JPS61187349A - 電力用半導体モジユール - Google Patents
電力用半導体モジユールInfo
- Publication number
- JPS61187349A JPS61187349A JP61028050A JP2805086A JPS61187349A JP S61187349 A JPS61187349 A JP S61187349A JP 61028050 A JP61028050 A JP 61028050A JP 2805086 A JP2805086 A JP 2805086A JP S61187349 A JPS61187349 A JP S61187349A
- Authority
- JP
- Japan
- Prior art keywords
- power semiconductor
- semiconductor module
- case
- ceramic substrate
- module according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
- H01L2224/3754—Coating
- H01L2224/37599—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/40227—Connecting the strap to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Amplifiers (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3505086.1 | 1985-02-14 | ||
DE19853505086 DE3505086A1 (de) | 1985-02-14 | 1985-02-14 | Leistungshalbleitermodul mit einem kunststoffgehaeuse |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61187349A true JPS61187349A (ja) | 1986-08-21 |
Family
ID=6262528
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61028050A Pending JPS61187349A (ja) | 1985-02-14 | 1986-02-13 | 電力用半導体モジユール |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS61187349A (de) |
DE (1) | DE3505086A1 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3837920A1 (de) * | 1988-11-09 | 1990-05-10 | Semikron Elektronik Gmbh | Halbleiterelement |
DE3915707A1 (de) * | 1989-05-13 | 1990-11-22 | Asea Brown Boveri | Kunststoffgehaeuse und leistungshalbleitermodul mit diesem gehaeuse |
DE4001554A1 (de) * | 1990-01-20 | 1991-07-25 | Abb Ixys Semiconductor Gmbh | Leistungshalbleitermodul |
JP2956363B2 (ja) * | 1992-07-24 | 1999-10-04 | 富士電機株式会社 | パワー半導体装置 |
DE4300516C2 (de) * | 1993-01-12 | 2001-05-17 | Ixys Semiconductor Gmbh | Leistungshalbleitermodul |
DE4446527A1 (de) * | 1994-12-24 | 1996-06-27 | Ixys Semiconductor Gmbh | Leistungshalbleitermodul |
DE10064194B4 (de) * | 2000-12-22 | 2006-12-07 | Infineon Technologies Ag | Leistungshalbleiter-Modul und Kühlkörper zur Aufnahme des Leistungshalbleiter-Moduls |
DE10213648B4 (de) | 2002-03-27 | 2011-12-15 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul |
DE10340328A1 (de) * | 2003-08-29 | 2005-03-24 | Endress + Hauser Gmbh + Co. Kg | Vergußschale |
DE102004035746B4 (de) * | 2004-07-23 | 2009-04-16 | Infineon Technologies Ag | Leistungshalbleitermodul |
DE102004057421B4 (de) * | 2004-11-27 | 2009-07-09 | Semikron Elektronik Gmbh & Co. Kg | Druckkontaktiertes Leistungshalbleitermodul für hohe Umgebungstemperaturen und Verfahren zu seiner Herstellung |
DE102005016650B4 (de) * | 2005-04-12 | 2009-11-19 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit stumpf gelöteten Anschluss- und Verbindungselementen |
US7808100B2 (en) | 2008-04-21 | 2010-10-05 | Infineon Technologies Ag | Power semiconductor module with pressure element and method for fabricating a power semiconductor module with a pressure element |
DE102008033852B3 (de) * | 2008-07-19 | 2009-09-10 | Semikron Elektronik Gmbh & Co. Kg | Anordnung mit einem Leistungshalbleitermodul und Verfahren zu deren Herstellung |
DE102008049460A1 (de) * | 2008-09-29 | 2010-04-08 | Siemens Aktiengesellschaft | Schaltungsanordnung mit Elastomer-Verguss und Verfahren zum Herstellen der Schaltungsanordnung |
DE102009002191B4 (de) | 2009-04-03 | 2012-07-12 | Infineon Technologies Ag | Leistungshalbleitermodul, Leistungshalbleitermodulanordnung und Verfahren zur Herstellung einer Leistungshalbleitermodulanordnung |
DE102009026558B3 (de) | 2009-05-28 | 2010-12-02 | Infineon Technologies Ag | Leistungshalbleitermodul mit beweglich gelagerten Schaltungsträgern und Verfahren zur Herstellung eines solchen Leistungshalbleitermoduls |
DE102013102829B4 (de) * | 2013-03-20 | 2017-10-19 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul und Anordnung hiermit |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1231811B (de) * | 1962-04-06 | 1967-01-05 | Bosch Gmbh Robert | Halbleiteranordnung |
DE1815989A1 (de) * | 1968-12-20 | 1970-07-02 | Semikron Gleichrichterbau | Halbleiter-Anordnung |
CH560999A5 (de) * | 1973-08-16 | 1975-04-15 | Bbc Brown Boveri & Cie | |
FR2479564A1 (fr) * | 1980-03-26 | 1981-10-02 | Thomson Csf | Boitier d'encapsulation pour module de puissance en circuit hybride |
DE3028178C2 (de) * | 1980-07-25 | 1985-05-09 | Brown, Boveri & Cie Ag, 6800 Mannheim | Leistungshalbleiter-Modul |
JPS5753947A (en) * | 1980-09-17 | 1982-03-31 | Hitachi Ltd | Transistor and electronic device containing it |
DE3241508A1 (de) * | 1982-11-10 | 1984-05-10 | Brown, Boveri & Cie Ag, 6800 Mannheim | Leistungstransistor-modul |
DE3307704C2 (de) * | 1983-03-04 | 1986-10-23 | Brown, Boveri & Cie Ag, 6800 Mannheim | Stromrichtermodul mit Befestigungslaschen |
-
1985
- 1985-02-14 DE DE19853505086 patent/DE3505086A1/de not_active Withdrawn
-
1986
- 1986-02-13 JP JP61028050A patent/JPS61187349A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
DE3505086A1 (de) | 1986-08-28 |
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