JPS63153548U - - Google Patents

Info

Publication number
JPS63153548U
JPS63153548U JP1987045280U JP4528087U JPS63153548U JP S63153548 U JPS63153548 U JP S63153548U JP 1987045280 U JP1987045280 U JP 1987045280U JP 4528087 U JP4528087 U JP 4528087U JP S63153548 U JPS63153548 U JP S63153548U
Authority
JP
Japan
Prior art keywords
package
lead terminals
longitudinal direction
electronic component
type electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987045280U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987045280U priority Critical patent/JPS63153548U/ja
Publication of JPS63153548U publication Critical patent/JPS63153548U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Multi-Conductor Connections (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例のDIP型電子部品
を示し、同図aはその平面図、同図bは正面図、
第2図は本実施例の他の実施例のDIP型電子部
品を示し、同図aはその一部を示す平面図、同図
bは正面図、第3図は従来のDIP型電子部品を
示し、同図aはその斜視図、同図bは平面図、同
図cは正面図である。 1,3,11……パツケージ、2,4,10…
…リード端子。
Figure 1 shows a DIP type electronic component according to an embodiment of the present invention, in which figure a is a plan view, figure b is a front view,
Figure 2 shows a DIP type electronic component according to another embodiment of the present invention, Figure a is a plan view showing a part of it, Figure b is a front view, and Figure 3 shows a conventional DIP type electronic component. FIG. 2A is a perspective view, FIG. 1B is a plan view, and FIG. 1C is a front view. 1, 3, 11...Package, 2, 4, 10...
...Lead terminal.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] パツケージの長手方向に対して直角の方向に突
き出た複数のリード端子が前記パツケージの長手
辺に沿つて連設してあり、前記リード端子が前記
パツケージの長手方向に対して斜めに折り曲げて
あることを特徴とするDIP型電子部品。
A plurality of lead terminals protruding in a direction perpendicular to the longitudinal direction of the package are arranged in series along the longitudinal side of the package, and the lead terminals are bent diagonally with respect to the longitudinal direction of the package. A DIP type electronic component characterized by
JP1987045280U 1987-03-27 1987-03-27 Pending JPS63153548U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987045280U JPS63153548U (en) 1987-03-27 1987-03-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987045280U JPS63153548U (en) 1987-03-27 1987-03-27

Publications (1)

Publication Number Publication Date
JPS63153548U true JPS63153548U (en) 1988-10-07

Family

ID=30863875

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987045280U Pending JPS63153548U (en) 1987-03-27 1987-03-27

Country Status (1)

Country Link
JP (1) JPS63153548U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106252292A (en) * 2015-06-15 2016-12-21 三菱电机株式会社 The manufacture method of crimp type terminal, semiconductor device, power-converting device and crimp type terminal

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106252292A (en) * 2015-06-15 2016-12-21 三菱电机株式会社 The manufacture method of crimp type terminal, semiconductor device, power-converting device and crimp type terminal
JP2017005200A (en) * 2015-06-15 2017-01-05 三菱電機株式会社 Press-fit terminal, semiconductor device, electric power conversion device, and method of manufacturing press-fit terminal
CN106252292B (en) * 2015-06-15 2019-06-25 三菱电机株式会社 The manufacturing method of crimp type terminal, semiconductor device, power-converting device and crimp type terminal

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