JPS61183884A - Lead mounting for electronic component - Google Patents
Lead mounting for electronic componentInfo
- Publication number
- JPS61183884A JPS61183884A JP60022893A JP2289385A JPS61183884A JP S61183884 A JPS61183884 A JP S61183884A JP 60022893 A JP60022893 A JP 60022893A JP 2289385 A JP2289385 A JP 2289385A JP S61183884 A JPS61183884 A JP S61183884A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- lead wire
- soldering
- lead
- flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Details Of Resistors (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電子部品のリード線の取付方法に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for attaching lead wires to electronic components.
従来の技術
従来の電子部品のリード線の取付は方法としては、第５
図に示すように、絶縁基板１に設けられた貫通穴よりリ
ード線２の先端部２ ａ ｌ を突出させ、貫通穴の周
囲の銅等よりなる金属皮膜１ａとの間に外部より半田３
を供給して絶縁基板１とリード線２とを電気的に導通お
よび機械的に固定していた。なお、プリント基板等への
半田付けに際しては、半田付は工程の前に７ラツクス塗
布、半田付は後にフラックス洗浄を行う必要があった。Conventional technology The conventional method for attaching lead wires of electronic components is the fifth method.
As shown in the figure, the tip 2 a l of the lead wire 2 protrudes from a through hole provided in an insulating substrate 1, and solder 3 is applied from the outside between it and the metal film 1 a made of copper or the like around the through hole.
was supplied to electrically conduct and mechanically fix the insulating substrate 1 and the lead wires 2. In addition, when soldering to a printed circuit board or the like, it was necessary to apply 7 lux before the soldering process and to perform flux cleaning after soldering.
発明が解決しようとする問題点
しかしながら、上記のような方法によると、半田付作業
が煩雑であり、かつ半田付けする部分の面積も大きいと
いう問題があった。Problems to be Solved by the Invention However, the above method has problems in that the soldering work is complicated and the area to be soldered is large.
本発明はこのうよな問題よ解決し、絶縁基板の金属皮膜
とリード線とを効率よりかつ必要な部分にだけ半田付け
することのできる電子部品のリード取付方法を提供する
ことを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to solve these problems and provide a method for attaching leads to electronic components that can efficiently solder the metal film of an insulating substrate and the lead wires only to the necessary parts. .
問題点を解決するための手段
上記問題点を解決するため、本発明の電子部品のリード
取付方法は、絶縁基板の適所に形成した半田付用の金属
皮膜に、表面に半田コーティングされたリード線を接触
させ、この状態を保持して前記リード線にコーティング
された半田の融点よりも高い温度に加熱したフラックス
中に浸漬した後、該フラックス中から取出して前記金属
皮膜とリード線間の半田を固化するようにした。Means for Solving the Problems In order to solve the above problems, the electronic component lead attachment method of the present invention includes a lead wire whose surface is coated with solder on a metal film for soldering formed at a suitable location on an insulating substrate. The lead wires are brought into contact with each other, held in this state, and immersed in flux heated to a temperature higher than the melting point of the solder coated on the lead wires, and then removed from the flux to remove the solder between the metal coating and the lead wires. Made it solidify.
作用
すなわら、このような方法によると、フラックスの表面
清浄作用により金属皮膜の酸化膜等が除去されるととも
に、リード線にコーティングされた半田が溶融後固化し
て必要な部分にのみ半田付けされることになる。In other words, with this method, the surface cleaning action of the flux removes oxide films on the metal coating, and the solder coated on the lead wires melts and solidifies, allowing soldering only to the necessary parts. will be done.
実施例
以下本発明の一実施例について、図面を参照しながら説
明する。EXAMPLE An example of the present invention will be described below with reference to the drawings.
第１図において５は絶縁基板で、貫通穴５ｂおよび該貫
通穴５ｂの周囲に金属皮膜５ａが設けられている。６は
リード線で、絶縁基板５の貫通穴５ｂに挿入される先端
部５ａ’ と絶縁基板５のうら面に当たる貫通穴５ｂよ
りも大きなツバ部６ｂが設けられている。またリード線
６の表面はメッキ処理等の方法により半田コーティング
〈図示せず）がなされている。リード線６の先端部５ａ
’は貫通穴５ｂの深さよりも長く、貫通穴５ｂに挿入さ
れた状態で先端部６ａ Ｉの最先端部を押しつぶすこと
により、貫通穴５ｂよりも大きなツバ部６ａができる。In FIG. 1, reference numeral 5 denotes an insulating substrate, and a through hole 5b and a metal coating 5a are provided around the through hole 5b. A lead wire 6 has a tip 5a' inserted into the through hole 5b of the insulating substrate 5, and a flange 6b larger than the through hole 5b, which contacts the back surface of the insulating substrate 5. Further, the surface of the lead wire 6 is coated with solder (not shown) by a method such as plating. Tip part 5a of lead wire 6
' is longer than the depth of the through hole 5b, and by crushing the most extreme part of the tip 6a I while inserted into the through hole 5b, a collar 6a larger than the through hole 5b is formed.
以上のようにして出来上っているリード線６の取付けら
れた絶縁基板５を、前記リード線６の半田コーティング
に使用されている半田の融点よりも高い沸点を持つフラ
ックスの中に浸漬する。この場合、槽内のフラックスは
リードＩ６にコーティングされた半田の融点よりも高く
温めておく。そうすると、フラックスの表面清浄作用に
て金属皮膜５ａの酸化膜等が除去され、次に半田コーテ
ィングされている半田が溶融して第２図に示すように、
金属皮膜５ａに半田ぬれが起こる。そこで、これを７ラ
ツクス槽より出すと溶融している半田が固体化し、リー
ド線６のツバ部６ａと金属皮膜５ａが半田付けされるこ
とになる。The insulating substrate 5 to which the lead wires 6 are attached, which has been completed as described above, is immersed in a flux having a boiling point higher than the melting point of the solder used for the solder coating of the lead wires 6. In this case, the flux in the tank is heated to a temperature higher than the melting point of the solder coated on the lead I6. Then, the oxide film etc. of the metal coating 5a is removed by the surface cleaning action of the flux, and then the solder coated with the solder melts, as shown in FIG.
Solder wetting occurs on the metal film 5a. When this is removed from the 7lux tank, the molten solder solidifies, and the collar 6a of the lead wire 6 and the metal coating 5a are soldered together.
なお、６Ｃは溶融後に固体化した反面である。In contrast, 6C was solidified after melting.
このように本実施例によれば、リード線６に半田コーテ
ィングされている半田の融点よりも高く加熱されたフラ
ックス中に、絶縁基板５の金属皮膜５ａとリード線６と
を接触させた状態で浸漬することにより、金属皮膜５ａ
の表面清浄作用と同時に半田付けを行うものであり、半
田付けの必要な部分にのみ半田付けすることが可能とな
り、半田付けする部分の面積が少なくても安定した半田
付けが可能となる。また、組立設備の簡素化もできるこ
ととなる。According to this embodiment, the lead wire 6 is placed in contact with the metal coating 5a of the insulating substrate 5 in flux heated to a temperature higher than the melting point of the solder with which the lead wire 6 is coated with solder. By dipping, the metal coating 5a
It performs soldering at the same time as the surface cleaning action of , making it possible to solder only the parts that require soldering, and even if the area of the part to be soldered is small, stable soldering is possible. Furthermore, assembly equipment can be simplified.
なお、本実施例のように、半田付けの面積を大きくした
り絶縁基板５の表面上にリード線６の先端部６ａ’ を
突出させられない時は、第３図に示すように貫通穴５ｂ
の内壁にも金属皮膜５ａを施して本実施例と同じように
半田付を行っても良い。Note that, as in this embodiment, when the soldering area is increased or the tip portion 6a' of the lead wire 6 cannot be made to protrude above the surface of the insulating substrate 5, the through hole 5b is used as shown in FIG.
It is also possible to apply a metal film 5a to the inner wall and perform soldering in the same manner as in this embodiment.
また、第４図に示すように、金属皮膜側５ａのみにリー
ド線６のツバ一部６ａを形成し、半田付けを行っても良
い。Alternatively, as shown in FIG. 4, the collar portion 6a of the lead wire 6 may be formed only on the metal film side 5a and soldered.
発明の効果
以上のように本発明は金属皮膜の表面清浄作用と同時に
リード線にコーティングされた半田を溶融させて半田付
けする方法であり、絶縁基板の金属皮膜とリード線とを
効率よ（かつ必要な部分にだけ半田付けすることができ
る。したがって、その実用的効果は電子部品の小型化が
要求される中にあってきわめて大きい。Effects of the Invention As described above, the present invention is a method of melting and soldering the solder coated on the lead wire at the same time as the surface cleaning effect of the metal film, and it is possible to efficiently connect the metal film of the insulating substrate and the lead wire. It is possible to solder only the necessary parts.Therefore, its practical effects are extremely large as miniaturization of electronic components is required.
第１図〜第４図は本発明の一実施例を示し、第１図ａ、
ｂ、ｃは工程図、第２図ａ、ｂは要部断面図、第３図、
第４図はそれぞれ他の実施例における要部断面図、第５
図ａ、ｂは従来方法の工程図である。
５・・・絶縁基板、５ａ・・・金属皮膜、６・・・リー
ド線、６Ｃ・・・固化した半田
代理人 森 本 義 弘
第１図
第３図 第杢図
第５図
（ａ）（め1 to 4 show an embodiment of the present invention, and FIG. 1a,
b, c are process drawings, Fig. 2 a, b are main part sectional views, Fig. 3,
FIG. 4 is a sectional view of main parts in other embodiments, and FIG.
Figures a and b are process diagrams of the conventional method. 5... Insulating substrate, 5a... Metal film, 6... Lead wire, 6C... Solidified solder agent Yoshihiro Morimoto Figure 1 Figure 3 Figure 5 (a) ( eye
Claims (1)
表面に半田コーティングされたリード線を接触させ、こ
の状態を保持して前記リード線にコーティングされた半
田の融点よりも高い温度に加熱したフラックス中に浸漬
した後、該フラックス中から取出して前記金属皮膜とリ
ード線間の半田を固化する電子部品のリード取付方法。1. On the metal film for soldering formed on the appropriate location of the insulating board,
A lead wire coated with solder is brought into contact with the surface, held in this state and immersed in flux heated to a temperature higher than the melting point of the solder coated on the lead wire, and then taken out from the flux and soldered to the metal. A lead attachment method for electronic components that solidifies the solder between the film and the lead wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60022893A JPS61183884A (en) | 1985-02-07 | 1985-02-07 | Lead mounting for electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60022893A JPS61183884A (en) | 1985-02-07 | 1985-02-07 | Lead mounting for electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61183884A true JPS61183884A (en) | 1986-08-16 |
Family
ID=12095333
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60022893A Pending JPS61183884A (en) | 1985-02-07 | 1985-02-07 | Lead mounting for electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61183884A (en) |
-
1985
- 1985-02-07 JP JP60022893A patent/JPS61183884A/en active Pending
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