JPS60202985A - Method of producing printed circuit board - Google Patents
Method of producing printed circuit boardInfo
- Publication number
- JPS60202985A JPS60202985A JP6005084A JP6005084A JPS60202985A JP S60202985 A JPS60202985 A JP S60202985A JP 6005084 A JP6005084 A JP 6005084A JP 6005084 A JP6005084 A JP 6005084A JP S60202985 A JPS60202985 A JP S60202985A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- circuit board
- printed circuit
- producing printed
- spray
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 （厘來上の利用分束ｒ） 木゛兄側Ｑコノリント配厳板の装造法に関する。[Detailed description of the invention] (Usage fraction r on arrival) Concerning the construction method of the Q Conorinto marking plate on the brother's side.
（発明の＊京）
７’ リント配紛似の製造工程ａ杷虻払銅畑り槓増板等
の基＋Ｉｉで穴あけ、パリ城りτ竹った恢。(*Kyoto of invention) 7' Manufacturing process similar to lint dispersion a. Drilling holes with the base + Ii of the base of loquat removal, copper field expansion board, etc., and the Paris castle τ bamboo.
篩圧水抗等で入内？Ｃ抗浄し、無電解めつきπ行い、ス
ルーホールに導通性τ４７（ぜていゐ。Is it entering the house due to sieve pressure water tunnel, etc.? After C cleaning and electroless plating, the through-hole has conductivity of τ47.
この無′！Ｌ屏めっきａ従来バッチ式で竹わｆしており
情の甲にめっ＠他τ人ｎ１枚ごと治具性けし、あゐいＵ
ｉｌ’Ｊ収刀為で１肢ｆＬバスケツトに人ｒＬ。This nothingness! L-panel plating a is conventionally batch-type and bamboo-wafed.
il'J put one foot in fL's basket to collect his sword.
槽の中でＳ電解めっ＠反応によりスルーホールに導通性
ｔもたせていゐ〇
しかし、この方＆でに１作業性が悪い〇（発明の目的）
不発明にこのＬ５な点にｉＭｉ÷てなさｎたもので１作
業性に優ｎる連続的なプリント配瞼板を提供するもので
ある〇
（発明の楕戟）
本発明にプリント配栂伍用基／ｌＲτ水平式コンベアー
で連続的に移動させながら、上下〃Ｓら無電解めっｔ！
！欣τスプレー吹付けめっ＠τ行う工程τ宮むこと？！
−物倣と丁ゐプリント配線板の装造法である。The through hole is made conductive by S electrolytic plating @ reaction in the tank. However, this method & 1 workability is bad (Objective of the invention) Inventively, iMi has not focused on this L5 point. This invention provides a continuous printed eyelid panel with superior workability among other things. While doing this, move up and down, S, electroless!
! Is it the process of spraying @τ? !
-Imitation and the method of manufacturing printed wiring boards.
すなわち不発明はプリント配線板製造工程における無を
解めっき法において水平式コンベアーで連続的にスプレ
ーあるいに、噴流式により無％鱗めっき畝ｔプリント値
表面に世相し、めっ１！！皮映を析出させゐものである
〇従来の無ｖＩＬ所めつきはバッチ憎に建冶し、プリン
ト配＃也を役償することによりめっきτ行っでい１ζ０
このため作業性が慈（通続ライン化の大＠なネックにな
っていゐ◎このπめ不発明ではコンベア一方式で連続的
に基＆９ｒ投入しながら、スプレーあるい０噴流式によ
りめっき畝ｇ：基板次血に世相し無電解めっき反応によ
りスルーホール内あるいは基板表面に尋通性ｔもた一＋
！：心ものでりる０
図面ＱＪ本発明の方法τ示すめっき装はの簡略萌囲図で
めり、１はめっきチャンバー、２にスプレー％ ６ａ刀
（抗チャンバー、４はプリント基板、５ａ崗腿肖節用コ
イル、６に排気２−ドでｔりゐ０
英雄例
カラスエポキシ積〕曽板（両面銅張５５μ）に八あけ（
直径ｌ、 Ｑ ｆｆＩｎ＋ ）故パラジワムの触媒醜（
日立績）制卸ＪＨ８−１０１８日文化處工業−製部品名
）で内閣にバラク９ム１ｔＪ与τ何った俊。In other words, the uninvention is to solve the problem in the printed wiring board manufacturing process by continuously spraying with a horizontal conveyor or using a jet method to apply zero scale plating ridges to the surface of the printed wiring board, and plating 1! ! 〇 The conventional no-vIL method is based on batch-based methods, and plating can be performed by paying the print manufacturer.1ζ0
For this reason, workability is a major bottleneck in creating a continuous line.In this π method, one conveyor system is used to continuously feed the base and 9r while spraying or jetting the plating ridges. : Due to the current situation of substrates, electroless plating reaction creates permeability inside the through holes or on the surface of the substrate.
! : Shinmono Deru 0 Drawing QJ The method of the present invention τ The plating system shown is a simplified diagram of the plating system, 1 is the plating chamber, 2 is the spray percentage, 6a is the anti-chamber, 4 is the printed circuit board, 5a is the Coil for portrait use, exhaust 2-door to 6 and t-removed.
Diameter l, Q ffIn+) late palladium catalyst ugly (
Hitachi Co., Ltd.) Control wholesaler JH8-1018 Nippon Bunkako Kogyo - Product name) Toshi who gave Barak 9 1tJ to the Cabinet.
Ａ元鴫の方法で焦を酔銅めっきて行った燕篭所鋼めっ８
ね日立無電解銅めっきＣＵ Ｓ Ｔ−２０１（日立化Ｄ
ｘ、ｌｌ業＠４製曲品名）を用い水子連続スプレーめり
＠装置でめっ＠を行った０コンヘア一スピードｎ５ｍ１
分、スプレー圧は約乙５ｋｇ ／ ａｔ ｓチャンバー
円は、約１分間で通壇丁ゐように設計した＠この結果ス
ルーホール内には平均ａ６μの鋼が析出し、従来の方式
の約１０分の１の時間で、銅τ析出させゐことができ友
。Tsubamekodokoro steel plated using the method of Motosuke A.8
Hitachi electroless copper plating CU S T-201 (Hitachi Chemical D
0con hair 1 speed n5m1 which was performed using Mizuko continuous spraying @ device using
The spray pressure was approximately 5 kg/at s.The chamber circle was designed so that it could be pierced in approximately 1 minute.As a result, steel with an average thickness of 6μ was deposited in the through hole, compared to the conventional method of approximately 10 minutes. Copper τ can be precipitated in 1 hour.
（発明の効米）
従来リパッチ式のめっきでｆｌ、（１３μの鋼で析出さ
ぜゐためにａ、當御では１０〜１５分ｕ４１要したか本
発明でに、約１分間で、蛸τ町出させることかで＠罠。(Effects of the invention) Conventional repatch plating required 10 to 15 minutes to deposit on 13μ steel. @Trap by forcing her to leave town.
またコンベアー刀式の採用Ｖこより５県絖的に均一なめ
っ＠竹性か侍らｎｌまた。スプレー力式により基板表面
へのめっき敵への拡散幼米も大きくなりスルーホール内
の凹凸が大さい状態でも均一に析出しているのが牟らｆ
Ｌだ。In addition, the conveyor sword style is used to create a uniform mesh across the five prefectures. With the spray force method, the amount of particles spread onto the surface of the substrate becomes larger, and even when the through-hole is uneven, it is evenly deposited.
It's L.
また、スプレー力式でに析出銅の慎械的性症の同上も児
らｆＬ、コンベアーτ止め約６０μめっき’ｒｌｒ出さ
ぞＳ銅糸の伸び抗う長刀を副だしたところ迫富の置償法
で６０μ析出さぜ１ζ姻曾と比軟し１ψひおよび仇張力
のＮ７Ｉｌｌｌが見らｒした。In addition, when using the spray force method, the copper deposited by the spray force method was used as a restraint, and the conveyor τ stopped and about 60μ plating was removed. N7IIll of 60μ precipitated 1ζ tension and relative softening 1ψ and opposite tension was observed.
図面ａ不発明の方法τ示すめっき装置の簡略〜「１凶で
ある。
祠−号の続開
１、めっきチャンバー ２．スプレー
５ 水仇ナヤンバ−４，プリント板
５、 １−脚用コイル ６． 排気フード代理人弁理士
若 林 邦 麟
Δり；
、′・二Drawing A Simplification of the plating equipment showing the uninvented method τ ~ ``1. Food Representative Patent Attorney Kuni Wakabayashi RinΔri; ,′・2
Claims (1)
わＣ的に移＃Ｉ６ぜながら、上下η為ら無電解めつき欣
τスプレー次付けめっ＠τ行う工程τ甘むことγ萄畝と
丁々プリント配線仏の衷ブＭ ’／ｉｉ 。1. While slowly moving the lint gland wiring board on a horizontal conveyor, spray electroless plating from the top and bottom η and then apply the plating process τ. The sleeves and the printed wiring Buddha's neck M'/ii.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6005084A JPS60202985A (en) | 1984-03-28 | 1984-03-28 | Method of producing printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6005084A JPS60202985A (en) | 1984-03-28 | 1984-03-28 | Method of producing printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60202985A true JPS60202985A (en) | 1985-10-14 |
Family
ID=13130864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6005084A Pending JPS60202985A (en) | 1984-03-28 | 1984-03-28 | Method of producing printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60202985A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019214776A (en) * | 2018-06-13 | 2019-12-19 | 株式会社Ｓｃｒｅｅｎホールディングス | Electroless plating method, electroless plating apparatus and program |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5050668A (en) * | 1973-09-06 | 1975-05-07 | ||
| JPS5815293A (en) * | 1981-07-20 | 1983-01-28 | シャープ株式会社 | Method of producing printed circuit board |
-
1984
- 1984-03-28 JP JP6005084A patent/JPS60202985A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5050668A (en) * | 1973-09-06 | 1975-05-07 | ||
| JPS5815293A (en) * | 1981-07-20 | 1983-01-28 | シャープ株式会社 | Method of producing printed circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019214776A (en) * | 2018-06-13 | 2019-12-19 | 株式会社Ｓｃｒｅｅｎホールディングス | Electroless plating method, electroless plating apparatus and program |
| WO2019239772A1 (en) * | 2018-06-13 | 2019-12-19 | 株式会社Ｓｃｒｅｅｎホールディングス | Electroless plating method and electroless plating apparatus and program |
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