JPS6026633A - Insert alloy for joining - Google Patents
Insert alloy for joiningInfo
- Publication number
- JPS6026633A JPS6026633A JP13443483A JP13443483A JPS6026633A JP S6026633 A JPS6026633 A JP S6026633A JP 13443483 A JP13443483 A JP 13443483A JP 13443483 A JP13443483 A JP 13443483A JP S6026633 A JPS6026633 A JP S6026633A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- joining
- bonding
- insert
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は接合用インサート合金及び接合方法に係シ、特
に非金属材料（セラミック又はグラファイト）同士又は
非金属材料と金属の接合に好適なインサート合金に関す
るものである。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to an insert alloy for joining and a joining method, and particularly to an insert alloy suitable for joining non-metallic materials (ceramic or graphite) to each other or to join non-metallic materials to metal. It is related to.
非金属材料（セラミック又はグラファイト）同士又は非
金属材料と金属の接合ズは、融接が困難で、ろう接にも
問題点かあり、むずかしいのが現状である。ろう接での
問題点は、一般ろう材（Ａｕろう、Ａｇろう、黄銅ろう
、Ａｔろう。Fusion welding of nonmetallic materials (ceramic or graphite) or nonmetallic materials and metals is difficult at present, as there are problems with soldering. The problem with brazing is general brazing materials (Au brazing, Ag brazing, brass brazing, At brazing).
Ｎｉろう）が非金属材料（セラミック又はグラファイト
）に対してぬれにくく、接合部でほとんどろう材が丸く
なってしまうことである。したがって現状では、非金属
材料の接合面上をぬれやすくするために前処理を行なっ
ている。それば非金属材料の表面にけん濁させた金属粉
末を加熱してメタ２イズする方法や薄い銅あるいはニッ
ケル層のメッキ又は晶出したシしておシ、前処理に時間
を費やしている。また非金属材料同士又は非金属材料と
金属の直接接合する方法もあるが、特殊なインサート合
金を用いているため汎用性にとぼしい。The problem is that Ni solder metal (Ni solder) is difficult to wet with non-metallic materials (ceramic or graphite), and the solder metal almost becomes rounded at the joint. Therefore, at present, pretreatment is performed to make it easier to wet the bonding surfaces of nonmetallic materials. In other cases, time is spent on pretreatment, such as heating metal powder suspended on the surface of a non-metallic material to meta-ize it, plating a thin copper or nickel layer, or crystallizing it. There is also a method of directly joining non-metallic materials or non-metallic materials to metal, but this method uses a special insert alloy and is therefore not very versatile.
非金属材料と金属の接合においては、非金属材料と金属
の中間に熱膨張差による応力を緩和するために緩衝材（
モリブデン、チタン、コパール。When joining nonmetallic materials and metals, a buffer material (
Molybdenum, titanium, copal.
ファーニコなど）を用いている。このため非金属材料と
中間緩衝材の接合を行なった後、さらに中間緩衝相と金
属の接合を行なっており、大幅な接合工数を要している
。Furnico, etc.) are used. For this reason, after the nonmetallic material and the intermediate buffer material are bonded, the intermediate buffer phase and the metal are further bonded, which requires a large number of bonding steps.
本発明の目的は、非金属材料（セラミック又はグラファ
イト）の表面にぬれやすく、非金属材料同士の接合又は
非金属材料と金属の接合を可能にし、なおかつ接合不良
欠陥のない高品質の接合部を得ることのできる接合用イ
ンサート合金接合方法を提供することにある。The purpose of the present invention is to easily wet the surface of non-metallic materials (ceramic or graphite), to enable the joining of non-metallic materials to each other or to join non-metallic materials to metal, and to provide high-quality joints free of bonding defects. It is an object of the present invention to provide a method for joining insert alloys for joining that can be obtained.
本発明は、重量比でＣｕ８０〜９５チ、Ｔｉ又はｚｒの
少なくとも一種５〜２０ｑＩ）にＳ ｉ、Ｍｇ。In the present invention, Cu (80 to 95 qI), at least one of Ti or ZR (5 to 20 qI), and Si, Mg in a weight ratio.
Ｇｅ、Ｍｎ、８ｎ、又はｚｎの少なくとも一種以上０．
１〜４チ添加した組成からなる接合用インサート合金で
ある。At least one of Ge, Mn, 8n, or zn.
This is a joining insert alloy having a composition in which 1 to 4 tres are added.
本発明の接合用インサート合金は、非金属材料の接合又
は金属の接合に使用でき、特に非金属材料同士の接合又
は非金属材料と金属の接合に好適である。非金属材料同
士の接合又は非金属材料と金属の接合では、非金属材料
表面に対して、ぬれ性良好なインサート材が必要である
。このため非金属材料に対するぬれ性を改良するために
、ＣｕにＴＩ及びＺｒを添加した。すなわちセラミック
の界面に非常に活性なＴｉ及びＺｒが有効に反応し、ぬ
れ性が改良される。またグラファイトに対しても非常に
活性であり、炭化物生成元素であるＩｌｌ ＋及びｚｒ
は、反応しぬれ性が改良される。The joining insert alloy of the present invention can be used for joining nonmetallic materials or joining metals, and is particularly suitable for joining nonmetallic materials to each other or joining nonmetallic materials to metals. In joining non-metallic materials to each other or joining non-metallic materials to metal, an insert material that has good wettability to the surface of the non-metallic material is required. Therefore, TI and Zr were added to Cu in order to improve the wettability to nonmetallic materials. That is, highly active Ti and Zr react effectively at the ceramic interface, improving wettability. It is also very active against graphite, and the carbide-forming elements Ill + and zr
reacts and improves wettability.
ＣｕにＴｉ及び７．ｒを添加することは、非金属材料の
ぬれ性を改良するほかに共晶反応し、低融点化が計られ
ることである。Ｃｕ−Ｔｉの共晶温１ｉは８９０ｔ’で
あり、Ｃｕ−Ｚｒの共晶温度は８６０Ｃである。このた
め本発明の接合用インサート合金を使用して接合する場
合の接合温度は、９００〜１０５０Ｃで行なうとよい。Cu, Ti and 7. Adding r not only improves the wettability of the nonmetallic material, but also causes a eutectic reaction to lower the melting point. The eutectic temperature 1i of Cu-Ti is 890t', and the eutectic temperature of Cu-Zr is 860C. Therefore, when bonding is performed using the bonding insert alloy of the present invention, the bonding temperature is preferably 900 to 1050C.
またＣｕに５〜２０チのＴ１及びＺ「を添加することは
、５チ以下のＴｉ及びＺｒの添加では、非金属材料のぬ
れ性の改良効果が少なく、さらに接合温度上昇するため
好ましくない。また２０チ以上のＴｉ及びｚｒの添加で
は、複雑な化合物（ＴｉＣｕ２．Ｔｉ２Ｃｕ３．′ｒｉ
Ｃｕ、ｚｒＣｕ３゜Ｚｒ２Ｃ’３）が生成しやすくなり
、接合部が脆化し好ましくない。なお、ＣｕＫＴｉ及び
Ｚｒを添加する場合単一添加でも複合添加でもよい。ま
た接合時間を長時間することにより、母材中に拡散し、
良好な接合部が得られる。Further, it is not preferable to add 5 to 20 inches of T1 and Z' to Cu because adding less than 5 inches of Ti and Zr has little effect on improving the wettability of the nonmetallic material and further increases the bonding temperature. Furthermore, when Ti and zr are added in an amount of 20 or more, complex compounds (TiCu2.Ti2Cu3.'ri
Cu, zrCu3°Zr2C'3) is likely to be formed, and the joint becomes brittle, which is not preferable. Note that when CuKTi and Zr are added, they may be added singly or in combination. In addition, by prolonging the bonding time, it will diffuse into the base material.
A good joint can be obtained.
次にＣＬＩ−Ｔｉ又は７．ｒ合金にＳｉ、Ｍｇ。Next, CLI-Ti or 7. r alloy with Si and Mg.
Ｇｅ、Ｍｎ、Ｓｎ又はｚｎを添加することは、ｃ ｕ−
’ｒ ｉ及びＺｒ合金の湯流れを改善するのに効果があ
り、さらにＣｕ−’、［’ｉ又はＺｒ合金の融点を降下
させるのに効果がある。Adding Ge, Mn, Sn or zn
It is effective in improving the melt flow of 'r i and Zr alloys, and is also effective in lowering the melting point of Cu-', ['i or Zr alloys.
Ｃｕ−Ｔｉ又はＺｒ合金にｓ ｔ、Ｑｅ、Ｍｇ＋Ｍｎ、
Ｓｎ又は７．ｎを０．１％以下の添加では、ＣＬＩ−’
ｌ’ｉ又はＺｒ合金の湯流れを改良するにいたらず、融
点降下の効果も少ない。また４襲以上の添加では、複雑
な化合物が生成しやすくなり、接合部が脆化し好ましく
ない。Cu-Ti or Zr alloy with st, Qe, Mg+Mn,
Sn or 7. When n is added below 0.1%, CLI-'
It does not improve the melt flow of l'i or Zr alloy, and has little effect on lowering the melting point. Addition of four or more times is not preferable because complex compounds tend to be formed and the joint becomes brittle.
本発明の接合用インサート合金を接合に使用する際は、
接合面間に箔及び粉末として介在させてもよいし、被接
合材の少なくとも一方の接合面に蒸着やスパッタによシ
合金膜や積層膜を形成してもよい。When using the joining insert alloy of the present invention for joining,
It may be interposed as a foil or powder between the bonding surfaces, or an alloy film or a laminated film may be formed on at least one bonding surface of the materials to be bonded by vapor deposition or sputtering.
非金属材料と金属の接合では、非金属材料と金属の熱膨
張の違いから熱応力が発生するため非金属材料と金属の
間に応力を緩和する緩衝材（ＭＯ２ｆｉｌ ｉ、コパー
ル、ノアーニコなど） を設け−ｃいる。When joining non-metallic materials and metal, thermal stress is generated due to the difference in thermal expansion between the non-metallic material and the metal. Therefore, a buffer material (MO2fil, Copal, Noanico, etc.) that relieves the stress is used between the non-metallic material and the metal. There is a provision-c.
したがって接合方法は、非金属材料と緩衝材の接合後、
緩衝材と金属の接合を行なっているのが現状である。Therefore, after joining the nonmetallic material and the cushioning material,
Currently, we are bonding cushioning materials and metals.
本発明の接合用インサート合金は、金属の接合にも適し
ていることから、非金属材料と緩衝材の接合及び緩衝材
と金属の接合を同時に行なうことができ、接合工数の低
減に有効である。Since the joining insert alloy of the present invention is also suitable for joining metals, it is possible to simultaneously join non-metallic materials and cushioning materials and to join cushioning materials and metals, which is effective in reducing the number of joining steps. .
また本発明方法での接合を行なうと、非金属材料にぬれ
るため接合不良などの欠陥の発生がなく高品質の接合部
が得られる。Furthermore, when bonding is performed using the method of the present invention, a high-quality bonded portion can be obtained without the occurrence of defects such as poor bonding because the nonmetallic material is wetted.
本発明のインサート材金を接合面間に箔及び粉末を介在
させたり、蒸着あるいはスノくツタにより合金膜を形成
する前に接合面をドライエツチング（グロー放電あるい
−はイオンス・くツタリング）によシ清沖化した後、酸
化防止膜を形成すると、さらに、非金属及び金属にぬれ
るため、接合時の欠陥の発生がなく良好な接合部が得ら
れる。The insert material of the present invention can be dry-etched (glow discharge or ion sintering) before forming an alloy film by interposing foil or powder between the joint surfaces, or by vapor deposition or snowboarding. If an oxidation-preventing film is formed after cleaning, it will further wet the non-metal and metal, resulting in a good joint without any defects during joining.
以下、本発明の実施例について説明する。 Examples of the present invention will be described below.
（実施例１）
インサート合金として、Ｃ０−１２％’ｌ’ｉ−０，５
％Ｓｉ合金及びＣｕ−８１Ｚｒ−０，５％Ｓ ｉ−ｏ、
ｓ ％ Ｓ ｎ合金を真空溶解により作成し、これを
粒径１００μｍの粉末状にした。次に被接合部材として
、Ｔ ｉ −５Ａ ｌ −２，５Ｓ ｎ合金とグラフア
イ）（Ｃ）を使用し、接合面間に上記したインサート合
金を介して接合を行なった。接合条件は、２Ｘ１０−”
ｆｏｒｒの真空下にて接合温度９３０Ｃ（ＣＬＩ−１２
％ｒｉ−０，５％Ｓｉ合金の場合）、１０００ｔ？（Ｃ
ｕ−８％Ｚｒ−０，５％Ｓ ｉ−０，５％Ｓ１１＠金の
場合）で、接合時間３０ｍｍ、加圧力２０ ｇｆ／１ｔ
ｕｎ”である。(Example 1) As an insert alloy, C0-12%'l'i-0,5
%Si alloy and Cu-81Zr-0,5%Si-o,
An s % S n alloy was prepared by vacuum melting, and this was made into a powder with a particle size of 100 μm. Next, Ti-5Al-2,5S n alloy and Graphai) (C) were used as members to be joined, and joining was performed with the above-mentioned insert alloy interposed between the joining surfaces. The bonding conditions are 2X10-”
Bonding temperature 930C (CLI-12
%ri-0.5%Si alloy), 1000t? (C
u-8%Zr-0,5%Si i-0,5%S11@gold), bonding time 30mm, pressing force 20gf/1t
It is "un".
グラファイトとＴｉ合金の接合部の金属組織（Ｃｕ−１
２％Ｔｉ−０，５％Ｓｉ合金）を観察した結果、Ｃｕ−
１２１Ｔｉ−０，５％Ｓｉ合金インサート材を使用した
グラファイトとＴｉ合金の接合部では、ボイド及び接合
不良欠陥の発生もなく、高品質の接合部を形成できた。Metal structure of the joint between graphite and Ti alloy (Cu-1
As a result of observing Cu-2% Ti-0.5% Si alloy)
In the joint between graphite and Ti alloy using the 121Ti-0.5% Si alloy insert material, a high-quality joint could be formed without any voids or joint defects.
またＣｕ−８％Ｚ ｒ −０，５％８ｉ−０，５％８ｎ
合金イ７サー）材を使用したグラファイトと金属の接合
部も同様に高品質の接合部が得られた。これら高品質の
接合部の得られる要因は、非金属材料であるグラファイ
ト及びＴ１合金に対して、本発明のインサート合金がよ
くぬれるためである。また、グラファイト中に接合近傍
で金属が混入していた。Also Cu-8%Z r -0,5%8i-0,5%8n
A high-quality joint between graphite and metal using the alloy I7S was similarly obtained. The reason why these high-quality joints are obtained is that the insert alloy of the present invention wets well with graphite and T1 alloy, which are non-metallic materials. Additionally, metal was mixed into the graphite near the junction.
（実施例２）
インサート合金として、Ｃｕ−１２チＴｉ−〇、５チＳ
ｉ合金を真空溶解によシ作成し、これを粒径１００μｍ
の粉末状にした。次に被接合材として、非金属材料であ
るアルミナ（Ａｔ２０３）、中間緩衝材であるｌＩＩ
１１金属である５Ｏ８３０４使用し、アルミナとＴｊの
接合とＴ Ｉと５ＵＳ３０４の接合を同時に行った。接
合条件は、２ Ｘ Ｉ Ｏ−’’ｌ’ｏｒｒの真空下に
て接合温度９３０７？、接合時間３９ｍｍ、加圧力２０
ｇｆ／ｍｍ２テ６ル。(Example 2) As insert alloys, Cu-12 Ti-〇, 5-chi S
I alloy was prepared by vacuum melting, and the particle size was 100 μm.
powdered. Next, the materials to be joined are alumina (At203), which is a non-metallic material, and lII, which is an intermediate buffer material.
Using 5O8304, which is a No. 11 metal, bonding of alumina and Tj and bonding of TI and 5US304 were performed at the same time. The bonding conditions were a bonding temperature of 9307? under a vacuum of 2XIO-''l'orr. , bonding time 39mm, pressing force 20
gf/mm2t6tl.
その結果、アルミナとＴｉの接合及びＴｉと５ＵＳ３０
４の接合では、ボイド及び接合不良の欠陥の発生もなく
、高品質の接合部が得られた。As a result, alumina and Ti bonding and Ti and 5US30
In the bonding of No. 4, a high-quality bonded portion was obtained without the occurrence of voids or defective bonding.
（実施例３）
インサート合金として、Ｃｕ−１２％Ｔｉ−０，５％Ｓ
ｉ合金を真空溶解により作成し、これを粒径１００μ【
ｎの粉末状にした。次に被接合材として、非金属材料で
あるアルミナ（Ａｌｚ０３）を使用し、アルオ、すの接
合を行なった。接合条件は、２ Ｘ Ｉ Ｏ，−”ｆｏ
ｒｒの真空下にて接合温度９３０Ｃ。(Example 3) Cu-12%Ti-0.5%S as insert alloy
I alloy was created by vacuum melting, and the particle size was 100μ.
It was made into powder form. Next, alumina (Alz03), which is a non-metallic material, was used as the material to be joined, and aluminum and aluminum were joined. The bonding conditions are 2X I O,-”fo
Bonding temperature is 930C under vacuum of rr.
接合時（１＞’１’−３０ｍｉｎ、加圧力２０ ｇｆ／
ｍｍ２である。During bonding (1>'1'-30min, pressure 20 gf/
It is mm2.
アルミナの接合部の金属組織を観察した結果、アルミナ
の接合部では、非金属材料であるアルミナに対し、本発
明のインサート合金が良くぬれるため高品質の接合部が
得られた。また、インサート金属が接合部界面でアルミ
ナ中に凸状に入シ込んでいた。As a result of observing the metal structure of the alumina joint, it was found that in the alumina joint, a high-quality joint was obtained because the insert alloy of the present invention was well wetted with alumina, which is a non-metallic material. In addition, the insert metal had entered the alumina in a convex shape at the joint interface.
本発明によれば、非金属材料（セラミック又はグラファ
イト）のぬれ性を改良するため、非金属材料間゛士の接
合及び非金属材料と金属の接合を可能にするとともに、
ボイドや接合不良等の欠陥を防止し、接合工程を短縮す
ることができる。According to the present invention, in order to improve the wettability of nonmetallic materials (ceramic or graphite), it is possible to bond between nonmetallic materials and to bond nonmetallic materials and metals, and
Defects such as voids and poor bonding can be prevented, and the bonding process can be shortened.
Claims (1)
なくとも一種５〜２０％にＳ ｉ ｒ Ｍｇ＋ （）ｅ
。 Ｍｎ、Ｓｎ又はＺｎの少なくとも一種以上０６１〜４チ
添加した組成からなることを特徴とした接合用インサー
ト合金。[Claims] 1. Cu8o to 95% by weight, 5 to 20% of at least one of T4, rl, r, Si r Mg+ ()e
. 1. An insert alloy for joining, characterized in that it has a composition in which at least one of Mn, Sn, and Zn is added in an amount of 061 to 40%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13443483A JPS6026633A (en) | 1983-07-25 | 1983-07-25 | Insert alloy for joining |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13443483A JPS6026633A (en) | 1983-07-25 | 1983-07-25 | Insert alloy for joining |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6026633A true JPS6026633A (en) | 1985-02-09 |
Family
ID=15128279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13443483A Pending JPS6026633A (en) | 1983-07-25 | 1983-07-25 | Insert alloy for joining |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6026633A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4591535A (en) * | 1984-06-20 | 1986-05-27 | Gte Products Corporation | Method of brazing ceramics using active brazing alloys |
| EP0205897A2 (en) * | 1985-06-24 | 1986-12-30 | BBC Brown Boveri AG | Arcing contact piece and process for manufacturing such a piece or the like |
| US20100011910A1 (en) * | 2004-09-06 | 2010-01-21 | Plansee Se | Method of producing a material composite |
| WO2010087432A1 (en) * | 2009-01-29 | 2010-08-05 | 株式会社オクテック | Heat dissipating base body and electronic device using same |
-
1983
- 1983-07-25 JP JP13443483A patent/JPS6026633A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4591535A (en) * | 1984-06-20 | 1986-05-27 | Gte Products Corporation | Method of brazing ceramics using active brazing alloys |
| EP0205897A2 (en) * | 1985-06-24 | 1986-12-30 | BBC Brown Boveri AG | Arcing contact piece and process for manufacturing such a piece or the like |
| US20100011910A1 (en) * | 2004-09-06 | 2010-01-21 | Plansee Se | Method of producing a material composite |
| US7670681B2 (en) * | 2004-09-06 | 2010-03-02 | Plansee Se | Material composite and method of producing the composite |
| US8557383B2 (en) | 2004-09-06 | 2013-10-15 | Plansee Se | Method of producing a material composite |
| WO2010087432A1 (en) * | 2009-01-29 | 2010-08-05 | 株式会社オクテック | Heat dissipating base body and electronic device using same |
| JPWO2010087432A1 (en) * | 2009-01-29 | 2012-08-02 | 株式会社オクテック | Heat dissipation base and electronic device using the same |
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