JPS6111480B2 - - Google Patents
Info
- Publication number
- JPS6111480B2 JPS6111480B2 JP12042279A JP12042279A JPS6111480B2 JP S6111480 B2 JPS6111480 B2 JP S6111480B2 JP 12042279 A JP12042279 A JP 12042279A JP 12042279 A JP12042279 A JP 12042279A JP S6111480 B2 JPS6111480 B2 JP S6111480B2
- Authority
- JP
- Japan
- Prior art keywords
- electroless plating
- metal
- catalyst
- entire surface
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- 238000007772 electroless plating Methods 0.000 claims description 10
- 239000003054 catalyst Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 239000004020 conductor Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 239000000976 ink Substances 0.000 description 8
- 239000000243 solution Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- PTKWYSNDTXDBIZ-UHFFFAOYSA-N 9,10-dioxoanthracene-1,2-disulfonic acid Chemical compound C1=CC=C2C(=O)C3=C(S(O)(=O)=O)C(S(=O)(=O)O)=CC=C3C(=O)C2=C1 PTKWYSNDTXDBIZ-UHFFFAOYSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- ODWXUNBKCRECNW-UHFFFAOYSA-M bromocopper(1+) Chemical compound Br[Cu+] ODWXUNBKCRECNW-UHFFFAOYSA-M 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- JZULKTSSLJNBQJ-UHFFFAOYSA-N chromium;sulfuric acid Chemical compound [Cr].OS(O)(=O)=O JZULKTSSLJNBQJ-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- LPAFSORAXBYKGJ-UHFFFAOYSA-J copper disodium tetraacetate Chemical compound C(C)(=O)[O-].[Cu+2].[Na+].[Na+].C(C)(=O)[O-].C(C)(=O)[O-].C(C)(=O)[O-] LPAFSORAXBYKGJ-UHFFFAOYSA-J 0.000 description 1
- 239000003984 copper intrauterine device Substances 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】
本発明は印刷配線板の製造法に関する。近年、
スルホール接続信頼性、コスト低減をねらいとし
て絶縁基板の所要パターン部およびスルホール壁
のみに選択的に光化学的に触媒性金属粒子を析出
させて回路像を形成し、化学銅のめつきのみで導
体を完成する新規な印刷配線板の製造方法が提案
されている。（例えば米国特許第3772078号）
この方法に於て紫外線照射により選択的に金属
核を形成し、この核を触媒として無電解めつきに
より導体を形成する場合紫外線を選択的に照射す
るために絶縁基板にフオトマスクを当て紫外線を
照射し像を形成しなければならないため、印刷法
による像形成に較べ量産性において劣つている。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing printed wiring boards. recent years,
Aiming to improve through-hole connection reliability and reduce costs, catalytic metal particles are selectively photochemically deposited only on the required pattern areas of the insulating substrate and on the through-hole walls to form a circuit image, and conductors are formed using only chemical copper plating. A new method of manufacturing a completed printed wiring board has been proposed. (For example, US Pat. No. 3,772,078) In this method, metal nuclei are selectively formed by ultraviolet irradiation, and when a conductor is formed by electroless plating using these nuclei as a catalyst, insulating Since an image must be formed by applying a photomask to the substrate and irradiating it with ultraviolet rays, it is inferior to image formation by printing methods in terms of mass productivity.
また、絶縁基板上に印刷により像を形成し、無
電解めつきにより導体を形成する方法は、従来基
材にあらかじめ無電解めつきの反応の触媒となり
得る金属核を入れておく手段がとられていたが、
これでは基材が限定されてしまうと共に、製造コ
ストが高くなる。 Furthermore, in the conventional method of forming an image on an insulating substrate by printing and forming a conductor by electroless plating, a method was used in which a metal nucleus that could serve as a catalyst for the electroless plating reaction was placed in the base material in advance. However,
This limits the number of base materials and increases manufacturing costs.
本発明はこのような点に鑑みてなされたもの
で、まず絶縁基板、例えば積層板、穴明け加工し
た金属板に静電粉体塗装または電着塗装等により
絶縁被覆した金属芯絶縁板射出成形したプラスチ
ツク板等に必要に応じて穴明け加工した後、表面
および穴内をクロム酸硫酸混液の様な液で化学的
に粗化する。その後紫外線照射により金属核を形
成する様な処理液すなわち、還元可能で無電解め
つきに対して触媒となる酸化状態の金属を含む処
理液で処理してから、導体を形成しようとする部
分以外の表面にスクリーン印刷法によりインクを
塗布する。この際使用するインクとしては、メラ
ミン樹脂、エポキシ樹脂等主成分とする各種の物
が使用できるが、特に紫外線照射により硬化反応
が進むインクを使用すれば熱硬化型インクに較べ
有利である。次に全面に紫外線を照射する。これ
によつてマスクされていない部分、すなわち処理
液が露出した部分で還元反応が起こり金属核が形
成される。この時紫外線硬化型インクを使用した
場合は、金属核の形成と同時にインクの硬化反応
も進む。次に無電解めつき液に浸漬すると、この
金属核を触媒として無電解めつき反応が進み、必
要部分にのみ導体が形成される。 The present invention has been made in view of the above points, and firstly, an insulating substrate, such as a laminate or a perforated metal plate, is insulated by electrostatic powder coating or electrodeposition coating, etc., and is insulated by injection molding of a metal core insulating plate. After drilling holes in the plastic plate, etc., as necessary, the surface and inside of the holes are chemically roughened with a liquid such as a chromic acid/sulfuric acid mixture. After that, the parts other than those to be formed into conductors are treated with a treatment solution that forms metal nuclei by irradiation with ultraviolet rays, that is, a treatment solution that contains a metal in an oxidized state that is reducible and acts as a catalyst for electroless plating. Ink is applied to the surface by screen printing. As the ink used at this time, various inks having a main component such as melamine resin or epoxy resin can be used, but it is particularly advantageous to use an ink whose curing reaction progresses when irradiated with ultraviolet rays compared to a thermosetting ink. Next, the entire surface is irradiated with ultraviolet light. As a result, a reduction reaction occurs in the unmasked portions, that is, the portions where the processing liquid is exposed, and metal nuclei are formed. If an ultraviolet curable ink is used at this time, the curing reaction of the ink proceeds simultaneously with the formation of the metal nucleus. Next, when it is immersed in an electroless plating solution, the electroless plating reaction proceeds using this metal core as a catalyst, and conductors are formed only in the necessary areas.
実施例 図面に基づいて説明する。Example The explanation will be based on the drawings.
(1) ガラスエポキシ積層板１(A)の表面にエポキシ
樹脂、NBRを主成分とする接着剤２を塗布す
る。(1) Apply adhesive 2 mainly composed of epoxy resin and NBR to the surface of glass epoxy laminate 1 (A).
(2) ドリルにより穴明け加工後(C)クロム硫酸混液
（無水クロム酸100ｇ/、濃硫酸300ml/）で
処理した接着剤表面に細かな凹凸３をつける。
(D)
(3) 下記組成の感光液４に浸漬後100℃で約10分
乾燥する。(E)
ソルピトール 120ｇ/
2.6アントラキノンジスルホン酸 20ｇ/
ジナトリウム
酢酸銅 10ｇ/
臭化銅 １ｇ/
ホウ弗酸（42％） ５ml/
(4) 紫外線硬化型樹脂５を用いて、回路以外の部
分にスクリーン印刷によりマスク印刷をする。
(F)
(5) 紫外線照射装置により全面に紫外線照射し、
触媒金属６を析出させる。(G)
(6) これを次の無電解銅めつき液に浸漬し、マス
クしていない部分に銅７を約30μ析出させ、印
刷配線板を作つた。(H)
硫酸銅 10ｇ/
ホルマリン ５ml/
EDTA 40ｇ/
シアンカナトリウム 30mg/
水酸化ナトリウム PH＝12.0になるだけの量
めつき温度 65℃
以上説明したような本発明に於ては次の効果が
達成される。(2) After drilling holes with a drill, (C) Make fine irregularities 3 on the adhesive surface treated with a chromium sulfuric acid mixture (chromic acid anhydride 100g/, concentrated sulfuric acid 300ml/).
(D) (3) After immersing in photosensitive solution 4 having the composition below, dry it at 100°C for about 10 minutes. (E) Solpitol 120g/ 2.6 anthraquinone disulfonic acid 20g/ disodium copper acetate 10g/ copper bromide 1g/ borofluoric acid (42%) 5ml/ (4) Using UV curable resin 5, screen areas other than the circuit. Print a mask by printing.
(F) (5) Irradiate the entire surface with ultraviolet light using an ultraviolet irradiation device,
Catalytic metal 6 is deposited. (G) (6) This was immersed in the following electroless copper plating solution to deposit about 30 μm of copper 7 on the unmasked areas to produce a printed wiring board. (H) Copper sulfate 10g/ Formalin 5ml/ EDTA 40g/ Sodium cyanka 30mg/ Sodium hydroxide Weighing temperature 65°C to give PH=12.0 The present invention as explained above achieves the following effects. be done.
(1) 無電解めつきの触媒としてパラジウム等高価
な貴金属を使用しないで、安価な銅を使用出
来、しかもこの触媒を基材にあらかじめ入れて
おく必要なく、後で浸漬するだけで良いため、
基材の選定が広がる。(1) As a catalyst for electroless plating, inexpensive copper can be used instead of expensive precious metals such as palladium, and there is no need to add this catalyst to the base material beforehand, just immerse it afterwards.
Expands the selection of base materials.
(2) 写真法によりパターンを形成するのではな
く、量産性にすぐれた印刷法にてパターン形成
ができる。(2) Rather than forming a pattern using a photographic method, the pattern can be formed using a printing method that is highly suitable for mass production.
図面は本発明の製造工程を示す印刷配線板の断
面図である。
符号の説明 １……絶縁基板、２……接着剤、
３……粗化された接着剤表面、４……感光液、５
……マスクインク、６……金属核、７……無電解
めつきにより析出した銅。
The drawings are cross-sectional views of a printed wiring board showing the manufacturing process of the present invention. Explanation of symbols 1...Insulating substrate, 2...Adhesive,
3...Roughened adhesive surface, 4...Photosensitive liquid, 5
...mask ink, 6...metal core, 7...copper deposited by electroless plating.
Claims (1)
板の製造法。 ａ 絶縁基板全面を化学的に粗化する。 ｂ 全面を還元可能で無電解めつきに対して触媒
となる酸化状態の金属を含む処理液で処理す
る。 ｃ 回路となる部分を除いて樹脂層を形成する。 ｄ 紫外線を照射して金属核を形成する。 ｅ 無電解めつき液に浸漬して導体を形成する。[Scope of Claims] 1. A method for manufacturing a printed wiring board, characterized by comprising the following steps. a) Chemically roughen the entire surface of the insulating substrate. b. The entire surface is treated with a treatment solution containing a metal in an oxidized state that is reducible and acts as a catalyst for electroless plating. c. Form a resin layer except for the part that will become the circuit. d. Irradiate with ultraviolet rays to form metal nuclei. e Immerse in electroless plating solution to form a conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12042279A JPS5643799A (en) | 1979-09-18 | 1979-09-18 | Producing printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12042279A JPS5643799A (en) | 1979-09-18 | 1979-09-18 | Producing printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5643799A JPS5643799A (en) | 1981-04-22 |
| JPS6111480B2 true JPS6111480B2 (en) | 1986-04-03 |
Family
ID=14785822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12042279A Granted JPS5643799A (en) | 1979-09-18 | 1979-09-18 | Producing printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5643799A (en) |
-
1979
- 1979-09-18 JP JP12042279A patent/JPS5643799A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5643799A (en) | 1981-04-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3606677A (en) | Multilayer circuit board techniques | |
| US4770900A (en) | Process and laminate for the manufacture of through-hole plated electric printed-circuit boards | |
| US3481777A (en) | Electroless coating method for making printed circuits | |
| JPS6148570A (en) | Formation of conductor layer onto resin | |
| JPS6111480B2 (en) | ||
| KR100235930B1 (en) | Printed wiring board and method for preparing the same | |
| US4084968A (en) | Method of manufacturing electrically conductive metal layers on substrates | |
| JPH036880A (en) | Printed wiring board and manufacture thereof | |
| JPS647592A (en) | Manufacture of printed wiring board | |
| JPH02143492A (en) | Manufacture of high-density multilayered printed-wiring board | |
| JPH0350791A (en) | Manufacture of printed wiring board | |
| JPH06152126A (en) | Manufacture of wiring board | |
| JP3056865B2 (en) | Manufacturing method of printed wiring board | |
| JPS58128788A (en) | Method of producing printed board | |
| JPS59178788A (en) | Method of producing circuit board | |
| JPS62296493A (en) | Manufacture of printed wiring board | |
| SU1045420A1 (en) | Process for manufacturing printed circuit board | |
| JPH01122112A (en) | Manufacture of pattern coil | |
| JPS61252689A (en) | Manufacture of printed circuit board | |
| JPH0810786B2 (en) | Method of forming conductor pattern by ultraviolet laser | |
| JP2669411B2 (en) | Manufacturing method of printed wiring board | |
| JP3191686B2 (en) | Manufacturing method of printed wiring board | |
| JPS62271491A (en) | Manufacture of printed wiring board | |
| JPS5846698A (en) | Method of producing printed circuit board | |
| JPS5877287A (en) | Method of producing printed circuit board |