JPS63249669A - Optical printing head - Google Patents
Optical printing headInfo
- Publication number
- JPS63249669A JPS63249669A JP62084257A JP8425787A JPS63249669A JP S63249669 A JPS63249669 A JP S63249669A JP 62084257 A JP62084257 A JP 62084257A JP 8425787 A JP8425787 A JP 8425787A JP S63249669 A JPS63249669 A JP S63249669A
- Authority
- JP
- Japan
- Prior art keywords
- led
- driver
- substrate
- led array
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 24
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 abstract description 23
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000000926 separation method Methods 0.000 abstract description 2
- 238000009792 diffusion process Methods 0.000 abstract 2
- 238000000034 method Methods 0.000 description 13
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000003491 array Methods 0.000 description 2
- 210000003128 head Anatomy 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 235000012149 noodles Nutrition 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
- B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は光源としての発光素子アレイ（以下ＬＥＤア
レイ）と、このＬＥＤアレイの発光素子（以下ＬＥＤ）
を駆動するドライバとを接続してなる光プリントヘッド
に関する。[Detailed Description of the Invention] [Industrial Application Field] This invention relates to a light emitting element array (hereinafter referred to as an LED array) as a light source, and a light emitting element in this LED array (hereinafter referred to as an LED).
This invention relates to an optical print head that is connected to a driver that drives the optical print head.
従来、この種の光プリントヘッドとしては、種々のもの
が実施化されているが、例えば、第４図に示すようなも
のがある。Conventionally, various types of optical print heads have been implemented as this type of optical print head, and for example, there is one shown in FIG. 4.
第４図は特開昭６１−２０５１５３号公報に開示された
第１従来例に係る光プリントヘッドのＬＥＤアレイを示
す平面図である。FIG. 4 is a plan view showing an LED array of an optical print head according to the first conventional example disclosed in Japanese Patent Application Laid-Open No. 61-205153.
同図において、１はＬＥＤアレイ、１１〜１ｎはＬＥＤ
、２ｔ 〜２ｎは電極であシ、このＬＥＤアレイ１はＬ
Ｐ Ｄ １１〜１ｎをアレイ状に集積してなシ、集積
密度として１１ｒ１１当夛１０〜１６素子のＬ′ＥＤを
有している。In the same figure, 1 is an LED array, and 11 to 1n are LEDs.
, 2t to 2n are electrodes, and this LED array 1 is L
P D 11 to 1n are integrated in an array, and the integration density is L'ED of 10 to 16 elements per 11r11.
このＬＥＤｌｔ 〜１ｎＫ対して電極２１〜２ｎがｌ：
ｌで構成され、後述するワイヤボンディング接続によっ
てＬＥｏｌ １〜１ｎへの通電が可能にされている。The electrodes 21 to 2n are 1 for this LEDlt to 1nK:
LEol 1 to LEol 1 to 1n can be powered by wire bonding connection, which will be described later.
前記電極２１〜２ｎはワイヤボンディング接続を可能に
するだけの充分なスペースを確保するために千鳥状に配
列されている。The electrodes 21 to 2n are arranged in a staggered manner to ensure sufficient space for wire bonding connection.
このＬＥＤ１１〜１ｎの素子数は実際にはｌチップ当９
６４〜１２８素子でモノリシックに形成し、ＬＥＤアレ
イ１を構成している。The number of elements of these LEDs 11 to 1n is actually 9 per l chip.
The LED array 1 is formed monolithically with 64 to 128 elements.
仁のＩ、ＥＤアレイ１を一枚の基板上に直線上に複数個
配列することによシ光プリントヘッドを構成している。An optical print head is constructed by arranging a plurality of I/ED arrays 1 in a straight line on one substrate.
第５図は前記光プリントヘッドを示す斜視図である。FIG. 5 is a perspective view showing the optical print head.
同図において、１はＬＥＤアレイ、３はこのＬＥＤアレ
イ１を複数個配列した基板、４はこの基板３に設けられ
た導電パターン、５はＬＥＤアレイ１の電極２１〜２ｎ
と基板３上の導電パターン４とをワイヤボンディングで
接続するボンディングワイヤである。In the figure, 1 is an LED array, 3 is a substrate on which a plurality of LED arrays 1 are arranged, 4 is a conductive pattern provided on this substrate 3, and 5 is an electrode 21 to 2n of the LED array 1.
This is a bonding wire that connects the conductive pattern 4 on the substrate 3 by wire bonding.
６はＬＥＤアレイ１に発光データおよび印加電圧を供給
するＦＰＣテープ（またはキャリアテープともいう）、
７はＬＥＤアレイ１を駆動するドライバ、８はドライバ
７のデータ入力端子である。6 is an FPC tape (also called carrier tape) that supplies light emission data and applied voltage to the LED array 1;
7 is a driver that drives the LED array 1, and 8 is a data input terminal of the driver 7.
ここで、基板３上の導電パターン４はＬ Ｅ Ｄｌ １
〜１ｎのピッチとほぼ同ピツチに形成されている。Here, the conductive pattern 4 on the substrate 3 is L E Dl 1
The pitch is approximately the same as that of ~1n.
前記構成の作用としては、まず、基板３にＬＥＤアレイ
１をダイスボンディングにより搭載接着する。As for the operation of the above structure, first, the LED array 1 is mounted and adhered to the substrate 3 by die bonding.
接着したＬＥＤアレイ１は基板３上の導電パターン４に
ボンディングワイヤ５を介して接続する。The bonded LED array 1 is connected to a conductive pattern 4 on a substrate 3 via a bonding wire 5.
一方、ＦＰＣテープ６上にインナリードボンディング等
により接続されたドライバ７の出力線（ＬＥＤアレイ１
方向）は基板３上の導電パターン４にレーザまたは熱圧
接等によって接続する。On the other hand, the output line of the driver 7 (LED array 1
direction) is connected to the conductive pattern 4 on the substrate 3 by laser or thermo-pressure welding.
これにより 、Ｌ Ｅ Ｄ １１〜１ｎとドライバ７の
出力線は１：ｌで対応し、ボンディングワイヤ５を介し
てＬＥＤ１１〜１ｎに通電電流が供給される。As a result, the LEDs 11 to 1n correspond to the output lines of the driver 7 at a ratio of 1:1, and a current is supplied to the LEDs 11 to 1n via the bonding wire 5.
ドライバ７への入力信号および印加電圧はＦＰＣテープ
６の配線８によって供給される。Input signals and applied voltages to the driver 7 are supplied by wiring 8 of the FPC tape 6.
第６図は第２従来例に係る光プリントヘッドを宗す斜視
図である。FIG. 6 is a perspective view of an optical print head according to a second conventional example.
同図において、５はボンディングワイヤ、７はドライバ
、８はこのドライバ７への入力信号の供給手段として基
板３上に設けられた入力信号パターンである。In the figure, 5 is a bonding wire, 7 is a driver, and 8 is an input signal pattern provided on the substrate 3 as means for supplying input signals to the driver 7.
前記構成の製造手順については、まず、基板３にＬＥＤ
アレイ１とドライバ７をダイスボンディング等によシ搭
載接着する。Regarding the manufacturing procedure of the above configuration, first, an LED is installed on the board 3.
The array 1 and the driver 7 are mounted and bonded together by die bonding or the like.
次に、ＬＥＤアレイ１の電極２１〜２ｎとドライバ７の
出力部電極とをボンディングワイヤ５によって１：１で
直接接続する（これをチップツウチップ接続という）。Next, the electrodes 21 to 2n of the LED array 1 and the output electrode of the driver 7 are directly connected in a 1:1 ratio using the bonding wire 5 (this is called chip-to-chip connection).
一方、ドライバ７の入力部電極は基板３上の入力信号パ
ターン８に前記出力部電極と同様にボンディングワイヤ
５を介して直接接続する。On the other hand, the input electrode of the driver 7 is directly connected to the input signal pattern 8 on the substrate 3 via the bonding wire 5 in the same way as the output electrode.
この第２従来例を前記第１従来例と比較すれば、ドライ
バ７とＬＥＤアレイ１間の接続方法の点で異なる。If this second conventional example is compared with the first conventional example, the difference is in the connection method between the driver 7 and the LED array 1.
すなわち、第１従来例の接続方法は第５図に示すように
ドライバ出力線を一旦基板３上のパターン４にボンディ
ングしてからＬＥＤアレイ１と接続する方法である。That is, the connection method of the first conventional example is a method in which the driver output line is once bonded to the pattern 4 on the substrate 3 and then connected to the LED array 1, as shown in FIG.
これに対し、第２従来例の接続方法は第６図に示すよう
にドライバ７とＬＥＤアレイ１間を直接接続する方法で
ある。On the other hand, the connection method of the second conventional example is a method of directly connecting the driver 7 and the LED array 1, as shown in FIG.
また、第１および第２の従来例においては、ＬＥＤアレ
イ１テップに対して２チツプのドライバ７を使用してい
るが、第３従来例の接続方法としてＬＥＤアレイ１の電
極構造を第４図のような千鳥状ではなく、どちらか一方
向のみ（片動取出し方法）に構成した場合は、ここでは
、図示しないが、ＬＥＤアレイ１チップに対して１チツ
プのドライバ７で構成して前記第２従来例の接続方法で
光プリントヘッドを形成することも可能である。In addition, in the first and second conventional examples, two chips of the driver 7 are used for one step of the LED array, but as a connection method of the third conventional example, the electrode structure of the LED array 1 is changed as shown in FIG. If the configuration is not staggered but only in one direction (single-movement extraction method), one chip of the driver 7 is used for one LED array chip (not shown here). 2. It is also possible to form an optical print head using the conventional connection method.
以上、説明したように、光プリントヘッドを形成する上
で、ＬＥＤアレイとドライバ間のボンディング数は極め
て多く、発光部ピッチによってボンディングピッチ精度
も要求されるので、ＬＥＤアレイとドライバ間の接続方
法が極めて重要となる。As explained above, when forming an optical print head, the number of bonds between the LED array and the driver is extremely large, and the bonding pitch accuracy is also required depending on the pitch of the light emitting part, so the connection method between the LED array and the driver is becomes extremely important.
ＬＥＤアレイとドライバ間を直接接続する第２従来例の
接続方法はＬＥＤアレイとドライバを１：工で接続する
ので、相互の位置合わせ精度が要求される。In the second conventional connection method in which the LED array and driver are directly connected, the LED array and driver are connected in a one-to-one manner, so mutual alignment accuracy is required.
また、ＬＥＤアレイとドライバ間に−Ｈパターンを介し
て接続する第１従来例の接続方法では、前記第２従来例
の接続方法の倍のボンディング数と工数を必要とする。Furthermore, the first conventional connection method in which the LED array and the driver are connected via a -H pattern requires twice the number of bonding and man-hours as the second conventional connection method.
さらに、ＬＥＤアレイの電極構造を一方向のみに取出し
て接続する第３従来例の接続方法では、ＬＥＤアレイと
ドライバ相互の位置合わせおよびボンディングピッチの
精度が要求される。Furthermore, in the third conventional connection method in which the electrode structure of the LED array is taken out and connected in only one direction, precision in alignment and bonding pitch between the LED array and the driver is required.
したがって、第１．第２．第３の従来例のいずれの接続
方法においても、接続数が多く、製造が極めて困難であ
るという問題があった。Therefore, the first. Second. All of the connection methods in the third conventional example have a problem in that the number of connections is large and manufacturing is extremely difficult.
そこで、この発明は前記問題点に着目してなされたもの
で、その目的とするところは、接続数を減少させて製造
を容易にするとともに、信頼性を向上させ、コストの低
廉化を図った光プリントヘッドを提供することにある。Therefore, this invention was made by focusing on the above-mentioned problems, and its purpose is to reduce the number of connections to facilitate manufacturing, improve reliability, and reduce costs. The purpose of the present invention is to provide an optical print head.
前記目的に沿うこの発明は、ＬＥＤアレイのＬＥＤとＬ
ＥＤ駆動ドライバとが１＝１で対応するようにシリコン
ＩＣとＬＥＤとをモノリシックに集積化したモノリシッ
ク素子を用いたことを要旨とする。In accordance with the above object, the present invention includes LEDs and L of an LED array.
The gist of this invention is to use a monolithic element in which a silicon IC and an LED are monolithically integrated so that the ED drive driver corresponds to 1=1.
光プリントヘッドの製造手顆については、まず、ＬＥＤ
アレイのＬＥＤ、！＝ＬＥＤ駆動ドライバとがｌ：１で
対応するようにシリコンＩＣとＬＥＤとをモノリシック
に集積化したモノリシック素子を用い、このモノリシッ
ク素子を１枚の基板上に直線状に複数個搭載し、導電性
接着剤で接着する。Regarding the manufacture of optical print heads, first of all, LED
LED array! = A monolithic element is used, in which a silicon IC and an LED are monolithically integrated so that the LED drive driver corresponds to the LED drive driver at a ratio of 1:1. Attach with adhesive.
次いで、基板上の配線パターンの入力信号線とモノリシ
ック素子の電極パッド部とをボンディングワイヤで接続
する。Next, the input signal line of the wiring pattern on the substrate and the electrode pad portion of the monolithic element are connected with a bonding wire.
したがって、前記問題点を除去することができる。Therefore, the above-mentioned problem can be eliminated.
以下、この発明の実施例を図面に基づいて詳細に説明す
る。Hereinafter, embodiments of the present invention will be described in detail based on the drawings.
第２図は実施例に係る光プリントヘッドに用いるモノリ
シック素子を示す断面図である。FIG. 2 is a sectional view showing a monolithic element used in the optical print head according to the embodiment.
同図において、２０はＳｉ基板であフ、このＳｉ基板２
０はＬＥＤ２２を駆動する回路をＩＣ化したシリコンＩ
Ｃ（以下５ｉＩＣという）２１を備えている。In the same figure, 20 is a Si substrate, and this Si substrate 2
0 is silicon I, which is an IC for the circuit that drives the LED 22.
C (hereinafter referred to as 5iIC) 21.
２３は隣接するＬＥＤ２２間の光学的および５ｉＩＣ２
１との電気的分離を行う素子分離層であり、この素子分
離層２３は例えばＬＥＤ２２の周囲の基板２０上に設け
られている。23 is the optical and 5i IC2 between adjacent LEDs 22
This element isolation layer 23 is provided on the substrate 20 around the LED 22, for example.
２４はＬＥＤ２２と５ｉＩＣ２１とを接続する配線部で
あシ、２５は電極パッド部である。24 is a wiring section connecting the LED 22 and the 5i IC 21, and 25 is an electrode pad section.
２６はＬＥＤ２２および５ｉＩＣ２１とＳｉ基板２０と
の間に設けられた拡散抵抗でちゃ、との拡散抵抗２６は
ＬＥＤ２２とオーミックコンタクトを形成するとともに
Ｓｉ基板２０との絶縁分離を行い、ＬＥＤ２２と５ｉＩ
Ｃ２１との間に抵抗を形成できるようにしたものである
。26 is a diffused resistor provided between the LED 22 and the 5i IC 21 and the Si substrate 20. The diffused resistor 26 forms an ohmic contact with the LED 22 and also provides insulation separation from the Si substrate 20.
This allows a resistance to be formed between C21 and C21.
２７は５ｉＩ０２１等に設けた絶縁層である。27 is an insulating layer provided on 5iI021 or the like.
このようにＬＥＤ素子２２とドライバ素子２１が一対と
なし、例えば６４〜１２８素子が１チツプ上にモノリシ
ックに構成されている。In this way, the LED element 22 and the driver element 21 form a pair, and for example, 64 to 128 elements are monolithically constructed on one chip.
第３図は前記モノリシック素子の等価回路を示す図であ
る。FIG. 3 is a diagram showing an equivalent circuit of the monolithic element.
便宜上第３図を基に説明すれば、いま、５ｉＩＣ２１は
ＬＥＤ２２を発光もしくは先光させる論理回路（レジス
タ）とドライバ（トランジスタ）部を有する。For convenience, the explanation will be based on FIG. 3. The 5i IC 21 has a logic circuit (register) and a driver (transistor) section that cause the LED 22 to emit light or emit light first.
ＩＪｉｌ：Ｄ２２を発光させるには、ドライバ２１を「
ＯＮ」状態として定電圧ＶＤＤを印加する０このとき、
ＬＥＤ２２に流れる電流は拡散抵抗（電流制限抵抗）２
６を介して供給される。IJil: To make D22 emit light, set driver 21 to
At this time, apply constant voltage VDD as “ON” state.
The current flowing through the LED 22 is diffused resistor (current limiting resistor) 2
6.
第１図は前記モノリシック素子を用いた光プリントヘッ
ドを示す斜視図である。FIG. 1 is a perspective view showing an optical print head using the monolithic element.
第１図において、３は１枝の基板であり、この１枚の基
板３上にモノリシック素子３０が直線状に複数個配列さ
れている。In FIG. 1, reference numeral 3 denotes one branch of a substrate, on which a plurality of monolithic elements 30 are linearly arranged.
これらモノリシック素子３０の電極パッド部と基板３上
の配線パターン８とがボンディングワイヤ５で接続され
前記配線パターン８と通電するインタフェース用の入力
コネクタ３２にコネクタ結合によ）論理回路および定電
圧が供給されるようになっている。The electrode pad portions of these monolithic elements 30 and the wiring pattern 8 on the substrate 3 are connected by bonding wires 5, and a logic circuit and a constant voltage are supplied by connector coupling to an input connector 32 for an interface that conducts electricity with the wiring pattern 8. It is now possible to do so.
２２はＬＥＤ発光部、３１は導電性接着剤である。22 is an LED light emitting part, and 31 is a conductive adhesive.
次に、前記構成のＬＥＤプリントヘッドの製造手順を説
明する。Next, the manufacturing procedure of the LED print head having the above structure will be explained.
まず、１枚の基板３上にモノリシック素子３０を直線状
に複数個搭載し、導電性接着剤３１で接着する。First, a plurality of monolithic elements 30 are linearly mounted on one substrate 3 and bonded with a conductive adhesive 31.
次いで、基板３上の配線パターン８０入力信号線とモノ
リシック素子３０の電極パッド部とをボンディングワイ
ヤ５で接続する。Next, the input signal line of the wiring pattern 80 on the substrate 3 and the electrode pad portion of the monolithic element 30 are connected with the bonding wire 5.
接続本数はモノリシック素子３０当９６〜７本程度とす
る。The number of connections is approximately 96 to 7 per 30 monolithic elements.
これにより、電極パッド部間のスペースも十分に広くと
れる。Thereby, the space between the electrode pad portions can also be sufficiently widened.
また、ＬＥＤ発光部２２の駆動を行なう場合、入力コネ
クタ３２に発光データ信号やクロック信号等の論理回路
信号および定電圧を供給することによ、！りＬＥＤ発光
部発光全２２する。Furthermore, when driving the LED light emitting section 22, by supplying logic circuit signals such as a light emission data signal and a clock signal and a constant voltage to the input connector 32! The LED light emitting section emits all 22 lights.
以上の説明から明らかなように、この発明によれば、Ｌ
ＥＤアレイのＬＥＤとドライバとが１：ｌで対応するよ
うにシリコンＩＣとＬＥＤとをモノリシックに集積化し
たモノリシック素子を用いた構成としたので、以下に示
すような効果が得られる。As is clear from the above description, according to the present invention, L
Since the configuration uses a monolithic element in which silicon ICs and LEDs are monolithically integrated so that the LEDs and drivers of the ED array correspond in a 1:1 ratio, the following effects can be obtained.
（１）モノリシック素子を用いた構造により、高信頼性
を有する素子が得られる。(1) A structure using a monolithic element provides a highly reliable element.
（２）モノリシック素子構造のため、極めて簡単な直線
状の配列構造とすることができる。(2) Because of the monolithic element structure, an extremely simple linear arrangement structure can be achieved.
（３）ボンディングワイヤがモノリシック素子の入力部
のみで済むので、接続数を大幅に低減でき、信頼性を向
上させることができる。(3) Since the bonding wire is only required at the input section of the monolithic element, the number of connections can be significantly reduced and reliability can be improved.
（４）ヘッドの高精細化および小型化を図ることができ
るとともに、製造コストの低廉化をも図ることができる
。(4) High definition and miniaturization of the head can be achieved, and manufacturing costs can also be reduced.
（５）不良素子が発生した場合でも、極めて簡単に交換
することができる。(5) Even if a defective element occurs, it can be replaced extremely easily.
第１図は実施例に係る光プリントヘッドを示す斜視図、
第２図は光プリントヘッドのモノリシック素子を示す断
面図、第３図はモノリシック素子の等価回路図、第４図
は第１従来例の光グリントヘッドのＬＥＤアレイを示す
平面図、第５図は第１従来例の光プリントヘッドを示す
斜視図、第６図は第２従来例の光プリントヘッドを示す
斜視図である。
３・・・基板 ５・・・ボンディングワイヤ ８・・・
配線パターン ２０・・・Ｓｔ基板 ２１・・・５ｉＩ
Ｃ２２・・・ＬＥＤ ２３・・・素子分離層 ２４・
・・配線部２５・・・電極パッド部 ２６・・・拡散抵
抗 ２７・・・絶縁層３０・・・モノリシック素子 ３
１・・・導電性接着剤３２・・・入力コネクタ
特許出願人 沖電気工業株式会社
代 理 人弁理士金倉喬二
３１：再ｅ性専看削
３２：入力コネクタ
喫ジ但イダ月；係るし印ブリ〕トヘ＝Ｊ’Ｅ示Ｔ４斗羽
巳図閤 １ 図
モノリシ、り素÷の崖Ｗ面図 ２７：
絶特眉＠ ２ 口
算仙回路図
閣 ３ 図
男１省〔床弼列（２Ｌ印プリ；トへ１．７トめＬＥＤア
［４μ乎面図＠４（２１
争し１省〔オイ列ｔＡＬＥＤ）゛りントへ、７ドめａ視
図麺 ５［ｉｉ］
＠６［ｉFIG. 1 is a perspective view showing an optical print head according to an embodiment;
FIG. 2 is a cross-sectional view showing a monolithic element of an optical print head, FIG. 3 is an equivalent circuit diagram of the monolithic element, FIG. 4 is a plan view showing an LED array of the first conventional optical glint head, and FIG. FIG. 6 is a perspective view showing a first conventional optical print head, and FIG. 6 is a perspective view showing a second conventional optical print head. 3... Board 5... Bonding wire 8...
Wiring pattern 20...St board 21...5iI
C22...LED 23...Element isolation layer 24.
...Wiring part 25...Electrode pad part 26...Diffused resistance 27...Insulating layer 30...Monolithic element 3
1... Conductive adhesive 32... Input connector patent applicant Representative of Oki Electric Industry Co., Ltd. Patent attorney Takashi Kanakura 31: Re-examination 32: Input connector scraping; Inburi] Tohe = J'E Show T4 Touhami Zukan 1 Figure Monolithi, Cliff W view of Riso ÷ 27:
Zekku special eyebrows @ 2 Kuansen circuit diagram 3 Figure man 1 ministry [floor line (2L mark pre; ) To the print, 7th a view noodle 5[ii] @6[i
Claims (1)
を駆動するドライバとを接続してなる光プリントヘッド
において、 前記発光素子アレイの発光素子とドライバとが１：１で
対応するようにシリコンＩＣと発光素子とをモノリシッ
クに集積化したモノリシック素子を用いたことを特徴と
する光プリントヘッド。[Claims] 1. In an optical print head formed by connecting a light emitting element array and a driver for driving the light emitting elements of the light emitting element array, the light emitting elements of the light emitting element array and the driver are arranged in a ratio of 1:1. An optical print head characterized by using a monolithic element in which a silicon IC and a light emitting element are monolithically integrated in a corresponding manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8425787A JPH0694216B2 (en) | 1987-04-06 | 1987-04-06 | Optical print head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8425787A JPH0694216B2 (en) | 1987-04-06 | 1987-04-06 | Optical print head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63249669A true JPS63249669A (en) | 1988-10-17 |
| JPH0694216B2 JPH0694216B2 (en) | 1994-11-24 |
Family
ID=13825399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8425787A Expired - Lifetime JPH0694216B2 (en) | 1987-04-06 | 1987-04-06 | Optical print head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0694216B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1418624A2 (en) | 2002-11-11 | 2004-05-12 | Oki Data Corporation | Light emitting diode array and print head |
| EP1420456A2 (en) | 2002-11-13 | 2004-05-19 | Oki Data Corporation | Monolithic semiconductor component and optical print head |
| EP1434271A2 (en) * | 2002-12-24 | 2004-06-30 | Oki Data Corporation | Integrated semiconductor device comprising semiconductor thin films and optical print head |
| EP1526574A2 (en) * | 2003-10-22 | 2005-04-27 | Oki Data Corporation | Semiconductor device, light emitting diode print head and image-forming apparatus using same, and method of manufacturing semiconductor device |
| JP2009290232A (en) * | 2009-09-03 | 2009-12-10 | Oki Data Corp | Method for manufacturing semiconductor composite device |
-
1987
- 1987-04-06 JP JP8425787A patent/JPH0694216B2/en not_active Expired - Lifetime
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8395159B2 (en) | 2002-11-11 | 2013-03-12 | Oki Data Corporation | Semiconductor apparatus with thin semiconductor film |
| EP1418624A2 (en) | 2002-11-11 | 2004-05-12 | Oki Data Corporation | Light emitting diode array and print head |
| US8816384B2 (en) | 2002-11-11 | 2014-08-26 | Oki Data Corporation | Semiconductor apparatus with thin semiconductor film |
| EP1418624A3 (en) * | 2002-11-11 | 2011-03-09 | Oki Data Corporation | Light emitting diode array and print head |
| US8445935B2 (en) | 2002-11-11 | 2013-05-21 | Oki Data Corporation | Semiconductor apparatus with thin semiconductor film |
| EP1420456A2 (en) | 2002-11-13 | 2004-05-19 | Oki Data Corporation | Monolithic semiconductor component and optical print head |
| EP1420456A3 (en) * | 2002-11-13 | 2011-03-09 | Oki Data Corporation | Monolithic semiconductor component and optical print head |
| EP1434271A2 (en) * | 2002-12-24 | 2004-06-30 | Oki Data Corporation | Integrated semiconductor device comprising semiconductor thin films and optical print head |
| EP1434271A3 (en) * | 2002-12-24 | 2011-01-12 | Oki Data Corporation | Integrated semiconductor device comprising semiconductor thin films and optical print head |
| US8664668B2 (en) | 2002-12-24 | 2014-03-04 | Oki Data Corporation | Combined semiconductor apparatus with semiconductor thin film |
| EP1526574A2 (en) * | 2003-10-22 | 2005-04-27 | Oki Data Corporation | Semiconductor device, light emitting diode print head and image-forming apparatus using same, and method of manufacturing semiconductor device |
| US8343848B2 (en) | 2003-10-22 | 2013-01-01 | Oki Data Corporation | Semiconductor device, LED print head and image-forming apparatus using same, and method of manufacturing semiconductor device |
| EP1526574A3 (en) * | 2003-10-22 | 2011-04-27 | Oki Data Corporation | Semiconductor device, light emitting diode print head and image-forming apparatus using same, and method of manufacturing semiconductor device |
| JP2009290232A (en) * | 2009-09-03 | 2009-12-10 | Oki Data Corp | Method for manufacturing semiconductor composite device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0694216B2 (en) | 1994-11-24 |
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