JPS60231588A - Method of laser cutting of new ceramic - Google Patents
Method of laser cutting of new ceramicInfo
- Publication number
- JPS60231588A JPS60231588A JP59086910A JP8691084A JPS60231588A JP S60231588 A JPS60231588 A JP S60231588A JP 59086910 A JP59086910 A JP 59086910A JP 8691084 A JP8691084 A JP 8691084A JP S60231588 A JPS60231588 A JP S60231588A
- Authority
- JP
- Japan
- Prior art keywords
- laser
- workpiece
- laser beam
- axis
- new ceramics
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mining & Mineral Resources (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
発明の技術分野
本発明はニューセラミックのレーザー切削加工法に関す
る。DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to a new ceramic laser cutting method.
発明の技術的背景とその問題点
従来、ニューセラミックをレーザー加工することは既に
知られているが、それは切断加工や穴あけ加工にとどま
り、切削加工までには至っていない。レーザー加工は原
理的には、高密度の光エネルギーのレーザスポットを加
工部位に側段することにより、これを溶解乃至は溶蝕さ
せる加工法であり、これをそのまま加工物の切削に応用
することはできない。事実、ニューセラミックの切削加
工はダイヤモンドバイトによる方法に依存していいるの
が現状である。ニューセラミックは材質的機械的特性に
より加工が非常に困難であり、ダイヤモンドバイトによ
る切削でもなお能率的でないし、ダイヤモンドバイトが
高価なためコスト面でも問題が大きい。Technical Background of the Invention and Problems Theretofore, laser processing of new ceramics has already been known, but this has been limited to cutting and drilling, and has not yet reached the level of cutting. Laser processing is, in principle, a processing method in which a laser spot with high-density optical energy is applied to the processing area to melt or erode it, but it is not possible to directly apply this to cutting the workpiece. Can not. In fact, cutting of new ceramics currently relies on the method using a diamond bit. New ceramics are extremely difficult to process due to their material and mechanical properties, and even cutting with a diamond cutting tool is still inefficient, and since diamond cutting tools are expensive, there is a big problem in terms of cost.
発明の目的
そこで本発明はレーザー加工によりニューセラミックの
レーザー切削加工法、例えば表面削成り、肉べらし切削
等を工業的に確立し、それも従来のダイヤモンドバイト
による切削加工より能率よく行なうことを保証するニュ
ーセラミックのレーザー切削加工法を提供しようという
ものである。Purpose of the Invention Therefore, the present invention aims to industrially establish a new ceramic laser cutting method, such as surface grinding and meat grinding, using laser processing, and to perform it more efficiently than the conventional cutting process using a diamond cutting tool. The aim is to provide a new ceramic laser cutting method that guarantees the quality of the product.
発明の構成
本発明のニューセラミックのレーザー切削加工法は、ニ
ューセラミックの被加工面にレーザスポットの側段によ
りＸ軸方向（左右方向）或いはＹ軸方向（前後方向）に
延びる日覆条痕をそれが小さな並列ピッチの分布状態と
なるよう施した後、或いは施しつつ、該日覆条痕の施工
で上記被加工面に形成される突条を、それにその側方か
らレーザスポットを突条沿いに側段して、切断すること
を特徴としている。Structure of the Invention The laser cutting method for new ceramics of the present invention is to create shaded streaks extending in the X-axis direction (left-right direction) or Y-axis direction (front-back direction) on the processed surface of the new ceramic by the side steps of the laser spot. After applying it so that it is distributed in a small parallel pitch, or while applying it, the ridges formed on the surface to be processed by the construction of the shaded streaks are applied, and the laser spot is applied from the side along the ridges. It is characterized by being cut on the sides.
本発明において加工するニューセラミックとしては、ア
ルミナ、ジルコニア、炭化珪素、ベリリア、窒化珪素等
を代表的なものとしてあげることができる。レーザーと
しては一般的にはＣＯ２レーザーが適用できる。Typical new ceramics processed in the present invention include alumina, zirconia, silicon carbide, beryllia, and silicon nitride. As the laser, a CO2 laser is generally applicable.
発明の効果
本発明においてはレーザスポットの側段によりニューセ
ラミックの被加工面にＸ軸方向或いはＹ軸方向に延びる
日覆条痕をそれが小さな並列ピッチの分布状態となるよ
う施すので、この加工によりニューセラミックの被加工
部位は当初の面から細い突条と化せられ、従って該日覆
条痕を施した後、或いは施しつつ、その細い突条部位に
これの側方からレーザスポットを突条沿いに側段するこ
とにより、これを容易に切断することができる。Effects of the Invention In the present invention, the side steps of the laser spot are used to create sun-shading streaks extending in the X-axis direction or the Y-axis direction on the processed surface of the new ceramic so that they are distributed at small parallel pitches. As a result, the part to be processed of the new ceramic is turned into thin protrusions from the original surface, and therefore, after or while applying the shaded marks, the laser spot is struck from the side of the thin protrusions. By making side steps along the strips, it can be easily cut.
即ち、本発明によれば、ニューセラミックの被加工面を
Ｘ軸方向とＹ軸方向とについてレーザー加工することに
なり、これ等両方向の加工の複合の結果、加工原理的に
切削能を持たないレーザスポットの側段を面の切削に寄
与させ得るのである。That is, according to the present invention, the surface to be processed of the new ceramic is laser processed in the X-axis direction and the Y-axis direction, and as a result of the combination of processing in both directions, it does not have cutting ability due to the processing principle. This allows the side steps of the laser spot to contribute to cutting the surface.
斯くして本発明によれば、レーザスポットの側段に対し
加工物を適当な手段、例えば工作機械におけるような送
り手段で相対的に所要の方向に移動させて、レーザー加
工によりニューセラミックの切削加工を工業的に確立し
得るのである。Thus, according to the present invention, the new ceramic is cut by laser processing by moving the workpiece in a desired direction relative to the side of the laser spot using a suitable means, for example, a feeding means such as in a machine tool. Processing can be established industrially.
また本発明の加工法はレーザー加工であるから、それが
二方向の複合加工であるにかかわらず高速加工が可能で
あり、従来のダイヤモンドバイトによる切削加工より、
はぼ値以上の能率が得られるし、経済面でも好ましい。Furthermore, since the processing method of the present invention is laser processing, high-speed processing is possible even though it is a two-way composite processing, and it is faster than cutting using a conventional diamond cutting tool.
Efficiency exceeding the average value can be obtained, and it is also preferable from an economical point of view.
レーザー加工装置はダイヤモンドバイトのような消耗品
ではなく、半永久的な耐用性のものであり、成る期間を
経過すればレーザー加工の方がダイヤモンドバイトによ
る加工より経済的である。Laser processing equipment is not a consumable item like a diamond cutting tool, but has semi-permanent durability, and after a certain period of time, laser processing is more economical than processing using a diamond cutting tool.
実 施 例 以下、本発明の実施例を図面について説明する。Example Embodiments of the present invention will be described below with reference to the drawings.
第１．２図に実施例１を、第３．４図に実施例２を、第
５．６図に実施例３を示した。Example 1 is shown in Fig. 1.2, Example 2 is shown in Fig. 3.4, and Example 3 is shown in Fig. 5.6.
実施例ル
−ザー発振器（図示せず）よりのレーザービームをレー
ザーヘッド（１）における集光レンズ（２）で集光し、
ニューセラミックの板（或いはブロック）状加■物（３
）の被加工面にレーザスポットを側段し、加工物（３）
或いはレーザーヘッド（１）をＸ軸方向に移動させて、
該加工物を（３）の被加工面にＸ軸方向に延びる日覆条
痕（４）を刻み入れる。次いで加工物（３）或いはレー
ザーヘッド（１）をＹ軸方向に若干、移動させ、その移
動させた位置で再び加工物（３）あるいはレーザーヘッ
ド（１）をＸ軸方向に移動させて、上記日覆条痕（４）
に近接してＸ軸方向に延びる日覆条痕（４）を施す。以
下、同様にして、レーザスポットの側段により日覆条痕
（４）を加工物（３）の被加工面に全面的に施す。ここ
に加工物（３）の被加工面に日覆条痕が小さな並列ピッ
チの分布状態で施工される。次いで、上記日覆条痕（４
）の施工で加工物（３）の被加工面に形成された突条（
５）にレーザーヘッド（１）の集光レンズ（２）よりの
レーザービームを反射鏡（６）を経て側方から集光し、
加工物（３）或いはレーザーヘッド（１）を反射＃１ｔ
（６）と共にＸ軸方向に移動させ、斯くして突条（５）
の側方から突条（５）沿いに側段されるレーザスポット
により突条（５）を切断する。同様にして突条（５）を
順次切断する。Example A laser beam from a loser oscillator (not shown) is focused by a condensing lens (2) in a laser head (1),
New ceramic plate (or block) shaped addition (3
), the laser spot is placed on the surface of the workpiece (3).
Or move the laser head (1) in the X-axis direction,
A sun cover mark (4) extending in the X-axis direction is carved on the workpiece surface (3) of the workpiece. Next, move the workpiece (3) or the laser head (1) slightly in the Y-axis direction, and at the moved position, move the workpiece (3) or the laser head (1) again in the X-axis direction to achieve the above. Hidden streaks (4)
A shade strip (4) extending in the X-axis direction is applied close to the area. Thereafter, in the same manner, sun-covering streaks (4) are applied to the entire surface of the workpiece (3) using the side steps of the laser spot. Here, shaded streaks are formed on the workpiece surface of the workpiece (3) in a distribution state with a small parallel pitch. Next, the above-mentioned sun cover marks (4
) formed on the surface of the workpiece (3)
5) focuses the laser beam from the condensing lens (2) of the laser head (1) from the side through the reflecting mirror (6);
Reflecting workpiece (3) or laser head (1) #1t
(6) in the X-axis direction, and thus the protrusion (5)
The protrusion (5) is cut by a laser spot that is stepped along the protrusion (5) from the side. Similarly, the protrusions (5) are sequentially cut.
上記レーザー切削加工において、必要に応じレーザーヘ
ッド（１）の集光レンズ（２）をアシストガスの吹付け
により冷却してもよい。該アシストガスはレーザービー
ムの出射側に流出しないようにする。日覆条痕（４）は
Ｙ軸方向に施してもよい。In the above laser cutting process, the condenser lens (2) of the laser head (1) may be cooled by spraying assist gas, if necessary. The assist gas is prevented from flowing out to the exit side of the laser beam. The shade stripes (4) may be applied in the Y-axis direction.
実施例２
ニューセラミックの円筒型の加工物（３′）の内空に、
内部に反射鏡（７）（８）を備えた筒状バー（９）を差
込み、レーザー発振器よりのレーザービームをレーザー
ヘッド（１）の集光レンズ（２）により上記反射鏡（７
）（８）を経て加工物（３′）の内面に集光し、加工物
（３′）を軸線の周りの方向へ回転させながら、加工物
（３′ ）をレーザーヘッド（１）の側に送込んで行き
、或いは加工物（３′）に対しレーザーヘッド（１）及
び筒状バー（９）を移動させて行く。すると、円筒型の
加工物（３′）の内周面にＸ軸方向に延びるＨｇ条痕（
４′ ）がスパイラルの形として小さな並列ピッチの分
布状態で施される。然る後、反射１（１０）を内蔵した
筒状バー（１１）を加工物（３′）の内空に差入れて、
レーザービームを集光レンズ（２）により反射！（１０
）を経て上記Ｈｇ条痕（４′）の施工で形成された加工
物（３′）内周面の突条（５′ ）にその側方から集光
し、前記と同様な加工物（３′）の回転、ならびに加工
物（３′）とレーザーヘッド（１）及び筒状バー（１１
）組合せ体との相対的な移動を行ない、上記加工物（３
′）内周面の突条（５′）を切断する。Example 2 Inside the new ceramic cylindrical workpiece (3'),
A cylindrical bar (9) equipped with reflecting mirrors (7) and (8) is inserted inside, and the laser beam from the laser oscillator is directed through the condensing lens (2) of the laser head (1) to the reflecting mirror (7).
)(8), the light is focused on the inner surface of the workpiece (3'), and while rotating the workpiece (3') in the direction around the axis, the workpiece (3') is placed on the side of the laser head (1). or move the laser head (1) and cylindrical bar (9) relative to the workpiece (3'). Then, Hg streaks (
4') is applied in the form of a spiral with a distribution of small parallel pitches. After that, insert the cylindrical bar (11) containing the reflector 1 (10) into the inner space of the workpiece (3'),
The laser beam is reflected by the condensing lens (2)! (10
), the light is focused from the side onto the protrusion (5') on the inner circumferential surface of the workpiece (3') formed by the construction of the Hg streak (4'), and the light is focused from the side on the protrusion (5') on the inner peripheral surface of the workpiece (3'), which is formed by forming the Hg streak (4'). '), as well as the workpiece (3'), laser head (1) and cylindrical bar (11).
) to move the workpiece (3) relative to the combination body.
') Cut the protrusion (5') on the inner peripheral surface.
実施例３
ニューセラミックの円筒或いは丸棒状の加工物（３″）
を軸線の周りの方向へ回転させながら前進させ（或いは
加工物（３″）に対しレーザーヘッド（１）を移動させ
）、レーザーヘッド（１）の集光レンズ（２）により加
工物（３″）の外面にレーザービームを集光する。斯く
して、加工物（３“）の外周面にＸ軸方向に延びるＨｇ
条痕（４″）がスパイラルの形として小さな並列ピッチ
の分布状態で施され、それにより突条（５″）が加工物
（３“）の外周面に形成される。次いで加工物（３″）
外周面の突条（５’Ｍにレーザーヘッド（１）の集光レ
ンズ（２）により反射鏡（１２）を経てレーザービーム
を側方がら集光し、加工物（３″）の上記と同様な回転
、ならびに加工物（３”）とレーザーヘッド（１）の相
対的前進を行ない、加工物（３″）外周面の突条（５″
）を切断する。Example 3 New ceramic cylindrical or round bar-shaped workpiece (3″)
The laser head (1) is moved forward while rotating around the axis (or the laser head (1) is moved relative to the workpiece (3")), and the condenser lens (2) of the laser head (1) focuses the workpiece (3") ) focuses a laser beam on the outer surface of the In this way, Hg extending in the X-axis direction on the outer peripheral surface of the workpiece (3")
The striations (4") are applied in the form of a spiral with a distribution of small parallel pitches, so that ridges (5") are formed on the outer circumferential surface of the workpiece (3"). )
The laser beam is focused from the side on the protrusion (5'M) of the outer peripheral surface by the condensing lens (2) of the laser head (1) via the reflecting mirror (12), and the same as above for the workpiece (3''). rotation and relative advancement of the workpiece (3") and the laser head (1), the protrusion (5") on the outer circumferential surface of the workpiece (3")
) to cut.
以上に述べた実施例は何れもＨｇ条痕の施工に次いで、
それによる突条を切断するものであるが、突条の切断加
工をＨｇ条痕の施工と同時に行なっても構わない。In all of the examples described above, following the construction of Hg streaks,
Although the resulting protrusions are cut, the cutting of the protrusions may be performed simultaneously with the construction of the Hg marks.
加工物の加工された面はダイヤモンド砥石で仕上げ研削
を施してもよい。The machined surface of the workpiece may be finished ground with a diamond grindstone.
第１．２図は本発明の一実施例を、第３．４図は本発明
の実施例の他側を、第５．６図は本発明の更に他の実施
例を示し、第１．３．５図がそれぞれＨｇ条痕の施工工
程であり、第２．４．６図がそれぞれ突条の切断工程を
示している。
（１）はレーザーヘッド（１）、
（２）は集光レンズ、
（３）、（３′）、（３″）は加工物、（４）、（４′
）、（４″）はＨｇ条痕、（５）、（５′）、（５“）
は突条、
（６）、（７）、（８）、（１ｏ）、（１２）は反射鏡
、
（９）、（１１）は筒状バー
（以 上）Fig. 1.2 shows one embodiment of the invention, Fig. 3.4 shows the other side of the embodiment of the invention, and Fig. 5.6 shows yet another embodiment of the invention. Figure 3.5 shows the construction process of the Hg stripes, and Figure 2.4.6 shows the cutting process of the protrusions. (1) is the laser head (1), (2) is the condenser lens, (3), (3'), (3'') is the workpiece, (4), (4')
), (4″) are Hg streaks, (5), (5′), (5″)
(6), (7), (8), (1o), (12) are reflectors, (9), (11) are cylindrical bars (and above)
Claims (1)
段によりＸ軸方向（左右方向）或いはＹ軸方向（前後方
向）に延びる凹窪条痕をそれが小さな並列ピッチの分布
状態となるよう施した後、或いは施しつつ、該凹窪条痕
の施工で上記被加工面に形成される突条を、それにその
側方からレーザスポットを突条沿いに側段して、切断す
ることを特徴とするニューセラミックのレーザー切削加
工法。■ After making concave grooves extending in the X-axis direction (left-right direction) or Y-axis direction (front-back direction) using the side steps of the laser spot on the processed surface of the new ceramic so that they are distributed at a small parallel pitch. or, while performing the process, the protrusions formed on the work surface by forming the recessed groove marks are cut by passing a laser spot along the protrusions from the side thereof. Ceramic laser cutting method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59086910A JPS60231588A (en) | 1984-04-27 | 1984-04-27 | Method of laser cutting of new ceramic |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59086910A JPS60231588A (en) | 1984-04-27 | 1984-04-27 | Method of laser cutting of new ceramic |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60231588A true JPS60231588A (en) | 1985-11-18 |
| JPH036873B2 JPH036873B2 (en) | 1991-01-31 |
Family
ID=13899993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59086910A Granted JPS60231588A (en) | 1984-04-27 | 1984-04-27 | Method of laser cutting of new ceramic |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60231588A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02142694A (en) * | 1988-11-19 | 1990-05-31 | Nippon Steel Corp | Laser beam machining method for fine ceramics |
| JP2001263521A (en) * | 2000-03-17 | 2001-09-26 | Denso Corp | Electromagnetic drive, fluid control valve using it, and manufacturing method for electromagnetic drive |
| JP2014039955A (en) * | 2012-08-23 | 2014-03-06 | Ntn Corp | Processing method and processing device for workpiece |
-
1984
- 1984-04-27 JP JP59086910A patent/JPS60231588A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02142694A (en) * | 1988-11-19 | 1990-05-31 | Nippon Steel Corp | Laser beam machining method for fine ceramics |
| JP2001263521A (en) * | 2000-03-17 | 2001-09-26 | Denso Corp | Electromagnetic drive, fluid control valve using it, and manufacturing method for electromagnetic drive |
| JP2014039955A (en) * | 2012-08-23 | 2014-03-06 | Ntn Corp | Processing method and processing device for workpiece |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH036873B2 (en) | 1991-01-31 |
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