JPS60203436A - High heat-load-resistant composite structure - Google Patents
High heat-load-resistant composite structureInfo
- Publication number
- JPS60203436A JPS60203436A JP5942284A JP5942284A JPS60203436A JP S60203436 A JPS60203436 A JP S60203436A JP 5942284 A JP5942284 A JP 5942284A JP 5942284 A JP5942284 A JP 5942284A JP S60203436 A JPS60203436 A JP S60203436A
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- tungsten
- high heat
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Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は、高熱流束負荷を受けても熱応力の発生や変形
などが少なく、しかも熱伝導特性に優れたタングステン
（、）−モリブデン（ＭＯ）−銅（Ｃｕ）系の耐高熱負
荷複合構造体に関する。Detailed Description of the Invention [Technical Field of the Invention] The present invention is directed to a tungsten (,)-molybdenum (MO) material that exhibits little thermal stress or deformation even when subjected to high heat flux loads, and has excellent thermal conductivity. )-Copper (Cu)-based high heat load resistant composite structure.
Ｘ線発生装置の対陰極、プラズマ発生装置の不純物除去
板など高温下で高熱流束負荷を受ける部品は、直接高熱
流束負荷を受ける表面部分の部材と、負荷された熱を効
果的に除去して全体を冷却する冷却部分の部材とを接合
した構造より成る複合構造体である。一般に、表面部分
の部材にはＸ線の発生効率、耐熱性若しくは耐スパツタ
性などの観点からＷ若しくはＷ−Ｒｅ合金が用いられ、
冷却部分の部材には、熱伝導特性が良好であることから
してＣ，若しくはＣｕ合金が用いられている。Components that are subjected to high heat flux loads at high temperatures, such as anticathodes in X-ray generators and impurity removal plates in plasma generators, have surface parts that are directly subjected to high heat flux loads, and the applied heat is effectively removed. It is a composite structure consisting of a structure in which a member of a cooling part is joined to cool the entire body. Generally, W or W-Re alloy is used for surface parts from the viewpoint of X-ray generation efficiency, heat resistance, spatter resistance, etc.
C or a Cu alloy is used for the cooling part because it has good thermal conductivity.
このようなＷ−Ｃｕ複合構造体を構成する際における重
要な問題は、両部材間の接合に関することである。なぜ
ならば、２０℃〜６００℃における平均熱膨張係数につ
いて見てみると、Ｗのそれは４．３Ｘ１０”／℃、Ｃｕ
のそれは１４．７ Ｘ １０ ””’／℃と両者の間
には大きな差異があり、熱負荷を受けて温度上昇を生じ
たときには両部材の接合部には大きな熱応力が発生する
からである。An important issue in constructing such a W-Cu composite structure is the bonding between the two members. This is because when we look at the average coefficient of thermal expansion between 20°C and 600°C, that of W is 4.3X10”/°C, and that of Cu
This is because there is a large difference between the two, 14.7 x 10 ''''/℃, and when the temperature rises due to heat load, a large thermal stress is generated at the joint between the two members. .
一般に両部材の接合方法には、ボルト締めなどの機械的
方法またはろう伺などを用いた冶金的方法がある。Generally, the two members can be joined together using a mechanical method such as bolt tightening or a metallurgical method using brazing or the like.
前者の方法の場合には、接合部の形状９間隔などを考慮
して両部材間の熱膨張の差を逃がして熱応力の発生を避
けることは可能である。反面、両部材間の密着度が低下
するため両者間の熱伝達は低下し、効果的な冷却作用が
阻害される。そのため、例えば、プラズマ発生装置にお
いては、プラズマディスラプションなどの発生により大
きな熱負荷が加わった場合には、表面部分の部材（Ｗ）
の表面温度が大巾に上昇し、その結果、表面の溶融など
の破損現象が生ずるに至る。In the case of the former method, it is possible to avoid the generation of thermal stress by taking into consideration the shape and spacing of the joint portion, etc., and releasing the difference in thermal expansion between the two members. On the other hand, since the degree of adhesion between the two members is reduced, heat transfer between the two members is reduced, and an effective cooling effect is inhibited. Therefore, for example, in a plasma generator, when a large heat load is applied due to occurrence of plasma disruption, etc., the surface part of the member (W)
The surface temperature of the material increases significantly, resulting in damage phenomena such as surface melting.
一方、後者の冶金的接合方法によれば、両部材は密着し
て接合されるので当初は熱の除去が有効に行なわれ円滑
な冷却作用を示すが、温度上昇により熱膨張差が増大す
ると接合面には熱応力が発生する。特に間欠的な運転モ
ードをとるトカマク型プラズマ発生装置などにおいては
、上記した熱応力は変動し、さらにそれに加えてプラズ
マからの電磁力も重畳されることにより、接合部のうち
強度の小さい部分に疲労クラックが発生し、成長するに
至る。接合部にこのようなりラックが発生し、成長する
と、この部分では熱伝達の効率が劣化し、Ｌ記したと同
様の理由により表面溶融による損傷の発生する虞れがあ
る。On the other hand, according to the latter metallurgical joining method, since both parts are joined in close contact, heat is removed effectively at first and a smooth cooling effect is exhibited, but when the difference in thermal expansion increases due to temperature rise, the joining Thermal stress occurs on the surface. In particular, in tokamak-type plasma generators that operate in intermittent operation mode, the above-mentioned thermal stress fluctuates, and on top of that, the electromagnetic force from the plasma is also superimposed, causing fatigue in parts of the joint where the strength is low. Cracks occur and grow. If such a rack is generated and grows at the joint, the efficiency of heat transfer will deteriorate in this part, and there is a risk that damage will occur due to surface melting for the same reason as described in L.
本発明は、上記した欠点を解消し、接合部における熱応
力の発生が小さく、かつ熱伝導が良好で冷却作用に優れ
たＷ−Ｍｏ−Ｃｕ複合構造体の提供を目的とする。An object of the present invention is to eliminate the above-mentioned drawbacks, and to provide a W-Mo-Cu composite structure that generates less thermal stress at the joint, has good heat conduction, and has excellent cooling effect.
本発明者らは、上記の欠点が両部材間接合部における熱
伝達の効率の低下により生じ、その低下は両部材間の熱
膨張の差に起因するという事実に着目し、接合部におい
て両部材間の熱膨張差を低減せしめれば上記欠点を解消
し得るとの着想を得、研究を行なった結果、本発明のＷ
−Ｍｏ−Ｃｕ複合構造体を開発するに到った。The present inventors focused on the fact that the above-mentioned drawback is caused by a decrease in the efficiency of heat transfer at the joint between the two members, and that the decrease is due to the difference in thermal expansion between the two members. We got the idea that the above-mentioned drawbacks could be solved by reducing the thermal expansion difference between the W
-We have developed a Mo-Cu composite structure.
すなわち、本発明のＷ −ｋｉ（１−Ｃｕ複合構造体は
Ｗ部材とＣｕ 部材とを接合して成る複合構造体におい
て、該部材間に、該Ｗ部材に接する部分ではＭ。含有量
が多く、該Ｃｕ 部材に接する部分ではＣｕ 含有量の
多いＭ。−〇〇 合金の層が介在することを特徴とする
ものである。（ＭＯ含有量が多いとは純Ｍ。である場合
も含む）なお、本発明の複合構造体にあって、Ｗ部材と
しては、Ｗ牟独でもよいが、実用上はＲｅ を０．２〜
３重諷チ含有するＷ −Ｒｅ合金を用いる事が好ましい
。Ｒｅ は、Ｗの高温強度を高め、Ｗの再結晶温度を上
昇させて高熱負荷を受けた状態でＷの結晶粒の成長を抑
制して、粗大結晶粒に起因する表面クラックの発生を防
止するために有効であるが、その含有量が０，２重量％
未満の場合には上記効果をもたらさず、また３重量％を
超えて添加しても効果の顕著な向上は認められない。That is, the W-ki (1-Cu composite structure of the present invention is a composite structure formed by joining a W member and a Cu member), in which the M. content is large between the members and in the portion in contact with the W member. , the part in contact with the Cu member is characterized by the presence of a layer of M.-〇〇 alloy with a high Cu content. (The high MO content also includes the case of pure M.) Note that in the composite structure of the present invention, the W member may be a W member, but for practical purposes, Re should be 0.2 to 0.2.
It is preferable to use a W--Re alloy containing a triple layer. Re increases the high-temperature strength of W, increases the recrystallization temperature of W, suppresses the growth of W crystal grains under high thermal load, and prevents the occurrence of surface cracks caused by coarse crystal grains. The content is 0.2% by weight.
If the amount is less than 3% by weight, the above effects will not be obtained, and if it is added in an amount exceeding 3% by weight, no significant improvement in the effect will be observed.
また、Ｃｕ 部材はＣｕ またはＣｕ 合金から構成さ
れる。Further, the Cu member is made of Cu or a Cu alloy.
さて、本発明の複合構造体における最大の特徴は、Ｗ部
材とＣｕ 部材の中間に介在するＭ６−Ｃｕ 合金の層
にある０
該層にあっては、Ｗ部材に接する部分ではＭｏ 含有量
が多く（純Ｍ。でもよい）、Ｃｕ 部材に接する部分で
はＣｕ 含有量が多いことを特徴とする。該層における
Ｍ。含有量（またはＣｕ 含有量）は、Ｗ部材からＣｕ
部材までの間で変化するが、この変化は連続的であっ
ても不連続的な段階的なものでもよい。Now, the greatest feature of the composite structure of the present invention lies in the layer of M6-Cu alloy interposed between the W member and the Cu member. It is characterized by a high Cu content in the portion that is in contact with the Cu member (pure M may also be used). M in the layer. The content (or Cu content) is the Cu content from the W member.
This change may be continuous or discontinuous stepwise.
本発明の複合構造体にあっては、熱膨張係数が大きく異
なる。Ｗ部材とＣｕ 部材との中間に、該Ｗ部材から該
Ｃｕ 部材にかけて、Ｍｏ の含有量（またはＣｕ の
含有量）の変化に対応してその熱膨張係数が連続的また
は段階的に変化するＭｏ−Ｃｕ の層が介在するので、
両部材間では熱膨張差が緩慢に変化して熱応力の発生が
抑制されることになる。The composite structures of the present invention have significantly different coefficients of thermal expansion. Between the W member and the Cu member, there is a Mo whose coefficient of thermal expansion changes continuously or stepwise from the W member to the Cu member in response to changes in Mo content (or Cu content). -Cu layer is present, so
The thermal expansion difference changes slowly between the two members, and the generation of thermal stress is suppressed.
本発明の複合構造体の態様は次のように２大別される。Aspects of the composite structure of the present invention are broadly classified into the following two types.
第１はＭ。−Ｃｕ の合金層においてＭｏの含有量（Ｃ
ｕ の含有量）が連続的に変化するものである。これは
例えば以下のような方法によって製造される。The first is M. -Mo content (C
u content) changes continuously. This is manufactured, for example, by the following method.
まず、Ｍｏ の粉末から常法の粉末冶金法によって多孔
構造のＭ。焼結体の板材を製造する。First, a porous structure of M is prepared from Mo powder using a conventional powder metallurgy method. Manufacture sintered plate materials.
このときＭｏ 粉末の圧粉体を焼結する際に杜、Ｗ部材
が接合される側を高温で、Ｃｕ 部材が接合される側を
それよりも低い温度で焼結すると得られたＭｏ 焼結体
の厚み方向においてはその高温側表面が緻密構造で、低
温側表面にいく程多孔構造になる。すなわち、板材の厚
み方向に多孔度の勾配が形成される０これは、例えば焼
結しようとする圧粉体を高周波加熱などにより加熱され
たＷブロック上におき、圧粉体の上部は低温のＨ，ガス
により冷却するなどの焼結方法により達成することがで
きる。ついでこのＭ。At this time, when sintering the Mo powder compact, the side where the Mori and W members are joined is sintered at a high temperature, and the side where the Cu member is joined is sintered at a lower temperature. In the thickness direction of the body, the high temperature side surface has a dense structure, and the closer you go to the lower temperature side surface, the more porous the structure becomes. In other words, a porosity gradient is formed in the thickness direction of the plate material.This is because, for example, the green compact to be sintered is placed on a W block heated by high-frequency heating, and the top of the green compact is placed at a low temperature. This can be achieved by a sintering method such as cooling with H or gas. Next, this M.
焼結体の高温で焼結された側にＷ板を接着する。A W plate is bonded to the side of the sintered body that has been sintered at a high temperature.
接着方法としてはＷ板とＭ。焼結体をＭｏ ペーストを
介在させて加圧加熱して、拡散接合を行う方法、Ｍｏ
焼結体表面にＷ層を化学蒸着法により形成せしめる方法
などがある。The adhesion method is W board and M board. A method of performing diffusion bonding by pressurizing and heating a sintered body with Mo paste interposed, Mo
There is a method of forming a W layer on the surface of the sintered body by chemical vapor deposition.
ついで、このようにして得られたＷ−Ｍ。焼結体複合材
のＭ。の上にＣｕ またはＣｕ 合金のブロックを載せ
Ｃｕ またはＣｕ 合金を溶融する。Then, the WM thus obtained. M of sintered composite material. A block of Cu or Cu alloy is placed on top and the Cu or Cu alloy is melted.
融液はＭ。焼結体の空孔に浸透する。もち論、最初から
Ｍ。焼結体表面にＣｕ またはＣｕ 合金の融液を流し
込んでもより。このとき、Ｍｏ 焼結体には多孔度の勾
配が形成されているので、融液は該Ｍ０ 焼結体の低温
側表面では最も多量に、以後、高温側にいくにつれて順
次少量となるようにして空孔部に浸入することになる。The melt is M. Penetrates into the pores of the sintered body. Mochi theory, M from the beginning. It is also possible to pour a Cu or Cu alloy melt onto the surface of the sintered body. At this time, since a porosity gradient is formed in the Mo sintered body, the amount of melt is greatest on the low temperature side surface of the Mo sintered body, and then gradually decreases as it goes to the high temperature side. and enters into the pores.
すなわち、Ｍｏ を、マトリクスとしその厚み方向では
Ｃｕ 含有量が変化しだＷ−Ｍ（１−Ｃｕ 複合体が形
成される。That is, using Mo as a matrix, the Cu content changes in the thickness direction to form a WM (1-Cu) composite.
なお、ＭＯ−Ｃｕ 合金層のＭｏ 含有量（またはＣｕ
含有量）はＭ。焼結体の空孔の大小、その孔径分布、
厚み方向における多孔度の勾配などによって規定される
が、それは圧粉時の圧力。Note that the Mo content (or Cu
content) is M. The size of the pores in the sintered body, the pore size distribution,
It is determined by the porosity gradient in the thickness direction, but it is also the pressure during powder compaction.
焼結温度およびその分布などによって任意に選定するこ
とができる。It can be arbitrarily selected depending on the sintering temperature and its distribution.
第２はＷの板とＣｕ Ｏ板またはブロックの間にＭＯ含
有量の異なるＭ＠ −Ｃｕ 合金の板の複数枚積層して
介在させ、全体を熱圧ブレスやロク付などの方法により
一体化するものである０このとき、得られた複合構造体
のＷとＣｕ ０間に介在する層中においてはＭｏ 含有
量（またはＣｕ 含有量）が段階的に変化することとな
る。The second method is to laminate and interpose multiple M@-Cu alloy plates with different MO contents between the W plate and the CuO plate or block, and then integrate the whole thing using methods such as hot pressure pressing or locking. At this time, the Mo content (or Cu content) in the layer interposed between W and Cu 0 of the obtained composite structure changes stepwise.
以上の２方法のいずれにおいてもＷ材とＭ。In both of the above two methods, W material and M material.
をもっとも多く含有する層との間にさらにＷ−Ｍ。Furthermore, between the layer containing the largest amount of W-M.
合金の層を介在させ不こともできる。It is also possible to use an alloy layer or not.
実施例工。 Example work.
平均粒径２５μｍのＭｏ 粉末を所定の金型に充填して
０．５ｔ０ｎ／ＣＩ＆の圧力を印加して板状圧粉体を成
形した。A predetermined mold was filled with Mo 2 powder having an average particle size of 25 μm, and a pressure of 0.5 t0n/CI& was applied to form a plate-shaped green compact.
ついでＨ２雰囲気中において、この圧粉体の片面を１８
００℃、他面を１３５０℃の温度に５時間保持し、厚さ
１０ｗ′Ｌの板状焼結体を得た。得られた焼結体の高温
側表面にモリブデンペーストをぬり、厚さ５１ｍのＷ板
をのせ２ノ多−の圧力を印加し、真空中にて１３５０℃
の温度で１８時間保持し、Ｗ板とＭ。焼結体の接合を行
った。Then, in an H2 atmosphere, one side of this green compact was heated to 18
The other side was kept at a temperature of 00°C and 1350°C for 5 hours to obtain a plate-shaped sintered body with a thickness of 10w'L. Molybdenum paste was applied to the high temperature side surface of the obtained sintered body, a W plate with a thickness of 51 m was placed on it, a pressure of 2 mm was applied, and the temperature was heated to 1350°C in a vacuum.
W plate and M plate were kept at a temperature of 18 hours. The sintered bodies were joined.
得られた接合体のＭｏ 側を上にしてカーボン型の中に
収納し、更にこの上にＣｕ ブロックを載置してＨ７雰
囲気中で１１２０℃に昇温し、Ｃｕを溶融し、その融液
をＭｏ 焼結体に含浸せしめた。更に、焼結体の上面か
ら高さ２５“に相当するＣｕ の融液を加え、全体を冷
却固化したＯ得られたＷ −Ｍｏ−Ｃｕ複合構造体にお
いて、ＭＯ焼結体の高温側表面位置でのＭｏ 含有量は
９３％（Ｃｕ は７チ）、低温側表面位置でのＭｏ 含
有量は５５％（Ｃｕ は４５ｓ）であった０厚さ２５ｗ
ｎのＣｕ 層には径１０１の水冷用の孔を穿設した。The resulting bonded body was placed in a carbon mold with the Mo side up, and a Cu block was further placed on top of this, and the temperature was raised to 1120°C in an H7 atmosphere to melt the Cu, and the melt was impregnated into a Mo sintered body. Furthermore, a Cu melt corresponding to a height of 25" from the top surface of the sintered body was added, and the whole was cooled and solidified. In the obtained W-Mo-Cu composite structure, the surface position on the high temperature side of the MO sintered body was The Mo content at the surface position was 93% (Cu 7cm), and the Mo content at the low temperature side surface position was 55% (Cu 45s).
A hole for water cooling with a diameter of 101 was bored in the Cu layer of n.
実施例２
実施例１と同様にして厚さ１５“のＭｏ 焼結体を製造
した。この焼結体の高温側表面に１１００℃にて、ＷＣ
ｔ４＋Ｈ１＋Ａｒの混合気流中で厚み１００μｍｎ０Ｗ
層を化学蒸着した０ついでこれに実施例１と同様にして
Ｃｕ を含浸せしめてＷ−λ４６−Ｃｕ複合構造体とし
た。Example 2 A 15" thick Mo sintered body was produced in the same manner as in Example 1. WC was applied to the high temperature side surface of this sintered body at 1100°C.
Thickness 100μmn0W in a mixed air flow of t4+H1+Ar
The layer was chemically vapor deposited and then impregnated with Cu as in Example 1 to form a W-λ46-Cu composite structure.
実施例３
常用のＭｏ 粉末とＣｕ 粉末との混合焼結法およびＭ
。の圧粉体への溶融Ｃｕ の含浸法によってＭｏ 含有
量が９０重量％、７０：ｉ量饅、５５重量％、４０重量
％、３０重量％である５種類の厚さ各１． ｓ Ｉｆ！
″′のＭ。−Ｃｕ 合金板を製造した。Example 3 Commonly used mixed sintering method of Mo powder and Cu powder and M
. By impregnating the green compact with molten Cu, five thicknesses were obtained, each having a Mo content of 90% by weight, 70% by weight, 55% by weight, 40% by weight, and 30% by weight. s If!
An M.-Cu alloy plate of ″″ was manufactured.
ついで片面に厚みそれぞれ１０μｆｆｌと２０μｍのＮ
ｉ メッキ層およびＣｕ メッキ層を順次形成した厚さ
７．５”のＷ板と上記したＭＯ−Ｃｕ 合金板を上記し
た順序で積層して、全体に０．５ 破−の荷重を加えて
Ｈ２雰囲気中、８００℃、４時間熱圧プレスし、さらに
その後、上記複合体のＣｕ 含有量の多い側に、径１０
”７の冷却水用孔を設けた厚み２５”のＣｕ ブロック
をロウ付にて接合し、Ｗ−Ｃｕ複合構造体とした０比較
例１
実施例３で用いたと同様のＷ板と所定の冷却水用孔を設
けた厚み３２．５Ｔｕ′のＣｕ ブロックとの間に厚み
２５μｍのロウ箔を挾み、全体に０、５ ”／ ＝の荷
重を加えてＨ２雰囲気中８５０℃に加熱してロウ付接合
した。Next, N was applied to one side with a thickness of 10 μffl and 20 μm, respectively.
i A 7.5" thick W plate on which a plating layer and a Cu plating layer were sequentially formed and the MO-Cu alloy plate described above were laminated in the above order, and a load of 0.5 rupture was applied to the entire body for H2. Hot-pressing was carried out in an atmosphere at 800°C for 4 hours, and after that, a diameter of 10
A 25-thick Cu block with 7 holes for cooling water was joined with brazing to form a W-Cu composite structure. Comparative Example 1 A W plate similar to that used in Example 3 and a predetermined cooling A 25 μm thick wax foil was sandwiched between a 32.5 Tu′ thick Cu block with water holes, a load of 0.5”/= was applied to the whole, and the wax was heated to 850°C in an H2 atmosphere. It was attached.
比較例２
厚さ７．５８のＷ板と比較例１で用いたと同様のＣｕ
ブロックとをそのまま重ね両者にあけられた孔にＮｂ
類ボルトを入れて結合した０以上５種類のＷ ７ Ｍ（
１−ＣｕおよびＷ−Ｃｕ複合構造体につき以下の試験を
行なった０すなわち、Ｃｕ 板の孔に冷却水（入口温度
２０℃）を流しながら、Ｗ板の表面に電子ビーム照射に
より５００ ｗ／、１１の熱流束を連続して加える加熱
試験及び上記熱流束を６０秒間加え３０秒間休止すると
いう、加熱−冷却を１００ 回くり返す熱サイクル試験
である。Comparative Example 2 W plate with a thickness of 7.58 and Cu similar to that used in Comparative Example 1
Stack the blocks as they are and insert the Nb
0 or more 5 types of W 7 M (
The following tests were conducted on 1-Cu and W-Cu composite structures. In other words, while cooling water (inlet temperature 20°C) was flowing through the holes in the Cu plate, the surface of the W plate was irradiated with an electron beam at a rate of 500 W/, A heating test in which 11 heat fluxes were applied continuously, and a thermal cycle test in which heating and cooling were repeated 100 times, in which the above heat flux was applied for 60 seconds and then paused for 30 seconds.
このときの加熱試験時のＷ板表面の温度及び熱サイクル
試験後の接合部での剥離など異常発生の有無を調べ、そ
れらを一括して表に記した０表
以下（白
〔発明の効果〕
以上の説明で明らかなように、本発明のＷ Ｍ６ Ｃｕ
複合構造体は■反復する高熱流束負荷を受けても接合部
における剥離、クラックなどの発生現象はなく、■しか
も充分効果的に冷却効果が得られるのでその工業的価値
は犬である０At this time, the temperature of the surface of the W plate during the heating test and the presence or absence of abnormalities such as peeling at the joint after the thermal cycle test were investigated, and these were summarized in a table below 0 (white [Effects of the invention] As is clear from the above explanation, the W M6 Cu of the present invention
The composite structure ■ ■ does not develop phenomena such as peeling or cracking at the joints even when subjected to repeated high heat flux loads, ■ Moreover, it provides a sufficiently effective cooling effect, so its industrial value is extremely high.
Claims (3)
合構造体において、該部材間に、該タングステン部材に
接する部分ではモリブデン含有量が多く、かつ該銅部材
に接する部分では銅含有量の多いモリブデン−銅合金の
層が介在することを特徴とする耐高熱負荷複合構造体。(1) In a composite structure formed by joining a tungsten member and a copper member, the molybdenum content is high in the part in contact with the tungsten member, and the copper content is high in the part in contact with the copper member between the members. A high heat load resistant composite structure characterized by interposing a layer of molybdenum-copper alloy.
は表面処理法によって形成されたタングステンあるいは
タングステン合金である特許請求の範囲第１項記載の耐
高熱負荷複合構造体。(2) The high heat load resistant composite structure according to claim 1, wherein the tungsten member is tungsten or a tungsten alloy formed by a powder metallurgy method, a melting method, or a surface treatment method.
ムを含有するタングステン−レニウム合金である特許請
求の範囲第１項記載の耐高熱負荷複合構造体。(3) The high heat load resistant composite structure according to claim 1, wherein the tungsten member is a tungsten-rhenium alloy containing 0.2 to 3 weight of rhenium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5942284A JPS60203436A (en) | 1984-03-29 | 1984-03-29 | High heat-load-resistant composite structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5942284A JPS60203436A (en) | 1984-03-29 | 1984-03-29 | High heat-load-resistant composite structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60203436A true JPS60203436A (en) | 1985-10-15 |
Family
ID=13112803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5942284A Pending JPS60203436A (en) | 1984-03-29 | 1984-03-29 | High heat-load-resistant composite structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60203436A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102312186A (en) * | 2010-07-02 | 2012-01-11 | 中国科学院上海硅酸盐研究所 | Method for improving bonding strength of vacuum plasma spraying tungsten coating |
| CN103194712A (en) * | 2012-01-09 | 2013-07-10 | 中国科学院上海硅酸盐研究所 | High-heat-conductivity tungsten-copper heat sink and electronic packaging material, and preparation method thereof |
-
1984
- 1984-03-29 JP JP5942284A patent/JPS60203436A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102312186A (en) * | 2010-07-02 | 2012-01-11 | 中国科学院上海硅酸盐研究所 | Method for improving bonding strength of vacuum plasma spraying tungsten coating |
| CN103194712A (en) * | 2012-01-09 | 2013-07-10 | 中国科学院上海硅酸盐研究所 | High-heat-conductivity tungsten-copper heat sink and electronic packaging material, and preparation method thereof |
| CN103194712B (en) * | 2012-01-09 | 2015-10-21 | 中国科学院上海硅酸盐研究所 | A kind of tungsten-copper composite material of high thermal conductivity is as the application of tungsten copper heat-sink and electronic package material |
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