JPS61146958U - - Google Patents

Info

Publication number
JPS61146958U
JPS61146958U JP3045685U JP3045685U JPS61146958U JP S61146958 U JPS61146958 U JP S61146958U JP 3045685 U JP3045685 U JP 3045685U JP 3045685 U JP3045685 U JP 3045685U JP S61146958 U JPS61146958 U JP S61146958U
Authority
JP
Japan
Prior art keywords
gold
terminal portion
crystallized glass
metal lead
eutectic solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3045685U
Other languages
Japanese (ja)
Other versions
JPH0132364Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985030456U priority Critical patent/JPH0132364Y2/ja
Publication of JPS61146958U publication Critical patent/JPS61146958U/ja
Application granted granted Critical
Publication of JPH0132364Y2 publication Critical patent/JPH0132364Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図、第２図及び第３図はそれぞれ本考案の
一実施例に係る結晶化ガラスＩＣパツケージの側
面図、平面図及び底面図である。 1, 2, and 3 are a side view, a top view, and a bottom view, respectively, of a crystallized glass IC package according to an embodiment of the present invention.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 誘電率６．０以下の結晶化ガラスよりなるＩＣ
パツケージ基板の外表面に導出してなる端子部に
金属リードをろう付接合してなるものにおいて、
端子部と金属リードとの接合用ろう材が金―スズ
共晶ろう又は金―ケイ素共晶ろうであることを特
徴とする結晶化ガラスＩＣパツケージ。 IC made of crystallized glass with a dielectric constant of 6.0 or less
In a product in which a metal lead is brazed to a terminal portion led out to the outer surface of a package board,
A crystallized glass IC package characterized in that a brazing material for joining a terminal portion and a metal lead is a gold-tin eutectic solder or a gold-silicon eutectic solder.
JP1985030456U 1985-03-04 1985-03-04 Expired JPH0132364Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985030456U JPH0132364Y2 (en) 1985-03-04 1985-03-04

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985030456U JPH0132364Y2 (en) 1985-03-04 1985-03-04

Publications (2)

Publication Number Publication Date
JPS61146958U true JPS61146958U (en) 1986-09-10
JPH0132364Y2 JPH0132364Y2 (en) 1989-10-03

Family

ID=30530170

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985030456U Expired JPH0132364Y2 (en) 1985-03-04 1985-03-04

Country Status (1)

Country Link
JP (1) JPH0132364Y2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55128899A (en) * 1979-03-23 1980-10-06 Ibm Method of fabricating glass ceramic structure
JPS60170286A (en) * 1984-02-14 1985-09-03 富士通株式会社 Method of producing glass ceramic substrate
JPS60198763A (en) * 1984-03-22 1985-10-08 Nec Corp Pinned substrate and manufacture thereof
JPS60198760A (en) * 1984-03-22 1985-10-08 Nec Corp Soldering method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55128899A (en) * 1979-03-23 1980-10-06 Ibm Method of fabricating glass ceramic structure
JPS60170286A (en) * 1984-02-14 1985-09-03 富士通株式会社 Method of producing glass ceramic substrate
JPS60198763A (en) * 1984-03-22 1985-10-08 Nec Corp Pinned substrate and manufacture thereof
JPS60198760A (en) * 1984-03-22 1985-10-08 Nec Corp Soldering method

Also Published As

Publication number Publication date
JPH0132364Y2 (en) 1989-10-03

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