JPS61127197A - Plastic housing having electromagnetic wave shielding property - Google Patents

Plastic housing having electromagnetic wave shielding property

Info

Publication number
JPS61127197A
JPS61127197A JP59248397A JP24839784A JPS61127197A JP S61127197 A JPS61127197 A JP S61127197A JP 59248397 A JP59248397 A JP 59248397A JP 24839784 A JP24839784 A JP 24839784A JP S61127197 A JPS61127197 A JP S61127197A
Authority
JP
Japan
Prior art keywords
plastic
layer
shielding effect
plastic housing
electromagnetic wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59248397A
Other languages
Japanese (ja)
Inventor
直喜 笛井
崇 阿部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Priority to JP59248397A priority Critical patent/JPS61127197A/en
Publication of JPS61127197A publication Critical patent/JPS61127197A/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は′vtla波シールド性を有するグラスチック
ハウジングに関するもので、事務用、家庭用、産業用、
医療用電子機器を収容するノーウジングとして、電子機
器から発生する電磁波の漏洩防止および他の機器から発
生した電磁波による障害を防止するために有用である。
Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a glass housing having VTL wave shielding properties, and is suitable for office, home, industrial, and other uses.
It is useful as a nousing for accommodating medical electronic equipment to prevent leakage of electromagnetic waves generated from the electronic equipment and to prevent interference due to electromagnetic waves generated from other equipment.

(従来技術とその問題点) 現在、電子機器用ハウジングの多くは軽量、耐久性、デ
ザインの自由度および経済性の観点からプラスチック成
形品が用いられている。
(Prior Art and its Problems) Currently, many housings for electronic devices are made of plastic molded products from the viewpoints of light weight, durability, freedom of design, and economy.

しかしながら、プラスチックは電気絶縁性のために、電
磁波がそのまま透過してしま5ため、機器内で発生した
電磁波が漏洩して周辺機器に悪影響を及ばしたり、また
、外部からの妨害電磁波により機器自身が誤動作すると
いった電磁波障害の問題が深刻化し【きた。
However, due to the electrical insulating properties of plastics, electromagnetic waves can pass through them5, so the electromagnetic waves generated inside the device may leak and have a negative impact on peripheral devices, or the device itself may be affected by interference from the outside. The problem of electromagnetic interference, such as malfunctions, has become increasingly serious.

従来、金属製の板や網でシールドすることが行なわれて
いるが、これらは硬いため加工性が悪く、さらに比重が
大きいため運搬には不便であり、持ち運びを重視する移
動体への利用は困難である。
Traditionally, shielding has been done with metal plates or nets, but these are hard and difficult to work with, and their high specific gravity makes them inconvenient to transport. Have difficulty.

また、さび易く、そのため耐用年数が短かくなる欠点も
ある。
It also has the disadvantage that it rusts easily, which shortens its useful life.

プラスチックハウジングに直接、導電性を付与して電磁
波シールドを行なう手段として亜鉛溶射法や導電性塗料
による塗装が行なわれている。亜鉛溶射法はプラスチッ
クハウジングのシールド法として古くから行なわれてお
り、優れたシールド効果をもっている。しかし、この方
法ではプラスチック基材と付与される亜鉛被膜との密着
性が問題となる。亜鉛被膜が簡単に剥離したり、クラン
クが生じたのではシールド効果の低下をきたす。
Zinc spraying and coating with conductive paint are used to directly impart conductivity to plastic housings and shield them from electromagnetic waves. Zinc spraying has been used for a long time as a shielding method for plastic housings, and has an excellent shielding effect. However, this method poses a problem in the adhesion between the plastic substrate and the applied zinc coating. If the zinc coating easily peels off or cracks occur, the shielding effect will be reduced.

さらに亜鉛溶射法の場合、亜鉛蒸気の人体への悪影響や
騒音などの欠点を有している。
Furthermore, the zinc spraying method has drawbacks such as negative effects of zinc vapor on the human body and noise.

導電性塗料による。i製法の場合、膜厚を均一に塗装す
ることは難しく、塗膜を厚くすればシールド効果は増す
が、塗膜にクラックが生じたり、剥落する危険がある。
By conductive paint. In the case of the i-manufacturing method, it is difficult to apply a coating with a uniform thickness, and although a thicker coating increases the shielding effect, there is a risk that the coating will crack or peel off.

(問題点を解決するための手段) 以上が従来技術の概要であるが、本発明はこれら従来技
術の欠点を解消することを目的とするもので、密着性に
優れ、導電層の厚みが均一で、かつ高い電磁波シールド
効果を有するものであり、第1図に示すように基体とな
るハウジング基材(1)の片面あるいは両面の全面ある
いは一部分にニッケル、銅、クロム等の無電解メッキ層
(2)、接着剤層(3)、および電気絶縁性プラスチッ
クフィルム層(4)を積層した構造、または第2図に示
すように基体となるハウジング基材(1)の片面の全面
あるいは一部分に前記メッキ層(2)、他の片面の全面
あるいは一部分にも同じ(メッキ層(2)、接着剤層(
3)、電気絶縁性プラスチックフィルム層(4)を積層
した構造を有するものである。
(Means for Solving the Problems) The above is an overview of the conventional techniques.The present invention aims to eliminate the drawbacks of these conventional techniques. It also has a high electromagnetic shielding effect, and as shown in Figure 1, an electroless plating layer (such as nickel, copper, chromium, etc.) of nickel, copper, chromium, etc. 2), a structure in which an adhesive layer (3) and an electrically insulating plastic film layer (4) are laminated, or as shown in FIG. Plating layer (2), the same applies to the entire surface or part of the other side (plating layer (2), adhesive layer (
3) It has a structure in which electrically insulating plastic film layers (4) are laminated.

本発明のグラスチックハウジングのハウジング基材はA
BS樹脂(アクリロニトリル−ブタジェン−スチレン共
重合体樹脂)、変性ポリフェニレンオキサイド樹脂、ポ
リスチレン樹脂、ポリヵーボネー)/ABS樹脂複合体
が適している。
The housing base material of the plastic housing of the present invention is A
BS resin (acrylonitrile-butadiene-styrene copolymer resin), modified polyphenylene oxide resin, polystyrene resin, polycarbonate)/ABS resin composite is suitable.

メッキ層(2)の厚みは0.5〜10μm でぶましく
は1〜2μm、表面抵抗値がl O−’〜10”Ωの導
電性を有するものである。導電性が10”Ω以上の場合
は十分な電磁波シールド効果を得ることができず、表面
抵抗値は低℃・程シールド効果は向上する。
The plating layer (2) has a thickness of 0.5 to 10 μm, more specifically 1 to 2 μm, and has a surface resistance value of lO-' to 10"Ω. It has a conductivity of 10"Ω or more. In this case, sufficient electromagnetic shielding effect cannot be obtained, and the lower the surface resistance value is, the better the shielding effect will be.

これらの条件及び経済性、耐錆性を考慮するとメッキ層
(2)は無電解ニッケルメッキが好ましく、ハウジング
基材(1)の片面だけでなく両面の全面あるいは一部分
にも付与することができ、より高い電磁波シールド効果
を必要とする場合、両面に無電解ニッケルメッキ層を付
与することが特に好ましい。
Considering these conditions, economy, and rust resistance, the plating layer (2) is preferably electroless nickel plating, which can be applied not only to one side of the housing base material (1) but also to the entire surface or a part of both sides. When a higher electromagnetic shielding effect is required, it is particularly preferable to provide electroless nickel plating layers on both sides.

接着剤層(3)はポリウレタン系、エポキシ樹脂系。The adhesive layer (3) is polyurethane-based or epoxy resin-based.

アクリル樹脂系等の接着剤、又はアイオノマー樹脂、エ
チレン−アクリル酸共重合体樹脂、エチレン−メタクリ
ル酸共重合体樹脂等の金属接着性樹脂等が使用される。
Adhesives such as acrylic resins, metal adhesive resins such as ionomer resins, ethylene-acrylic acid copolymer resins, ethylene-methacrylic acid copolymer resins, etc. are used.

電気絶縁性プラスチックフィルム層(4)としてはポリ
プロピレン、ポリ塩化ビニル、ポリエチレンテレフタレ
ート、ポリカーボネート、ポリアミド。
The electrically insulating plastic film layer (4) is made of polypropylene, polyvinyl chloride, polyethylene terephthalate, polycarbonate, polyamide.

ポリサルホン、ポリイミド等のプラスチックフィルムが
適しており、その厚みは10〜100μm。
Plastic films such as polysulfone and polyimide are suitable, and have a thickness of 10 to 100 μm.

表面抵抗値はl 01l−10+11Ωを有するもので
ある。
The surface resistance value is 1011-10+11Ω.

次に具体的な実施例と比較例を掲げ、本発明の詳細な説
明する。
Next, the present invention will be described in detail with reference to specific examples and comparative examples.

(実施例) 基材となるABS樹脂製ハウジング基材の両面の一部分
に無電解ニッケルメッキ(膜厚2μm)を施し、ついで
前記基材の片面にポリウレタン系二液反応型接着剤(膜
厚 5μm)  を塗布したポリエチレンテレフタレー
トフィルム(膜厚30μm)を貼布したものを本発明の
プラスチックハウジングとした。
(Example) Electroless nickel plating (film thickness: 2 μm) was applied to a portion of both sides of an ABS resin housing base material, and then a polyurethane-based two-component reactive adhesive (film thickness: 5 μm) was applied to one side of the base material. ) was applied with a polyethylene terephthalate film (thickness: 30 μm), which was used as the plastic housing of the present invention.

実施例において150X150X21111の試験片を
用い、タケダ理研法により電磁波シールド効果を測定し
た。
In Examples, the electromagnetic shielding effect was measured by the Takeda Riken method using a 150×150×21111 test piece.

(比較例) ABS樹脂製板(150X150X27111)の片面
にニッケル系導電性塗料を塗布(膜厚50μrrL)し
たものを比較例とし、タケダ埋研法により電磁波シール
ド効果を測定した。
(Comparative Example) An ABS resin plate (150 x 150 x 27111) coated with a nickel-based conductive paint (film thickness: 50 μrrL) on one side was used as a comparative example, and the electromagnetic shielding effect was measured using the Takeda embedding method.

測定結果を第1表に示した。The measurement results are shown in Table 1.

第1表 電界および磁界に対するシールド効果(dB)
第1表に示すように本発明のプラスチックハウジング(
実施例)は20〜l OOOMHz  において電界お
よび磁界に対して30〜70 dB  の十分なシール
ド効果を有しており、ニッケル系導電性塗料(比較例)
に比べて高いシールド効果が得られた。ABS樹脂ハウ
ジングと無電解ニッケルメッキ層および無電解ニッケル
メッキ層とポリエチレンテレフタレートフィルムとの密
着性も良好で無電解ニッケルメッキの膜厚は均一なもの
であった。
Table 1 Shielding effect against electric and magnetic fields (dB)
As shown in Table 1, the plastic housing of the present invention (
Example) has a sufficient shielding effect of 30 to 70 dB against electric and magnetic fields at 20 to 1 OOOMHz, and the nickel-based conductive paint (comparative example)
A higher shielding effect was obtained compared to Adhesion between the ABS resin housing and the electroless nickel plating layer and between the electroless nickel plating layer and the polyethylene terephthalate film was also good, and the film thickness of the electroless nickel plating was uniform.

(発明の効果) 本発明は以上の構成になっているので次のような優れた
実用上の効果を有する。
(Effects of the Invention) Since the present invention has the above configuration, it has the following excellent practical effects.

(イ)導電層の上にさらに電気絶縁性プラスチック・フ
ィルム層が設けられているので感電、漏電の危険がなく
、しかも導電層の酸化や腐蝕を防止できる。
(a) Since an electrically insulating plastic film layer is further provided on the conductive layer, there is no risk of electric shock or leakage, and furthermore, oxidation and corrosion of the conductive layer can be prevented.

(ロ) 導電層は、ハウジング基材に対し℃メッキによ
り設げであるので厚さは均一であり、必要とする電磁波
シールドの水準に応じて容易に厚さを変えることができ
る。
(b) Since the conductive layer is provided on the housing base material by C plating, the thickness is uniform, and the thickness can be easily changed depending on the level of electromagnetic shielding required.

また、従来の導電性塗料によるものに比べて薄い厚みで
高いシールド効果が得られ、/・ウジング基材との密着
性も良好で剥離の危険もない。
In addition, compared to conventional conductive paints, a high shielding effect can be obtained with a thinner thickness, and the adhesion to the welding base material is also good and there is no risk of peeling.

(ハ)導電層をニッケルの無電解メッキ層とすれば、銅
クロム等に比べて導電性、経済性の点でより優れたもの
となる。
(c) If the conductive layer is an electroless plating layer of nickel, it will be superior in terms of conductivity and economy compared to copper chromium or the like.

に) メッキ層は基体となるプラスチックの全面に施せ
ば高い電磁波シールド効果が得られるが、ハウジングに
収納される機器の電磁波放射部分の周囲だけ部分的にメ
ッキを施しても十分な電磁波シールド効果が得られる。
) A high electromagnetic shielding effect can be obtained by applying a plating layer to the entire surface of the plastic base, but a sufficient electromagnetic shielding effect cannot be achieved even if the plating is applied only partially around the electromagnetic wave emitting part of the equipment housed in the housing. can get.

さらに、基体となるプラスチック材料の両面にメッキを
施すことにより、高い電磁波シールド効果が得られる。
Furthermore, by plating both sides of the plastic material that serves as the base, a high electromagnetic shielding effect can be obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本発明の一実施例を示すもので、第1図は第一の
実施例の層構成を示す断面図、第2図は第二の実施例の
層構成を示す断面図である。 (1)・・・ハウジング基材 (2)・・・メッキ層 (3)・・・接着剤層
The drawings show one embodiment of the present invention; FIG. 1 is a sectional view showing the layer structure of the first embodiment, and FIG. 2 is a sectional view showing the layer structure of the second embodiment. (1)...Housing base material (2)...Plating layer (3)...Adhesive layer

Claims (2)

【特許請求の範囲】[Claims] (1)基体となるプラスチック基材の少なくとも片面の
全面あるいは一部分にメッキ層を設け、該メッキ層の上
にさらに電気絶縁性プラスチックフィルム層を設けた積
層構造を有する電磁波シールド性を有するプラスチック
ハウジング。
(1) A plastic housing having electromagnetic shielding properties and having a laminated structure in which a plating layer is provided on the entire surface or a portion of at least one side of a plastic base material, and an electrically insulating plastic film layer is further provided on the plating layer.
(2)メッキ層をプラスチック基材の両面に設け、一方
の面のメッキ層の上にさらに電気絶縁性プラスチックフ
ィルム層を設けた積層構造を有する特許請求の範囲第1
項記載の電磁波シールド性を有するプラスチックハウジ
ング。
(2) Claim 1 having a laminated structure in which plated layers are provided on both sides of a plastic base material, and an electrically insulating plastic film layer is further provided on the plated layer on one side.
A plastic housing having electromagnetic shielding properties as described in .
JP59248397A 1984-11-24 1984-11-24 Plastic housing having electromagnetic wave shielding property Pending JPS61127197A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59248397A JPS61127197A (en) 1984-11-24 1984-11-24 Plastic housing having electromagnetic wave shielding property

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59248397A JPS61127197A (en) 1984-11-24 1984-11-24 Plastic housing having electromagnetic wave shielding property

Publications (1)

Publication Number Publication Date
JPS61127197A true JPS61127197A (en) 1986-06-14

Family

ID=17177495

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59248397A Pending JPS61127197A (en) 1984-11-24 1984-11-24 Plastic housing having electromagnetic wave shielding property

Country Status (1)

Country Link
JP (1) JPS61127197A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0320492U (en) * 1989-07-05 1991-02-28
JP2016005908A (en) * 2014-05-30 2016-01-14 トッパン・フォームズ株式会社 Laminated body and electronic equipment
JP2016005909A (en) * 2014-05-30 2016-01-14 トッパン・フォームズ株式会社 Laminated body and electronic equipment
WO2017043348A1 (en) * 2015-09-11 2017-03-16 オムロン株式会社 Magnetic shield structure
WO2023232505A1 (en) * 2022-05-30 2023-12-07 Bdr Thermea Group B.V. Electronic component box for a heat pump system

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0320492U (en) * 1989-07-05 1991-02-28
JP2016005908A (en) * 2014-05-30 2016-01-14 トッパン・フォームズ株式会社 Laminated body and electronic equipment
JP2016005909A (en) * 2014-05-30 2016-01-14 トッパン・フォームズ株式会社 Laminated body and electronic equipment
WO2017043348A1 (en) * 2015-09-11 2017-03-16 オムロン株式会社 Magnetic shield structure
CN107851535A (en) * 2015-09-11 2018-03-27 欧姆龙株式会社 Magnet shielding structure
WO2023232505A1 (en) * 2022-05-30 2023-12-07 Bdr Thermea Group B.V. Electronic component box for a heat pump system

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