JPS60262435A - Supplying device of bonding wire in semiconductor fabricating apparatus - Google Patents
Supplying device of bonding wire in semiconductor fabricating apparatusInfo
- Publication number
- JPS60262435A JPS60262435A JP11793484A JP11793484A JPS60262435A JP S60262435 A JPS60262435 A JP S60262435A JP 11793484 A JP11793484 A JP 11793484A JP 11793484 A JP11793484 A JP 11793484A JP S60262435 A JPS60262435 A JP S60262435A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- sensor
- bonding
- maintain
- bonding wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
Landscapes
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はボンディング装置にワイヤーを供給するボンデ
ィングワイヤー供給装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a bonding wire supply device for supplying wire to a bonding device.
この種のボンディングワイヤー供給装置はボンディング
時のワイヤーの緊張による切断を防止するために、スプ
ールからワイヤーを余分に繰り出してたるみをもだせつ
つ供給される。This type of bonding wire supply device feeds the wire while unwinding the wire from the spool to prevent the wire from being cut due to tension during bonding.
ところで、従来のボンディングワイヤー供給装置では、
供給ワイヤーの有無を検知するには、一定距離を置いて
ワイヤーの２点間に接触子を接触させ、固接触子間の導
通を検知することによって行っていた。By the way, in the conventional bonding wire supply device,
The presence or absence of a supply wire has been detected by placing a contact between two points of the wire at a certain distance and detecting continuity between the solid contacts.
しかし、実際上、細いワイヤーの２点間に接触子を確実
に接触させた状態を保つことはむずかしいという問題が
あった。However, in practice, there is a problem in that it is difficult to maintain the contact between two points of the thin wire reliably.
本発明は前記問題点を解消し、光学的に供給ワイヤーの
有無を検知し、しかも無理なくワイヤーを供給できるボ
ンディングワイヤー供給装置を提供するものである。The present invention solves the above-mentioned problems and provides a bonding wire supply device that can optically detect the presence or absence of a supply wire and can supply the wire easily.
すなわち、本発明は一定長のたるみをもたせつつワイヤ
ーをボンディング装置に供給するボンデインクワイヤー
供給装置において、ワイヤーに照射した光の反射光を受
けてワイヤーの有無を検出するセンサーをワイヤーの通
路に設け、かつ気体圧力をワイヤーに作用させて該ワイ
ヤーのセンサーに対する通過姿勢を一定に保たせる気体
吹き出しノズルを備えだことを特徴とする半導体組立装
置におけるボンディングワイヤー供給装置である。That is, the present invention provides a bonding ink wire supply device that supplies a wire to a bonding device with a certain length of slack, and a sensor is provided in the wire path to detect the presence or absence of the wire by receiving reflected light from the light irradiated on the wire. , and a gas blowing nozzle that applies gas pressure to the wire to maintain a constant posture of the wire passing through the sensor.
以下に、本発明の一実施例を図により説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第１図に示すように、スプール３の周面に巻回されたワ
イヤー６は供給モータ４・の、駆動によりスプール３よ
り繰り出され、一定間隔をおいて設置された２つのガイ
ド２，２を経てボンディング装置（図示略）に供給され
る。ワイヤー６は両ガイド２．２間にたるみが形成され
ている。As shown in FIG. 1, the wire 6 wound around the circumferential surface of the spool 3 is fed out from the spool 3 by the drive of the supply motor 4, and passes through two guides 2, 2 installed at a constant interval. It is then supplied to a bonding device (not shown). The wire 6 has a slack formed between the two guides 2.2.
本発明は２つのガイド２，２間に形成されるワイヤーの
通路に対応して、たるみをもつワイヤー６ａに光を照射
し、ワイヤー６ａからの反射光を検出する光フアイバセ
ンサー１を配設するとともに、ワイヤー６ａの上方に気
体を吹き付けることによりたるみをもつワイヤー６ａを
強制的に緊張させる気体吹き出しノズル５を下向きに設
置したものである。The present invention provides an optical fiber sensor 1 that irradiates light onto a slack wire 6a and detects reflected light from the wire 6a, corresponding to the wire path formed between the two guides 2, 2. At the same time, a gas blowing nozzle 5 is installed downward to forcibly tighten the slack wire 6a by blowing gas above the wire 6a.
本発明においては、ファイバセンザーｌの垂直方向より
ノズル５を通してエアーをたるみをもつワイヤー６ａに
吹き付は一該ワイヤー６ａを強制的に緊張させ、センサ
ー１の下方の一定の走行位置に保持させ、光フアイバセ
ンサー１より光をワイヤー ６ａ ＩＩＣ向けて照射し
、ワイヤー６ａからの反射光の有無を検知することによ
って、供給ワイヤー６ａの有無を監視する。In the present invention, air is blown onto the slack wire 6a from the vertical direction of the fiber sensor 1 through the nozzle 5, so that the wire 6a is forcibly tensed and held at a constant running position below the sensor 1. The presence or absence of the supply wire 6a is monitored by emitting light from the optical fiber sensor 1 toward the wire 6a IIC and detecting the presence or absence of reflected light from the wire 6a.
本発明は以上のように、光学的反射を利用して供給ワイ
ヤーの有無を検知するため、無接触で確実に検出できる
。As described above, the present invention utilizes optical reflection to detect the presence or absence of a supply wire, so that it can be detected reliably without contact.
まだ、ワイヤーにエアーを吹付けてワイヤーのたるみを
強制的に緊張状態に保たせるため、センサに対する関係
位置を一定に保つことができ、さ ）らに、センサーの
検知信号を利用してモータの回転を制御することにより
、ワイヤーのたるみを一定に保ちつつ途中で切断すると
となくワイヤーボンディング部へ供給することができ、
したがってボンディング時のワイヤー抜は或いは切断事
故等の発生を阻止して５００ｍ巻或いは１０００ｍ巻等
の長巻きのワイヤーを容易に使用できる効果を有するも
のである。However, by blowing air onto the wire to forcibly keep the slack in the wire taut, the relative position relative to the sensor can be kept constant; By controlling the rotation, it is possible to keep the slack of the wire constant and feed it to the wire bonding part without cutting it midway.
Therefore, it is possible to easily use a long wire such as a 500 m winding or a 1000 m winding by preventing the wire from being pulled out or cutting accidents during bonding.
第１図は本発明の一実施例を示す斜視図である。
１・光フアイバセンサー、２・・・ガイド、３・・・ス
プール、 ４１ 供給モータ、５ ・ノズル、６，６ａ
・・・ワイヤー。
特許出願人 九州日本電気株式会社FIG. 1 is a perspective view showing an embodiment of the present invention. 1. Optical fiber sensor, 2... Guide, 3... Spool, 41 Supply motor, 5. Nozzle, 6, 6a
···wire. Patent applicant Kyushu NEC Co., Ltd.
Claims (1)
グ装置に供給するボンディングワイヤー供給装置におい
て、ワイヤーに照射した光の反射光を受けてワイヤーの
有無を検出するセンサーをワイヤーの通路に設け、かつ
気体圧力をワイヤーに作用させて該ワイヤーのセンサー
に対する通過姿勢を一定に保たせる気体吹出しノズルを
備えたことを特徴とする半導体組立装置におけるボンデ
ィングワイヤー供給装置。(1) In the bonding wire supply device that supplies the wire to the bonding device while creating a certain amount of slack, a sensor is installed in the wire path to detect the presence or absence of the wire by receiving the reflected light from the light irradiated on the wire, and 1. A bonding wire supply device for a semiconductor assembly device, comprising a gas blowing nozzle that applies pressure to the wire to maintain a constant posture of the wire passing through the sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11793484A JPS60262435A (en) | 1984-06-08 | 1984-06-08 | Supplying device of bonding wire in semiconductor fabricating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11793484A JPS60262435A (en) | 1984-06-08 | 1984-06-08 | Supplying device of bonding wire in semiconductor fabricating apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60262435A true JPS60262435A (en) | 1985-12-25 |
Family
ID=14723822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11793484A Pending JPS60262435A (en) | 1984-06-08 | 1984-06-08 | Supplying device of bonding wire in semiconductor fabricating apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60262435A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02122637A (en) * | 1988-11-01 | 1990-05-10 | Shinkawa Ltd | Wire bonding apparatus |
| JPH0459140U (en) * | 1990-09-18 | 1992-05-21 | ||
| US5233265A (en) * | 1986-07-04 | 1993-08-03 | Hitachi, Ltd. | Photoconductive imaging apparatus |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5258949A (en) * | 1975-11-11 | 1977-05-14 | Hagiwara Denki Kk | Photoelectric position detector |
| JPS5572049A (en) * | 1978-11-27 | 1980-05-30 | Nec Corp | Wire bonding device |
| JPS58155778A (en) * | 1982-03-10 | 1983-09-16 | Ricoh Co Ltd | Photosensor |
-
1984
- 1984-06-08 JP JP11793484A patent/JPS60262435A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5258949A (en) * | 1975-11-11 | 1977-05-14 | Hagiwara Denki Kk | Photoelectric position detector |
| JPS5572049A (en) * | 1978-11-27 | 1980-05-30 | Nec Corp | Wire bonding device |
| JPS58155778A (en) * | 1982-03-10 | 1983-09-16 | Ricoh Co Ltd | Photosensor |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5233265A (en) * | 1986-07-04 | 1993-08-03 | Hitachi, Ltd. | Photoconductive imaging apparatus |
| JPH02122637A (en) * | 1988-11-01 | 1990-05-10 | Shinkawa Ltd | Wire bonding apparatus |
| JPH088271B2 (en) * | 1988-11-01 | 1996-01-29 | 株式会社新川 | Wire bonding equipment |
| JPH0459140U (en) * | 1990-09-18 | 1992-05-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4695007A (en) | Apparatus for continuously supplying sheets from supply rolls | |
| JPS60262435A (en) | Supplying device of bonding wire in semiconductor fabricating apparatus | |
| US5918829A (en) | Apparatus for winding a thread onto a bobbin | |
| JP4781788B2 (en) | Wire feeder | |
| JP2020070144A (en) | Feeding device for linear body | |
| KR0168627B1 (en) | Tension control device | |
| JPH07276218A (en) | Wire type cutting device | |
| JP3651257B2 (en) | Mechanism for detecting the separation of the wire from the pulley in the tension measuring section of the wire rewinding device | |
| JP3644578B2 (en) | Wire bonder automatic wire feeder | |
| JP2003181633A (en) | Method and device for soldering | |
| JP3324217B2 (en) | Common traverse device for supply and winder | |
| JP2513442Y2 (en) | Wire feeder for wire bonding machine | |
| JP2003206071A (en) | Filament winding device | |
| US3952591A (en) | Machine for cleaning and inspecting motion picture films | |
| KR100273237B1 (en) | Wire feeder for wire bonding process of semiconductor package | |
| JPS60234734A (en) | Feeding device of ropy body | |
| JP2966374B2 (en) | Fishing line winding device | |
| JPH0873092A (en) | Slitter | |
| JP3641198B2 (en) | Fishing line unit and fishing line winding device | |
| JPH08235823A (en) | Magnetic tape take-up device | |
| JPH05283464A (en) | Wire feeding device | |
| JPH0521504A (en) | Wire feeding method in wire bonding device | |
| JPH0774202A (en) | Apparatus and method for wire bonding | |
| US4920274A (en) | Metering apparatus and method for the measurement of a fixed length of continuous yarn or strand | |
| JPH08323610A (en) | Guide roller in wire saw |