JPH04300259A - Joining member and joining - Google Patents
Joining member and joiningInfo
- Publication number
- JPH04300259A JPH04300259A JP3087915A JP8791591A JPH04300259A JP H04300259 A JPH04300259 A JP H04300259A JP 3087915 A JP3087915 A JP 3087915A JP 8791591 A JP8791591 A JP 8791591A JP H04300259 A JPH04300259 A JP H04300259A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- members
- joining
- metal powder
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005304 joining Methods 0.000 title claims abstract description 65
- 229910052751 metal Inorganic materials 0.000 claims abstract description 141
- 239000002184 metal Substances 0.000 claims abstract description 141
- 239000000843 powder Substances 0.000 claims abstract description 74
- 239000000919 ceramic Substances 0.000 claims abstract description 51
- 239000007790 solid phase Substances 0.000 claims abstract description 39
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 25
- 229910052802 copper Inorganic materials 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 26
- 238000005245 sintering Methods 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 abstract description 16
- 229910045601 alloy Inorganic materials 0.000 abstract description 7
- 239000000956 alloy Substances 0.000 abstract description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 6
- 239000011521 glass Substances 0.000 abstract description 3
- 239000011812 mixed powder Substances 0.000 abstract description 2
- 229910000833 kovar Inorganic materials 0.000 description 17
- 238000000576 coating method Methods 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- 239000010408 film Substances 0.000 description 10
- 239000002245 particle Substances 0.000 description 8
- 230000008018 melting Effects 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 238000010304 firing Methods 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 238000005219 brazing Methods 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 239000011104 metalized film Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 229910015365 Au—Si Inorganic materials 0.000 description 2
- 229910015363 Au—Sn Inorganic materials 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 229910052573 porcelain Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910017980 Ag—Sn Inorganic materials 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 238000010344 co-firing Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は，接合強度に優れた，接
合部材及び接合方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a joining member and a joining method that have excellent joining strength.
【０００２】0002
【従来技術】図９に示すごとく，例えばアルミナ回路基
板，低温焼成回路基板等のセラミックス基板９上には，
リードフレーム（図示略），導体ピン等の金属部材８が
接合されている。該金属部材８としては，セラミックス
材料との熱膨張差を考慮してコバール，４２アロイ合金
（Ｆｅ−４２％Ｎｉ，６％Ｃｒ）等が用いられている。
しかし，上記金属部材８は，一般に直接セラミックス基
板９上に接合することが極めて困難である。そのため，
該金属部材８をセラミックス基板９上に接合するに当た
り，例えば下記の処理が行われている。まず，上記セラ
ミックス基板９には，図９に示すごとく，予めＷ，Ａｇ
等からなる金属部材７ｂを内設しておき，その上の金属
と接合したい部位に，Ｗ，Ａｇ等からなる金属部材７ａ
を厚膜印刷，スパッタ，メッキ法等により形成しておく
。次いで，該金属部材７ａ上にＮｉ等のメタライズ層６
１を形成する。そして，該メタライズ層６１上にコバー
ル等からなる導体ピン，またはリードフレーム等の金属
部材８を接合する。その後，全体にＡｕメッキ（図示し
ない）が施される。[Prior Art] As shown in FIG. 9, on a ceramic substrate 9 such as an alumina circuit board or a low-temperature fired circuit board,
Metal members 8 such as a lead frame (not shown) and conductor pins are joined. As the metal member 8, Kovar, 42 alloy alloy (Fe-42% Ni, 6% Cr), etc. are used in consideration of the difference in thermal expansion with the ceramic material. However, it is generally extremely difficult to bond the metal member 8 directly onto the ceramic substrate 9. Therefore,
In bonding the metal member 8 onto the ceramic substrate 9, for example, the following process is performed. First, as shown in FIG. 9, the ceramic substrate 9 is coated with W and Ag in advance.
A metal member 7b made of W, Ag, etc. is installed inside the metal member 7b, and a metal member 7a made of W, Ag, etc. is installed at the part where it is desired to be joined to the metal above it.
is formed by thick film printing, sputtering, plating, etc. Next, a metallized layer 6 such as Ni is formed on the metal member 7a.
form 1. Then, a metal member 8 such as a conductor pin made of Kovar or the like or a lead frame is bonded onto the metallized layer 61. Thereafter, the entire structure is plated with Au (not shown).
【０００３】上記金属部材７ａを形成するに当たっては
，金属部材７ｂとの同時焼成法（Ｗ，Ａｇ，Ａｇ−Ｐｄ
，Ａｕ），厚膜印刷焼成法（Ａｕ，Ａｇ，Ａｇ−Ｐｄ，
Ｃｕ）スパッタ（Ｔｉ，Ｃｒ），無電解メッキ法（Ｎｉ
，Ｃｕ）等によりセラミックス基板上に形成される。ま
た，上記メタライズ層６１を形成するに当たっては，メ
ッキにより，セラミックス基板９上の金属部材７ａ上に
Ｎｉ等からなる金属膜が形成される。また，上記金属部
材８を上記メタライズ層６１上に立設接合するにあった
ては，例えば，ロウ材６３を用いたロウ付け，あるいは
ハンダ材を用いたハンダ付けを用いる。ロウ材は，Ａｇ
−Ｃｕ，Ａｕ−Ｓｎ，Ａｕ−Ｓｉ等から，あるいはハン
ダ材は，Ｓｎ−Ｐｂ，Ａｇ−Ｓｎハンダ等から必要に応
じて選ばれる。[0003] In forming the metal member 7a, a co-firing method (W, Ag, Ag-Pd) with the metal member 7b is used.
, Au), thick film printing and firing method (Au, Ag, Ag-Pd,
Cu) sputtering (Ti, Cr), electroless plating method (Ni
, Cu) or the like on a ceramic substrate. Furthermore, in forming the metallized layer 61, a metal film made of Ni or the like is formed on the metal member 7a on the ceramic substrate 9 by plating. Further, when the metal member 8 is erected and joined on the metallized layer 61, brazing using a brazing material 63 or soldering using a solder material is used, for example. The brazing material is Ag
-Cu, Au-Sn, Au-Si, etc., or the solder material is selected from Sn-Pb, Ag-Sn solder, etc. as necessary.
【０００４】0004
【解決しようとする課題】しかしながら，上記従来技術
には，次の問題点がある。即ち，上記Ａｇ−Ｃｕは，約
７９０℃の共晶点を有する。そこで，ロウ付け時に，そ
のロウ付け作業温度の約８５０℃で，Ａｇ系メタライズ
層６１やＡｇ，Ｃｕ系の上記回路配線の金属部材７ａに
拡散し易く，最悪の場合には，異種金属接合部が，融解
し，セラミックス基板とメタライズ層６１との密着性が
低下したり，また上記金属部材の回路配線が断線を生じ
る場合がある。[Problem to be Solved] However, the above-mentioned conventional technology has the following problems. That is, the Ag-Cu has a eutectic point of about 790°C. Therefore, during brazing, at the brazing temperature of about 850° C., it is easy to diffuse into the Ag-based metallized layer 61 and the metal member 7a of the circuit wiring made of Ag and Cu-based materials, and in the worst case, the dissimilar metal joints However, the metallized layer 61 may melt and the adhesion between the ceramic substrate and the metallized layer 61 may deteriorate, or the circuit wiring of the metal member may be disconnected.
【０００５】また，上記Ａｕ−Ｓｎ，Ａｕ−Ｓｉは，溶
融温度が低く，後工程で約５００℃以上の温度に曝され
ると，導体ピン，リードフレームの配線位置がずれてし
まう場合がある。また，工業的にはコストが比較的高い
という欠点もある。また，上記ハンダ付においては，後
工程で，該ハンダが溶融する温度，例えば，２００〜４
００℃以上の温度に曝されると，導体ピン，リードフレ
ームの配設位置がずれる場合がある。更には，ハンダ中
のＳｎがＣｕ等の金属部材７ｂに拡散し，脆いＣｕ−Ｓ
ｎ合金等を生成して，上記金属部材７ｂの回路配線が破
断してしまう場合がある。[0005] Furthermore, the above-mentioned Au-Sn and Au-Si have a low melting temperature, and if they are exposed to temperatures of about 500°C or higher in the subsequent process, the wiring positions of the conductor pins and lead frame may shift. . Another disadvantage from an industrial perspective is that it is relatively expensive. In addition, in the above soldering, the temperature at which the solder melts in the subsequent process, for example, 200 to 4
When exposed to temperatures of 00°C or higher, the positions of the conductor pins and lead frame may shift. Furthermore, Sn in the solder diffuses into the metal member 7b such as Cu, and the brittle Cu-S
There are cases where n-alloy or the like is generated and the circuit wiring of the metal member 7b is broken.
【０００６】一方，セラミックスと金属との間では，熱
膨張係数が異なるため，両者を接合するに当たっては，
なるべく低い温度で接合することが強く望まれている。
また，セラミックスとセラミックス又は金属と金属の部
材の接合についても，同様の要望がある。本発明は，か
かる従来の問題点に鑑みてなされたもので，比較的低温
で接合でき，接合強度に優れた，接合部材及び接合方法
を提供しようとするものである。On the other hand, since the thermal expansion coefficients of ceramics and metals are different, when joining them, it is necessary to
It is strongly desired to bond at as low a temperature as possible. Furthermore, there are similar demands regarding the joining of ceramic-to-ceramic or metal-to-metal members. The present invention has been made in view of these conventional problems, and it is an object of the present invention to provide a joining member and a joining method that can be joined at a relatively low temperature and have excellent joining strength.
【０００７】[0007]
【課題の解決手段】本発明は，金属又はセラミックスか
らなる部材を金属粉末の固相焼結層を介して接合してな
り，上記金属粉末は，０．１〜１０μｍのＣｕ又はＮｉ
を主成分とする粉末であることを特徴とする接合部材に
ある。上記金属としては，コバール，４２アロイ，Ｃｕ
，Ｎｉ等の金属板がある。上記セラミックスとしては，
例えば，アルミナ磁器，低温焼成セラミック，窒化アル
ミニウム磁器等の材料を焼結した基板がある。上記金属
粉末としては，０．１〜１０μｍのＣｕ又はＮｉを主成
分とし金属粉末を用いる。０．１μｍ未満であると，卑
金属粉末表面の酸化量が増加し，焼結性が低下する。１
０μｍを越えると，活性な表面が減少し，低温焼結性が
低下する。更に均一充填が難しくなる。また，上記金属
粉末は，上記金属又はセラミックスからなる両部材間に
おいて，固相焼結層を形成するために用いるものである
。また，上記部材の接合形態としては，セラミックスと
セラミックス（実施例１），セラミックスと金属（実施
例１，２），金属と金属（実施例３）がある。[Means for Solving the Problems] The present invention is made by joining members made of metal or ceramics through a solid-phase sintered layer of metal powder, and the metal powder has a thickness of 0.1 to 10 μm of Cu or Ni.
A bonding member characterized in that it is a powder containing as a main component. The above metals include Kovar, 42 alloy, Cu
There are metal plates such as , Ni, etc. The above ceramics include:
For example, there are substrates made of sintered materials such as alumina porcelain, low-temperature fired ceramics, and aluminum nitride porcelain. As the metal powder, a metal powder containing Cu or Ni as a main component and having a diameter of 0.1 to 10 μm is used. If it is less than 0.1 μm, the amount of oxidation on the surface of the base metal powder increases and sinterability decreases. 1
When the thickness exceeds 0 μm, the active surface area decreases and low-temperature sinterability deteriorates. Furthermore, uniform filling becomes difficult. Further, the metal powder is used to form a solid phase sintered layer between the two members made of the metal or ceramic. In addition, the joining forms of the above-mentioned members include ceramics and ceramics (Example 1), ceramics and metals (Examples 1 and 2), and metals and metals (Example 3).
【０００８】また，上記金属又はセラミックスの両部材
を接合する方法としては，次の方法がある。即ち，金属
又はセラミックスからなる部材を互いに接合するに当た
り，両部材の表面にＣｕ又はＮｉを主成分とする被覆金
属をコーティングし，その後，両部材の間にＣｕ又はＮ
ｉを主成分とする金属粉末を介在させ，これらを加圧下
で３００〜７００℃において加熱して上記金属粉末を固
相焼結すると共に，両部材を接合することを特徴とする
金属又はセラミックスからなる部材の接合方法である。[0008] Furthermore, as a method for joining the metal or ceramic members, there are the following methods. That is, when joining members made of metal or ceramics to each other, the surfaces of both members are coated with a coating metal mainly composed of Cu or Ni, and then Cu or N is applied between the two members.
A metal or ceramic material characterized by interposing a metal powder containing i as a main component and heating the metal powder under pressure at 300 to 700°C to solid-phase sinter the metal powder and bond the two members. This is a method for joining members.
【０００９】ここで最も注目すべきことは，上記両部材
の間にＣｕ又はＮｉを主成分とする金属粉末を介在させ
，これらを加圧下で３００〜７００℃の比較的低温で固
相焼結することである。３００℃未満では焼結速度が遅
く，高い接合強度が得られない。７００℃を越えると，
接合部材間の熱膨張差が大きいものは応力が大きく冷却
工程で破断し易くする。上記被覆金属のコーティング方
法としては，例えば，メッキ，スパッタリング，真空蒸
着，厚膜印刷焼成がある。また，接合時の加圧としては
，例えば１〜６００ｋｇ／ｃｍ２ の圧力で加圧される
。加圧が１ｋｇ／ｃｍ２ 未満では，接合体間の密着が
不十分であり，固相焼結が緻密に焼結できず接合強度が
十分得られない。６００ｋｇ／ｃｍ２ を越えるとセラ
ミックス体内部の破断が生じたり，金属が変形する。上
記固相焼結の雰囲気は，真空，Ｎ２ ，Ａｒ，Ｈｅ，Ｈ
２ 等の非酸化性で行う。What is most noteworthy here is that metal powder mainly composed of Cu or Ni is interposed between the above two members, and these are solid phase sintered under pressure at a relatively low temperature of 300 to 700°C. It is to be. If the temperature is less than 300°C, the sintering speed is slow and high bonding strength cannot be obtained. When the temperature exceeds 700℃,
Those with a large difference in thermal expansion between bonded members have large stress and are likely to break during the cooling process. Examples of coating methods for the above metal coating include plating, sputtering, vacuum deposition, and thick film printing and baking. Furthermore, the pressure applied during bonding is, for example, 1 to 600 kg/cm2. If the pressure is less than 1 kg/cm2, the adhesion between the bonded bodies will be insufficient, solid phase sintering will not be able to sinter densely, and sufficient bonding strength will not be obtained. If it exceeds 600 kg/cm2, the inside of the ceramic body may break or the metal may be deformed. The atmosphere for the solid phase sintering is vacuum, N2, Ar, He, H.
2. Carry out with a non-oxidizing agent such as No. 2.
【００１０】また，上記Ｃｕ又はＮｉを主成分とする金
属部材同士を互いに接合する方法としては，次の方法が
ある。即ち，Ｃｕ又はＮｉを主成分とする部材を互いに
接合するに当たり，両部材の間にＣｕ又はＮｉを主成分
とする金属粉末を介在させ，これらを加圧下で３００〜
７００℃において加熱して上記金属粉末を固相焼結する
と共に，両部材を接合することを特徴とする金属又はセ
ラミックスからなる部材の接合方法である。ここで，最
も注目すべきことは，金属と金属の部材を互いに接合す
るに当たり，Ｃｕ又はＮｉを主成分とする金属粉末を用
いて，３００〜７００℃の比較的低温で該金属粉末を固
相焼結し，両部材を接合することである。[0010] Furthermore, as a method for joining the metal members whose main component is Cu or Ni, there is the following method. That is, when joining members mainly composed of Cu or Ni, a metal powder mainly composed of Cu or Ni is interposed between the two members, and these are heated under pressure to a
This is a method for joining members made of metal or ceramics, characterized in that the metal powder is solid-phase sintered by heating at 700° C., and both members are joined. What is most noteworthy here is that when joining metal members to each other, metal powder containing Cu or Ni as the main component is used to form a solid state at a relatively low temperature of 300 to 700°C. This involves sintering and joining both parts together.
【００１１】[0011]
【作用及び効果】本発明の接合部材においては，各部材
を互いに接合する接合層を，粒径が０．１〜１０μｍの
Ｃｕ又はＮｉを主成分とする金属粉末の固相焼結層を用
いて形成してある。このように，粒径が比較的微粒子で
あるため，かかる金属粉末の表面は高活性となる。その
ため，該金属粉末を焼結するに当たっては，比較的低温
で固相焼結することができる。また，上記金属粉末は，
Ｃｕ又はＮｉを主成分としているため，上記各部材の接
合表面との「なじみ」が良く，熱膨張差が少なくなるよ
う構成されている。そのため，上記固相焼結層が強固と
なり，優れた接合強度を得ることができる。[Operations and Effects] In the joining member of the present invention, the joining layer that joins each member to each other is a solid phase sintered layer of metal powder mainly composed of Cu or Ni with a particle size of 0.1 to 10 μm. It is formed as follows. As described above, since the particle size is relatively fine, the surface of the metal powder becomes highly active. Therefore, when sintering the metal powder, solid phase sintering can be performed at a relatively low temperature. In addition, the above metal powder is
Since the main component is Cu or Ni, it is configured to have good "compatibility" with the bonding surfaces of the above-mentioned members and to reduce the difference in thermal expansion. Therefore, the solid phase sintered layer becomes strong and excellent bonding strength can be obtained.
【００１２】したがって，本発明によれば，比較的低温
で接合でき，接合強度に優れた，接合部材及び接合方法
を提供することができる。また，上記接合方法において
は，金属又はセラミックスからなる部材を互いに接合す
るに当たり，両部材の表面にＣｕ又はＮｉを主成分とす
る被覆金属をコーティングしている。また，該両部材の
間には，上記のごとく表面が高活性のＣｕ又はＮｉを主
成分とする金属粉末を介在させている。そのため，両部
材の接合表面は，その間に介在させる金属粉末と同質の
材料からなる。したがって，両部材の接合表面の間に熱
膨張による熱歪を生じない。そのため，上記両部材は，
上記金属粉末によって強固に接合されることになる。ま
た，上記固相焼結層においては，従来のごとく，接合部
分の溶融に起因するリードフレーム等の断線を生ずるこ
とがない。Therefore, according to the present invention, it is possible to provide a joining member and a joining method that can be joined at a relatively low temperature and have excellent joining strength. Furthermore, in the above joining method, when joining members made of metal or ceramics to each other, the surfaces of both members are coated with a coating metal containing Cu or Ni as a main component. Furthermore, as described above, a metal powder whose main component is Cu or Ni and has a highly active surface is interposed between the two members. Therefore, the joining surfaces of both members are made of the same material as the metal powder interposed therebetween. Therefore, thermal distortion due to thermal expansion does not occur between the joining surfaces of both members. Therefore, both of the above members are
The above-mentioned metal powder provides a strong bond. Further, in the solid phase sintered layer, there is no disconnection of the lead frame or the like due to melting of the bonded portion, unlike in the conventional case.
【００１３】また，両部材と金属粉末とは，加圧下で３
００〜７００℃において加熱される。そのため，上記部
材と金属粉末とは，これらの融点以下の比較的低温で固
相焼結することができる。該固相焼結は，被焼結物の融
点以下の温度で加熱して，該被焼結物を焼き固める，有
効な手段となるからである。また，上記固相焼結は，加
圧下で行われる。そのため，上記金属粉末からなる固相
焼結層は，強固となり，優れた接合強度を得ることがで
きる。したがって，比較的低温で，接合強度に優れた接
合部材を接合することができる。[0013] Furthermore, both members and the metal powder are separated by 3
Heated at 00-700°C. Therefore, the above member and the metal powder can be solid-phase sintered at a relatively low temperature below their melting points. This is because the solid phase sintering is an effective means of baking and solidifying the sintered object by heating it at a temperature below the melting point of the sintered object. Further, the solid phase sintering described above is performed under pressure. Therefore, the solid phase sintered layer made of the metal powder becomes strong, and excellent bonding strength can be obtained. Therefore, it is possible to join joining members with excellent joining strength at a relatively low temperature.
【００１４】また，Ｃｕ又はＮｉを主成分とする金属部
材を互いに接合するに当たって，両部材の間にＣｕ又は
Ｎｉを主成分とする被覆金属をコーティングしている。
また，両部材の間にＣｕ又はＮｉを主成分とする金属粉
末を介在させている。そのため，両部材は，上記と同様
に，表面活性の大きい金属粉末によって強固に接合され
ることになる。また，両部材と金属粉末とは，加圧下で
３００〜７００℃において加熱される。そのため，上記
と同様に，両部材と金属粉末とを，比較的低温で固相焼
結することができる。したがって，上記と同様に，比較
的低温で，接合強度に優れた接合部材を接合することが
できる。[0014] Furthermore, when joining metal members containing Cu or Ni as a main component to each other, a coating metal containing Cu or Ni as a main component is coated between the two members. Further, a metal powder containing Cu or Ni as a main component is interposed between both members. Therefore, both members are firmly joined by the highly surface-active metal powder, as described above. Moreover, both members and the metal powder are heated at 300 to 700° C. under pressure. Therefore, similarly to the above, both members and the metal powder can be solid-phase sintered at a relatively low temperature. Therefore, similarly to the above, it is possible to join joining members with excellent joining strength at a relatively low temperature.
【００１５】[0015]
【実施例】実施例１〜実施例５，比較例１本発明の実施
例にかかる接合部材及び接合方法につき，図１〜図３を
用いて説明する。即ち，本例の接合部材は，図１，図２
に示すごとく，セラミックス部材２と金属部材２１とを
，金属粉末１１からなる固相焼結層１を介して接合した
ものである。以下，実施例１にかかる接合部材及びその
接合方法につき，主として説明する。[Examples] Examples 1 to 5, Comparative Example 1 Bonding members and bonding methods according to embodiments of the present invention will be described with reference to FIGS. 1 to 3. That is, the joining member of this example is as shown in FIGS. 1 and 2.
As shown in the figure, a ceramic member 2 and a metal member 21 are joined via a solid phase sintered layer 1 made of metal powder 11. The joining member and the joining method thereof according to Example 1 will be mainly explained below.
【００１６】上記金属粉末１１は，その平均粒径が約１
μｍのＣｕ微粉末からなる。また，上記セラミックス部
材２は，ホウケイ酸系ガラスとアルミナとの混合粉末か
らなるセラミックス基板である。該セラミックス基板は
，厚みが約５ｍｍで，直径が約２０．５ｍｍの円盤状の
焼結体からなる。また，該セラミックス基板の表面には
，Ｃｕメタライズ膜の被覆金属３が形成してある。また
，上記金属部材２１は，コバール（Ｆｅ５４％，Ｎｉ２
９％，Ｃｏ１７％）合金からなる金属部材よりなる。
そして，該金属部材２１は，直径が１３．５ｍｍで，そ
の全面にスパッタリングにより形成したＣｕメタライズ
膜からなる被覆金属３１をコーティングしてある。また
，該金属部材２１は，上記セラミックス部材２と同様の
厚み５ｍｍを有する。The metal powder 11 has an average particle size of about 1
Consists of μm Cu fine powder. The ceramic member 2 is a ceramic substrate made of a mixed powder of borosilicate glass and alumina. The ceramic substrate is a disc-shaped sintered body with a thickness of about 5 mm and a diameter of about 20.5 mm. Furthermore, a metal coating 3 made of a Cu metallized film is formed on the surface of the ceramic substrate. Further, the metal member 21 is made of Kovar (Fe54%, Ni2
9%, Co17%) alloy. The metal member 21 has a diameter of 13.5 mm, and its entire surface is coated with a metal coating 31 made of a Cu metallized film formed by sputtering. Further, the metal member 21 has a thickness of 5 mm, similar to the ceramic member 2 described above.
【００１７】次に，上記固相焼結層１につき，これを詳
述する。即ち，上記固相焼結層１は，上記金属粉末１１
を固相焼結して形成したものである。該Ｃｕ微粉末は，
図３に示すごとく，上記固相焼結層１において強固なネ
ック１２を形成するよう，その粒径が略均一となるよう
調整してある。ここにいうネック１２とは，Ｃｕ微粉末
の相隣接する粒子間に生じた焼き付きによる「くびれ」
をいう。そして，このネック１２は，Ｃｕ微粉末の各粒
子径，形状が均一となるよう調整することにより，可及
的に大きくできる。上記接合部材は，次の方法により接
合する。まず，上記ホウケイ酸系ガラス（ＣａＯ−Ａｌ
２ Ｏ３ −ＳｉＯ２ −Ｂ２ Ｏ５ ）粉末６０重量
部と，アルミナ（Ａｌ２ Ｏ３ ）粉末４０重量部との
混合材料からなるグリーンシートを，ドクターブレード
法により準備する。Next, the solid phase sintered layer 1 will be explained in detail. That is, the solid phase sintered layer 1 has the metal powder 11
It is formed by solid phase sintering. The Cu fine powder is
As shown in FIG. 3, in order to form a strong neck 12 in the solid phase sintered layer 1, the grain size is adjusted to be approximately uniform. The neck 12 referred to here is a "constriction" caused by seizure between adjacent particles of Cu fine powder.
means. The neck 12 can be made as large as possible by adjusting the diameter and shape of each particle of the fine Cu powder to be uniform. The above joining members shall be joined by the following method. First, the above borosilicate glass (CaO-Al
A green sheet made of a mixed material of 60 parts by weight of 2O3-SiO2-B2O5) powder and 40 parts by weight of alumina (Al2O3) powder is prepared by a doctor blade method.
【００１８】次に，上記グリーンシート上には，Ｃｕ粉
末を含有するペースト膜を印刷する。該ペースト膜は，
図１，図５に示すごとく，焼結することにより，上記Ｃ
ｕメタライズ膜の厚さ２μｍの被覆金属３になる。また
，被覆金属３１はスパッタでＣｕを２ｍｍ形成する。
また，上記部材２１は，上記コバール合金からなる円盤
状の金属部材よりなる。図１に示すごとく，両部材２，
２１の間に，上記Ｃｕ微粉末からなる金属粉末１１を配
置し，積層する。また，Ｃｕ微粉末は，総量が約０．１
ｇである。Next, a paste film containing Cu powder is printed on the green sheet. The paste film is
As shown in Figures 1 and 5, the above C
The coating metal 3 of the u metallized film has a thickness of 2 μm. Further, the covering metal 31 is formed by sputtering Cu to a thickness of 2 mm. Further, the member 21 is a disc-shaped metal member made of the Kovar alloy. As shown in Fig. 1, both members 2,
The metal powder 11 made of the Cu fine powder is placed between the two layers 21 and laminated. In addition, the total amount of Cu fine powder is approximately 0.1
It is g.
【００１９】そして，図２に示すごとく，上記両部材２
，２１及び金属粉末１１からなる積層物を，加圧下で焼
結する。上記焼結は，１０−１Ｐａ以下の真空中で，５
５０ｋｇｆ／ｃｍ２ の加圧下において，５５０℃の比
較的低温で６０分間行う。なお，実施例１及び実施例２
〜５にかかる焼成条件については，表１に示した。また
，上記５５０℃の焼結温度は，その焼結温度中の最高温
度を示したものである。また，この時の昇温速度は，２
０℃／分である。これにより，前記図２，図３に示した
接合材を得た。なお，上記金属部材２１に代えて，セラ
ミックス基材とすることができる。次に，上記複合材に
つき，剪断強度（ｋｇｆ／ｃｍ２ ）を測定して，接合
強度の評価を行った。その測定結果及び構成部材等につ
いては，表１に示した。Then, as shown in FIG. 2, both of the above members 2
, 21 and metal powder 11 is sintered under pressure. The above sintering is performed in a vacuum of 10-1 Pa or less.
The test is carried out at a relatively low temperature of 550°C for 60 minutes under a pressure of 50 kgf/cm2. In addition, Example 1 and Example 2
The firing conditions for items 5 to 5 are shown in Table 1. Further, the sintering temperature of 550° C. above indicates the highest temperature among the sintering temperatures. Also, the temperature increase rate at this time is 2
0°C/min. As a result, the bonding material shown in FIGS. 2 and 3 was obtained. Note that the metal member 21 may be replaced with a ceramic base material. Next, the shear strength (kgf/cm2) of the composite material was measured to evaluate the bonding strength. The measurement results and constituent members are shown in Table 1.
【００２０】次に，実施例２〜５の製造条件の概要及び
比較例１につき，表１を用いて説明する。同表において
，実施例２の接合部材は，上記実施例１と同様の構成で
ある。また，実施例３〜５の接合部材は，金属部材とし
てＮｉメッキ被覆金属膜を有するコバール片（図１中符
号２１，３１）とした外は，上記実施例１の接合部材と
同様の構成である。また，焼成条件は，同表に示した通
りである。また，比較例１は，金属部材として，被覆金
属を有しないコバール片を用いた。また，金属粉末とし
て，粒径が１．０μｍのＣｕ粉末を用いた。そして，セ
ラミックス部材として，上記実施例１と同様のセラミッ
クス基板を用いた。その他は，実施例１と同様である。Next, an outline of the manufacturing conditions of Examples 2 to 5 and Comparative Example 1 will be explained using Table 1. In the same table, the joining member of Example 2 has the same structure as that of Example 1 described above. The joining members of Examples 3 to 5 had the same structure as the joining member of Example 1, except that the metal members were Kovar pieces (reference numerals 21 and 31 in FIG. 1) having a Ni-plated metal film. be. Furthermore, the firing conditions are as shown in the same table. Moreover, in Comparative Example 1, a Kovar piece without a coating metal was used as the metal member. Moreover, Cu powder with a particle size of 1.0 μm was used as the metal powder. The same ceramic substrate as in Example 1 was used as the ceramic member. The rest is the same as in the first embodiment.
【００２１】表１における剪断強度に関し，本発明の実
施例１〜５は，２９０〜４６０ｋｇｆ／ｃｍ２ である
。
そして，このときの破壊モードである破断面は，セラミ
ックス部材２におけるセラミックス基板破壊であった。
これに対し，比較例１は，８０ｋｇｆ／ｃｍ２ であり
，破壊モードが上記固相焼結層１と部材２１としてのコ
バール片との間の界面破壊であった。それ故，実施例１
〜５は，いずれも接合強度が，比較例１に比し，著しく
優れていることが知られる。なお，上記剪断強度は，速
度０．５ｍｍ／分で引っ張ったときの測定値である。こ
のように，本発明の実施例１〜５が，比較例１よりも接
合強度が優れている理由としては，次のように考えられ
る。Regarding the shear strength in Table 1, Examples 1 to 5 of the present invention are 290 to 460 kgf/cm2. The fracture surface, which was the fracture mode at this time, was a ceramic substrate fracture in the ceramic member 2. On the other hand, in Comparative Example 1, the force was 80 kgf/cm2, and the failure mode was interface failure between the solid phase sintered layer 1 and the Kovar piece as the member 21. Therefore, Example 1
It is known that all of Samples Nos. 5 to 5 have significantly superior bonding strength compared to Comparative Example 1. Note that the above shear strength is a measured value when pulled at a speed of 0.5 mm/min. The reason why Examples 1 to 5 of the present invention are superior in bonding strength to Comparative Example 1 is considered to be as follows.
【００２２】即ち，本例の接合部材においては，セラミ
ックス部材とセラミックス部材，セラミックス部材と金
属部材の各部材を互いに接合する固相焼結層を，粒径が
０．１〜１０μｍのＣｕ又はＮｉを主成分とする金属粉
末を用いて形成してある。この様に，粒径が比較的微粒
子であるため，かかる金属粉末の表面は高活性となる。
そのため，該金属粉末を焼結するに当たっては，比較的
低温で固相焼結することができるものと推察される。ま
た，上記固相焼結層１においては，従来のごとく，接合
部分の溶融に起因するリードフレーム等の断線を生ずる
ことがない。また，上記Ｃｕ微粉末は，その熱膨張係数
が１６．８〜１７．７×１０−６／℃である。これに対
し，上記セラミックス，例えばガラスとセラミックスの
混合部材は，上記熱膨張係数が５〜１０×１０−６／℃
である。また，上記金属としてコバール片（図１中の部
材２１）は，上記熱膨張係数がガラスと略同等の５．５
〜６．５×１０−６／℃である。That is, in the joining member of this example, the solid phase sintered layer that joins the ceramic members and the ceramic members and the ceramic member and the metal member to each other is made of Cu or Ni with a particle size of 0.1 to 10 μm. The main component is metal powder. As described above, since the particle size is relatively fine, the surface of such metal powder becomes highly active. Therefore, when sintering the metal powder, it is presumed that solid phase sintering can be performed at a relatively low temperature. Further, in the solid-phase sintered layer 1, there is no disconnection of the lead frame or the like due to melting of the bonded portion, unlike in the conventional case. Further, the Cu fine powder has a coefficient of thermal expansion of 16.8 to 17.7 x 10-6/°C. On the other hand, the above ceramics, for example, a mixed member of glass and ceramics, have a coefficient of thermal expansion of 5 to 10 x 10-6/°C.
It is. In addition, the Kovar piece (member 21 in FIG. 1) as the metal has a coefficient of thermal expansion of 5.5, which is approximately the same as glass.
~6.5x10-6/°C.
【００２３】そのため，セラミックス部材とセラミック
ス部材，セラミックス部材と金属部材（コバール片）か
らなる各部材を，互いに熱膨張差のない固相焼結層１に
より，容易に接合することができるものと推察される。
即ち，上記金属粉末は，Ｃｕであるため，上記各被覆金
属３，３１との「なじみ」が良く，熱膨張差が少なくな
るよう構成されている。そのため，表１に示すごとく，
上記固相焼結層１は強固となり，優れた剪断強度を得る
ことができる。[0023] Therefore, it is inferred that each member consisting of a ceramic member and a ceramic member, or a ceramic member and a metal member (Kovar piece) can be easily joined by the solid phase sintered layer 1 having no difference in thermal expansion. be done. That is, since the metal powder is Cu, it is configured to have good "compatibility" with each of the coating metals 3 and 31, and to reduce the difference in thermal expansion. Therefore, as shown in Table 1,
The solid phase sintered layer 1 becomes strong and can obtain excellent shear strength.
【００２４】[0024]
【表１】[Table 1]
【００２５】実施例６〜１０
本例の接合部材は，金属部材同士を接合するもので，図
４，図５に示すごとく，実施例１〜５における金属部材
としてのコバール片に代えて，コバール製のピン（コバ
ールピン）としたものである。即ち，上記金属部材とし
てのコバールピン４は，図４，図５に示すごとく，先端
部にφ０．８ｍｍの略円形のツバ部４１を有する。また
，上記コバールピン４は，その全面にＣｕスパッタ被覆
金属膜３２を有する。また，該コバールピン４は，細長
棒状の円柱形を有する。Examples 6 to 10 The joining members of the present examples are for joining metal members together, and as shown in FIGS. 4 and 5, Kovar pieces were used instead of Kovar pieces as the metal members in Examples 1 to 5. It is a manufactured pin (Kovar pin). That is, as shown in FIGS. 4 and 5, the Kovar pin 4 as the metal member has a substantially circular collar portion 41 with a diameter of 0.8 mm at its tip. Further, the Kovar pin 4 has a Cu sputter coated metal film 32 on its entire surface. Further, the Kovar pin 4 has a cylindrical shape in the form of an elongated rod.
【００２６】また，表２に示すごとく，セラミックス部
材として，上記実施例１におけるセラミックス部材２と
同様のセラミックス基板を用いる。また，金属粉末とし
て，上記実施例１における金属粉末１１と同様のＣｕ微
粉末を用いる。その他，焼成条件としての焼結温度（℃
），焼成時間（分），加圧条件が若干異なる外は，実施
例１と同様の構成である。なお，図４，図５において，
符号３３はＮｉメッキ膜，３４はＣｕメッキ膜を示す。
表２より知られるごとく，引張強度（ｋｇ／ｐｉｎ）に
関し，実施例６〜１０は，５，１２〜７，４１ｋｇ／ｐ
ｉｎである。このように，本例にかかる接合部材は，い
ずれも接合強度としての引張り強度に優れていることが
知られる。この様に実施例６〜１０が引張り強度に優れ
ている理由としては，次のように考えられる。なお，上
記ｋｇ／ｐｉｎとは，１つのｐｉｎを垂直に引っ張って
基板から破断する時の強度のことを意味する。Further, as shown in Table 2, a ceramic substrate similar to the ceramic member 2 in Example 1 is used as the ceramic member. Further, as the metal powder, Cu fine powder similar to the metal powder 11 in Example 1 is used. In addition, the sintering temperature (°C
), firing time (minutes), and pressurizing conditions were slightly different, but the configuration was the same as in Example 1. In addition, in Figures 4 and 5,
Reference numeral 33 indicates a Ni plating film, and numeral 34 indicates a Cu plating film. As is known from Table 2, regarding the tensile strength (kg/pin), Examples 6 to 10 have a tensile strength of 5,12 to 7,41 kg/pin.
It is in. As described above, it is known that all of the bonding members according to this example have excellent tensile strength as bonding strength. The reason why Examples 6 to 10 are excellent in tensile strength is considered to be as follows. Note that the above kg/pin refers to the strength when one pin is pulled vertically and broken from the substrate.
【００２７】即ち，上記接合部材，接合方法においては
，金属又はセラミックスからなる部材を互いに接合する
に当たり，両部材の表面にＣｕ又はＮｉを主成分とする
被覆金属をコーティングしている。また，該両部材の間
には，上記両部材と同様に，Ｃｕ又はＮｉを主成分とす
る金属粉末を介在させてある。したがって，両部材は，
これらの間に熱膨張による熱歪を生じない。そのため，
上記両部材は，上記金属粉末によって強固に接合される
ことになるものと推察される。また，両部材と金属粉末
とは，加圧下で５５０〜６５０℃において加熱される。
そのため，上記部材と金属粉末とは，これらの融点以下
の比較的低温で固相焼結することができる。該固相焼結
は，被焼結物の融点以下の温度で加熱して，該被焼結物
を焼き固める，有効な手段となる。また，上記固相焼結
は，加圧下で行われる。そのため，上記金属粉末からな
る固相焼結層は強固となり，優れた接合強度としての引
張強度を得ることができる。That is, in the above joining member and joining method, when joining members made of metal or ceramics to each other, the surfaces of both members are coated with a coating metal containing Cu or Ni as a main component. Furthermore, metal powder containing Cu or Ni as a main component is interposed between the two members, similar to the above-mentioned two members. Therefore, both members are
No thermal distortion occurs between them due to thermal expansion. Therefore,
It is presumed that the two members are firmly joined by the metal powder. Moreover, both members and the metal powder are heated at 550 to 650° C. under pressure. Therefore, the above member and the metal powder can be solid-phase sintered at a relatively low temperature below their melting points. The solid-phase sintering is an effective means of baking and hardening the sintered object by heating it at a temperature below the melting point of the sintered object. Further, the solid phase sintering described above is performed under pressure. Therefore, the solid-phase sintered layer made of the metal powder becomes strong and can provide excellent tensile strength as bonding strength.
【００２８】[0028]
【表２】[Table 2]
【００２９】実施例１１
本例は，図６，図７に示すごとく，金属部材相互を接合
するものである。即ち，同図に示すごとく，金属部材と
して，被覆金属を有しない直径が１３．５ｍｍで厚みが
５ｍｍの金属部材５１と，直径が２０．５ｍｍで厚みが
５ｍｍの金属部材５２とを用いる。上記金属部材５１，
５２は，純粋なＣｕ部材により構成してある。そして，
図６に示すごとく，上記実施例１と同様に，上記金属部
材５１，５２間に金属粉末１を配置する。次に，上記金
属部材５１，５２を下記の焼成条件により，固相焼結し
た。Embodiment 11 In this embodiment, metal members are joined together as shown in FIGS. 6 and 7. That is, as shown in the figure, a metal member 51 with a diameter of 13.5 mm and a thickness of 5 mm without coating metal and a metal member 52 with a diameter of 20.5 mm and a thickness of 5 mm are used. The metal member 51,
52 is made of pure Cu material. and,
As shown in FIG. 6, metal powder 1 is placed between the metal members 51 and 52, as in the first embodiment. Next, the metal members 51 and 52 were solid phase sintered under the following firing conditions.
【００３０】即ち，図７に示すごとく，真空中で７０ｋ
ｇｆ／ｃｍ２ の加圧下で，３００〜７００℃の被覆金
属で６０分間焼成した。このようにして，固相焼結した
金属部材同士の接合部材につき，剪断強度を測定した。
その結果を，図８に示す。一方，比較例２として，上記
金属部材５１，５２を，金属粉末を用いることなしに，
直接接合をした。そして，この比較例２についても，剪
断強度を測定した。その結果を，図８に示す。That is, as shown in FIG. 7, 70k in vacuum
The coated metal was fired for 60 minutes at 300-700°C under a pressure of gf/cm2. In this way, the shear strength of the bonded member between solid-phase sintered metal members was measured. The results are shown in Figure 8. On the other hand, as Comparative Example 2, the metal members 51 and 52 were prepared without using metal powder.
I made a direct connection. The shear strength of Comparative Example 2 was also measured. The results are shown in Figure 8.
【００３１】なお，上記実施例１〜５のいずれにおいて
も，図８に示した剪断強度と同様に，焼成温度が３００
℃付近で上記剪断強度が向上し，比較例２に比し著しく
接合強度が優れていた。なお，比較例２については，焼
結温度が６００℃以上において剪断強度が向上するのみ
である。このように，本発明の実施例１１が，比較例２
よりも，著しく剪断強度が優れている理由としては，次
のように考えられる。即ち，Ｃｕ微粉末の金属部材２枚
を互いに接合するに当たって，両部材の間にＣｕを主成
分とする金属粉末を介在させている。そのため，両部材
は，上記と同様に，金属粉末によって強固に接合される
ことになるものと推察される。また，両部材と金属粉末
とは，加圧下で３００〜７００℃において加熱される。
そのため，上記と同様に，両部材と金属粉末とを，比較
的低温で固相焼結することができる。したがって，上記
と同様に，比較的低温で，接合強度に優れた接合部材を
接合することができる。[0031] In any of Examples 1 to 5 above, the firing temperature was 300°C, similar to the shear strength shown in Figure 8.
The above-mentioned shear strength improved near ℃, and the bonding strength was significantly superior to that of Comparative Example 2. Note that in Comparative Example 2, the shear strength only increases when the sintering temperature is 600° C. or higher. In this way, Example 11 of the present invention is different from Comparative Example 2.
The reason why the shear strength is significantly superior to that of the steel is thought to be as follows. That is, when joining two metal members made of fine Cu powder to each other, metal powder containing Cu as a main component is interposed between the two members. Therefore, it is presumed that both members will be firmly joined by the metal powder, similar to the above. Moreover, both members and the metal powder are heated at 300 to 700° C. under pressure. Therefore, similarly to the above, both members and the metal powder can be solid-phase sintered at a relatively low temperature. Therefore, similarly to the above, it is possible to join joining members with excellent joining strength at a relatively low temperature.
【図１】実施例１における部材の接合方法を示す断面図
。FIG. 1 is a cross-sectional view showing a method of joining members in Example 1.
【図２】実施例１にかかる接合部材の断面図。FIG. 2 is a sectional view of a joining member according to Example 1.
【図３】実施例１にかかる接合部材の接合状態を示す断
面図。FIG. 3 is a cross-sectional view showing a joined state of the joining member according to Example 1.
【図４】実施例６〜１０における部材の接合方法を示す
断面図。FIG. 4 is a cross-sectional view showing a method of joining members in Examples 6 to 10.
【図５】実施例６〜１０にかかる接合部材の断面図。FIG. 5 is a sectional view of a joining member according to Examples 6 to 10.
【図６】実施例１１における部材の接合方法を示す断面
図。FIG. 6 is a cross-sectional view showing a method of joining members in Example 11.
【図７】実施例１１における接合部材の断面図。FIG. 7 is a sectional view of a joining member in Example 11.
【図８】実施例１１における焼結温度と剪断強度との関
係を示すグラフ。FIG. 8 is a graph showing the relationship between sintering temperature and shear strength in Example 11.
【図９】従来例にかかる接合部材の断面図。FIG. 9 is a sectional view of a joining member according to a conventional example.
１．．．固相焼結層， １１．．．金属粉末， ２．．．セラミックス部材， ２１．．．金属部材， ３．．．被覆金属， ４．．．コバールピン， ５１，５２．．．金属部材， 1. ．． ．． solid phase sintered layer, 11. ．． ．． metal powder, 2. ．． ．． ceramic parts, 21. ．． ．． metal parts, 3. ．． ．． coated metal, 4. ．． ．． Kovar pin, 51, 52. ．． ．． metal parts,
Claims (3)
金属粉末の固相焼結層を介して接合してなり，上記金属
粉末は，０．１〜１０μｍのＣｕ又はＮｉを主成分とす
る粉末であることを特徴とする接合部材。[Claim 1] A member made of metal or ceramics is joined through a solid-phase sintered layer of metal powder, and the metal powder is a powder whose main component is Cu or Ni with a diameter of 0.1 to 10 μm. A joining member characterized by:
互いに接合するに当たり，両部材の表面にＣｕ又はＮｉ
を主成分とする被覆金属をコーティングし，その後両部
材の間にＣｕ又はＮｉを主成分とする金属粉末を介在さ
せ，これらを加圧下で３００〜７００℃において加熱し
て上記金属粉末を固相焼結すると共に，両部材を接合す
ることを特徴とする金属又はセラミックスからなる部材
の接合方法。[Claim 2] When joining members made of metal or ceramics to each other, the surfaces of both members are coated with Cu or Ni.
After that, a metal powder mainly composed of Cu or Ni is interposed between both members, and these are heated at 300 to 700°C under pressure to turn the metal powder into a solid phase. A method for joining parts made of metal or ceramics, characterized by sintering and joining both parts.
いに接合するに当たり，両部材の間にＣｕ又はＮｉを主
成分とする金属粉末を介在させ，これらを加圧下で３０
０〜７００℃において加熱して上記金属粉末を固相焼結
すると共に，両部材を接合することを特徴とする金属又
はセラミックスからなる部材の接合方法。[Claim 3] When joining members containing Cu or Ni as a main component, a metal powder containing Cu or Ni as a main component is interposed between the two members, and these are bonded under pressure for 30 minutes.
A method for joining members made of metal or ceramics, characterized in that the metal powder is solid-phase sintered by heating at 0 to 700°C, and both members are joined.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3087915A JPH04300259A (en) | 1991-03-27 | 1991-03-27 | Joining member and joining |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3087915A JPH04300259A (en) | 1991-03-27 | 1991-03-27 | Joining member and joining |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04300259A true JPH04300259A (en) | 1992-10-23 |
Family
ID=13928220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3087915A Pending JPH04300259A (en) | 1991-03-27 | 1991-03-27 | Joining member and joining |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04300259A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000335983A (en) * | 1999-05-28 | 2000-12-05 | Denki Kagaku Kogyo Kk | Production of conjugate |
| JP2009146912A (en) * | 2009-03-27 | 2009-07-02 | Jsr Corp | Anisotropic conductive sheet, and electrical inspection method and electrical connection method using the same |
| JP2009177084A (en) * | 2008-01-28 | 2009-08-06 | Mutsuki Denki Kk | Electronic device and method of manufacturing the same |
| JP2014043382A (en) * | 2012-08-27 | 2014-03-13 | Toyota Central R&D Labs Inc | Semiconductor device and method of manufacturing the same |
-
1991
- 1991-03-27 JP JP3087915A patent/JPH04300259A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000335983A (en) * | 1999-05-28 | 2000-12-05 | Denki Kagaku Kogyo Kk | Production of conjugate |
| JP2009177084A (en) * | 2008-01-28 | 2009-08-06 | Mutsuki Denki Kk | Electronic device and method of manufacturing the same |
| JP2009146912A (en) * | 2009-03-27 | 2009-07-02 | Jsr Corp | Anisotropic conductive sheet, and electrical inspection method and electrical connection method using the same |
| JP2014043382A (en) * | 2012-08-27 | 2014-03-13 | Toyota Central R&D Labs Inc | Semiconductor device and method of manufacturing the same |
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