JPH0481283A - Solid phase diffusion joining method - Google Patents
Solid phase diffusion joining methodInfo
- Publication number
- JPH0481283A JPH0481283A JP19595990A JP19595990A JPH0481283A JP H0481283 A JPH0481283 A JP H0481283A JP 19595990 A JP19595990 A JP 19595990A JP 19595990 A JP19595990 A JP 19595990A JP H0481283 A JPH0481283 A JP H0481283A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- bonding
- joined
- copper alloy
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007790 solid phase Substances 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 title claims description 20
- 238000009792 diffusion process Methods 0.000 title claims description 12
- 238000005304 joining Methods 0.000 title claims description 4
- 238000007747 plating Methods 0.000 claims abstract description 33
- 229910052751 metal Inorganic materials 0.000 claims abstract description 27
- 239000002184 metal Substances 0.000 claims abstract description 27
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 21
- 239000010949 copper Substances 0.000 claims abstract description 14
- 229910052802 copper Inorganic materials 0.000 claims abstract description 11
- 150000002739 metals Chemical class 0.000 claims abstract description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 abstract description 40
- 238000005266 casting Methods 0.000 abstract description 8
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 abstract description 5
- 229910017518 Cu Zn Inorganic materials 0.000 abstract description 3
- 229910017752 Cu-Zn Inorganic materials 0.000 abstract description 3
- 229910017943 Cu—Zn Inorganic materials 0.000 abstract description 3
- 229910017767 Cu—Al Inorganic materials 0.000 abstract description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 abstract description 2
- 229910017755 Cu-Sn Inorganic materials 0.000 abstract 1
- 229910017927 Cu—Sn Inorganic materials 0.000 abstract 1
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 238000005219 brazing Methods 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 239000011701 zinc Substances 0.000 description 5
- 238000009835 boiling Methods 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、２種の金属のうち少なくとも一方が銅合金
であるそれぞれの金属を接合させる固相拡散接合法に関
する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a solid-phase diffusion bonding method for bonding two metals, at least one of which is a copper alloy.
従来、２種の金属の接合法としては鋳込み法が一般的で
あった。しかし、接合材が合金である場合、鋳込み法に
よって接合を行うことができる合金は限られていた。な
ぜなら鋳込み法では接合材を完全に溶融しなければなら
ないから、合金の成分に低沸点金属が含まれていると、
溶融時にその低沸点金属が気化してしまうからである。Conventionally, casting has been a common method for joining two types of metals. However, when the joining material is an alloy, there are a limited number of alloys that can be joined by the casting method. This is because the casting method requires the joining material to be completely melted, so if the alloy contains low-boiling metals,
This is because the low boiling point metal vaporizes during melting.
例えば銅−亜鉛合金では亜鉛が合金の融点直上で蒸発し
て接合材の表面に亜鉛の層や酸化亜鉛の層が形成される
。その結果接合強度が著しく低下したり、銅−亜鉛の組
成比が鋳込み時と異なったものになったりする。したか
ってこのような材料を鋳込み法によって接合することは
困難であった。For example, in a copper-zinc alloy, zinc evaporates just above the melting point of the alloy, forming a zinc layer or a zinc oxide layer on the surface of the bonding material. As a result, the joint strength may drop significantly, or the copper-zinc composition ratio may become different from that at the time of casting. Therefore, it has been difficult to join such materials by casting.
固相拡散接合法は接合材を熔融することなく固相のまま
加圧して接合させる方法であり、こうような難鋳込み材
料の接合に適している。この固相拡散接合法では接合強
度を上げることが主な課題となっている。その１つの解
決手段はアモルファスろう利等の中間Ｈを２種の材料の
間に介在させて圧接を行う方法である。また、別の手段
として同軸方向に超高圧を付加する超高圧法や静水圧的
に加圧するＩ（Ｉ Ｐ法等も行われている。The solid phase diffusion bonding method is a method of pressurizing and bonding the bonding material in a solid phase without melting it, and is suitable for bonding such difficult-to-cast materials. The main challenge with this solid-phase diffusion bonding method is to increase the bonding strength. One solution is to interpose an intermediate H, such as an amorphous solder, between the two materials and perform pressure welding. Further, as other means, an ultra-high pressure method in which an ultra-high pressure is applied in the coaxial direction and an I (IP method) in which pressure is applied hydrostatically are also used.
しかしながら、アモルファスろう材を用いた固相拡散接
合法では一般に入手可能なアモルファスろう材の材質や
種類等に限りがあるために接合強度等に問題がある場合
が多い。ずなわら、アモルファスろう利は（ａ）融点が
低く延性に富んだ金属箔状のものが多く、摩捺による熱
やせん断力が加わると接合強度が低下する。（ｂ）高融
点のものではタングステンやモリブデン等を成分に有す
るアモルファスろう材があるが、ぬれ性など接合材との
適合性に問題がある。（Ｃ）不純物として含有されてい
る金属と接合材との間で脆弱な金属間化合物を生成する
。したがって油圧機器の摺動部材のように耐熱性が求め
られ大きなせん断力が加わる部材に適用可能なほど満足
できる接合強度は得られなかった。However, the solid-phase diffusion bonding method using an amorphous brazing filler metal often has problems with bonding strength, etc., because there are limits to the materials and types of amorphous brazing filler metals that are generally available. However, many amorphous solders (a) have a low melting point and are highly ductile in the form of metal foils, and the bonding strength decreases when heat or shearing force due to rubbing is applied. (b) Among those with high melting points, there are amorphous brazing fillers containing tungsten, molybdenum, etc. as components, but they have problems in wettability and compatibility with bonding materials. (C) A fragile intermetallic compound is generated between the metal contained as an impurity and the bonding material. Therefore, it has not been possible to obtain a bonding strength that is satisfactory enough to be applicable to members that require heat resistance and are subjected to large shear forces, such as sliding members of hydraulic equipment.
一方、超高圧法やＨＩ Ｐ法ではコストが高くつくため
に、高付加価値を有する部材や部品にしか適用できなく
一般的な方法とは言えない。On the other hand, the ultra-high pressure method and the HIP method are expensive and can only be applied to parts and components with high added value, so they cannot be considered general methods.
本発明は、このような問題を解決し、鋳込み法によって
は接合が困難であった材料（合金）についても適用可能
であり、コストが低くでき、大きな接合強度が得られる
固相拡散接合法を提供することを目的とする。The present invention solves these problems and introduces a solid-phase diffusion bonding method that can be applied to materials (alloys) that are difficult to bond using the casting method, can be made at low cost, and can provide high bonding strength. The purpose is to provide.
前述された課題を解決するために、本発明による固相拡
散接合法は、前述されたものにおいて、
（１）前記２種の金属のうち、一方の金属が接合される
べき他方の金属の接合面に銅メッキまたは銅合金メッキ
を施す工程と、
（２）このメッキされた接合面において前記一方の金属
を加熱・加圧条件下にて接合させる工程
とを有することを特徴とする。In order to solve the above-mentioned problems, the solid-phase diffusion bonding method according to the present invention includes: (1) bonding of one of the two metals to which the other metal is to be bonded; It is characterized by comprising a step of applying copper plating or copper alloy plating to the surface, and (2) a step of joining the one metal on the plated joint surface under heating and pressurizing conditions.
本発明において接合される一方の金属である銅合金（以
下、接合材と称する。）は連続鋳造や押出等によって得
られるものであってよく、Ｃｕ−Ｚｎ系、Ｃｕ−３ｎ系
、Ｃｕ−Ａｌ系、Ｃｕ−Ｐｂ系等いずれの組成を有する
銅合金であってもよい。また、他方の金属（以下、被接
合材と称する。）としては一般にＳＣＭ＝ＳＳ等のＦｅ
系の鋳物が多く用いられるが、何れの純金属または合金
も使用可能であり前記接合材の銅合金と同一または異な
る組成の銅合金であってもかまわない。The copper alloy (hereinafter referred to as the bonding material), which is one of the metals to be bonded in the present invention, may be obtained by continuous casting, extrusion, etc., and may be Cu-Zn based, Cu-3n based, Cu-Al It may be a copper alloy having any composition such as Cu-Pb type or Cu-Pb type. The other metal (hereinafter referred to as the material to be joined) is generally Fe such as SCM=SS.
Although castings of the same type are often used, any pure metal or alloy can be used, and a copper alloy with the same or different composition from the copper alloy of the bonding material may be used.
被接合材の接合面に形成されるメッキの種類も銅メッキ
または銅合金メッキであれば何れでもよく銅合金メッキ
の組成としてはＣｕ−Ｚｎ等が例示される。このメッキ
は１種類だけでなく複数種類の層重であってもよい。ま
た、メッキの下地としてＦｅ系の被接合材との親和性を
図ってＮｉメッギを行ったり、銅合金メッキの付着性を
良くするだめの銅メッキを行うことも可能である。The type of plating formed on the joint surfaces of the materials to be joined may be any copper plating or copper alloy plating, and examples of the composition of the copper alloy plating include Cu-Zn. This plating may be of not only one type but also of multiple types. Furthermore, it is also possible to perform Ni plating as a base for plating to improve compatibility with Fe-based materials to be joined, or to perform copper plating to improve adhesion of copper alloy plating.
［
被接合材にメッキを施した後、メッキ処理した面におい
て接合材を加熱・加圧することによって接合させる。固
相拡散は接合する銅合金の融点Ｔｍ（絶対温度）の０．
７倍付近の温度から活発になり出す。したがって接合温
度は、少なくともＴｍＸ０．７（・Ｋ）以上であること
が望ましく、また接合材の融点以下の温度範囲である。[After plating the materials to be joined, the joining material is heated and pressurized on the plated surface to join them. Solid phase diffusion occurs when the melting point Tm (absolute temperature) of the copper alloy to be joined is 0.
It becomes active at temperatures around 7 times higher. Therefore, the bonding temperature is desirably at least TmX0.7 (·K) or higher, and is in a temperature range below the melting point of the bonding material.
また接合の際の雰囲気は真空またはＡｒガスやＮ２ガス
等の不活性雰囲気であることが望ましいが、加圧が大き
くて接合時間を短縮できる場合には大気中であってもよ
い。加圧力の大きさも通常の加圧装置で可能な範囲であ
ってよいが望ましくは数１００Ｋｇ／ｃ＋ｔ〜数ｔ／ｃ
ｆｌの範囲内である。Further, the atmosphere during bonding is preferably a vacuum or an inert atmosphere such as Ar gas or N2 gas, but air may be used if the pressurization is large and the bonding time can be shortened. The magnitude of the pressurizing force may be within the range possible with a normal pressurizing device, but is preferably from several 100 Kg/c+t to several t/c.
It is within the fl range.
作 用〕
本発明では被接合材の接合面に銅メッキまたば銅合金メ
ッキを施した後に加熱・加圧条件下にて接合材の接合を
行うことにより、接合強度を確保している。すなわち、
接合材は銅合金から成るから、これらの銅系メッキとの
ぬれ性が非常に良く固相拡散によって大きな接合強度が
得られる。一方、これらのメッキは例えばＦｅ系の金属
から成る被接合材とのなじみ性が良いからメッキ強度も
大きくてきる。全体として見れば、銅メッキまたは銅合
金メッキを介して被接合材と接合材とが強固に接合して
一体化した挙動をとる形になっている。[Function] In the present invention, the bonding strength is ensured by applying copper plating or copper alloy plating to the bonding surfaces of the materials to be bonded, and then bonding the bonding materials under heating and pressurizing conditions. That is,
Since the bonding material is made of a copper alloy, it has very good wettability with these copper-based platings, and high bonding strength can be obtained through solid phase diffusion. On the other hand, since these platings have good compatibility with materials to be joined made of Fe-based metals, for example, the plating strength increases. Viewed as a whole, the material to be joined and the material to be joined are firmly joined through the copper plating or copper alloy plating, and behave as an integrated body.
実施例１
鋼材ＳＣＭ４４０Ｈと耐摩耗性黄銅Ｐ３１Ｃ（組成（ｗ
ｔ％） 〜Ｃｕ：Ｂａ１． 、Ｚｎ：２６〜３０、Ｆｅ
：０．５〜１．３ ＡＩ：３．５〜４．５ 、Ｎｉ：
２．０〜４．０ 、Ｓｉ：０．５〜１．５ 、Ｃｏ：Ｑ
〜１．０）との接合を行った。Example 1 Steel material SCM440H and wear-resistant brass P31C (composition (w)
t%) ~Cu:Ba1. , Zn:26-30, Fe
:0.5~1.3 AI:3.5~4.5, Ni:
2.0~4.0, Si:0.5~1.5, Co:Q
~1.0) was bonded.
まず、ＳＣＭ４４０Ｈに下地としてＣｕメツキを５ｐ程
度の膜厚に施した後、
ＣＬＪ−Ｚｎ （真鍮）メッキを約２０μｍの膜厚に施
した。このメッキ面上にＰ３１Ｃを重ね、真空中（Ｉ
Ｘ １Ｏ−２Ｔｏｒｒ）で８５０°Ｃの温度に５分間保
持し、そのうちの１分間Ｐ３１Ｃ上からＩｔ／ＣＴＭの
圧力を加えた。このようにして接合を行った後、超音波
探傷法による非破壊検査、およびせん断テストを行って
接合状態を調べた。その結果を表１に示した。また、同
し材料について接合条件を変えた場合の接合条件および
接合状態についても同しく表１に示した。First, Cu plating was applied to SCM440H as a base to a thickness of about 5p, and then CLJ-Zn (brass) plating was applied to a thickness of about 20μm. Layer P31C on this plated surface and place it in a vacuum (I
The temperature was maintained at 850° C. for 5 minutes, and a pressure of It/CTM was applied from above the P31C for 1 minute. After the bonding was performed in this manner, a non-destructive inspection using an ultrasonic flaw detection method and a shear test were performed to examine the bonding state. The results are shown in Table 1. In addition, Table 1 also shows the bonding conditions and bonding states when the bonding conditions were changed for the same materials.
接合の際の雰囲気をＡｒガスに変えた場合、および加圧
時間を３分にした場合についても接合状態をしらべたが
結果は同じであった。The bonding conditions were also examined when the atmosphere during bonding was changed to Ar gas and when the pressurization time was changed to 3 minutes, but the results were the same.
実施例２
鋼材ＳＣＭ４４０Ｈとリン青銅ＰＢＣ−２０（組成（４
％） 〜Ｃｕ：８７．Ｏ〜９１．０、Ｓｎ：９．０〜１
２．０、Ｐ：０．０５〜０，５）との接合を行った。Example 2 Steel material SCM440H and phosphor bronze PBC-20 (composition (4
%) ~Cu: 87. O~91.0, Sn:9.0~1
2.0, P: 0.05 to 0.5).
まず、ＰＢＣ−２Ｃに実施例１と同様にＣｕメッキとＣ
ｕ−Ｚｎメッキを施した後、真空中にて表１に示す条件
で接合を行った。First, PBC-2C was plated with Cu and C as in Example 1.
After applying u-Zn plating, bonding was performed in vacuum under the conditions shown in Table 1.
接合状態を調べ、その結果についても表１に併せ示した
。接合雰囲気を真空からＡｒガスに変えた場合について
も同様の結果が得られた。The bonding state was investigated and the results are also shown in Table 1. Similar results were obtained when the bonding atmosphere was changed from vacuum to Ar gas.
表
（発明の効果〕
本発明では銅合金から成る接合材を、やはり銅系のメッ
キが接合面に施された被接合材に固相拡散により接合さ
せる構成としたから、（八〉メッキの成分、厚み等がア
モルファスろう材のように制約されず、接合材および被
接合材との適合性に優れたものに選択でき、加えて形成
されるメッキは不純物の少ない高純度のものにできるか
ら大きな接合強度を得ることができる、
（Ｂ）接合材を熔融せずに固相のままで接合を行うから
、接合材に低沸点成分が含まれているか含まれていない
かにかかわらず安定な状態にて接合を行うことができ、
鋳込み法に比べて接合の適用範囲が広がる、
（Ｃ）メッキはその技術が確立している上に、アモルフ
ァスろう材の使用よりも作業コストが安価にでき、また
加圧や加熱に特別な措置を要しないから、超高圧法やＨ
ＩＰ法に比べても設備等のコスト面ではるかに有利であ
る、等の効果を奏する。Table (Effects of the Invention) In the present invention, since the bonding material made of a copper alloy is bonded to the bonded material whose bonding surface is also coated with copper-based plating by solid-phase diffusion, (8) Components of the plating , thickness, etc. are not limited as with amorphous brazing filler metal, and it is possible to select a material with excellent compatibility with the joining material and the material to be joined, and in addition, the plating formed can be of high purity with few impurities, making it a great choice. (B) Since the bonding material is not melted but is bonded in a solid phase, it remains stable regardless of whether the bonding material contains low-boiling components or not. can be joined by
(C) Plating has an established technology, has lower work costs than the use of amorphous brazing filler metal, and requires special measures for pressurization and heating. Ultra-high pressure method and H
Compared to the IP method, it is far more advantageous in terms of equipment costs, etc.
Claims (1)
れの金属を接合させる固相拡散接合法において、 （１）前記２種の金属のうち、一方の金属が接合される
べき他方の金属の接合面に銅メッキまたは銅合金メッキ
を施す工程と、 （２）このメッキされた接合面において前記一方の金属
を加熱・加圧条件下にて接合させる工程 とを有することを特徴とする固相拡散接合法。[Claims] In a solid phase diffusion bonding method for joining two metals, at least one of which is a copper alloy, (1) one of the two metals is joined; (2) applying copper plating or copper alloy plating to the bonding surface of the other metal to be bonded; and (2) bonding the one metal on the plated bonding surface under heating and pressurizing conditions. Characteristic solid-phase diffusion bonding method.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19595990A JPH0481283A (en) | 1990-07-24 | 1990-07-24 | Solid phase diffusion joining method |
| DE69104845T DE69104845T2 (en) | 1990-07-24 | 1991-07-23 | HOT DIFFUSION WELDING. |
| US07/966,170 US5330097A (en) | 1990-07-24 | 1991-07-23 | Hot diffusion welding method |
| EP91913089A EP0550749B1 (en) | 1990-07-24 | 1991-07-23 | Hot diffusion welding |
| PCT/JP1991/000976 WO1992001528A1 (en) | 1990-07-24 | 1991-07-23 | Hot diffusion welding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19595990A JPH0481283A (en) | 1990-07-24 | 1990-07-24 | Solid phase diffusion joining method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0481283A true JPH0481283A (en) | 1992-03-13 |
Family
ID=16349830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19595990A Pending JPH0481283A (en) | 1990-07-24 | 1990-07-24 | Solid phase diffusion joining method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0481283A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006272390A (en) * | 2005-03-29 | 2006-10-12 | Nippon Steel Corp | Composite structure of invar alloy and brass, and its joining method |
| JP2011206918A (en) * | 2010-03-26 | 2011-10-20 | Nisshin Steel Co Ltd | Laminated die for resin molding and method of manufacturing the same |
| CN102592712A (en) * | 2012-03-23 | 2012-07-18 | 株洲博雅科技股份有限公司 | Method for preparing integral type multi-branch structure copper-bus busbar and busbar |
-
1990
- 1990-07-24 JP JP19595990A patent/JPH0481283A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006272390A (en) * | 2005-03-29 | 2006-10-12 | Nippon Steel Corp | Composite structure of invar alloy and brass, and its joining method |
| JP4562569B2 (en) * | 2005-03-29 | 2010-10-13 | 新日鉄マテリアルズ株式会社 | Invar alloy and brass composite structure and method for producing the same |
| JP2011206918A (en) * | 2010-03-26 | 2011-10-20 | Nisshin Steel Co Ltd | Laminated die for resin molding and method of manufacturing the same |
| CN102592712A (en) * | 2012-03-23 | 2012-07-18 | 株洲博雅科技股份有限公司 | Method for preparing integral type multi-branch structure copper-bus busbar and busbar |
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