JPS61149378U - - Google Patents

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図の本考案の実施例を示す図、第２図は混
成集積回路の斜視図、第３図は従来の混成集積回
路パツケージの断面、第４図は従来の外装ケース
の内側を示す斜視図、第５図は第４図の部分拡大
図、第６図は本考案の実施例の部分拡大図、第７
図は実施例を用いた混成集積回路パツケージの断
面図である。 １……基板、２……リード端子、３……電子部
品、４……絶縁材、５……外装ケース、６，９…
…突出部、１０……テーパー部。 Fig. 1 is a diagram showing an embodiment of the present invention, Fig. 2 is a perspective view of a hybrid integrated circuit, Fig. 3 is a cross section of a conventional hybrid integrated circuit package, and Fig. 4 is a perspective view showing the inside of a conventional external case. 5 is a partially enlarged view of FIG. 4, FIG. 6 is a partially enlarged view of the embodiment of the present invention, and FIG.
The figure is a cross-sectional view of a hybrid integrated circuit package using an embodiment. 1... Board, 2... Lead terminal, 3... Electronic component, 4... Insulating material, 5... Exterior case, 6, 9...
...Protruding portion, 10...Tapered portion.

Claims (1)

【実用新案登録請求の範囲】 混成集積回路を外装ケースに収容してコーテン
グするために、外装ケースの内側面に複数の突出
部を設けて前記集積回路を該突出部で保持する混
成集積回路用外装ケースの構造において、 前記混成集積回路を外装ケースに挿入するに従
つて遊びをなくして所定の位置に混成集積回路を
案内するテーパー部を前記突出部に設けたことを
特徴とする混成集積回路用外装ケースの構造。[Claims for Utility Model Registration] For a hybrid integrated circuit in which a plurality of protrusions are provided on the inner surface of the outer case and the integrated circuit is held by the protrusions in order to house and coat the hybrid integrated circuit in the outer case. In the structure of the outer case, the hybrid integrated circuit is characterized in that the protrusion is provided with a tapered portion that guides the hybrid integrated circuit to a predetermined position with no play as the hybrid integrated circuit is inserted into the outer case. Structure of the outer case.