの液に添
加し、十分に手で混練した。硬化剤としてケイフッ化ソ
ーダ２％をあらかじめ混合し、さらに水２ｃｃ、油１ｇ
を添加した。混練物はドロドロの液状物となり、これを
ヘラでよく練った後、約２時間放置したところ、実施例
１に比して弾力性が少ない粘土状態となった。以下実施
例１と同様にして圧粉体を得た。Example 5 (Powder compact of metal powder): 80 g of Zn powder (350 mesh) was added to a liquid containing 15 g of the same binder as in Example 1, and thoroughly kneaded by hand. Mix 2% of sodium fluorosilicide as a hardening agent in advance, and then add 2 cc of water and 1 g of oil.
was added. The kneaded material became a mushy liquid material, and after being thoroughly kneaded with a spatula and left for about 2 hours, it became a clay state with less elasticity than in Example 1. Thereafter, a green compact was obtained in the same manner as in Example 1.
この圧粉体を自動鋸で切断し、旋盤で切削すると、切断
面は銀白色の金属光沢を有していた。密着強度、熱・電
気の伝導性等は実施例１と同様であるが、ショア硬度は
２５〜３０．５５Ｃの銅材でつくった円柱の硬度３０に
近い結果を示した。When this green compact was cut with an automatic saw and then cut with a lathe, the cut surface had a silvery white metallic luster. The adhesion strength, thermal and electrical conductivity, etc. were the same as in Example 1, but the Shore hardness was close to 30, which is the hardness of a cylinder made of copper material with a Shore hardness of 25 to 30.55C.
これは結合剤の主成分をなしているＳｉＯ□がＺｎの硬
度を向上させているからで、この結合剤は接着効果のほ
かにＳｉＣと同様に硬度の向上に役立っている。This is because SiO□, which is the main component of the binder, improves the hardness of Zn, and in addition to its adhesive effect, this binder also serves to improve the hardness, similar to SiC.
実施例６：実施例１における軟いＺｎ粉末に代えてＮｉ
粉末を用い、このＮｉ粉末（３５ｏメツシユ）７４ｇと
ＳｉＣ粉末（Ａ−２タイプ、前出）１）ｇとを自動乳鉢
で約１週間混合した。この混合粉末を実施例１と同じ結
合剤と混合すると、粒子が凝集して硬いつぶができた。Example 6: Ni instead of soft Zn powder in Example 1
Using the powder, 74 g of this Ni powder (35o mesh) and 1) g of SiC powder (A-2 type, described above) were mixed in an automatic mortar for about one week. When this mixed powder was mixed with the same binder as in Example 1, the particles agglomerated to form a hard lump.
そこで、実施例１と同様にケイフッ化ソーダ０．５ｇを
結合剤２０ｇに添加し、混練後、その８ｇに結合調整剤
としてエチレングリコール１ｇと水２ｃｃを添加し、さ
らに油２ｇを添加した。添加後、十分に撹拌し、これに
混合粉末８５ｇを撹拌下で徐々に加えるとどろどろの泥
状物となった。以下実施例１と同様にして圧粉体を得た
。Therefore, in the same manner as in Example 1, 0.5 g of sodium fluorosilicide was added to 20 g of the binder, and after kneading, 1 g of ethylene glycol and 2 cc of water as a bond regulator were added to the 8 g, and 2 g of oil was further added. After the addition, the mixture was sufficiently stirred and 85 g of the mixed powder was gradually added thereto while stirring, resulting in a thick slurry. Thereafter, a green compact was obtained in the same manner as in Example 1.
この圧粉体を自動鋸で切断し、旋盤で切削すると表面は
真ちゅう色に近い色をした金属光沢をもった切断面とな
った。その他の物性は実施例１と同様であった。ただし
、引掻き抵抗性はＺｎ粉末よりＮｉ粉末を用いたほうが
強かった。ショア硬度は３５〜４０で変りがながった。When this powder compact was cut with an automatic saw and then cut with a lathe, the cut surface had a metallic luster with a color close to brass. Other physical properties were the same as in Example 1. However, the scratch resistance was stronger when using Ni powder than when using Zn powder. Shore hardness remained constant between 35 and 40.
実施例７ （金属粉末の圧粉体）：粗いＦｅ粉末（２０
０メソシユ）と微細粉末（昭和電工■製のＡＦＰ５Ｈ，
粒径５μ）とを３：１の配合割合で自動乳鉢で約２時間
混合した。このＦｅ粉末の混合物８０ｇを実施例１と同
じ結合剤１２ｇの液に浸し、十分に混練した。ただし、
結合剤には硬化剤としてケイフッ化ソーダ２％を予め混
合し、さらに水５ｃｃ、油１ｇを添加した。混練物はド
ロドロの泥状物となり、これをヘラでよく練ったのち、
約２時間放置した。これにより、ゲル化が進行し、結合
剤を含んだ粘土状態となった。以下、実施例１と同様に
して圧粉体を得た。Example 7 (Metal powder compact): Coarse Fe powder (20
0 mesoyu) and fine powder (AFP5H manufactured by Showa Denko ■,
(particle size: 5μ) at a mixing ratio of 3:1 in an automatic mortar for about 2 hours. 80 g of this Fe powder mixture was immersed in a solution containing 12 g of the same binder as in Example 1, and thoroughly kneaded. however,
The binder was mixed with 2% sodium silicofluoride as a hardening agent in advance, and 5 cc of water and 1 g of oil were added. The kneaded material becomes a mushy slurry, and after kneading it well with a spatula,
It was left for about 2 hours. As a result, gelation progressed, resulting in a clay state containing a binder. Thereafter, a green compact was obtained in the same manner as in Example 1.
この圧粉体を自動鋸で切断し、旋盤で切削すると、切断
面は平滑な銀白色の金属光沢を存した。When this green compact was cut with an automatic saw and lathe, the cut surface had a smooth silvery white metallic luster.
密度１強度、熱・電気の伝導性等は実施例１と同様であ
るが、ショア硬度は３０を越えており、５５Ｇの鋼材で
作った円柱の硬度３０とほぼ変わりなかった。The density 1 strength, thermal and electrical conductivity, etc. were the same as in Example 1, but the Shore hardness exceeded 30, which was almost the same as the hardness of 30 of the cylinder made of 55G steel.
実施例８（金属粉末の圧粉体）：Ｎｉ粉末（３２５メツ
シユ）を自動乳鉢で約７５時間混合し細分した。このＮ
ｉ粉末の８０ｇを実施例１と同じ結合剤２０ｇの液に添
加し、十分に混練した。ただし、結合剤には硬化剤とし
てケイフッ化ソーダとケイ酸マグネシウムとを１；１の
割合であらかじめ混合し、さらに水２ｃｃ、油２ｇを添
加した。混練物はどろどろの泥状物となり、これをヘラ
でよく練ったのち、約２時間放置したところ、実施例１
に比して弾力性が少ない粘土状態となった。以下、実施
例１と同様にして圧粉体を得た。Example 8 (Metal powder green compact): Ni powder (325 mesh) was mixed in an automatic mortar for about 75 hours and then finely divided. This N
80 g of i powder was added to a solution containing 20 g of the same binder as in Example 1, and thoroughly kneaded. However, as a hardening agent, sodium silicofluoride and magnesium silicate were mixed in advance in a ratio of 1:1, and 2 cc of water and 2 g of oil were added to the binder. The kneaded material turned into a muddy slurry, which was well kneaded with a spatula and left for about 2 hours, resulting in Example 1.
It became a clay state with less elasticity compared to. Thereafter, a green compact was obtained in the same manner as in Example 1.
この圧粉体を自動鋸で切断し、旋盤で切削すると、切断
面は真ちゅう色に近い色の金属光沢を有していた。密着
強度、熱、電気の伝導性等は実施例１と同様であるが、
ショアー硬度は４０〜４５とＳＫ３の鋼材より高かった
。また、機械加工も可能で、引掻抵抗性も金属Ｚｎを用
いた圧粉体より強かった。When this green compact was cut with an automatic saw and lathe, the cut surface had a metallic luster with a color close to brass. Adhesion strength, thermal conductivity, electrical conductivity, etc. are the same as in Example 1, but
Shore hardness was 40-45, higher than SK3 steel. Further, machining was possible, and the scratch resistance was stronger than that of a powder compact using metallic Zn.
実施例９ （金属粉末の多孔質圧粉体）：粒度が粗いＮ
ｉ粉末（２００、” ッシュ”）とＦｅ粉末（２００メ
フシエ）とを１：１の割合で混合した。一方、実施例１
と同じ結合剤２０ｇに硬化剤（ケイフッ化ソーダ）０．
５ｇを加え、十分に混練し、さらに水２ｃｃを添加して
撹拌したのち、これに前記混合粉末の７０ｇを徐々に加
えて混練した。以下、実施例１と同様にして圧粉体を得
た。ただし、加圧時には、過度に圧縮すると結合剤を吐
出して縮まるので、必要以上に圧縮しないように注意を
要する。Example 9 (Porous green compact of metal powder): N with coarse particle size
I powder (200, "Shush") and Fe powder (200 Mefusier) were mixed in a ratio of 1:1. On the other hand, Example 1
20g of the same binder and 0.0g of hardening agent (sodium fluorosilicide).
After adding 5 g and thoroughly kneading, 2 cc of water was added and stirred, 70 g of the mixed powder was gradually added and kneaded. Thereafter, a green compact was obtained in the same manner as in Example 1. However, when applying pressure, care must be taken not to compress it more than necessary, as excessive compression will cause the binder to be discharged and shrink.
この圧粉体を自動鋸で切断し旋盤で切削すると、表面は
小黒点が無数に散在した銀白色の金属光沢をもった切断
面となり、密着強度や電気、熱の伝導性も実施例１のも
のと変らないが、拡大鏡でみると表面の小黒点の部分が
気孔となり、表面に水滴をたらすと直ちに吸収した。こ
のことから、圧粉体は吸水性の多孔質体であることがわ
かる。When this green compact is cut with an automatic saw and lathe, the surface becomes a cut surface with a silvery white metallic luster with countless small dots scattered, and the adhesion strength and electrical and thermal conductivity are also the same as in Example 1. It looks just like the original, but when you look at it with a magnifying glass, you can see that the small sunspots on the surface become pores, and when you drop a drop of water on the surface, it immediately absorbs it. From this, it can be seen that the green compact is a water-absorbing porous body.
発明の効果
この発明によれば、金属圧粉体を焼結に達しない比較的
低温度、低圧力で簡単に製造することができ、しかも機
械的加工が可能になるという効果がある。Effects of the Invention According to the present invention, a metal compact can be easily manufactured at a relatively low temperature and low pressure that does not reach sintering, and furthermore, mechanical processing is possible.
【図面の簡単な説明】
第１図はこの発明における金属粉末とセラミック粉末と
を混合して圧粉体をつくる製造工程を示す工程図である
。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a process diagram showing the manufacturing process of mixing metal powder and ceramic powder to produce a green compact according to the present invention.
Claims (5)
の１種もしくは２種以上とセラミック粉末との混合物と
、無機結合剤と、要すれば結合調整剤とを含み、前記無
機結合剤がケイ酸塩類、アモルファスシリカおよびコロ
イダルシリカからなることを特徴とする金属圧粉体組成
物。(1) Contains one or more metal powders or a mixture of one or more metal powders and ceramic powder, an inorganic binder, and, if necessary, a bond modifier, wherein the inorganic binder is A metal compact composition comprising silicates, amorphous silica, and colloidal silica.
の混合物１００重量部に対して前記無機結合剤が５〜２
５重量部、前記結合調整剤が０〜２０重量部の割合で配
合された特許請求の範囲第（１）項記載の金属圧粉体組
成物。(2) 5 to 2 parts of the inorganic binder is added to 100 parts by weight of the metal powder or the mixture of metal powder and ceramic powder.
5 parts by weight of the metal compact composition according to claim 1, wherein the bonding regulator is blended in an amount of 0 to 20 parts by weight.
０：３〜１００：３０の割合で使用する特許請求の範囲
第（１）項記載の金属圧粉体組成物。(3) The weight ratio of the metal powder and ceramic powder is 10
The metal compact composition according to claim (1), which is used in a ratio of 0:3 to 100:30.
このセラミック粉末を粒度の大きい金属粉末および粒度
の小さい金属粉末と混合した特許請求の範囲第（１）項
記載の金属圧粉体組成物。(4) The ceramic powder has a particle size of 10 mμ or less,
The metal green compact composition according to claim 1, wherein the ceramic powder is mixed with a metal powder having a large particle size and a metal powder having a small particle size.
特許請求の範囲第（１）項記載の金属圧粉体組成物。(5) The metal compact composition according to claim (1), wherein the bonding regulator is oil or polyhydric alcohol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60062665A JPS61221301A (en) | 1985-03-27 | 1985-03-27 | Composition for metallic green compact |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60062665A JPS61221301A (en) | 1985-03-27 | 1985-03-27 | Composition for metallic green compact |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61221301A true JPS61221301A (en) | 1986-10-01 |
Family
ID=13206813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60062665A Pending JPS61221301A (en) | 1985-03-27 | 1985-03-27 | Composition for metallic green compact |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61221301A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01100204A (en) * | 1987-10-09 | 1989-04-18 | Furukawa Alum Co Ltd | Porous aluminum or aluminum alloy body |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4731802A (en) * | 1971-03-11 | 1972-11-13 | ||
| JPS5189198A (en) * | 1975-02-03 | 1976-08-04 | Atsupuntetsushinno jiseikojohoho | |
| JPS5518673A (en) * | 1978-07-28 | 1980-02-08 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Ionized radiation sensitive negative type resist |
| JPS5846044A (en) * | 1981-09-11 | 1983-03-17 | Takeda Chem Ind Ltd | Novel aminocyclitol and its preparation |
-
1985
- 1985-03-27 JP JP60062665A patent/JPS61221301A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4731802A (en) * | 1971-03-11 | 1972-11-13 | ||
| JPS5189198A (en) * | 1975-02-03 | 1976-08-04 | Atsupuntetsushinno jiseikojohoho | |
| JPS5518673A (en) * | 1978-07-28 | 1980-02-08 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Ionized radiation sensitive negative type resist |
| JPS5846044A (en) * | 1981-09-11 | 1983-03-17 | Takeda Chem Ind Ltd | Novel aminocyclitol and its preparation |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01100204A (en) * | 1987-10-09 | 1989-04-18 | Furukawa Alum Co Ltd | Porous aluminum or aluminum alloy body |
| JPH045721B2 (en) * | 1987-10-09 | 1992-02-03 | Furukawa Aruminiumu Kogyo Kk |
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