JPS6111260A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS6111260A JPS6111260A JP59132369A JP13236984A JPS6111260A JP S6111260 A JPS6111260 A JP S6111260A JP 59132369 A JP59132369 A JP 59132369A JP 13236984 A JP13236984 A JP 13236984A JP S6111260 A JPS6111260 A JP S6111260A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- thermal head
- recording current
- image signal
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims abstract description 63
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
Landscapes
- Electronic Switches (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
本発明はサーマルヘッドに関し、とくに発熱抵抗体を直
接駆動する複数個のドライバＩＣを用いるサー゛マルへ
、ドに関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a thermal head, and more particularly to a thermal head using a plurality of driver ICs that directly drive a heating resistor.
半導体ＩＣは技術の進歩に伴なって高集積度化し、従来
と同一の機能を実現するＩＣの外形寸法は、高集積度Ｉ
Ｃ技術を用いることによって著しく小屋となる。このた
めに、外形寸法を従来と同一とするＩＣは、従来の２倍
程度の機能を実現することができる。例えば、サーマル
ヘッドに用いられるドライバＩＣが駆動する発熱抵抗体
数を６４本（ｍ＝６４）／Ｉｃとすると、このＩＣは横
幅が２〜２．５ｍ前後であり、縦方向が６〜８ｓｗ＋前
後の寸法として実現することができる。Semiconductor ICs have become highly integrated with the advancement of technology, and the external dimensions of ICs that achieve the same functions as conventional ICs have become more integrated.
By using C technology, it becomes noticeably hut. For this reason, an IC with the same external dimensions as a conventional IC can realize twice the functions of the conventional IC. For example, assuming that the number of heating resistors driven by a driver IC used in a thermal head is 64 (m = 64)/Ic, the width of this IC is approximately 2 to 2.5 m, and the vertical direction is approximately 6 to 8 SW + It can be realized as the dimensions of
従って解像度が１２本／■で総抵抗体本数が２５６０本
のＡ４判サーマルヘッドを例にとると、工０は５．４１
８ ｗｍピ、チで合計４０個基板上に並列配置されるこ
とになるが、ＩＣとＩＣとの間隙は、１〜２露と広く形
成させることができる。この効果は、発熱抵抗体の解像
度を８本／ｍから１６本／、、程度に高めても同様であ
る。Therefore, if we take an A4 size thermal head with a resolution of 12 lines/■ and a total number of resistors of 2560 as an example, the workpiece 0 is 5.41
Although a total of 40 ICs are arranged in parallel on the substrate in 8-wm squares, the gap between the ICs can be formed as wide as 1 to 2 cm. This effect remains the same even when the resolution of the heating resistor is increased from 8 lines/m to 16 lines/m.
本発明は、従って上記間隙に記録電流接地導電体を設け
、しかも画像信号の並列入力を必要とするＩＣへ、記録
電流接地導電体近傍に設けた導電体にようて画像信号を
並列供給することにある。Therefore, the present invention provides a recording current grounding conductor in the above-mentioned gap, and supplies image signals in parallel to an IC that requires parallel input of image signals through the conductor provided near the recording current grounding conductor. It is in.
本構成の基本的なサーマルヘッドは、例えば特願昭５９
−４２３２２におる。これを第１図によって説明する。The basic thermal head of this configuration is, for example,
-42322. This will be explained with reference to FIG.
発熱抵抗体列の一端は共通電極から短冊形に分岐した導
電体に接続される。抵抗体の他端は各々個別導電体Ｌ１
〜Ｌｍに接続される。従って単一のＩＣが６４本の抵抗
体を駆動する場合にはｍ＝６４となる。個別導電体Ｌｌ
−Ｌ−はＩＣへの接続端子Ｔ１〜Ｔｍまで延長して形成
される。端子ＴＩ ＝ Ｔｍは第１図に示すように、異
なるＩＣ毎に、記録電流接地導電体Ｐｃによって分離配
置される。即ち、隣接した工０の接続端子Ｔ１〜Ｔｍの
中央近傍には、記録電流接地導電体Ｐｃが配置される。One end of the heating resistor array is connected to a conductor branched into a rectangular shape from the common electrode. The other end of each resistor is an individual conductor L1.
~ Connected to Lm. Therefore, when a single IC drives 64 resistors, m=64. Individual conductor Ll
-L- is formed to extend to the connection terminals T1 to Tm to the IC. As shown in FIG. 1, the terminals TI=Tm are arranged separately for each different IC by a recording current grounding conductor Pc. That is, the recording current grounding conductor Pc is arranged near the center of the connection terminals T1 to Tm of the adjacent terminals 0.
導電体Ｐｃは第１図に示すようにＩＩＣ毎に基板の端子
部まで延長して形成させることもできるが、数ＩＣ毎に
基板の端子部まで延長して形成させると、サーマルヘッ
ドを駆動する外部端子数は極端に少なくなる。この場合
には、所望によシ信号線８１〜５ｉｃｔＩＣ間で共通接
続することもできる０
基板上に搭載されたＩＣはワイヤボンディング法、ＴＡ
Ｂ法等によシ基板と接続される。該搭載・接続された複
数個のＩＣにおいて、並列に画像信号を入力すべきＩＣ
には、記録電流接地導電体Ｐａを２つに分割し、その中
央部近傍に新たに設けられた第２の画像信号入力導電体
Ｓ′Ｐよシ画像信号が供給される、即ち画像信号は、接
続端子ＴｒｉからＩＣ内の最初のシフトレジスタに伝達
され、画像信号はＩＣ内のシフトレジスタを順次転送さ
れて、画像信号を出力すべき接続端子ＴＰ２へ出力され
る。The conductor Pc can be formed by extending to the terminal part of the board for each IIC as shown in FIG. 1, but if it is formed by extending to the terminal part of the board every few ICs, the thermal head can be driven. The number of external terminals becomes extremely small. In this case, if desired, the signal lines 81 to 5ictIC can be commonly connected.
It is connected to the board using the B method or the like. An IC to which image signals should be input in parallel among the plurality of installed/connected ICs.
In this case, the recording current grounding conductor Pa is divided into two parts, and the image signal is supplied to the second image signal input conductor S'P newly provided near the center. , the image signal is transmitted from the connection terminal Tri to the first shift register in the IC, and the image signal is sequentially transferred through the shift registers in the IC and output to the connection terminal TP2 to which the image signal is to be output.
接続端子ＴＰ２は、次のＩＣの画像信号を入力すべき接
続端子ＴＰＩに接続される。従って画像信号は複数個の
ＩＣ内のシフトレジスタを玉突き状に押し出されて転送
される。ところが、並列に画像信号が入力されるべき最
初のＩＣの接続端子ＴＰＩは、隣接したＩＣの画像信号
出力端子ＴＰ２とは接続されず、上記記録電流接地導電
体を分割して中央部に配置した第２の画像信号入力導電
体Ｓｐと接続される。The connection terminal TP2 is connected to the connection terminal TPI to which the image signal of the next IC is to be input. Therefore, the image signal is pushed through the shift registers in the plurality of ICs in a ball-shaped manner and transferred. However, the connection terminal TPI of the first IC to which image signals are to be input in parallel is not connected to the image signal output terminal TP2 of the adjacent IC, and the recording current grounding conductor is divided and placed in the center. It is connected to the second image signal input conductor Sp.
このような構成のサーマルヘッドは、ドライバＩＣの接
続端子Ｔｌ’−Ｔ−と、隣接したドライバＩＣの接続端
子Ｔ１〜Ｔｍとの間に記録電流接地導電体ＰＧを配置し
、この導電体の中央部に配した画像信号入力導電体Ｓｐ
によって、所望とするＩＣの画像信号入力端子へ画像信
号を並列供給するものでアシ、而も実質的に導電体層を
一層とする安価で高信頼度のサーマルヘッドを提供する
ものであるＯ
しかし本構成のサーマルヘッドにおいては、画像信号人
力導電体Ｓｐ ／が配置されている両側に記録電流接地
導電体Ｐｃが配置されているために、発熱抵抗体の解像
度が高くな、９ＩＣとＩＣとの間隙が狭くなった場合に
は、導電体のバタン幅が狭くなって大電流を流すべき導
電体の導体抵抗が大きくなる欠点があった。A thermal head with such a configuration has a recording current grounding conductor PG disposed between the connection terminal Tl'-T- of the driver IC and the connection terminals T1 to Tm of the adjacent driver IC, and The image signal input conductor Sp arranged in the
This method supplies image signals in parallel to the image signal input terminals of a desired IC, and provides an inexpensive and highly reliable thermal head that has essentially a single conductive layer. In the thermal head with this configuration, since the recording current grounding conductor Pc is arranged on both sides of the image signal human power conductor Sp/, the resolution of the heating resistor is high, and the 9IC and IC When the gap becomes narrow, the width of the conductor's flap becomes narrower, resulting in a drawback that the conductor resistance of the conductor through which a large current is to flow increases.
本発明の目的は上記欠点を除去し、記録電流接地導電体
幅を広く形成して損失電圧の少ないサーマルヘッドを提
供することにある。SUMMARY OF THE INVENTION An object of the present invention is to eliminate the above-mentioned drawbacks, and to provide a thermal head with a wide recording current grounding conductor width and low voltage loss.
本発明によれば実質的導電体層を一層とする配線基板上
に複数のＩＣを搭載するサーマルヘッドにおいて、発熱
抵抗体に接続ししかもこの抵抗体から延長して形成され
た個別導電体をＩＣへの接′続端子として搭載ＩＣの両
側に配置し、隣接した搭載ＩＣの上記接続端子中央近傍
に記録電流を接地するための導電体を設け、記録電流接
地導電体と上記接続端子との間に第２の画像信号人力導
電体を配し、しかも画像信号が人力されるべきＩＣの記
録電流接地端子を記録電流接地導電体側に配したことを
特徴とするサーマルヘッドが得られる。According to the present invention, in a thermal head in which a plurality of ICs are mounted on a wiring board having substantially a single conductor layer, an individual conductor connected to a heating resistor and extending from the resistor is connected to an IC. A conductor for grounding the recording current is placed near the center of the connection terminal of the adjacent IC, and a conductor is placed on both sides of the mounted IC as a connection terminal to connect the recording current to the connection terminal. There is obtained a thermal head characterized in that a second image signal human input conductor is disposed on the side of the recording current ground conductor, and the recording current grounding terminal of the IC to which the image signal is to be manually input is disposed on the side of the recording current ground conductor.
またこのようなサーマルヘッドにおいて、上記記録電流
接地導電体と第２の画像信号人力導電体との間に第３の
導電体を配することを特徴とするサーマルヘッドをも得
られる。Further, in such a thermal head, a third conductor is disposed between the recording current ground conductor and the second image signal human power conductor.
以下に本発明の一実施例を図面の簡単な説明する。An embodiment of the present invention will be briefly described below with reference to the drawings.
第２図は本発明の一実施例を示した図である。FIG. 2 is a diagram showing an embodiment of the present invention.
本発明は図に示すように、画像信号を供給すべき導電体
Ｓｐ’を記録電流接地導電体ＰｃとＩＣへの接続端子Ｔ
ｌ−Ｔｍ′との間に配置し、しかも画像信号を入力すべ
きＩＣの記録電流接地端子Ｔａ’を画像信号入力導電体
Ｓｐ ／を挟んで、ＩＣへの接続端子Ｔｌ−Ｔｍ’の側
とは反対の側に配置したものである。従って本発明のサ
ーマルヘッドにおいては、ＩＣ上の電極と接地端子Ｔｃ
’との接続はワイヤボンディング法によシ実施される。As shown in the figure, the present invention connects a conductor Sp' to which an image signal is to be supplied to a recording current grounding conductor Pc and a connection terminal T to an IC.
Moreover, the recording current grounding terminal Ta' of the IC to which the image signal is to be input is connected to the side of the connection terminal Tl-Tm' to the IC, with the image signal input conductor Sp / in between. is placed on the opposite side. Therefore, in the thermal head of the present invention, the electrode on the IC and the ground terminal Tc
The connection with ' is carried out by wire bonding method.
本発明を実施したサーマルヘッドにおいては、例えば１
２本／ｗｌのサーマルヘッドを例にとると、記録電流接
地導電体幅を０．６■程度とすることができた。これに
対して、従来のサーマルヘッドにおいては導体幅は画像
信号人力導電体の両側に配置された２つの導電体を合わ
せても０．４ｗ程度にしかできなかったものである０従
って本発明のサーマルヘッドは導体抵抗が小さいために
印字記録電圧の損失電圧変動が小さく、印字ムラの小さ
なサーマルヘッドを提供することができる。In the thermal head implementing the present invention, for example, 1
Taking a thermal head of 2 pieces/wl as an example, the width of the recording current ground conductor could be set to about 0.6 square meters. On the other hand, in the conventional thermal head, the conductor width could only be about 0.4W even if the two conductors placed on both sides of the image signal human-powered conductor were combined. Since the thermal head has a small conductor resistance, the loss voltage fluctuation of the printing recording voltage is small, and a thermal head with small printing unevenness can be provided.
本発明が上記した効果を呈する以上、本発明のサーマル
ヘッドの用途及び発熱抵抗体の解像度。Since the present invention exhibits the above-described effects, the uses of the thermal head and the resolution of the heating resistor of the present invention.
並列人力すべき画像信号入力導電体数、あるいは単一の
工０が駆動できる発熱抵抗体数等は特に限定されるべき
ものではなく、またＴｌ−Ｔｍ’ の間に予め接続端子
Ｔｃを設け、ＴＧとＴｃ’ とをワイヤボンディング法
によって接続すると、ＩＣの搭載・接続方法も制限され
なくなる利点がある。There are no particular limitations on the number of image signal input conductors to be manually operated in parallel or the number of heating resistors that can be driven by a single machine. Connecting TG and Tc' by wire bonding has the advantage that there are no restrictions on the method of mounting and connecting ICs.
サーマルヘッドにおいては、共通電極あるいは記録電流
接地導電体等の導電体部に大電流が流れるために、その
導電体部を部分的に厚く形成し、あるいはメッキ操作等
を施して部分的に厚く形成しても、本発明の趣旨は何ら
損なわれるものではない。また、上記第２の画像信号入
力導電体Ｓｐ’と記録電流接地導電体Ｐａとの間に第３
の導電体を配置し、この第３の導電体を接地電位、ＩＣ
の論理都電源、あるいは接地電位と論理部電源電位との
間を周期的に変動する信号線等に接続して、画像信号入
力電圧に重畳される漏話雑音を小さくすることも勿論で
きる。即ち、上記第３の導電体には画像信号出力端子等
を接続することができる。In thermal heads, large currents flow through conductive parts such as the common electrode or the recording current grounding conductor, so the conductive parts are made partially thicker, or by plating, etc. However, the spirit of the present invention is not impaired in any way. Further, a third conductor is provided between the second image signal input conductor Sp′ and the recording current ground conductor Pa
This third conductor is connected to ground potential, IC
Of course, it is also possible to reduce the crosstalk noise superimposed on the image signal input voltage by connecting the logical power source or a signal line that periodically fluctuates between the ground potential and the logic power source potential. That is, an image signal output terminal or the like can be connected to the third conductor.
しかし、画像信号出力端子は任意の位置から基板端子部
へ配線されることができるのは当然である。However, it is a matter of course that the image signal output terminal can be wired from any position to the board terminal section.
第１図は従来のサーマルヘッドを示す模式平面図、第２
図は本発明のサーマルヘッドの一実施例を示す模式平面
図である。
Ｌ１〜Ｌｍ・・・・・・個別導電体、Ｔ１〜’ｒｍ ｌ
Ｔｍ’・・・・・・ＩＣ接続端子、Ｔｃ、Ｔｃ’・・
・・・・記録電流接地端子、ＴＰｌ・・・・・・画像信
号入力端子、ＴＰ２・・・・・・画像信号出力端子、Ｓ
ｐ、 Ｓｐ’・・・・・・画像信号人力導電体、ＰＧ・
・・・・・記録電流接地導電体、８１〜ＳＫ・・・・・
・信号線。
代理人 弁理士 内 原 ｆｉ／２−ＩＪ−＼Ｅ
（ブ）
゛ぐ一一一一・Figure 1 is a schematic plan view showing a conventional thermal head, Figure 2 is a schematic plan view showing a conventional thermal head.
The figure is a schematic plan view showing an embodiment of the thermal head of the present invention. L1~Lm...Individual conductor, T1~'rm l
Tm'...IC connection terminal, Tc, Tc'...
... Recording current ground terminal, TPl... Image signal input terminal, TP2... Image signal output terminal, S
p, Sp'... Image signal human power conductor, PG.
...Recording current grounding conductor, 81~SK...
·Signal line. Agent Patent Attorney Uchihara fi/2-IJ-\E
(B) ゛gu111・
Claims (1)
Ｃを搭載するサーマルヘッドにおいて、発熱抵抗体に接
続ししかも該抵抗体から延長して形成された個別導電体
をＩＣへの接続端子として搭載ＩＣの両側に配置し、隣
接した搭載ＩＣの前記接続端子中央近傍に記録電流を接
地するための導電体を設け、該記録電流接地導電体と前
記接続端子との間に第２の画像信号入力導電体を配し、
しかも画像信号が入力されるべきＩＣの記録電流接地端
子を前記記録電流接地導電体側に配したことを特徴とす
るサーマルヘッド。 ２、特許請求の範囲第１項記載のサーマルヘッドにおい
て、前記記録電流接地導電体と第２の画像信号入力導電
体との間に第３の導電体を配することを特徴とするサー
マルヘッド。[Claims] 1. A plurality of I on a wiring board having a single substantially conductive layer
In the thermal head equipped with C, individual conductors connected to the heating resistor and extending from the resistor are arranged on both sides of the mounted IC as connection terminals to the IC, and the connection between adjacent mounted ICs is achieved. A conductor for grounding the recording current is provided near the center of the terminal, and a second image signal input conductor is disposed between the recording current grounding conductor and the connection terminal,
Moreover, the thermal head is characterized in that a recording current grounding terminal of an IC to which an image signal is input is arranged on the recording current grounding conductor side. 2. The thermal head according to claim 1, wherein a third conductor is disposed between the recording current ground conductor and the second image signal input conductor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59132369A JPS6111260A (en) | 1984-06-27 | 1984-06-27 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59132369A JPS6111260A (en) | 1984-06-27 | 1984-06-27 | Thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6111260A true JPS6111260A (en) | 1986-01-18 |
| JPH0472702B2 JPH0472702B2 (en) | 1992-11-18 |
Family
ID=15079762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59132369A Granted JPS6111260A (en) | 1984-06-27 | 1984-06-27 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6111260A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0533621U (en) * | 1991-10-03 | 1993-04-30 | 日本オートマチツクマシン株式会社 | Wire stripping device |
-
1984
- 1984-06-27 JP JP59132369A patent/JPS6111260A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0533621U (en) * | 1991-10-03 | 1993-04-30 | 日本オートマチツクマシン株式会社 | Wire stripping device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0472702B2 (en) | 1992-11-18 |
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