JP3194185B2 - Electromagnetic wave shield molded product - Google Patents
Electromagnetic wave shield molded productInfo
- Publication number
- JP3194185B2 JP3194185B2 JP27917097A JP27917097A JP3194185B2 JP 3194185 B2 JP3194185 B2 JP 3194185B2 JP 27917097 A JP27917097 A JP 27917097A JP 27917097 A JP27917097 A JP 27917097A JP 3194185 B2 JP3194185 B2 JP 3194185B2
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- JP
- Japan
- Prior art keywords
- molded product
- metal
- electromagnetic wave
- wave shield
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電磁波シールド成
形品に関する。ここで、電磁波シールドとは、電子機器
が、妨害電波を発生して周囲の機器に悪影響を及ぼすこ
とのないように、また、外部からの妨害電波に対して機
器が誤動作しないように電磁波を遮断することをいう
（斉藤省吾外３名編「電気・電子工学大百科事典第６
巻」（1983−10月）株式会社電気書院、p225-226参
照）。[0001] The present invention relates to an electromagnetic wave shield molded product. Here, the electromagnetic wave shield is used to block electromagnetic waves so that electronic devices do not generate jamming radio waves and adversely affect surrounding devices, and do not malfunction the devices against external jamming radio waves. (Shogo Saito, 3 members, "Electrical and Electrical Engineering Encyclopedia No. 6
Vol. (1983-Oct.) Denki Shoin Co., Ltd., p. 225-226).
【０００２】[0002]
【背景技術】昨今、携帯電話、ゲームウォッチ等の携帯
電子機器を一般人が持ち歩くようになってきている。こ
のため、病院の診断機器や交通機関の制御機器、さらに
は、心臓ペースメーカ等に内蔵されている電子機器が電
磁波障害（electro-magneticinterference;EMI)が社会
的問題になってきている。2. Description of the Related Art In recent years, ordinary people have been carrying portable electronic devices such as mobile phones and game watches. For this reason, electromagnetic interference (EMI) has become a social problem for diagnostic equipment in hospitals, control equipment for transportation, and electronic equipment built in cardiac pacemakers and the like.
【０００３】しかし、従来、上記のような携帯電子機器
は、軽量化の見地からプラスチック製ハウジング（プラ
スチック成形品）に納められて製品化されている。この
ため、本来的には、電磁波のシールド効果（shielding
effect: SE) はほとんどない。However, conventionally, such portable electronic devices have been commercialized in a plastic housing (plastic molded product) from the viewpoint of weight reduction. For this reason, originally, the shielding effect of electromagnetic waves (shielding
effect: SE).
【０００４】このため、電磁波シールドをプラスチック
ハウジングに行なう方式としては、導電性プラスチック
成形材料でハウジングを成形する方法、ハウジングの表
面または裏面にアルミニウム蒸着等により導電性処理を
する方法等が考えられる（同p226参照）。[0004] For this reason, as a method of applying the electromagnetic wave shielding to the plastic housing, a method of molding the housing with a conductive plastic molding material, a method of conducting a conductive treatment on the front or back surface of the housing by aluminum vapor deposition or the like are considered ( P.226).
【０００５】[0005]
【発明が解決しようとする課題】しかし、上記アルミニ
ウム蒸着単独では、ＭＦからＵＨＦの広い電磁波領域で
の電磁波シールド効果が十分ではないことが分かった。However, it has been found that the above-described aluminum deposition alone does not provide an adequate electromagnetic wave shielding effect in a wide electromagnetic wave region from MF to UHF.
【０００６】本発明は、上記にかんがみて、広い周波数
領域での効率的な電磁波シールドが可能な電磁波シール
ド成形品を提供することを目的とする。[0006] In view of the above, an object of the present invention is to provide an electromagnetic shielding product capable of efficiently shielding electromagnetic waves in a wide frequency range.
【０００７】[0007]
【課題を解決するための手段】 本発明に係る電磁波シ
ールド成形品は、上記課題を、プラスチック成形品の表
面側又は内側に、電磁波シールド能を有する複層構成の
金属蒸着膜が形成されている構成により解決するもので
ある。 Means for Solving the Problems The electromagnetic wave shield molded product according to the present invention solves the above-mentioned problem by forming a multi-layered metal vapor-deposited film having electromagnetic wave shielding ability on the surface side or inside the plastic molded product. This is solved by the configuration .
【０００８】[0008]
【０００９】[0009]
【００１０】 更には、該金属蒸着膜の表面側に金属酸
化物蒸着膜が形成されており、前記金属酸化物蒸着膜が
酸化けい素であることが望ましい。Further, a metal oxide deposited film is formed on a surface side of the metal deposited film, and the metal oxide deposited film is
Desirably, it is silicon oxide .
【００１１】[0011]
【発明の実施の形態】次に、本発明の一実施形態を、図
例に基づいて詳細に説明をする。Next, an embodiment of the present invention will be described in detail with reference to the drawings.
【００１２】(1) 上位概念的にはプラスチック製の成形
品本体１２の表面側または内側に、電磁波シールド能を
有する金属蒸着膜１４ａ，１４ｂ，１４ｃが形成されて
いる。図例では、該金属蒸着膜１４の表面側に金属酸化
物蒸着膜１６が形成されている。(1) As a general concept, metal-deposited films 14a, 14b and 14c having electromagnetic wave shielding performance are formed on the surface side or inside of a molded article body 12 made of plastic. In the illustrated example, a metal oxide deposited film 16 is formed on the surface side of the metal deposited film 14.
【００１３】ここで、金属蒸着膜１４ａ，１４ｂ，１４
ｃは、シールド作用を奏し、金属酸化物蒸着膜１６は、
最外層の金属蒸着膜１４ｃの絶縁及び表面保護（酸化防
止と耐擦傷性・摩耗性の付与）のために形成する。金属
蒸着膜の構成によっては、また、成形品の使用環境によ
っては、必然的ではない。Here, the metal deposition films 14a, 14b, 14
c has a shielding effect, and the metal oxide deposited film 16 has
It is formed to insulate and protect the surface of the outermost metal vapor-deposited film 14c (to prevent oxidation and impart abrasion resistance and abrasion resistance). This is not indispensable depending on the configuration of the metal deposition film and depending on the use environment of the molded product.
【００１４】例えば、Ａｌ最上層の場合、Ａｌの酸化保
護膜（Ａｌ2 Ｏ3 ）が形成され、実質的に金属酸化物層
が形成されるため、必然的ではない。For example, in the case of the uppermost layer of Al, it is not inevitable because an Al oxidation protection film (Al 2 O 3 ) is formed and a metal oxide layer is substantially formed.
【００１５】また、金属蒸着膜が表面に酸化保護膜が形
成されなくても、手等が接触せず耐摩耗性が要求されな
いような部位は、そのまま使用できる。Even if the metallized film does not have an oxidation protective film formed on its surface, a part that does not come into contact with a hand or the like and does not require abrasion resistance can be used as it is.
【００１６】更には、金属蒸着膜及び金属酸化物蒸着膜
のいずれが最上層であっても、表面を樹脂系塗料等で彩
色して、意匠性を高めることも勿論できる。Further, regardless of which of the metal deposited film and the metal oxide deposited film is the uppermost layer, it is of course possible to enhance the design by coloring the surface with a resin paint or the like.
【００１７】(2) ここで、成形品本体１２を構成するプ
ラスチック材料としては、ＡＢＳ樹脂、ＡＳ樹脂、ポリ
カーボネート、ポリメチルメタクリレート、ポリメチル
アクリレート、ポリ塩化ビニル、ポリアミド、ポリアセ
タール、ポリフェニレンオキサイド等の極性樹脂を好ま
しく使用できる。極性を有する金属蒸着膜との密着性の
見地からである。金属蒸着膜の形成に先立ち、プライマ
ー塗布をすれば、ポリプロピレン、ポリエチレン等の非
極性樹脂であってもよい。(2) Here, the plastic material constituting the molded article main body 12 includes ABS resin, AS resin, polycarbonate, polymethyl methacrylate, polymethyl acrylate, polyvinyl chloride, polyamide, polyacetal, and polyphenylene oxide. Resins can be preferably used. This is from the viewpoint of adhesion to a metal deposition film having polarity. If a primer is applied before the formation of the metal deposition film, a non-polar resin such as polypropylene or polyethylene may be used.
【００１８】上記成形品本体としては、携帯電話、ポケ
ットベル、携帯パソコン、ゲームウォッチ等のハウジン
グや、機密保持用窓ガラス等を挙げることができる。Examples of the molded product body include housings for mobile phones, pagers, mobile personal computers, game watches, etc., and confidential window glasses.
【００１９】(3) ここで、金属蒸着膜１４ａ，１４ｂ，
１４ｃは、比抵抗（２０℃）が２０μΩ・ｃｍ以下でか
つ比抵抗が相互に１．５倍以上異なる金属の蒸着膜組み
合わせである複層構造が望ましい。２０μΩ・ｃｍを越
えると、シールド効率（ＳＥ）が低いためである。ま
た、金属蒸着膜として、２種以上の比抵抗が相互に１．
５倍以上（望ましくは２倍以上）異なる金属の組み合わ
せである複層構造とするのは、理由は断定できないが、
電波の吸収特性が異なるためである。(3) Here, the metal deposition films 14a, 14b,
14c is desirably a multilayer structure in which a combination of metal deposited films having a specific resistance (20 ° C.) of 20 μΩ · cm or less and a specific resistance different from each other by 1.5 times or more. This is because if it exceeds 20 μΩ · cm, the shielding efficiency (SE) is low. Further, as a metal deposited film, two or more types of specific resistances are 1.
The reason why the multi-layer structure, which is a combination of metals that are five times or more (preferably two times or more) different from each other, cannot be determined for certain reasons.
This is because the radio wave absorption characteristics are different.
【００２０】なお、図例では、金属蒸着膜１４ａ，１４
ｂ，１４ｃは、３層構成であるが、要求シールド能に応
じて、２層構成、更には４〜６層構成等であってもよ
い。構成層の数を多くすれば、より広い領域での電磁波
吸収特性が得易くなる。In the illustrated example, the metal deposition films 14a, 14a
Although b and 14c have a three-layer configuration, they may have a two-layer configuration, or even a four to six-layer configuration, depending on the required shielding performance. Increasing the number of constituent layers makes it easier to obtain electromagnetic wave absorption characteristics in a wider area.
【００２１】 具体的には、金属蒸着膜の形成金属とし
て、第４周期５〜１１族の元素およびアルミニウムの内
から選択することが、蒸着のし易さ（密着性も含めて）
等の見地から望ましいが、下記例示の金属等でも勿論使
用可能であり、更には、２０μΩ・ｃｍを越えても、組
み合わせる他の金属として２０μΩ・ｃｍ以下のものを
使用すれば、Ｔｉ（５５μΩ・ｃｍ）でも使用可能であ
る。[0021] Specifically, it is easy to perform deposition (including adhesion) by selecting from among elements belonging to the fourth period of Groups 5 to 11 and aluminum as the metal for forming the metal deposition film.
Although it is desirable from the point of view such as the following, the metals exemplified below can of course be used, and even if it exceeds 20 μΩ · cm, if another metal combined with 20 μΩ · cm or less is used, Ti (55 μΩ · cm) can be used. cm).
【００２２】以下に、代表的な金属の２０℃における比
抵抗値を示す。単位は、μΩ・ｃｍである（同書、p10
参照）。The specific resistance of a typical metal at 20 ° C. is shown below. The unit is μΩ · cm (Id., P10
reference).
【００２３】Ａｇ：１．６、Ａｌ：２．６９、Ａｕ：
２．３、Ｃｄ：７．４、Ｃｏ：６．２４、Ｃｒ：１２．
９、Ｃｕ：１．６７、Ｆｅ：９．７１ Ｉｎ：９．０、Ｎｉ：６．８４、Ｚｎ：５．９２、好ま
しい組み合わせとしては、例えば、Ｃｒ／Ｎｉ／Ａｌ、
Ｃｒ／Ｎｉ／Ｃｕ／Ａｌ、Ｃｒ／Ｃｕ／Ｎｉ／Ａｌ等を
挙げることができる。Ag: 1.6, Al: 2.69, Au:
2.3, Cd: 7.4, Co: 6.24, Cr: 12.
9, Cu: 1.67, Fe: 9.71 In: 9.0, Ni: 6.84, Zn: 5.92, and preferable combinations include, for example, Cr / Ni / Al,
Cr / Ni / Cu / Al, Cr / Cu / Ni / Al and the like can be mentioned.
【００２４】また、複層構成の金属蒸着膜１４の各層厚
みは、０．０１〜０．５μｍ、望ましくは、０．０２〜
０．２μｍとし、合計厚みで、０．０２〜１．０μｍ、
望ましくは、０．０４〜０．４μｍとする。厚みが薄す
ぎると、シールド効果を得難く、厚すぎても、それ以上
のシールド効果を得難く、生産効率も低下する。The thickness of each layer of the metal vapor deposited film 14 having a multilayer structure is 0.01 to 0.5 μm, preferably 0.02 to 0.5 μm.
0.2 μm, 0.02-1.0 μm in total thickness,
Desirably, the thickness is 0.04 to 0.4 μm. If the thickness is too thin, it is difficult to obtain a shielding effect, and if it is too thick, it is difficult to obtain a further shielding effect, and the production efficiency is reduced.
【００２５】上記蒸着膜の形成方法は、通常、コスト的
見地から真空蒸着によるが、スパッタリング、イオンプ
レーティング等であっても勿論よい。なお、真空蒸着の
条件は、通常、３×１０-5Torr（４×１０-3Pa) 以下
で、温度８０℃以下とする。The method of forming the above-mentioned deposited film is usually vacuum deposition from the viewpoint of cost. However, it is needless to say that sputtering, ion plating or the like may be used. The vacuum deposition conditions are usually 3 × 10 −5 Torr (4 × 10 −3 Pa) or less and the temperature is 80 ° C. or less.
【００２６】(3) 金属酸化物蒸着膜１６を形成する金属
酸化物としては、ＳｉＯ2 、Ａｌ2Ｏ3等を挙げることが
できるが、ＳｉＯ2 等のケイ素酸化物が望ましい。(3) Examples of the metal oxide forming the metal oxide deposited film 16 include SiO 2 and Al 2 O 3, and a silicon oxide such as SiO 2 is preferable.
【００２７】金属酸化物蒸着膜の厚みは、０．０５〜
０．５μｍ、望ましくは０．０８〜０．３μｍとする。
０．０５μｍ以下では、絶縁効果及び表面保護効果が得
難く、０．５μｍを越えると、それ以上の絶縁効果及び
表面保護効果を期待できないとともに生産効率も低下す
る。The thickness of the deposited metal oxide film is 0.05 to
0.5 μm, preferably 0.08 to 0.3 μm.
When the thickness is less than 0.05 μm, it is difficult to obtain an insulating effect and a surface protection effect.
【００２８】 上記蒸着膜の形成方法は、上記、金属膜
の場合と同様、通常、コスト的見地から真空蒸着による
が、スパッタリング、イオンプレーティング等であって
も勿論よい。なお、真空蒸着の条件は、通常、３×１０
-5 Torr（４×１０-3Pa）以下で、温度８０℃以下とす
る。As in the case of the metal film, the method of forming the above-mentioned vapor-deposited film is usually vacuum deposition from the viewpoint of cost. However, it goes without saying that sputtering, ion plating or the like may be used. The conditions of vacuum deposition are usually 3 × 10
- at 5 Torr (4 × 10 -3 Pa ) or less, a temperature 80 ° C. or less.
【００２９】なお、金属酸化物蒸着膜１６の上にはシリ
コーン系等の樹脂ハード塗膜を形成してもよい。It should be noted that a resin-based hard coating such as a silicone resin may be formed on the metal oxide deposited film 16.
【００３０】[0030]
【実施例】以下、本発明の効果を確認するために行った
実施例について説明する。EXAMPLES Examples performed to confirm the effects of the present invention will be described below.
【００３１】(1) ポリカーボネート基材（成形品本体：
厚み１．２mm）１２の上に、下記金属ないし金属酸化物
を用いて下記設定膜厚で、金属蒸着膜１４ａ，１４ｂ，
１４ｃを真空蒸着（条件：３×１０-5Torr、５０℃）に
より順次形成した。(1) Polycarbonate substrate (molded article body:
The following metal or metal oxide is used to form a metal deposition film 14a, 14b,
14c was sequentially formed by vacuum deposition (condition: 3 × 10 −5 Torr, 50 ° C.).
【００３２】 第１層：Ｃｒ ０．０４μｍ 第２層：Ｎｉ ０．１３μｍ 第３層：Ａｌ ０．１５μｍ (2) 上記で得た電磁波シールド成形品について、電界及
び磁界におけるシール度をＫＥＣ法により測定した。な
お、測定機器は、スペクトラムアナライザーとして「Ｔ
Ｒ４１７２」（アドバンテスト社製商品名）及びシール
ド材評価器として「ＭＡ８６０２Ｂ」（アンリツ社製商
品名）を使用した。First layer: Cr 0.04 μm Second layer: Ni 0.13 μm Third layer: Al 0.15 μm (2) For the obtained electromagnetic wave shield molded product, the degree of sealing in an electric field and a magnetic field was determined by the KEC method. It was measured. In addition, the measuring instrument is a "T
R4172 "(trade name, manufactured by Advantest) and" MA8602B "(trade name, manufactured by Anritsu Corporation) were used as a shield material evaluation device.
【００３３】 測定結果を示す図２（電場）及び図３
（磁場）から、いずれも、広い周波数領域において良好
なシールド効果（減衰量）を示すことが分かる。即ち、
特に高周波数（１ＧＨｚ）側で、電場、磁場ともに、３
０ｄＢ以上の減衰量を示した。なお、成形品基材のみに
ついても、シールド効果を測定したが、全周波数領域
で、０ｄＢであり、全く遮蔽効果を示さなかった。The measurement resultsShowFigure2(Electric field) and figure3
(Magnetic field), all good in a wide frequency range
It can be seen that a large shielding effect (attenuation amount) is exhibited. That is,
Especially on the high frequency (1 GHz) side, both electric and magnetic fields are 3
The attenuation was 0 dB or more. It should be noted that only the molded product base material
We also measured the shielding effect,
And 0 dB, showing no shielding effect at all.
【００３４】[0034]
【発明の作用・効果】本発明の電磁波シールド成形品
は、前述の実施例で支持される如く、広い周波数領域で
の効率的な電磁波シールドが可能となる。The electromagnetic wave shield molded product of the present invention enables efficient electromagnetic wave shielding in a wide frequency range as supported by the above-described embodiment.
【図１】本発明の電磁波シールド成形品の層構造を示す
断面図FIG. 1 is a cross-sectional view showing a layer structure of an electromagnetic wave shield molded product of the present invention.
【図２】電界におけるシールド効果を示す減衰グラフ図FIG. 2 is an attenuation graph showing a shielding effect in an electric field.
【図３】磁界におけるシールド効果を示す減衰グラフ図FIG. 3 is an attenuation graph showing a shielding effect in a magnetic field.
１２ 成形品本体 １４ａ，１４ｂ，１４ｃ 金属蒸着膜 １６ 金属酸化物蒸着膜 12 Molded product main body 14a, 14b, 14c Metal deposited film 16 Metal oxide deposited film
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平６−177571（ＪＰ，Ａ) 特開 昭62−5699（ＪＰ，Ａ) 特開 平３−232974（ＪＰ，Ａ) 特開 平２−97097（ＪＰ，Ａ) 特開 平７−133361（ＪＰ，Ａ) 特開 平８−236976（ＪＰ，Ａ) 実開 昭59−87181（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 9/00 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-6-177571 (JP, A) JP-A-62-5699 (JP, A) JP-A-3-232974 (JP, A) JP-A-2- 97097 (JP, A) JP-A-7-133361 (JP, A) JP-A-8-236976 (JP, A) JP-A-59-87181 (JP, U) (58) Fields investigated (Int. Cl. 7 , DB name) H05K 9/00
Claims (4)
内側に、電磁波シールド能を有する複層構成の金属蒸着
膜が形成されてなる電磁波シールド成形品において、 前記金属蒸着膜が、前記プラスチック成形品基材側から
クロム、ニッケル、アルミニウムの順の３層の複層構成
であることを特徴とする電磁波シールド成形品。On the surface side or inner 1. A plastic article substrate, in the electromagnetic shielding molded article metallized film with a multilayer structure is formed having an electromagnetic shielding ability, the metal deposited film, the plastic article An electromagnetic wave shield molded product having a multilayer structure of three layers of chromium, nickel, and aluminum in order from the base material side.
内側に、電磁波シールド能を有する複層構成の金属蒸着
膜が形成されてなる電磁波シールド成形品において、 前記金属蒸着膜が、前記プラスチック成形品基材側から
クロム、ニッケル、アルミニウムの順であって、さらに
クロム−ニッケル間又はニッケル−アルミニウム間に銅
層を有する４層の複層構成であることを特徴とする電磁
波シールド成形品。 2. The surface side of a plastic molded article substrate or
Inside, multi-layer metal deposition with electromagnetic shielding ability
In the electromagnetic wave shield molded product in which a film is formed, the metal deposition film is formed from the plastic molded product base material side.
Chromium, nickel, aluminum in that order, and
Copper between chromium and nickel or between nickel and aluminum
Characterized in that it has a multilayer structure of four layers having layers.
Wave shield molded product.
化物蒸着膜が形成されていることを特徴とする請求項１
又は２に記載の電磁波シールド成形品。3. The method according to claim 1, further comprising forming a metal oxide deposited film on the surface of the metal deposited film.
Or the molded product of the electromagnetic wave shield according to 2.
ることを特徴とする請求項３記載の電磁波シールド成形
品。4. The molded article according to claim 3, wherein the metal oxide deposited film is silicon oxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27917097A JP3194185B2 (en) | 1997-10-13 | 1997-10-13 | Electromagnetic wave shield molded product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27917097A JP3194185B2 (en) | 1997-10-13 | 1997-10-13 | Electromagnetic wave shield molded product |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11121961A JPH11121961A (en) | 1999-04-30 |
| JP3194185B2 true JP3194185B2 (en) | 2001-07-30 |
Family
ID=17607431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27917097A Expired - Fee Related JP3194185B2 (en) | 1997-10-13 | 1997-10-13 | Electromagnetic wave shield molded product |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3194185B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19937284B4 (en) * | 1999-08-06 | 2008-10-30 | GfO Gesellschaft für Oberflächentechnik mbH | Electrically conductive multilayer structure |
| ES2358196T3 (en) * | 2005-01-26 | 2011-05-06 | Robert Bosch Gmbh | MICROPHONE. |
| KR100723410B1 (en) | 2005-08-17 | 2007-05-30 | 삼성전자주식회사 | Mehtod of fabricating resistive probe having self-aligned metal shield |
| JP2008050047A (en) * | 2006-08-28 | 2008-03-06 | Orient Sokki Computer Kk | Apparatus for making mobile terminal communication impossible |
| JP5202377B2 (en) * | 2008-04-21 | 2013-06-05 | 信越ポリマー株式会社 | Coverlay film and flexible printed wiring board |
| JP5193903B2 (en) * | 2009-02-26 | 2013-05-08 | 信越ポリマー株式会社 | Coverlay film, flexible printed wiring board and optical transceiver |
| JP6397806B2 (en) * | 2015-09-11 | 2018-09-26 | 東芝メモリ株式会社 | Semiconductor device manufacturing method and semiconductor device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5987181U (en) * | 1982-12-01 | 1984-06-13 | 東京電子工業株式会社 | electromagnetic shield box |
| JPS625699A (en) * | 1985-07-02 | 1987-01-12 | 株式会社 麗光 | Electromagnetic wave shielding cu thin film |
| JPH0297097A (en) * | 1988-10-03 | 1990-04-09 | Matsushita Electric Ind Co Ltd | Electromagnetic shielding material |
| JPH03232974A (en) * | 1990-02-07 | 1991-10-16 | Fujitsu Ltd | Formation of shielding film for plastic |
| JPH06177571A (en) * | 1992-12-01 | 1994-06-24 | Fujitsu Kasei Kk | Electronic equipment case and manufacture thereof |
| JP2817891B2 (en) * | 1993-11-08 | 1998-10-30 | 中外イングス株式会社 | Manufacturing method of electromagnetic wave shielding plastic molded products |
| JPH08236976A (en) * | 1995-02-23 | 1996-09-13 | Chiyuugai Ingusu Kk | Electromagnetic shield plastic molded item |
-
1997
- 1997-10-13 JP JP27917097A patent/JP3194185B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11121961A (en) | 1999-04-30 |
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