JPH01127275U - - Google Patents
Info
- Publication number
- JPH01127275U JPH01127275U JP1988023339U JP2333988U JPH01127275U JP H01127275 U JPH01127275 U JP H01127275U JP 1988023339 U JP1988023339 U JP 1988023339U JP 2333988 U JP2333988 U JP 2333988U JP H01127275 U JPH01127275 U JP H01127275U
- Authority
- JP
- Japan
- Prior art keywords
- submount
- laser device
- groove
- semiconductor laser
- juncture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
- H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
- H01L2224/26175—Flow barriers
Description
第１図ａ，ｂはこの考案の一実施例による光半
導体素子用サブマウントの上面図および正面図、
第２図はこの考案の一実施例による半導体レーザ
装置の断面図、第３図は従来の半導体レーザ装置
の断面図である。
図において、１はサブマウント、２は半田、３
は溝を示す。なお、図中、同一符号は同一、又は
相当部分を示す。
FIGS. 1a and 1b are a top view and a front view of a submount for an optical semiconductor device according to an embodiment of this invention,
FIG. 2 is a sectional view of a semiconductor laser device according to an embodiment of this invention, and FIG. 3 is a sectional view of a conventional semiconductor laser device. In the figure, 1 is a submount, 2 is a solder, and 3 is a submount.
indicates a groove. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
ンの組立技術でサブマウントに半田メタルをパタ
ーンニングする場合に、パターンの周囲のサブマ
ウント表面に溝をつけることを特徴とする光半導
体素子用サブマウント。 A submount for an optical semiconductor element, characterized in that when patterning solder metal on the submount using a juncture-down assembly technique for a semiconductor laser device, a groove is formed on the submount surface around the pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988023339U JPH01127275U (en) | 1988-02-24 | 1988-02-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988023339U JPH01127275U (en) | 1988-02-24 | 1988-02-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01127275U true JPH01127275U (en) | 1989-08-31 |
Family
ID=31242239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988023339U Pending JPH01127275U (en) | 1988-02-24 | 1988-02-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01127275U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001298237A (en) * | 2000-04-14 | 2001-10-26 | Nippon Telegr & Teleph Corp <Ntt> | Semiconductor optical element mounting carrier, semiconductor optical element module and its manufacturing method |
| WO2004077630A1 (en) * | 2002-12-26 | 2004-09-10 | Sony Corporation | Semiconductor laser assembly |
| JP2005136332A (en) * | 2003-10-31 | 2005-05-26 | Toyota Motor Corp | Semiconductor device |
| CN100449889C (en) * | 2002-12-26 | 2009-01-07 | 索尼株式会社 | Semiconductor laser assembly |
-
1988
- 1988-02-24 JP JP1988023339U patent/JPH01127275U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001298237A (en) * | 2000-04-14 | 2001-10-26 | Nippon Telegr & Teleph Corp <Ntt> | Semiconductor optical element mounting carrier, semiconductor optical element module and its manufacturing method |
| WO2004077630A1 (en) * | 2002-12-26 | 2004-09-10 | Sony Corporation | Semiconductor laser assembly |
| CN100449889C (en) * | 2002-12-26 | 2009-01-07 | 索尼株式会社 | Semiconductor laser assembly |
| JP2005136332A (en) * | 2003-10-31 | 2005-05-26 | Toyota Motor Corp | Semiconductor device |