JPS6021550A - Chip component - Google Patents

Chip component

Info

Publication number
JPS6021550A
JPS6021550A JP12975983A JP12975983A JPS6021550A JP S6021550 A JPS6021550 A JP S6021550A JP 12975983 A JP12975983 A JP 12975983A JP 12975983 A JP12975983 A JP 12975983A JP S6021550 A JPS6021550 A JP S6021550A
Authority
JP
Japan
Prior art keywords
chip component
resin
cut
molded
external connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12975983A
Other languages
Japanese (ja)
Inventor
Sunao Imai
直 今井
Yoshikazu Hamazawa
浜沢　良和
Hiromasa Yamamoto
博正 山本
Tomoko Iwami
石水　智子
Mikio Taoka
幹夫 田岡
Yukihiro Kitano
北野　幸弘
Hiroshi Otake
大嶽　博志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP12975983A priority Critical patent/JPS6021550A/en
Publication of JPS6021550A publication Critical patent/JPS6021550A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To improve the reliability of the dip-soldering for a chip component with a circuit element molded by insertion by a method wherein the resin-molded part of an external connecting terminal is partly provided with a cut, and then bent to the opposite side of the substrate at the time of mounting, thereby providing cut and raised pieces. CONSTITUTION:The resin-molded part of the external connecting terminal 3 is partly provided with the cut and then bent to the opposite side of the substrate at the time of mounting, thus having the cut and raised pieces 3a exposed along the side surface when resin is molded. Thereby, it is possible that the terminals 3 positioned close to the center of the side surface of a normal chip component or to the bottom surface from less than half position at the most part of the side surface of the chip component. The use of the chip component having such terminals 3 enables to realize the high reliability of dip-soldering even in high density mounting that many components are put on a substrate.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は回路素子をインサート成形するチップ部品に関
するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a chip component in which circuit elements are insert-molded.

従来例の構成とその問題点 最近のチップ部品の多くはコイル、コンデンサ半導体等
の回路素子を外部接続用端子に接続すると共に成形ある
いに１注型等で樹脂モールドして外２ページ 装することにより構成されている。以下、図面を参照し
ながら従来例を説明する。Conventional configuration and its problems Many of the recent chip components connect circuit elements such as coils and capacitor semiconductors to external connection terminals, and are molded with resin using molding or one-cast molding, and are packaged with two external pages. It is composed of: A conventional example will be described below with reference to the drawings.

第１図は従来のチップ部品の外観を示す斜視図であり、
１は外部接続用端子、２は外装成形樹脂であり、内部に
回路素子が内蔵されている。一般に外装樹脂より引き出
されている外部接続用端子１の位置は内部の回路素子（
図示せず）にもよるが、チップ部品の外装側面の中央附
近になる場合が多い。このように引き出さ扛た外部接続
用端子１を図示したよう［Ｌ字状に折りまげ、外装側面
の下部及び底面に端子が位置する形状となっている０ しかし、このような形状では基板に実装する場合、リフ
ロー半田付では問題ないが、ディップ半田付の時は外装
側面上部に端子が存在しないため、うまく半田付されな
く、１つの基板に多くの部品をのせた高密度実装のディ
ップ半田付の信頼性に問題を有している。FIG. 1 is a perspective view showing the appearance of a conventional chip component.
1 is an external connection terminal, 2 is an exterior molded resin, and a circuit element is built inside. In general, the position of the external connection terminal 1 pulled out from the exterior resin is the position of the internal circuit element (
(not shown), it is often located near the center of the exterior side of the chip component. As shown in the figure, the external connection terminal 1 pulled out in this way is folded into an L-shape, and the terminal is located at the bottom and bottom of the side of the exterior. In this case, there is no problem with reflow soldering, but when using dip soldering, there are no terminals on the upper side of the exterior, so the soldering does not work well, and dip soldering is difficult for high-density mounting with many components on one board. There are reliability problems.

発明の目的 本発明の目的は、回路素子をインサート成形し３１・−
〕゛ たチップ部品のディップ半田付の信頼性を向」ニさせる
ものである。OBJECTS OF THE INVENTION An object of the present invention is to perform insert molding of circuit elements.
] This improves the reliability of dip soldering of chip components.

発明の構成 この目的を達成するために本発明のチップ部品は、回路
素子を外装成形樹脂で覆い、かつ回路素子に接続した外
部接続用端子を外装成形樹脂より外部に引き出すと共に
、外装成形樹脂にそって折曲することにより構成し、か
つ外部接続用端子の樹脂モールドされる部分の一部に切
り込みを設けると共に、実装時の基板と反対側に折り曲
げることにより切起し片を設け、その切起し片を外装成
形樹脂の外部に露出させたものであり、これにより回路
素子をインサート成形したチップ部品のディップ半「１
付の信頼性を向」ニさせるものである。Structure of the Invention To achieve this object, the chip component of the present invention covers a circuit element with an exterior molding resin, pulls out an external connection terminal connected to the circuit element from the exterior molding resin, and covers the circuit element with an exterior molding resin. The external connection terminal is constructed by bending it along the side, and a notch is provided in a part of the resin-molded part of the external connection terminal. The raised piece is exposed to the outside of the exterior molding resin, and this allows the dip half "1" of the chip component in which the circuit element is insert-molded.
This will improve the reliability of the product.

実施例の説明 以下本発明の一実施例について、図面を参照しながら説
明する。DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

第２図は本発明の一実施例における外部接続用端子を有
するチップ部品である０第２図において、３はチップ部
品の外部接続用端子で、この樹脂モールドされる部分の
一部に切り込みを設け、実装時の基板と反対側に折りま
け樹脂モールドの時に側面に沿って露出させた切起し片
３ａを有している。これによって、通常チップ部品の側
面の中央近く、あるいは半分以下より底面にかけて位置
する外部接続用端子３がチップ部品の側面の大部分に位
置することが可能である。このような外部接続用端子３
を有するチップ部品によれば、１つの基板に多くの部品
をのせた高密度実装においてもディップ半田付の高信頼
性を実現することができる。なお、この実施例では外部
接続用端子３の樹脂モードされる部分の一部に切り込み
を入れ、折り曲げて切起し片３ａを設け、側面に露出さ
せてディップ半田付を可能としたが、折り曲げる方法ま
た露出させる方法は第２図のように限定されるものでは
なく、樹脂モールド内に位置ずる外部接続用端子３の一
部に切り込みを設けると共に、実装時の基板と反対側に
折り曲げることにより切起し片を設け、側面の大部分に
外部接続用端子が位置する構造であれば良い。Figure 2 shows a chip component having an external connection terminal according to an embodiment of the present invention. In Figure 2, 3 is an external connection terminal of the chip component, and a cut is made in a part of the resin-molded part. It has a cut-and-raised piece 3a that is folded on the side opposite to the board at the time of mounting and exposed along the side surface during resin molding. As a result, the external connection terminals 3, which are normally located near the center of the side surface of the chip component, or from less than half to the bottom surface, can be located on most of the side surface of the chip component. External connection terminal 3 like this
According to the chip component having the above, high reliability of dip soldering can be realized even in high-density mounting where many components are mounted on one board. In addition, in this embodiment, a cut is made in a part of the resin mode portion of the external connection terminal 3, and a cut and raised piece 3a is provided by bending it and exposing it on the side surface to enable dip soldering. The method of exposing the external connection terminal 3 is not limited to the one shown in Fig. 2, but can be done by making a notch in a part of the external connection terminal 3 located inside the resin mold and bending it to the side opposite to the board at the time of mounting. Any structure may be used as long as a cut-and-raised piece is provided and the external connection terminal is located on most of the side surface.

６１゛−ジ 発明の効果 以上の説明から明らかなように本発明は、チップ部品の
外部接続用端子の樹脂モールドされる部分の一部に切り
込みを設け、実装時の基板と反対側に折りまげ、この切
起し片を樹脂モールドした時に側面に露出さぜたもので
あり、これにより回路素子をインサート成形したチップ
部品を電子回路基板に取り付け、ディップ半田付する場
合、側面に露出させた切起し片を通じて半田が上り、デ
ィップ半田伺の信頼性を向上できるという優れた効果が
得ら扛る。その効果によりチップ部品の利用応用範囲を
広げるという効果が得られる０Effects of the Invention on Page 61 As is clear from the above explanation, the present invention provides a cut-out in a part of the resin-molded part of the external connection terminal of the chip component, and folds it to the side opposite to the board at the time of mounting. When this cut and raised piece is molded with resin, it is exposed on the side, and when a chip component with an insert-molded circuit element is attached to an electronic circuit board and dip soldered, the cut and raised piece exposed on the side is exposed. The solder rises through the raised piece, which has the excellent effect of improving the reliability of dip soldering. This has the effect of expanding the range of applications for chip components.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来のチップ部品の外観を示す斜視図、第２図
は本発明の一実施例によるチップ部品の外観を示す斜視
図である。 ２・・・・・・外装成形樹脂、３・・・・・・外部接続
用端子、３ａ・・・・・・切起し片。 代理人の氏名　弁理士　中　尾　敏　男　ほか１名第１
図 第２図FIG. 1 is a perspective view showing the appearance of a conventional chip component, and FIG. 2 is a perspective view showing the appearance of a chip component according to an embodiment of the present invention. 2... Exterior molded resin, 3... External connection terminal, 3a... Cut and raised piece. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2

Claims (1)

【特許請求の範囲】[Claims] 回路素子を外装成形樹脂で覆い、かつ回路素子に接続し
た外部接続用端子を外装成形樹脂より外部に引き出すと
共に、外装成形樹脂に沿って折曲することにより構成し
、かつ外部接続用端子の樹脂モールドされる部分の一部
に切り込みを設けると共に、実装時の基板と反対側に折
り曲げることにより切起し片を設け、その切起し片を外
装成形樹脂の外部に露出させたチップ部品。The circuit element is covered with an exterior molded resin, and the external connection terminal connected to the circuit element is pulled out from the exterior molded resin and bent along the exterior molded resin, and the resin of the external connection terminal is A chip component in which a cut is made in a part of the molded part, and a cut and raised piece is provided by bending it to the side opposite to the board at the time of mounting, and the cut and raised piece is exposed outside the exterior molding resin.
JP12975983A 1983-07-15 1983-07-15 Chip component Pending JPS6021550A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12975983A JPS6021550A (en) 1983-07-15 1983-07-15 Chip component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12975983A JPS6021550A (en) 1983-07-15 1983-07-15 Chip component

Publications (1)

Publication Number Publication Date
JPS6021550A true JPS6021550A (en) 1985-02-02

Family

ID=15017490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12975983A Pending JPS6021550A (en) 1983-07-15 1983-07-15 Chip component

Country Status (1)

Country Link
JP (1) JPS6021550A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5225897A (en) * 1991-10-02 1993-07-06 Unitrode Corporation Molded package for semiconductor devices with leadframe locking structure
JP2010182828A (en) * 2009-02-04 2010-08-19 Mitsubishi Electric Corp Power semiconductor module and method for manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5225897A (en) * 1991-10-02 1993-07-06 Unitrode Corporation Molded package for semiconductor devices with leadframe locking structure
JP2010182828A (en) * 2009-02-04 2010-08-19 Mitsubishi Electric Corp Power semiconductor module and method for manufacturing the same

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