JPS6065760A - Manufacture of highly electroconductive tin oxide film material - Google Patents

Manufacture of highly electroconductive tin oxide film material

Info

Publication number
JPS6065760A
JPS6065760A JP58173238A JP17323883A JPS6065760A JP S6065760 A JPS6065760 A JP S6065760A JP 58173238 A JP58173238 A JP 58173238A JP 17323883 A JP17323883 A JP 17323883A JP S6065760 A JPS6065760 A JP S6065760A
Authority
JP
Japan
Prior art keywords
tin oxide
oxide
film material
manufacture
oxide film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58173238A
Other languages
Japanese (ja)
Inventor
川上 登
智子 本田
森 忠芸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tosoh Corp
Original Assignee
Toyo Soda Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Soda Manufacturing Co Ltd filed Critical Toyo Soda Manufacturing Co Ltd
Priority to JP58173238A priority Critical patent/JPS6065760A/en
Publication of JPS6065760A publication Critical patent/JPS6065760A/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明は高電気伝導性酸化錫薄膜材料(ターゲット)の
製造方法に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for producing a highly electrically conductive tin oxide thin film material (target).

近年、電子工業の発展に伴い、光ディスク、磁気ヘッド
などの素子の製造に金属等の薄膜が多く用いられている
In recent years, with the development of the electronic industry, thin films of metals and the like have been increasingly used in manufacturing elements such as optical disks and magnetic heads.

この薄膜の製造方法には、真空蒸着法、スパッタリング
法、イオンブレーティング法、化学蒸着法などがある。
Methods for producing this thin film include vacuum evaporation, sputtering, ion blasting, and chemical vapor deposition.

真空蒸着法の蒸発源には、主にアルミニウム、銅。The evaporation sources for vacuum evaporation methods are mainly aluminum and copper.

銀、金、クロム、モリブデン、ケイ素などの金属が、イ
オンブレーティング法ではこの他に窒化チタン、窒化ク
ロム、炭化チタンなどが、化学蒸着法では、四塩化チタ
ン、四塩化ケイ素などの化学物質が、又、スパッタリン
グ法では金属の他にモリブデンシリサイド、タングステ
ンシリサイド。
Metals such as silver, gold, chromium, molybdenum, and silicon are produced using the ion-blating method, while titanium nitride, chromium nitride, and titanium carbide are produced using the ion-blating method, and chemical substances such as titanium tetrachloride and silicon tetrachloride are produced using the chemical vapor deposition method. In addition to metals, the sputtering method also uses molybdenum silicide and tungsten silicide.

アルミナ、シリカなどがその用途に照らして用いられて
いる。
Alumina, silica, etc. are used depending on their purpose.

(空蒸着法の蒸発源は、塊などで用いるが、その形状は
それ程問わない。しかし、イオンプレーティ/グ、スパ
ッタリング法の場合には、蒸発源そのものに通電するの
で角状あるいは丸状など通電り、易い形状に加工する必
要がある。このような形状とするには金属の場合には、
金属を溶解し、これを所望の型に流し込む方法がとられ
ている。金属以外の酸化物や炭化物の場合には通常セラ
ミッをボールミルで十分粉砕混合し、有機物等のバイン
ダーを加えて成形後、所定の温度で焼成してそれぞれの
焼結体として得る。(これらイオンブレーティング、ス
パッタリング法でのこのような蒸発源をターゲットと通
称されている。) 本発明の電気伝導性酸化錫ターゲットは液晶。
(The evaporation source in the dry evaporation method is used in the form of a block, but its shape does not matter so much. However, in the case of ion plating and sputtering methods, the evaporation source itself is energized, so it may have a square or round shape. It is necessary to process it into a shape that is easy to conduct electricity.In order to make such a shape, in the case of metal,
The method used is to melt the metal and pour it into the desired mold. In the case of oxides and carbides other than metals, ceramics are usually thoroughly ground and mixed in a ball mill, a binder such as an organic substance is added, molded, and then fired at a predetermined temperature to obtain the respective sintered bodies. (Such evaporation sources in these ion blating and sputtering methods are commonly called targets.) The electrically conductive tin oxide target of the present invention is a liquid crystal.

ビデオ、テレビの撮像管、太陽電池などの受動素子の薄
膜透明電極の蒸発源(ターゲット)として着目され使用
されている。従来、例えば酸化アンチモンをドープした
電気伝導性酸化錫ターゲットは所定量の酸化アンチモン
と酸化錫粉末をボールミルで十分粉砕、混合しバインダ
ーを加えて、静水圧プレスにより成形、大気中1300
℃〜1450℃で焼結し焼結体としている。このように
して得られた酸化錫ターゲットの比抵抗値はボールミル
中に混入する不純物や焼成中の結晶粒の成長のためにた
かだか数Ω・−副程度にしか到らない。又、この場合は
、酸化アンチモンと酸化錫とは、固相拡散反応であるの
で、均質な固溶体とするのは困難で、又焼結の際、焼結
助剤として酸化銅、酸化マンガンを用いるので、必然的
に不純分の多い製品となる。
It is attracting attention and being used as an evaporation source (target) for thin film transparent electrodes in passive devices such as video and television image pickup tubes and solar cells. Conventionally, for example, an electrically conductive tin oxide target doped with antimony oxide has been prepared by thoroughly crushing and mixing a predetermined amount of antimony oxide and tin oxide powder in a ball mill, adding a binder, molding with a hydrostatic press, and molding in the atmosphere at 1300 °C.
It is sintered at a temperature of 1450°C to 1450°C to form a sintered body. The resistivity value of the tin oxide target obtained in this manner reaches only a few ohms-sub level at most due to impurities mixed into the ball mill and growth of crystal grains during firing. In this case, antimony oxide and tin oxide undergo a solid phase diffusion reaction, so it is difficult to form a homogeneous solid solution, and copper oxide and manganese oxide are used as sintering aids during sintering. Therefore, the product inevitably contains many impurities.

本発明者らは、比抵抗値の低い酸化錫ターゲットの製造
法について鋭意研究した結果、本発明をするに到った。
The present inventors conducted intensive research on a method for producing a tin oxide target with a low specific resistance value, and as a result, they arrived at the present invention.

ターゲットの比抵抗値を下げることは、受動素子の薄膜
透明電極の電気伝導性を良くし、基板の温度上昇を防ぐ
と共に、応答速度を向上させるばかり、でなく、作動中
のターゲット表面温度の上昇をも防ぐこととなシ極めて
重要な意味をもつ。
Lowering the specific resistance value of the target not only improves the electrical conductivity of the thin film transparent electrode of the passive element, prevents the temperature rise of the substrate, and improves the response speed, but also reduces the rise in target surface temperature during operation. It is also extremely important to prevent this.

本発明によれば、アンチモン、インジウム、ガリウム、
ビスマスの酸化物の少なくとも1種を固溶した粒径1ミ
′クロン以下の酸化物微粒体を用い、静水圧プレスある
いは大気中または不活性雰囲気下で焼結させることによ
シ比抵抗値1o−”a anオーダーの良電気伝導性酸
化錫ターゲットをうろことができる。
According to the invention, antimony, indium, gallium,
By using fine oxide particles with a particle size of 1 micron or less containing at least one bismuth oxide as a solid solution, the specific resistance value is 1o by isostatic pressing or sintering in the air or an inert atmosphere. - A tin oxide target with good electrical conductivity on the order of "a an" can be passed through.

本発明を更に詳述する。The present invention will now be described in further detail.

本発明は、1μ以下の粒径を持つ微細な酸化錫を用いる
ことが特徴であるが、この様な酸化錫を得るには、例え
ば錫塩と酸化錫に固溶させる金属塩の水溶液からpH調
節などの手段で得た沈澱を乾燥し300〜1200℃程
度の温度で加熱することによシ得られる。このようにし
て得られた微粒体の成形性は極めて良好で、軽い解砕後
簡単な機械プレスと静水圧プレスを加えることによシ、
十分、スパッタリングあるいはイオンブレーティング用
のターゲットに供しつるターゲットを得る。
The present invention is characterized by the use of fine tin oxide having a particle size of 1μ or less, but in order to obtain such tin oxide, for example, from an aqueous solution of tin salt and a metal salt dissolved in tin oxide, pH It can be obtained by drying a precipitate obtained by conditioning or other means and heating it at a temperature of about 300 to 1200°C. The moldability of the fine particles obtained in this way is extremely good, and by adding simple mechanical pressing and hydrostatic pressing after light crushing,
A target suitable for sputtering or ion blasting is obtained.

さらに機械的強度を要する場合には、このようにして調
製した成形体を大気中500〜1000℃で焼成すれば
良い。焼成雰囲気は、チッ素ガスなどの不活性雰囲気で
行うことも出来る。このようにして得られた酸化錫ター
ゲットは他の金属酸化物の含有量にもよるが、通常の方
法によって得られるものにくらべて約17100の比抵
抗値をもつ。また、通常の電気伝導性酸化錫ターゲット
は、酸化錫と他金属の酸化物を混合し成形1300〜1
450℃で焼成して得ることとくらべて、本発明の方法
は、焼成の場合でも比較的低い温度で良い。
If further mechanical strength is required, the molded body thus prepared may be fired at 500 to 1000°C in the atmosphere. The firing atmosphere can also be an inert atmosphere such as nitrogen gas. The tin oxide target thus obtained has a resistivity value of about 17,100, which is higher than that obtained by conventional methods, although it depends on the content of other metal oxides. In addition, ordinary electrically conductive tin oxide targets are prepared by mixing tin oxide and other metal oxides and forming
Compared to the method obtained by firing at 450° C., the method of the present invention requires relatively low temperature for firing.

本発明で酸化錫にドープされる物質は、酸化錫を半導体
化させるものであればよく、また目的によって種々の物
質が選ばれる。例えばドープされる物質は、アンチモン
、インジウム、ガリウム。
The substance to be doped into tin oxide in the present invention may be any substance that converts tin oxide into a semiconductor, and various substances may be selected depending on the purpose. For example, the substances to be doped are antimony, indium, and gallium.

ビスマスなどの中から選ばれる。これら物質の含量はα
01〜10モルチで充分である。
Selected from bismuth etc. The content of these substances is α
01 to 10 molti is sufficient.

本発明を実施例をもって以下に説明するが、本発明はこ
れら実施例に限定されるものではない。
The present invention will be explained below using examples, but the present invention is not limited to these examples.

実施例1 水1000 m1ic 5no14−5r%0 249
を含む溶液と塩化アンチモン 1 gを加え、これに6
N−Nl観Hを加え、攪拌しながらp’H5〜7に調製
し、沈澱を得た。これを水洗分離し、700−のn −
ブチルアルコール中で加熱蒸留し、沸点が105℃にな
った時点で加熱を止め、冷却後、n−ブチルアルコール
を分離し、沈澱物を乾燥し、650℃で1時間加熱して
500〜1oooXのアンチモンドープ酸化錫微粒体を
得た。これを10鰭φの金型に入れプレス圧300kg
/ctdでプレスし、次にプレス圧1000kg/cI
Itで静水圧プレスして焼成用サンプルとした。焼成は
大気中800℃で5時間行った。得られた焼結体の比重
は&4・比抵抗1.5X10−”Ω・cnL(四探針法
)であった。
Example 1 Water 1000 mlic 5no14-5r%0 249
Add 1 g of antimony chloride to the solution containing 6
N-Nl was added and the pH was adjusted to 5 to 7 with stirring to obtain a precipitate. This was separated by washing with water, and 700-n-
Heat distillation in butyl alcohol, stop heating when the boiling point reaches 105℃, separate n-butyl alcohol after cooling, dry the precipitate, and heat at 650℃ for 1 hour to obtain 500 to 100X Antimony-doped tin oxide fine particles were obtained. Put this into a mold with a diameter of 10 fins and apply a press pressure of 300 kg.
/ctd, then press pressure 1000kg/cI
It was hydrostatically pressed to prepare a sample for firing. Firing was performed in the air at 800°C for 5 hours. The specific gravity of the obtained sintered body was &4 and the specific resistance was 1.5×10-''Ω·cnL (four-probe method).

実施例2 実施例1で得た粉体を実施例1と同様に成形し、大気中
1000℃で6時間焼成した。得られた焼結体の比重は
&3、比抵抗2.4XIQ−2Ω←蒲であった。焼結体
の表面は少し白味が出ていた。
Example 2 The powder obtained in Example 1 was molded in the same manner as in Example 1, and calcined at 1000° C. in the air for 6 hours. The specific gravity of the obtained sintered body was &3, and the specific resistance was 2.4XIQ-2Ω←蒲. The surface of the sintered body had a slight whitish appearance.

実施例3 実施例1で得た粉体を、2000に9/cmで静水圧プ
レスで成形体を得た。成形体は比重五2で熱く、比抵抗
は3g・鋸であった。
Example 3 The powder obtained in Example 1 was hydrostatically pressed at 2000:9/cm to obtain a molded body. The molded body had a specific gravity of 52, was hot, and a specific resistance of 3 g.

通常の固相反応でつくられる粉体を成形しただけでは絶
縁体である。
Powder produced through normal solid-state reactions is an insulator simply by forming it.

手続補正書 昭和58年12月20日 特W「庁長官 若 杉 和 夫 殿 1事件の表示 昭和58年特許願第 173238 号2発明の名称 高電気伝導性酸化錫薄膜材料の製造法 6補正をする者 事件と゛の関係 特許出願人 4補正命令の日付 自 発 5補正により増加する発明の数 0 6補正の対象 明細書の特許請求の範囲の欄 7補正の内容 (1) 明細書の特許請求の範囲を別紙のとおシ補正す
る。
Procedural amendment December 20, 1980 Special W "Director General Kazuo Wakasugi 1 Display of case 1982 Patent Application No. 173238 2 Title of invention 6 Amendment to manufacturing method of highly electrically conductive tin oxide thin film material Relationship between patent applicant 4. Date of order for amendment 5. Number of inventions increased by amendment 0. 6. Contents of amendment in column 7 of the scope of claims of the specification subject to amendment (1) Claims in the description Correct the range according to the attached sheet.

2、特許請求の範囲 (1) 酸化アンチモン、酸化インジウム、酸化ガリウ
ム、酸化ビスマスの少なくとも1種を固溶した粒径1μ
以下の微粒酸化錫を加圧成形及び/又は焼結することを
特徴とする酸化錫薄膜材料の製造法。
2. Claims (1) Particle size of 1 μm containing at least one of antimony oxide, indium oxide, gallium oxide, and bismuth oxide as a solid solution.
A method for producing a tin oxide thin film material, which comprises pressurizing and/or sintering the following fine-grained tin oxide.

Claims (1)

【特許請求の範囲】[Claims] (1)酸化アンチモン、酸化インジウム、酸化カリウム
、酸化ビスの少なくとも1種を固溶した粒径1μ以下の
微粒酸化錫を加圧成形及び/又は焼結することを特徴と
する酸化錫薄膜材料の製造法。
(1) A tin oxide thin film material characterized by pressure molding and/or sintering fine-grained tin oxide with a particle size of 1μ or less containing at least one of antimony oxide, indium oxide, potassium oxide, and bis oxide as a solid solution. Manufacturing method.
JP58173238A 1983-09-21 1983-09-21 Manufacture of highly electroconductive tin oxide film material Pending JPS6065760A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58173238A JPS6065760A (en) 1983-09-21 1983-09-21 Manufacture of highly electroconductive tin oxide film material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58173238A JPS6065760A (en) 1983-09-21 1983-09-21 Manufacture of highly electroconductive tin oxide film material

Publications (1)

Publication Number Publication Date
JPS6065760A true JPS6065760A (en) 1985-04-15

Family

ID=15956711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58173238A Pending JPS6065760A (en) 1983-09-21 1983-09-21 Manufacture of highly electroconductive tin oxide film material

Country Status (1)

Country Link
JP (1) JPS6065760A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01290551A (en) * 1988-05-16 1989-11-22 Tosoh Corp Production of target for sputtering to be used for production of transparent electroconductive film
JPH0243356A (en) * 1988-08-04 1990-02-13 Tosoh Corp Production of sputtering target for transparent conductive film
US4937148A (en) * 1986-03-06 1990-06-26 Catalysts & Chemicals Industries Co., Ltd. Process for preparing conductive fine particles
US5407602A (en) * 1993-10-27 1995-04-18 At&T Corp. Transparent conductors comprising gallium-indium-oxide
WO1995018080A1 (en) * 1993-12-28 1995-07-06 Showa Denko Kabushiki Kaisha Ito sintered body, ito transparent conductive film and method of forming the film
WO2006043333A1 (en) * 2004-10-22 2006-04-27 Sumitomo Metal Mining Co., Ltd. Gas barrier transparent resin substrate, method for manufacture thereof, and flexible display element using gas barrier transparent resin substrate

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4937148A (en) * 1986-03-06 1990-06-26 Catalysts & Chemicals Industries Co., Ltd. Process for preparing conductive fine particles
JPH01290551A (en) * 1988-05-16 1989-11-22 Tosoh Corp Production of target for sputtering to be used for production of transparent electroconductive film
JPH0243356A (en) * 1988-08-04 1990-02-13 Tosoh Corp Production of sputtering target for transparent conductive film
US5407602A (en) * 1993-10-27 1995-04-18 At&T Corp. Transparent conductors comprising gallium-indium-oxide
WO1995018080A1 (en) * 1993-12-28 1995-07-06 Showa Denko Kabushiki Kaisha Ito sintered body, ito transparent conductive film and method of forming the film
WO2006043333A1 (en) * 2004-10-22 2006-04-27 Sumitomo Metal Mining Co., Ltd. Gas barrier transparent resin substrate, method for manufacture thereof, and flexible display element using gas barrier transparent resin substrate
EP1825995A1 (en) * 2004-10-22 2007-08-29 Sumitomo Metal Mining Co., Ltd. Gas barrier transparent resin substrate, method for manufacture thereof, and flexible display element using gas barrier transparent resin substrate
EP1825995A4 (en) * 2004-10-22 2012-01-18 Sumitomo Metal Mining Co Gas barrier transparent resin substrate, method for manufacture thereof, and flexible display element using gas barrier transparent resin substrate

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