JPH01157470U - - Google Patents

Info

Publication number
JPH01157470U
JPH01157470U JP4673988U JP4673988U JPH01157470U JP H01157470 U JPH01157470 U JP H01157470U JP 4673988 U JP4673988 U JP 4673988U JP 4673988 U JP4673988 U JP 4673988U JP H01157470 U JPH01157470 U JP H01157470U
Authority
JP
Japan
Prior art keywords
circuit board
molded product
flexible circuit
embedded
resin molded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4673988U
Other languages
Japanese (ja)
Other versions
JP2510436Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988046739U priority Critical patent/JP2510436Y2/en
Publication of JPH01157470U publication Critical patent/JPH01157470U/ja
Application granted granted Critical
Publication of JP2510436Y2 publication Critical patent/JP2510436Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、本考案による可撓性回路板の一実施
例を示す平面図、第2図は、その回路板を埋設し
た樹脂成形品を示す背面側から見た切り欠き斜視
図、第3図は、その成形品の成形状態を説明する
ための、第2図の−線に相当する面での断面
図である。 1……可撓性回路板、2,3,4,5……プリ
ント基板、8,9,10……突条、11,12…
…ブリツジ、13……樹脂成形品。
1 is a plan view showing an embodiment of a flexible circuit board according to the present invention; FIG. 2 is a cutaway perspective view of a resin molded product in which the circuit board is embedded; The figure is a sectional view taken along the - line in FIG. 2 for explaining the molded state of the molded product. 1... Flexible circuit board, 2, 3, 4, 5... Printed circuit board, 8, 9, 10... Projection, 11, 12...
... Bridge, 13...Resin molded product.

Claims (1)

【実用新案登録請求の範囲】 少なくとも一方の面に、所望の埋設深さに相当
する高さの突条が設けられている、 樹脂成形品に埋設される可撓性回路板。
[Claims for Utility Model Registration] A flexible circuit board embedded in a resin molded product, which has a protrusion on at least one surface with a height corresponding to a desired embedded depth.
JP1988046739U 1988-04-08 1988-04-08 Flexible circuit board embedded in resin molded product Expired - Lifetime JP2510436Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988046739U JP2510436Y2 (en) 1988-04-08 1988-04-08 Flexible circuit board embedded in resin molded product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988046739U JP2510436Y2 (en) 1988-04-08 1988-04-08 Flexible circuit board embedded in resin molded product

Publications (2)

Publication Number Publication Date
JPH01157470U true JPH01157470U (en) 1989-10-30
JP2510436Y2 JP2510436Y2 (en) 1996-09-11

Family

ID=31272993

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988046739U Expired - Lifetime JP2510436Y2 (en) 1988-04-08 1988-04-08 Flexible circuit board embedded in resin molded product

Country Status (1)

Country Link
JP (1) JP2510436Y2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58120659U (en) * 1982-02-12 1983-08-17 株式会社日立製作所 Hybrid integrated circuit package
JPS6149484U (en) * 1984-09-03 1986-04-03
JPS61149378U (en) * 1985-03-08 1986-09-16
JPS62172176U (en) * 1986-04-15 1987-10-31

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58120659U (en) * 1982-02-12 1983-08-17 株式会社日立製作所 Hybrid integrated circuit package
JPS6149484U (en) * 1984-09-03 1986-04-03
JPS61149378U (en) * 1985-03-08 1986-09-16
JPS62172176U (en) * 1986-04-15 1987-10-31

Also Published As

Publication number Publication date
JP2510436Y2 (en) 1996-09-11

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