JPS60217696A - Ceramic substrate - Google Patents
Ceramic substrateInfo
- Publication number
- JPS60217696A JPS60217696A JP7279184A JP7279184A JPS60217696A JP S60217696 A JPS60217696 A JP S60217696A JP 7279184 A JP7279184 A JP 7279184A JP 7279184 A JP7279184 A JP 7279184A JP S60217696 A JPS60217696 A JP S60217696A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- plating
- film
- nickel
- thick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明はニッケルと金、あるいはニッケルのみが拡散し
た銅厚膜上に形成するオーバーコートやフォトレジスト
等の有機性被膜の密着を向上したことを特徴とした銅厚
膜セラミック基板に関する。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention improves the adhesion of an organic film such as an overcoat or photoresist formed on a thick copper film in which nickel and gold or only nickel is diffused. This article relates to a featured copper thick film ceramic substrate.
従来、タングステン等の高温焼結導体に銅厚膜導体を形
成するためにタングステン等の高温焼結導体にニッケル
と金あるいはニッケルのみをめっき法により施して銅厚
膜との接合信頼性を踊保している。このためニッケルあ
るいは金もしくは両者の金属が、銅厚膜の中に拡散する
。Conventionally, in order to form a copper thick film conductor on a high temperature sintered conductor such as tungsten, nickel and gold or only nickel were applied to the high temperature sintered conductor such as tungsten using a plating method to maintain the bonding reliability with the copper thick film. are doing. This causes nickel or gold or both metals to diffuse into the thick copper film.
この拡散部の上部は、たとえばフォトレジスト等の有機
性被膜やはんだの密着か悪く基板の構造や機能に制限が
加わり自由な設計ができない欠点かあった。The upper part of the diffusion part has the drawback that, for example, an organic film such as a photoresist or solder does not adhere well, and the structure and function of the substrate are restricted, making it difficult to design freely.
本発明の目的はニッケル等のめつき金属が拡散した厚膜
銅の上にめっきにより銅を析出して、はんだの濡れ性や
フォトレジスト等の密着強度を向上することを特徴とし
た銅厚膜基板を提供することにある。The purpose of the present invention is to provide a thick copper film characterized by depositing copper by plating on a thick film copper in which a plating metal such as nickel is diffused, thereby improving the wettability of solder and the adhesion strength of photoresist, etc. The purpose is to provide the substrate.
湿式多層基板に銅厚膜を組合わせて用いる時は、タング
ステンやモリブデン・マンガン等の高温焼結導体と銅厚
膜の間にニッケルやニッケルー金等のめっきを施して接
続する方法か行なわれている。この厚膜銅ペーストの焼
成は９００〜１．１００℃の凡雰囲気焼成を行なうので
下地のニッケル等のめつき金属が厚膜銅中に拡散する。When using a wet multilayer board in combination with a thick copper film, a method is used in which a high-temperature sintered conductor such as tungsten, molybdenum, manganese, etc. and the thick copper film are plated with nickel or nickel-gold for connection. There is. Since this thick film copper paste is fired in a normal atmosphere at 900 to 1.100 DEG C., the underlying plating metal such as nickel diffuses into the thick film copper.
ニッケル等のめつき金属が拡散した銅厚膜は、はんだの
濡れ性が悪く、またオーバーコートやフォトレジストな
どの有機被膜を塗布し乾燥しても密着が悪い。このため
に、フォトレジストの場合には銅厚膜の一部がエツチン
グで破かいされる等の品質を低下する原因にもなる。そ
こで本発明では、上記したようなニッケル等が拡散した
銅厚膜の上に電気銅めっきや化学銅めっきを施すことで
、その性質を改善する。銅めっきのめつき厚味は目的に
よって自由に変えてよい。A thick copper film in which a plating metal such as nickel is diffused has poor solder wettability, and even if an organic film such as an overcoat or photoresist is applied and dried, adhesion is poor. For this reason, in the case of a photoresist, a portion of the thick copper film may be damaged by etching, resulting in deterioration in quality. Therefore, in the present invention, electrolytic copper plating or chemical copper plating is applied to the above-mentioned thick copper film in which nickel or the like is diffused to improve its properties. The thickness of copper plating can be changed freely depending on the purpose.
たとえば、フォトレジストのような有機被膜の場合は０
２μ程度でもよい。またはんだ付けの場合は、０．５μ
以上をめっきした方が効果がある。For example, in the case of organic films such as photoresists, 0
It may be about 2μ. Or for soldering, 0.5μ
It is more effective to plate the above.
以下、本発明の実施例を図により説明する。 Embodiments of the present invention will be described below with reference to the drawings.
第１図は、湿式多層基板の焼結後の断面を示す。FIG. 1 shows a cross section of the wet multilayer substrate after sintering.
すなわち、グリーンシートの焼結体１の上に配したタン
グステン導体２に無電解ニッケルめっき３μと金めつき
０．１μを施した後に９００’Ｃ４Ｃてシンタリングを
行なった後のめっき層４を配した。That is, a tungsten conductor 2 placed on a sintered body 1 of a green sheet is plated with electroless nickel plating of 3μ and gold plating of 0.1μ, and then sintered at 900'C4C, followed by a plating layer 4. did.
めっき層４以外のタングステン導体２上はアルミナ絶縁
層３を形成しである。第２図は、銅ペーストパターン５
を印刷し乾燥した状態を示し、これを９００℃１０分の
Ｎ、雰囲気にて焼成を行なうとめっき層４が厚膜銅中に
拡散した銅パターン６となる。この上に銅めっき７を施
して基板を完成した。そこで、実験的に銅めっき膜７の
有るものと無いものについてはんだ付けを行なったとこ
ろ、めつき膜有のものが無いものの１７３の時間ではん
だが完全に濡れ、ｈ果を確認することができた。An alumina insulating layer 3 is formed on the tungsten conductor 2 other than the plating layer 4. Figure 2 shows the copper paste pattern 5.
When this is printed and dried at 900° C. for 10 minutes in a N atmosphere, a copper pattern 6 is formed in which the plating layer 4 is diffused into the thick copper film. Copper plating 7 was applied thereon to complete the board. Therefore, when we experimented with soldering with and without the copper plating film 7, we found that the solder was completely wetted in 173 hours on the solder with and without the copper plating film 7, and we were able to confirm the results. Ta.
本発明によれば、銅厚膜ペーストによるパターン上に銅
めっきを施すことで、パターンのはんだ濡れ性が向上し
、オーバーコートやフォトレジストなどの有機被膜の密
着も向上できるので、信頼性が向上する。According to the present invention, by applying copper plating on a pattern made of copper thick film paste, the solder wettability of the pattern is improved and the adhesion of organic films such as overcoats and photoresists can also be improved, thereby improving reliability. do.
第１図は湿式基板のタングステン導体にめっき膜を形成
した後の断面図、
第２図は、第１図で示した基板上に銅厚膜ペーストを印
刷・乾燥した断面図、
第３図は、第２図を焼成し、さらに厚膜銅の上に銅めっ
きを施した完成基板の断面図である。
２・・・・・・タングステン導体。
３・・・・・・アルミナ絶縁層。
４・・・・・Ｎｉ、Ａｕめつぎ層。
５・・・・・・厚膜銅ペースト印刷層。
７・・・・・・銅めつき層。
第１図
第２図
第３口Figure 1 is a cross-sectional view after forming a plating film on the tungsten conductor of a wet substrate. Figure 2 is a cross-sectional view after printing and drying the copper thick film paste on the substrate shown in Figure 1. Figure 3 is FIG. 2 is a cross-sectional view of a completed substrate obtained by firing the substrate shown in FIG. 2 and further performing copper plating on the thick film copper. 2...Tungsten conductor. 3...Alumina insulation layer. 4...Ni, Au mesh layer. 5... Thick film copper paste printing layer. 7... Copper plating layer. Figure 1 Figure 2 Figure 3 Port
Claims (1)
したセラミック基板において、導体上にニッケルめっき
と金めつき、あるいはニッケルめっきのみを施して、基
板上の全体もしくはめっきを施した導体の一部に厚膜銅
ペーストを印刷等により塗布を行ない、Ｎ、雰囲気中で
焼成した基板にさらに銅めつきを施したことにより、オ
ーバーコートや、フォトレジスト等の有機性被膜の密着
やはんだ濡れ性を向上させることを特徴としたセラミッ
ク基板。1. For ceramic substrates with conductors such as tungsten or molybdenum manganese, nickel plating and gold plating, or only nickel plating, is applied to the conductors, and a thick film is applied to the entire board or part of the plated conductors. The adhesion and solder wettability of organic coatings such as overcoats and photoresists are improved by applying copper paste by printing, etc., and then applying copper plating to the substrate that is fired in a nitrogen atmosphere. Ceramic substrate featuring
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7279184A JPS60217696A (en) | 1984-04-13 | 1984-04-13 | Ceramic substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7279184A JPS60217696A (en) | 1984-04-13 | 1984-04-13 | Ceramic substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60217696A true JPS60217696A (en) | 1985-10-31 |
Family
ID=13499563
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7279184A Pending JPS60217696A (en) | 1984-04-13 | 1984-04-13 | Ceramic substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60217696A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63107087A (en) * | 1986-05-19 | 1988-05-12 | 株式会社デンソー | Hybrid integrated circuit board |
-
1984
- 1984-04-13 JP JP7279184A patent/JPS60217696A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63107087A (en) * | 1986-05-19 | 1988-05-12 | 株式会社デンソー | Hybrid integrated circuit board |
| US5897724A (en) * | 1986-05-19 | 1999-04-27 | Nippondenso Co., Ltd. | Method of producing a hybrid integrated circuit |
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