JPS61135498A - Plate like composite brazing filler metal - Google Patents
Plate like composite brazing filler metalInfo
- Publication number
- JPS61135498A JPS61135498A JP25597284A JP25597284A JPS61135498A JP S61135498 A JPS61135498 A JP S61135498A JP 25597284 A JP25597284 A JP 25597284A JP 25597284 A JP25597284 A JP 25597284A JP S61135498 A JPS61135498 A JP S61135498A
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- solder
- layer
- group element
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は元素周期表IVa (Ti、Zr、Hf’)の
元素を間にはさみその両面に厚さの異なるAgろうを張
り合わせた板状複合ろう材(以下単に複合ろう材と云う
)に関するものである。Detailed Description of the Invention (Industrial Application Field) The present invention is a plate-like composite material in which elements of the periodic table of elements IVa (Ti, Zr, Hf') are sandwiched between them and Ag solder with different thicknesses is laminated on both sides. This relates to a brazing filler metal (hereinafter simply referred to as a composite brazing filler metal).
(従来技術とその問題点)
一般にセラミックスとセラミックスのろう付にはIVa
の元素の両面に同じ厚さのAgろうを張り合わせた複合
ろう材が使用されている。(Prior art and its problems) In general, IVa is used for brazing ceramics and ceramics.
A composite brazing material is used in which Ag solder of the same thickness is laminated on both sides of the element.
ところが、セラミックスと金属をろう付する場合、従来
の複合ろう材を使用すると、IVaの元素がAgろう中
に溶は込むと同時に母材であるセラミックス及び金属の
界面に向って等速度で同量拡散するので、活性なIVa
の元素がセラミックスとの界面でのろう付に効果をもた
らすようにすると、金属との界面では金属と■3の元素
が反応して脆い合金相を形成し良好な接合状態が得られ
ない。However, when brazing ceramics and metals, if a conventional composite brazing filler metal is used, the IVa element melts into the Ag brazing material and at the same time moves toward the interface between the ceramic and metal base materials in the same amount at a uniform rate. Because it diffuses, active IVa
If the element (3) is made to have an effect on brazing at the interface with the ceramic, the metal and the element (3) react at the interface with the metal to form a brittle alloy phase, making it impossible to obtain a good bonding state.
(発明の目的)
本発明はセラミックスと金属とのろう付におけるこの様
な不具合を解消せんが為になされたものである。(Object of the Invention) The present invention has been made in order to solve these problems in brazing ceramics and metals.
(発明の構成)
本発明の複合ろう材は、中間材としてIVaの元素を用
い、その両面に厚さの異なるAgろうを張り合わせた複
合ろう材において、薄い方のAgろうと中間材のトータ
ル厚さが厚い方のAgろうの厚さよりも薄くしたことを
特徴とするものである。(Structure of the Invention) The composite brazing material of the present invention uses the element IVa as an intermediate material, and in a composite brazing material in which Ag solder with different thicknesses is laminated on both sides, the total thickness of the thinner Ag solder and the intermediate material is This is characterized in that the thickness of the Ag solder is thinner than that of the thicker Ag solder.
一般に真中にIVaの元素の層をもうけた複合ろう材に
よるろう付の反応過程は次の様である。Generally, the reaction process of brazing with a composite brazing material having a layer of IVa element in the middle is as follows.
ろう付温度に加熱すると、先づIVaの元素の両面に張
り合わせであるAgろうが熔は出す0次にp/aの元素
がこのろう中に溶は込むと同時に母材との両界面に、は
ぼ等速度で同量拡散していきろう付に作用する。When heated to the brazing temperature, the Ag solder attached to both sides of the IVa element melts, and the P/A element melts into the solder at the same time at both interfaces with the base metal. They diffuse in the same amount at roughly the same speed and act on the brazing.
ところでセラミックスと金属のろう付において、中間層
のIVaの元素をセラミックスとの界面に優先的に拡散
させ、金属との界面ではIVaの元素を含まないAgろ
う成分がろう付をつかさどることが、必要である。By the way, in brazing ceramics and metals, it is necessary to diffuse the IVa element in the intermediate layer preferentially to the interface with the ceramic, and to have an Ag brazing component that does not contain the IVa element take charge of the brazing at the interface with the metal. It is.
それはIVaの元素の層をあらかじめ金属側よりもセラ
ミックス側に近い距離に位置するようにして、溶けたA
gろう中を拡散してい(IVaの元素をセラミックスと
の界面に早く到達させ金属側への到達を遅らせることに
より可能となることがわかった。This is done by positioning the IVa element layer closer to the ceramic side than the metal side, so that the molten A
It has been found that this is possible by allowing the IVa element to diffuse through the solder (IVa) to reach the interface with the ceramic quickly and delaying its arrival to the metal side.
したがって、本発明において薄い方のAgろうと中間材
のトータル厚さが、厚い方のAgろうの厚さよりも薄く
したのはこのことを意味している。Therefore, in the present invention, the total thickness of the thinner Ag solder and the intermediate material is made thinner than the thickness of the thicker Ag solder.
本発明の複合ろう材は脆い合金相を含まない為、塑性加
工が容易で所望の寸法、形状に仕上げることが可能であ
ると同時にセラミックスと金属とのろう付において、金
属側に脆い合金相を生成することなく、良好なろう行状
態が得られるものである。Since the composite brazing material of the present invention does not contain a brittle alloy phase, it is easy to plastically process and can be finished into desired dimensions and shapes. A good state of deafness can be obtained without generation.
なお、IVaの元素の厚さについては、セラミックスと
のろう付性から好ましくは薄い方のAgろうに対し重量
比で1〜18%になるような厚さがよい。The thickness of the IVa element is preferably 1 to 18% by weight of the thinner Ag solder in view of brazing properties with ceramics.
次に本発明を更に明瞭ならしめる為に、その具体的実施
例及び従来例について説明する。Next, in order to further clarify the present invention, specific embodiments and conventional examples thereof will be described.
(実施例1)
図に示す如き複合ろう材断面斜視図において、薄い方の
Agろう1としてAg−Cu28%、中間材2としてT
i、厚い方のAgろう3としてAg−Cu 2B%で、
その張り厚比が3:1:6である複合ろう材4を作り、
これを圧延加工して0.0711m厚の板材に仕上げた
。(Example 1) In the cross-sectional perspective view of a composite brazing material as shown in the figure, the thinner Ag brazing material 1 is 28% Ag-Cu, and the intermediate material 2 is T.
i, Ag-Cu 2B% as the thicker Ag solder 3;
A composite brazing material 4 whose tension thickness ratio is 3:1:6 is made,
This was rolled into a plate material with a thickness of 0.0711 m.
このろう材を、セラミックスとコバールとのろう付にお
いて、厚い方のAgろう3をコバール側にセットしアル
ゴン雰囲気中でろう付を行った。This brazing material was used to braze ceramics and Kovar in an argon atmosphere with the thicker Ag solder 3 set on the Kovar side.
ろう付部の断面観察を行った結果、コバールとろう材界
面には脆い合金相は観察されず良好なろう行状態が得ら
れた。As a result of cross-sectional observation of the brazed part, no brittle alloy phase was observed at the interface between Kovar and the brazing metal, and a good brazing condition was obtained.
(実施例2)
図に示す如き複合ろう材断面斜視図において、薄い方の
Agろう1としてA g −Cu 15%、中間材2と
してZr、厚い方のAgろう3としてAg−Cu 15
%で、その張り厚比が4:1:8である複合ろう材を作
りこれを圧延加工して0.07fi厚の板材に仕上げた
。(Example 2) In the cross-sectional perspective view of a composite brazing material as shown in the figure, the thinner Ag solder 1 is made of Ag-Cu 15%, the intermediate material 2 is Zr, and the thicker Ag solder 3 is made of Ag-Cu 15%.
%, and the tension ratio was 4:1:8. A composite brazing filler metal was prepared and rolled into a plate material having a thickness of 0.07 fi.
このろう材を、セラミックスとFe−Ni42%とのろ
う付において、厚い方のAgろう3をFe−Ni42%
側にセントしアルゴン雰囲気中でろう付を行った。When brazing this brazing material with ceramics and 42% Fe-Ni, the thicker Ag brazing material 3 is made of 42% Fe-Ni.
Brazing was performed in an argon atmosphere with a centrifuge on the side.
ろう付部の断面観察を行った結果、F e −N i4
2%とろう材界面には脆い合金相は観察されず、接合強
度の強い良好なろう行状態が得られた。As a result of cross-sectional observation of the brazed part, F e −N i4
No brittle alloy phase was observed at the interface between the 2% brazing metal and a good brazing state with strong joint strength.
(従来例)
Tiを間にはさんでその両面に同じ厚さのAg−Cu
2B%を張り合わせた複合ろう材を作り、その後圧延加
工にて0.07m厚の板材に仕上げた。(Conventional example) Ag-Cu with the same thickness on both sides with Ti sandwiched between them.
A composite brazing filler metal was made by laminating 2B%, and then rolled into a plate with a thickness of 0.07 m.
このろう材を用い、セラミックスとコバールをアルゴン
雰囲気中でろう付した。Using this brazing material, ceramics and Kovar were brazed in an argon atmosphere.
′ ろう付部の断面観察を行つた結果、ろう材とコバ
ールの界面およびその近辺にTiとFe、Co。' As a result of cross-sectional observation of the brazed part, it was found that Ti, Fe, and Co were present at and near the interface between the brazing material and Kovar.
Niからなる脆い合金層を生成し、期待したろう付強さ
は得られなかった。A brittle alloy layer consisting of Ni was formed, and the expected brazing strength could not be obtained.
(発明の効果)
以上詳記した通り、本発明の複合ろう材は充分な塑性加
工性を有すると共に、IVaの元素の両面に張り合わせ
たAgろうの張り厚比を変えている為、セラミックスと
金属のろう付の際にAgろうの厚い方を金属側にセット
してろう付すると、脆い合金相を生成せず良好なろう行
状態が得ることが出来ると云う効果がある。(Effects of the invention) As detailed above, the composite brazing material of the present invention has sufficient plastic workability, and since the thickness ratio of the Ag brazing material laminated on both sides of the IVa element is changed, the ceramic and metal When brazing, setting the thicker side of the Ag solder on the metal side has the effect that a brittle alloy phase is not generated and a good brazing state can be obtained.
図は本発明の複合ろう材の断面斜視図である。 The figure is a cross-sectional perspective view of the composite brazing filler metal of the present invention.
Claims (1)
厚さの異なるAgろうを張り合わせた板状ろう材におい
て、薄い方のAgろうと中間材のトータル厚さが厚い方
のAgろうの厚さよりも薄くしたことを特徴とする板状
複合ろう材。In a plate-shaped brazing material in which an element of the periodic table IVa is used as an intermediate material and Ag solder with different thicknesses is laminated on both sides, the total thickness of the thinner Ag solder and the intermediate material is greater than the thickness of the thicker Ag solder. A plate-shaped composite brazing filler metal that is also thin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25597284A JPS61135498A (en) | 1984-12-04 | 1984-12-04 | Plate like composite brazing filler metal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP25597284A JPS61135498A (en) | 1984-12-04 | 1984-12-04 | Plate like composite brazing filler metal |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61135498A true JPS61135498A (en) | 1986-06-23 |
JPH0470120B2 JPH0470120B2 (en) | 1992-11-10 |
Family
ID=17286126
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP25597284A Granted JPS61135498A (en) | 1984-12-04 | 1984-12-04 | Plate like composite brazing filler metal |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61135498A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023509856A (en) * | 2019-12-19 | 2023-03-10 | ロジャーズ ジャーマニー ゲーエムベーハー | Solder materials for joining metal layers to ceramic layers, methods of making such solder materials, and uses of such solder materials |
-
1984
- 1984-12-04 JP JP25597284A patent/JPS61135498A/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023509856A (en) * | 2019-12-19 | 2023-03-10 | ロジャーズ ジャーマニー ゲーエムベーハー | Solder materials for joining metal layers to ceramic layers, methods of making such solder materials, and uses of such solder materials |
Also Published As
Publication number | Publication date |
---|---|
JPH0470120B2 (en) | 1992-11-10 |
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