JPS6054448A - Attaching and detaching mechanism of wafer - Google Patents

Attaching and detaching mechanism of wafer

Info

Publication number
JPS6054448A
JPS6054448A JP16303683A JP16303683A JPS6054448A JP S6054448 A JPS6054448 A JP S6054448A JP 16303683 A JP16303683 A JP 16303683A JP 16303683 A JP16303683 A JP 16303683A JP S6054448 A JPS6054448 A JP S6054448A
Authority
JP
Japan
Prior art keywords
wafer
pin
susceptor
arms
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16303683A
Other languages
Japanese (ja)
Inventor
Kazuaki Hiuga
和昭 日向
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP16303683A priority Critical patent/JPS6054448A/en
Publication of JPS6054448A publication Critical patent/JPS6054448A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)

Abstract

PURPOSE:To prevent dusts from being adhered and scattered without contact with the surface of a wafer and to reliably perform the collection of the wafer by lifting the wafer by a pin in a floated state and interposing it by an arm. CONSTITUTION:A pin 13 is lifted by rising a plate 15 to float a wafer 12, and a plate 16 is disposed at the highest position. A block 21 is also disposed at the upper position, and the end of the arm 19 is opened. The plate 16 and the block 21 are moved down by the drive of a cam 17, and when the end of a guide pin 23 is contacted with the placing surface of the wafer, the opposed interval of the arms becomes minimum by an elastic member 20, and the arms are fixed. Then, the pin 13 is moved down, the wafer 12 is held by the hooks of the arms, and the arms are contacted only parts of the lower surfaces. Then, the plate 16 is lifted to the prescribed position, and the wafer 12 is collected completely from a susceptor 10. The wafer can be placed to the prescribed other position in the reverse order to the above operation. The wafer is collected without contact with the surface of the wafer, isolated by the pin from the susceptor, and held mechanically. Accordingly, it can be reliably collected without damage or contamination.

Description

【発明の詳細な説明】 〔発明の技術分野］ 本発明は、ウェハーの着脱機構に関する。[Detailed description of the invention] [Technical field of invention] The present invention relates to a wafer attachment/detachment mechanism.

〔発明の技術的背景及びその問題点」 従来、連続気相成長装置等に使用されるサセプタは、そ
の表面に載置したウェハーを、次のような着脱機構を用
いて採取するように１〜ている。第１図（４）は、バキ
ューム方式によるものである。図中１は、ヒータブロッ
ク２上のサーヒプタ３の表面に載置されたウェハーであ
る。ウェハー１は、その径より大きい開口径の吸着盤４
を被せられ、吸着盤４の内部を減圧状態に設定して、吸
着盤４の引−ヒげ操作によってサセプタ３から採取され
るようになっている。[Technical Background of the Invention and Problems Therewith] Conventionally, a susceptor used in a continuous vapor phase growth apparatus, etc. has a susceptor that collects a wafer placed on its surface using the following attachment/detachment mechanism. ing. FIG. 1(4) shows a vacuum method. In the figure, 1 is a wafer placed on the surface of the sahipter 3 on the heater block 2. The wafer 1 is attached to a suction cup 4 with an opening diameter larger than that of the wafer 1.
The sample is collected from the susceptor 3 by setting the inside of the suction cup 4 to a reduced pressure state and pulling the suction cup 4.

また、同図■に示す如く、吸着盤５の開口端の周面縁部
５ａを平坦にすると共に、ウェハー１の径と略等しい開
口径で吸着盤５がウェハー１に当接するようにした着脱
機構が使用されている。In addition, as shown in FIG. mechanism is used.

このような吸着盤４．５内を減圧状態にするバキューム
方式の着脱機構では、ウェハー１とサセプタ３の表面が
貞、空状態で密着しているため、ウェハー　１の着脱操
作を円滑に行い難い。In such a vacuum-type attachment/detachment mechanism that reduces the pressure inside the suction cup 4.5, the surfaces of the wafer 1 and the susceptor 3 are in close contact with each other in an empty state, making it difficult to smoothly attach and detach the wafer 1. .

ｔた、吸着盤４，５内の減圧状態は、サセプタ３の平坦
度に応じて適切に設定する必要があると共に、減圧にす
る吸引力を高めすぎるとウェハー１が割れてしまう。更
に、吸引処理の際にごみを吸引し、しかも、ウェハー１
と吸着盤４゜５が接触する際にウェハー１の表面を汚染
する問題がある。In addition, the reduced pressure state in the suction cups 4 and 5 needs to be appropriately set according to the flatness of the susceptor 3, and if the suction force for reducing the pressure is too high, the wafer 1 will break. Furthermore, the dust is sucked during the suction process, and the wafer 1
There is a problem in that the surface of the wafer 1 is contaminated when the suction cup 4.5 comes into contact with the wafer 1.

また、同図（Ｃ）は、高圧空気を吹き込む方式の着脱機
構を示している。この着脱機構では、ウェハー１の径よ
り大きな径の開口部を有する吸着盤６内に高圧空気を吹
き込むことにより、ウェハー１を吸着盤６内に押付けて
採取するようになっている。この場合にも高圧空気の吹
付は圧力が強すぎると、ウェハー１が割れてしまう。Further, FIG. 2C shows an attachment/detachment mechanism in which high-pressure air is blown. In this attachment/detachment mechanism, the wafer 1 is pressed into the suction cup 6 and collected by blowing high-pressure air into the suction cup 6, which has an opening having a diameter larger than the diameter of the wafer 1. In this case as well, if the pressure of high-pressure air is too strong, the wafer 1 will break.

また、高圧空気を吹付ける際にごみを飛散し、採取操作
の際にウェハー１を汚染する問題がある。Further, there is a problem in that dust is scattered when high-pressure air is blown, and the wafer 1 is contaminated during the collection operation.

〔発明の目的〕[Purpose of the invention]

本発明は、ウェハーの表面と無接触でごみの付着や飛散
を阻止して、しかも確実にウェハーを採取することがで
きるウニノ・−の着脱機構を提供することをその目的と
するものである。SUMMARY OF THE INVENTION An object of the present invention is to provide a mechanism for attaching and detaching a wafer, which prevents dust from adhering to or scattering without contacting the surface of the wafer, and which is capable of reliably picking up wafers.

〔発明の概要〕[Summary of the invention]

本発明は、ウェハーを浮遊させる突き上げピンと、浮遊
状態のウェハーを挟持するアームを設けて、ウェハーの
表面と無接触でごみの付着や飛散を阻止し、しかも確実
にウェハーを採取することができるウェハーの着脱機構
である。The present invention provides a wafer that is equipped with a push-up pin that suspends the wafer and an arm that holds the wafer in a floating state, thereby preventing dust from adhering to or scattering without contacting the wafer surface, and allowing the wafer to be reliably collected. This is the attachment/detachment mechanism.

〔発明の実施例〕[Embodiments of the invention]

以下、本発明の実施例について図面を参照して説明する
。Embodiments of the present invention will be described below with reference to the drawings.

第２図は、本発明の一実施例の正面図である。FIG. 2 is a front view of one embodiment of the present invention.

図中１０は、ヒータブロック１ノ上に設けられたサセプ
タである。サセプタ１０の一生面は、ウェハー載置面に
なっており、ウェハー１２が載置されるようになってい
る。ヒータブロック１ノ及びサセプタ１０には、先端部
がウェハー載置面から自在に出入するように突き上げピ
ン１３が取付けられている１、突き上げピン１３の下端
部は、カム１４によって昇降動する突き−）二げ板１５
に接続されている１、サセプタ１０の上方には、ウェハ
載置面に対向して上下プレート１６が設けられている。In the figure, 10 is a susceptor provided on the heater block 1. The life surface of the susceptor 10 is a wafer mounting surface, on which the wafer 12 is placed. A push-up pin 13 is attached to the heater block 1 and the susceptor 10 so that its tip can freely move in and out of the wafer mounting surface. ) second plate 15
Upper and lower plates 16 are provided above the susceptor 10 connected to the susceptor 1 and facing the wafer mounting surface.

上下プレート１６は、カム１７に接続して昇降動するよ
うになっている。上下プレート１６には、アーム保持体
１８が取付けられている。アーム保持体１８には、２本
の挾持アーム１９＆、１９ｂがその先端部をウェハー載
置面に向けるようにして、各々の中央部を支点にして取
付けられている。挾持アーム１９ａ、１９ｂの対向間隔
は、ウェハー１２の径に略等しく設定されている。各々
の挾持アーム１９ａ、１９ｂは、スプリング等の弾性部
材２０を介して互に引き付は合うように対設されている
。弾性部拐２０は、アーム保持体１８に取付けられた係
止棒１９ｃに接続されている。挾持アーム１９ａ、１９
ｂの後端部は、自在に折曲するようになっており、その
端部なリングブロック２ノに接続している。リングブロ
ック２１は、上下プレート１６を貫挿してカム１７に接
続した連結杆２２に接続されている。The upper and lower plates 16 are connected to a cam 17 to move up and down. An arm holder 18 is attached to the upper and lower plates 16. Two clamping arms 19&, 19b are attached to the arm holder 18 with their tips facing the wafer mounting surface, with the center of each arm serving as a fulcrum. The spacing between the clamping arms 19a and 19b is set to be approximately equal to the diameter of the wafer 12. The respective clamping arms 19a and 19b are arranged opposite each other so as to be attracted to each other via an elastic member 20 such as a spring. The elastic member 20 is connected to a locking rod 19c attached to the arm holder 18. Clamping arm 19a, 19
The rear end of b is bent freely and is connected to the ring block 2 at the end. The ring block 21 is connected to a connecting rod 22 that penetrates the upper and lower plates 16 and is connected to the cam 17.

挟持アーム１９＆、１９ｂの先端部は、ウェイト１２を
保持するために鉤形に折曲されている。The tips of the clamping arms 19&, 19b are bent into a hook shape to hold the weight 12.

またアーム保持体１８には、ガイドピン２３が、先端部
をウェハー載置面に向けて取付けられている。ガイドビ
ン２３の長さは、挟持アーム１９ａ、１９ｂの先端部か
らアーム保持体１８までの長さよりも僅に長く設定され
ている。ガイドビン２３の付根部には、ガイドビン２３
がウェハー載置面に当接した際の衝撃を吸収してガイド
ビン２３を伸縮させるばね２４が取付けられている。Further, a guide pin 23 is attached to the arm holder 18 with its tip facing the wafer mounting surface. The length of the guide bin 23 is set to be slightly longer than the length from the tip of the clamping arms 19a, 19b to the arm holder 18. The guide bin 23 is attached to the base of the guide bin 23.
A spring 24 is attached that absorbs the impact when the guide bin 23 comes into contact with the wafer placement surface and causes the guide bin 23 to expand and contract.

而して、このように構成されたウェハーの着脱機構によ
れば、次のようにしてウェハー１２の採取作業が行われ
る。先ず、第３図Ｑに示す如く、突き上げ板１５の上昇
によって突き上げピン１３を上昇し、ウェハー１２を浮
遊状態に設定する。このとき、上下プレート１６は、サ
セプタ１０の上方に時期している。つマリ、上下プレー
ト１６は最上位にあり、第３図に二点鎖線で示す如く、
リングブロック２１が上下プレート１６と共に引上げら
れて挟持アーム１９＆、１９ｂの先端部を開いた状態に
なっている。According to the wafer attachment/detachment mechanism configured in this way, the wafer 12 is picked up in the following manner. First, as shown in FIG. 3Q, the push-up pins 13 are raised by raising the push-up plate 15, and the wafer 12 is set in a floating state. At this time, the upper and lower plates 16 are positioned above the susceptor 10. The upper and lower plates 16 are located at the top, as shown by the two-dot chain line in FIG.
The ring block 21 is pulled up together with the upper and lower plates 16, and the tips of the clamping arms 19&, 19b are in an open state.

次いで、第３図ＣＢ）に示す如く、カム１７の駆動によ
り上下プレート１６を降して挟持アーム１９＆、１９ｂ
の先端がウェハー載置面の上方の所定位置に達するよう
に設定する。この上下プレート１６の降下に伴ってリン
グブロック２１の位置も下り、挟持アーム１９ａ、１９
ｂの対向間が狭められる。そして、ガイドビン２３の先
端部がウェハー載置面に当接したところで、挟持アーム
１９ａ、１９ｂの対向間隔が最小となって、第３図（０
に示す如く、弾性部材２０によって挟持アーム１９＆、
１９ｂの相互が所定位置に引き合った状態で固定される
。Next, as shown in FIG. 3CB), the upper and lower plates 16 are lowered by driving the cam 17, and the clamping arms 19&, 19b are lowered.
Set the tip so that it reaches a predetermined position above the wafer placement surface. With the lowering of the upper and lower plates 16, the position of the ring block 21 also lowers, and the gripping arms 19a, 19
b is narrowed. Then, when the tip of the guide bin 23 comes into contact with the wafer placement surface, the opposing distance between the clamping arms 19a and 19b becomes the minimum, as shown in FIG.
As shown in FIG.
19b are fixed in a predetermined position in a state where they are attracted to each other.

然る後、第３図■に示す如く、突き上げビン１３を降下
すると、ウェハー１２は、挟持アーム１９ａ、１９ｂの
鉤形に折曲した部分で保持される、このとき、ウェハー
１２の周面と挟持アーム１９ａ、１９ｂの間には、隙間
は存在せず、ウェハー１２はその下面の一部分だけで挟
持アーム１９ａ、１９ｂに接触している。次いで、上下
プレート１６を所定位置まで上昇することにより、サセ
プタ１０からのウェハー１２の採取を完了する１゜ なお、採取したウェハー１２を他の所定部所に載置する
操作は、これ寸でのウェハー１２の採取操作の逆の手順
で行われる。このとき、ガイドピン２３が挾持アーム１
９ｈ、１９ｂから離れたウェハー１２を案内してウェハ
ー１２を正しく所定位置に載置する。Thereafter, as shown in FIG. 3, when the push-up bin 13 is lowered, the wafer 12 is held by the hook-shaped bent portions of the clamping arms 19a and 19b. There is no gap between the clamping arms 19a, 19b, and the wafer 12 is in contact with the clamping arms 19a, 19b only at a portion of its lower surface. Next, by raising the upper and lower plates 16 to a predetermined position, the collection of the wafer 12 from the susceptor 10 is completed. The procedure for picking up the wafer 12 is reversed. At this time, the guide pin 23
The wafer 12 separated from 9h and 19b is guided to correctly place the wafer 12 in a predetermined position.

このようにこのウェハーの着脱機構によれば、挟持アー
ム１９ａ、１９ｂ等の機械的な保持作用によってウェハ
ー１２を保持するので、ウェハー１２の採取を確実に行
うことができる。゛また、ウェハー１２のサセプタ１０
からの離間は、突き上げビン１３によって突き上げるこ
とにより行うので、ウェハー１２に損傷が発止するのを
抑えることができる。まｆｃ、ウェハー１２の表面と無
接触の状態でウェハー１２の採取を行うので、ウェハー
１２がごみにより汚染するのを阻止することができる。As described above, according to this wafer attachment/detachment mechanism, the wafer 12 is held by the mechanical holding action of the clamping arms 19a, 19b, etc., so that the wafer 12 can be reliably sampled.゛Also, the susceptor 10 of the wafer 12
Since the separation from the wafer 12 is performed by pushing up the wafer 12 using the push-up bin 13, damage to the wafer 12 can be suppressed. Furthermore, since the wafer 12 is collected without contacting the surface of the wafer 12, it is possible to prevent the wafer 12 from being contaminated by dust.

さらに、高圧空気の吹き付けや吸引操作を施す必要がな
いので、ウェハー１２の汚染防止作用を更に高めること
ができる。Furthermore, since there is no need to perform high-pressure air blowing or suction operations, the effect of preventing contamination of the wafer 12 can be further enhanced.

〔発明の効果〕〔Effect of the invention〕

以上説明した如く、本発明に係るウェハーの着脱機構に
よれば、ウェハーの表面と無接触でごみの付着や飛散を
阻止して、しかも確実にウェハーを採取することができ
るものである。As explained above, according to the wafer attachment/detachment mechanism according to the present invention, it is possible to prevent dust from adhering to or scattering without contacting the wafer surface, and to reliably pick up the wafer.

【図面の簡単な説明】[Brief explanation of drawings]

第１図（４）乃至同図０は、従来のウェハーの着脱機構
を示す説明図、第２図は、本発明の一実施例の正面図、
第３図囚乃至同図０は、同実施例のウェハーの着脱機構
の動作を示″ｊ説明図である。 １０・・・サセプタ、１１・・・ヒータブロック、１２
・・・ウェハー、１３・・・突き上げビン、１４・・・
カム、１５・・・突き上げ板、１６・・・上下プレート
、１７・・・カム、１８・・・アーム保持体、１’ｊｔ
Ｌ。 １９　ｂ　°°°挟持アーム、１９　ｃ　＝・係止棒、
２０・・・弾性部材、２１・・・リングブロック、２２
・・・連結杆、２３・・・ガイドピン、２４・・・ばね
。 出願人代理人　弁理士　鈴　江　武　彦第１図 （Ａ）　（Ｂ）　（（ｊ 第３図 （Ａ）　（Ｂ） 第２図 ′°淳粁？下−１？1(4) to 0 are explanatory diagrams showing a conventional wafer attachment/detachment mechanism, FIG. 2 is a front view of an embodiment of the present invention,
3 to 0 are explanatory diagrams showing the operation of the wafer attachment/detachment mechanism of the same embodiment. 10... Susceptor, 11... Heater block, 12
...Wafer, 13...Push-up bottle, 14...
Cam, 15... Push-up plate, 16... Upper and lower plates, 17... Cam, 18... Arm holder, 1'jt
L. 19 b °°° clamping arm, 19 c = locking rod,
20... Elastic member, 21... Ring block, 22
...Connecting rod, 23...Guide pin, 24...Spring. Applicant's representative Patent attorney Takehiko Suzue Figure 1 (A) (B) ((j Figure 3 (A) (B) Figure 2'°Jun-kun?2-1?

Claims (1)

【特許請求の範囲】[Claims] ウェハー載置面を有するサセプタと、前記ウェハー載置
面に先端部が出入するようにして前記サセプタに取付け
られた突き上げピンと、前記ウェハー載置面に対して近
接離間自在に設けられたアーム保持体と、該アーム保持
体に先端部を前記ウェハー載１ｕ面に対向して取付けら
れ次ガイドピンと、前記アーム保持体の移動に同期して
対向間隔ヶ可変するようにして前記アーム保持体に取付
けられた挟持アームと、該挟持アーム間に介在された弾
性部材とを具備することを特徴とするウェハーの着脱機
構。A susceptor having a wafer placement surface, a push-up pin attached to the susceptor such that its tip portion enters and exits the wafer placement surface, and an arm holder provided so as to be able to move toward and away from the wafer placement surface. The guide pin is attached to the arm holder with its tip facing the wafer mounting surface 1u, and the guide pin is attached to the arm holder so that the distance between the two guide pins is variable in synchronization with the movement of the arm holder. A wafer attachment/detachment mechanism comprising: a wafer holding arm; and an elastic member interposed between the holding arms.
JP16303683A 1983-09-05 1983-09-05 Attaching and detaching mechanism of wafer Pending JPS6054448A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16303683A JPS6054448A (en) 1983-09-05 1983-09-05 Attaching and detaching mechanism of wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16303683A JPS6054448A (en) 1983-09-05 1983-09-05 Attaching and detaching mechanism of wafer

Publications (1)

Publication Number Publication Date
JPS6054448A true JPS6054448A (en) 1985-03-28

Family

ID=15765963

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16303683A Pending JPS6054448A (en) 1983-09-05 1983-09-05 Attaching and detaching mechanism of wafer

Country Status (1)

Country Link
JP (1) JPS6054448A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6489530A (en) * 1987-09-30 1989-04-04 Toshiba Corp Automatic setting device for semiconductor wafer
US6051074A (en) * 1996-06-21 2000-04-18 Micron Technology, Inc. Thermal conditioning apparatus
EP1463107A2 (en) * 2003-03-28 2004-09-29 Integrated Dynamics Engineering GmbH Apparatus and method for handling and conveying wafers

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6489530A (en) * 1987-09-30 1989-04-04 Toshiba Corp Automatic setting device for semiconductor wafer
US6051074A (en) * 1996-06-21 2000-04-18 Micron Technology, Inc. Thermal conditioning apparatus
US6403933B1 (en) 1996-06-21 2002-06-11 Micron Technology, Inc. Thermal conditioning apparatus
EP1463107A2 (en) * 2003-03-28 2004-09-29 Integrated Dynamics Engineering GmbH Apparatus and method for handling and conveying wafers
JP2004327970A (en) * 2003-03-28 2004-11-18 Integrated Dynamics Engineering Gmbh High-speed exchanging station for transferring wafer
EP1463107A3 (en) * 2003-03-28 2006-06-28 Integrated Dynamics Engineering GmbH Apparatus and method for handling and conveying wafers

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