JPS61106054U - - Google Patents

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、本考案に係る光半導体モジユールの
構造の一実施例を説明するためのａは正面図、ｂ
は要部側断面図、ｃは放熱金具の斜視図、第２図
は、従来の光半導体モジユールの構造を説明する
ためのａは正面図、ｂは要部側断面図である。 図中、１はハウジング、２は光半導体素子、３
，４はブツシユ、５は放熱金具、１１はフランジ
、１２はブツシユ嵌入孔、１３は光半導体素子挿
入孔、１４は切り欠き部、をそれぞれ示す。 FIG. 1 is a front view of a, and b is a front view for explaining an embodiment of the structure of an optical semiconductor module according to the present invention.
2 is a side sectional view of the main part, c is a perspective view of a heat dissipation fitting, and FIG. 2 is a front view and b is a side sectional view of the main part for explaining the structure of a conventional optical semiconductor module. In the figure, 1 is a housing, 2 is an optical semiconductor element, and 3
, 4 is a bush, 5 is a heat dissipation fitting, 11 is a flange, 12 is a bush fitting hole, 13 is an optical semiconductor element insertion hole, and 14 is a notch, respectively.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ハウジングに光半導体素子を挿入し、該光半導
体素子を押さえるブツシユを嵌入する構成の光半
導体モジユールの構造において、前記ハウジング
の光半導体素子挿入側の対向する端面を削り取つ
て切り欠きを形成し、前記ハウジングに嵌入した
ブツシユの端面と、ハウジングの端面を平面にな
るようにして、該ブツシユとハウジングとの間に
集光部材を塗布して、その部分をレーザ溶接し、
前記モジユール側面の光半導体素子空洞部に放熱
用金具を取付けたことを特徴とする光半導体モジ
ユールの構造。 In the structure of an optical semiconductor module in which an optical semiconductor element is inserted into a housing and a bush for holding the optical semiconductor element is fitted, a notch is formed by cutting off the opposite end surface of the housing on the side where the optical semiconductor element is inserted, The end face of the bushing fitted into the housing and the end face of the housing are made to be flat, a condensing member is applied between the bushing and the housing, and the part is laser welded,
A structure of an optical semiconductor module, characterized in that a heat dissipation fitting is attached to an optical semiconductor element cavity on a side surface of the module.