JPH01157470U - - Google Patents
Info
- Publication number
- JPH01157470U JPH01157470U JP4673988U JP4673988U JPH01157470U JP H01157470 U JPH01157470 U JP H01157470U JP 4673988 U JP4673988 U JP 4673988U JP 4673988 U JP4673988 U JP 4673988U JP H01157470 U JPH01157470 U JP H01157470U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- molded product
- flexible circuit
- embedded
- resin molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
Landscapes
- Casings For Electric Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Description
第1図は、本考案による可撓性回路板の一実施
例を示す平面図、第2図は、その回路板を埋設し
た樹脂成形品を示す背面側から見た切り欠き斜視
図、第3図は、その成形品の成形状態を説明する
ための、第2図の−線に相当する面での断面
図である。
1……可撓性回路板、2,3,4,5……プリ
ント基板、8,9,10……突条、11,12…
…ブリツジ、13……樹脂成形品。
1 is a plan view showing an embodiment of a flexible circuit board according to the present invention; FIG. 2 is a cutaway perspective view of a resin molded product in which the circuit board is embedded; The figure is a sectional view taken along the - line in FIG. 2 for explaining the molded state of the molded product. 1... Flexible circuit board, 2, 3, 4, 5... Printed circuit board, 8, 9, 10... Projection, 11, 12...
... Bridge, 13...Resin molded product.
Claims (1)
する高さの突条が設けられている、 樹脂成形品に埋設される可撓性回路板。[Claims for Utility Model Registration] A flexible circuit board embedded in a resin molded product, which has a protrusion on at least one surface with a height corresponding to a desired embedded depth.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988046739U JP2510436Y2 (en) | 1988-04-08 | 1988-04-08 | Flexible circuit board embedded in resin molded product |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988046739U JP2510436Y2 (en) | 1988-04-08 | 1988-04-08 | Flexible circuit board embedded in resin molded product |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01157470U true JPH01157470U (en) | 1989-10-30 |
JP2510436Y2 JP2510436Y2 (en) | 1996-09-11 |
Family
ID=31272993
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988046739U Expired - Lifetime JP2510436Y2 (en) | 1988-04-08 | 1988-04-08 | Flexible circuit board embedded in resin molded product |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2510436Y2 (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58120659U (en) * | 1982-02-12 | 1983-08-17 | 株式会社日立製作所 | Hybrid integrated circuit package |
JPS6149484U (en) * | 1984-09-03 | 1986-04-03 | ||
JPS61149378U (en) * | 1985-03-08 | 1986-09-16 | ||
JPS62172176U (en) * | 1986-04-15 | 1987-10-31 |
-
1988
- 1988-04-08 JP JP1988046739U patent/JP2510436Y2/en not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58120659U (en) * | 1982-02-12 | 1983-08-17 | 株式会社日立製作所 | Hybrid integrated circuit package |
JPS6149484U (en) * | 1984-09-03 | 1986-04-03 | ||
JPS61149378U (en) * | 1985-03-08 | 1986-09-16 | ||
JPS62172176U (en) * | 1986-04-15 | 1987-10-31 |
Also Published As
Publication number | Publication date |
---|---|
JP2510436Y2 (en) | 1996-09-11 |
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