JPS61114842U - - Google Patents
Info
- Publication number
- JPS61114842U JPS61114842U JP13827784U JP13827784U JPS61114842U JP S61114842 U JPS61114842 U JP S61114842U JP 13827784 U JP13827784 U JP 13827784U JP 13827784 U JP13827784 U JP 13827784U JP S61114842 U JPS61114842 U JP S61114842U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- coated
- sealed
- semiconductor device
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は、本考案の一実施例を示す断面図であ
る。 １……集積回路チツプ、２……リードフレーム
、３……絶縁性樹脂、４……導電性樹脂。
る。 １……集積回路チツプ、２……リードフレーム
、３……絶縁性樹脂、４……導電性樹脂。
Claims (1)
- 樹脂封止パツケージの上部面及び下部面が導電
性樹脂で被覆されていることを特徴とする樹脂封
止型半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13827784U JPS61114842U (ja) | 1984-09-12 | 1984-09-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13827784U JPS61114842U (ja) | 1984-09-12 | 1984-09-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61114842U true JPS61114842U (ja) | 1986-07-19 |
Family
ID=30696672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13827784U Pending JPS61114842U (ja) | 1984-09-12 | 1984-09-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61114842U (ja) |
-
1984
- 1984-09-12 JP JP13827784U patent/JPS61114842U/ja active Pending