JPS6092829U - マイクロ波トランジスタの取付構造体 - Google Patents

マイクロ波トランジスタの取付構造体

Info

Publication number
JPS6092829U
JPS6092829U JP1983183774U JP18377483U JPS6092829U JP S6092829 U JPS6092829 U JP S6092829U JP 1983183774 U JP1983183774 U JP 1983183774U JP 18377483 U JP18377483 U JP 18377483U JP S6092829 U JPS6092829 U JP S6092829U
Authority
JP
Japan
Prior art keywords
microwave transistor
mounting structure
chassis
transistor mounting
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983183774U
Other languages
English (en)
Other versions
JPH0423328Y2 (ja
Inventor
木幡　正勝
檜山　寅雄
Original Assignee
アルプス電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アルプス電気株式会社 filed Critical アルプス電気株式会社
Priority to JP1983183774U priority Critical patent/JPS6092829U/ja
Priority to US06/674,591 priority patent/US4612566A/en
Publication of JPS6092829U publication Critical patent/JPS6092829U/ja
Application granted granted Critical
Publication of JPH0423328Y2 publication Critical patent/JPH0423328Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Junction Field-Effect Transistors (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来のマイクロ波トランジスタの取付構造体を
示す斜視図、第２図は同要部断面図、第３図、第４図は
本考案の一実施例に係り、第３図は取付構造体を示す斜
視図、第４図は同要部断面図を示す。 １・・・・・・マイクロ波トランジスタ、１ａ、１ｂ。 ｌｂ’、　　Ｉ　Ｃ，１ｄ、　ｌｄ′・・・・・・端子
、２．５−−−−−一基板、５ａ・・・・・・孔、４・
・・・・・半田、６・・・・・・シャーシ、６ａ・・・
・・・凸部。

Claims (1)

    【実用新案登録請求の範囲】
  1. 凸部が形成されたシャーシと、孔が形成された基板と、
    マイクロ波トランジスタとから成り、前記シャーシの凸
    部に前記基板の孔が係合配置されるとともに、前記マイ
    クロ波トランジスタの接地端子をシャーシの凸部上に載
    置し、かね、マイクロ波トランジスタの端子を基板上に
    載置したことを特徴とするマイクロ波トランジスタの取
    付構造体。
JP1983183774U 1983-11-30 1983-11-30 マイクロ波トランジスタの取付構造体 Granted JPS6092829U (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1983183774U JPS6092829U (ja) 1983-11-30 1983-11-30 マイクロ波トランジスタの取付構造体
US06/674,591 US4612566A (en) 1983-11-30 1984-11-26 Microwave transistor mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983183774U JPS6092829U (ja) 1983-11-30 1983-11-30 マイクロ波トランジスタの取付構造体

Publications (2)

Publication Number Publication Date
JPS6092829U true JPS6092829U (ja) 1985-06-25
JPH0423328Y2 JPH0423328Y2 (ja) 1992-05-29

Family

ID=16141712

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983183774U Granted JPS6092829U (ja) 1983-11-30 1983-11-30 マイクロ波トランジスタの取付構造体

Country Status (2)

Country Link
US (1) US4612566A (ja)
JP (1) JPS6092829U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001185655A (ja) * 1999-12-27 2001-07-06 Mitsubishi Electric Corp マイクロ波回路

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4713730A (en) * 1985-10-07 1987-12-15 Rockwell International Corporation Microwave plug-in signal amplifying module solderment apparatus
US5182631A (en) * 1988-04-15 1993-01-26 Nippon Telegraph And Telephone Corporation Film carrier for RF IC
US4967258A (en) * 1989-03-02 1990-10-30 Ball Corporation Structure for use in self-biasing and source bypassing a packaged, field-effect transistor and method for making same
DE69010546T2 (de) * 1989-04-17 1995-02-09 Matsushita Electric Ind Co Ltd Hochfrequenz-Halbleiteranordnung.
US5297007A (en) * 1990-09-19 1994-03-22 Rockwell International Corporation E/M shielded RF circuit board
US7355854B2 (en) * 2006-06-07 2008-04-08 Harris Corporation Apparatus for improved grounding of flange mount field effect transistors to printed wiring boards
JP4982596B2 (ja) * 2009-09-08 2012-07-25 株式会社東芝 モジュールの接続構造

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS482058U (ja) * 1971-05-27 1973-01-11

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3021461A (en) * 1958-09-10 1962-02-13 Gen Electric Semiconductor device
US2985806A (en) * 1958-12-24 1961-05-23 Philco Corp Semiconductor fabrication
US3641398A (en) * 1970-09-23 1972-02-08 Rca Corp High-frequency semiconductor device
NL159818B (nl) * 1972-04-06 1979-03-15 Philips Nv Halfgeleiderinrichting, bevattende een flexibele isolerende folie, die aan een zijde is voorzien van metalen geleider- sporen.
JPS5811746B2 (ja) * 1976-10-27 1983-03-04 日本電気株式会社 超高周波トランジスタ増幅器
JPS5386576A (en) * 1977-01-10 1978-07-31 Nec Corp Package for semiconductor element
JPS55159571A (en) * 1979-05-24 1980-12-11 Yuasa Battery Co Ltd Lead-acid battery
JPS57115852A (en) * 1981-01-10 1982-07-19 Mitsubishi Electric Corp Microwave transistor mount
US4396140A (en) * 1981-01-27 1983-08-02 Bell Telephone Laboratories, Incorporated Method of bonding electronic components
US4455537A (en) * 1981-07-06 1984-06-19 Rca Corporation Microwave circuit interconnect system
US4538124A (en) * 1984-02-10 1985-08-27 Rca Corporation Planar microwave circuit component mounting system

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS482058U (ja) * 1971-05-27 1973-01-11

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001185655A (ja) * 1999-12-27 2001-07-06 Mitsubishi Electric Corp マイクロ波回路

Also Published As

Publication number Publication date
US4612566A (en) 1986-09-16
JPH0423328Y2 (ja) 1992-05-29

Similar Documents

Publication Publication Date Title
JPS6092829U (ja) マイクロ波トランジスタの取付構造体
JPS59115657U (ja) マイクロ波トランジスタの取付構造体
JPS5814682U (ja) 端子
JPS60106375U (ja) 外部リ−ド端子の取付構造
JPS5846472U (ja) プリント配線基板
JPS59131166U (ja) ア−スプレ−ト付混成集積回路
JPS60193673U (ja) 電子機器のア−ス接続装置
JPS6039297U (ja) 電磁シ−ルド板の取付構造
JPS617094U (ja) プリント基板の保持具
JPS5972706U (ja) チツプ部品と基板の位置決め構造
JPS59123973U (ja) 端子台
JPS6059587U (ja) ソケツト取付け装置
JPS58127632U (ja) コンデンサ
JPS6030557U (ja) 発光素子の取付装置
JPS5895092U (ja) ボス
JPS58166046U (ja) ヒ−トシンク取付機構
JPS5850709U (ja) アンテナ装置
JPS596808U (ja) コイル装置
JPS59132932U (ja) クツシヨン部材取付構造
JPS5869983U (ja) 回路基板のパタ−ン構造
JPS59127238U (ja) 丸型貫通コンデンサの取付構造
JPS6052690U (ja) 基板取付装置
JPS5952662U (ja) 印刷配線基板
JPS59114637U (ja) 回路装置の端子構造
JPS6016550U (ja) 電子部品の放熱板への取付け構造