JPS60192444U - Substrate holding device for semiconductor device assembly equipment - Google Patents

Substrate holding device for semiconductor device assembly equipment

Info

Publication number
JPS60192444U
JPS60192444U JP1984078581U JP7858184U JPS60192444U JP S60192444 U JPS60192444 U JP S60192444U JP 1984078581 U JP1984078581 U JP 1984078581U JP 7858184 U JP7858184 U JP 7858184U JP S60192444 U JPS60192444 U JP S60192444U
Authority
JP
Japan
Prior art keywords
substrate
semiconductor device
substrate holding
device assembly
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984078581U
Other languages
Japanese (ja)
Inventor
之宏 池谷
根本　俊哉
政義 山口
規安 加島
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP1984078581U priority Critical patent/JPS60192444U/en
Publication of JPS60192444U publication Critical patent/JPS60192444U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図ないし第５図は本考案の一実施例を示すもので、
第１図は押え部材の平面図、第２図は第１図のＡＢＣＤ
ＥＦ線に沿った断面図、第３図は第一１図の■−■線に
沿った押え部の断面図、第４図は押え部材と押上げ部材
との相互関係を示す一部断面正面図、第５図は第４図の
矢印Ｇ方向ｂ・らみた押上げ部材の平面図、第６図は本
実施例を適用した基板の斜視図である。 ３・・・基板、１１・・・押え部材、１２・・・押上げ
部材・ヒータブロック、１３・・・透孔、１８．１９・
・・周縁部、２０・・・押え部、２２・・・板ばね体。Figures 1 to 5 show an embodiment of the present invention.
Figure 1 is a plan view of the holding member, Figure 2 is ABCD of Figure 1.
3 is a sectional view of the presser section taken along the line EF, FIG. 4 is a partially sectional front view showing the mutual relationship between the presser member and the push-up member. 5 is a plan view of the push-up member viewed in the direction of arrow G in FIG. 4, and FIG. 6 is a perspective view of the substrate to which this embodiment is applied. 3... Substrate, 11... Pressing member, 12... Pushing member/heater block, 13... Through hole, 18.19.
... Peripheral part, 20... Presser part, 22... Leaf spring body.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）上方に押え部材を設けこれに対向して下方に位置
ぎめピンをもった押上げ部材を設けて上記押え部材と上
記押上げ部材とで基板を挾み位置ぎめ固定する半導体デ
バイス組立装置の基板押え装置において、 上記押え部材は、上記基板に臨む透孔と、こ５、の透孔
の周縁部に設けられて上記元板の周縁部に圧接する板ば
ね体を有する複数個の押え部とを具備したことを特徴と
する半導体デバイス組立装置の基板押え装置。 −（２）押上げ部材は基板を加熱するヒータブロックで
あることを特徴とする実用新案登録請求の範囲第１項記
載の半導体デバイス組立装置の基板押え装置。(1) A semiconductor device assembly apparatus in which a holding member is provided above, a pushing member with positioning pins is provided below, and a substrate is sandwiched between the holding member and the pushing member to position and fix the board. In the substrate holding device, the holding member includes a plurality of holding members having a through hole facing the substrate, and a leaf spring body provided at the peripheral edge of the through hole and pressed against the peripheral edge of the base plate. 1. A substrate holding device for a semiconductor device assembly apparatus, comprising: (2) The substrate holding device for a semiconductor device assembly apparatus according to claim 1, wherein the pushing up member is a heater block that heats the substrate.
JP1984078581U 1984-05-30 1984-05-30 Substrate holding device for semiconductor device assembly equipment Pending JPS60192444U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984078581U JPS60192444U (en) 1984-05-30 1984-05-30 Substrate holding device for semiconductor device assembly equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984078581U JPS60192444U (en) 1984-05-30 1984-05-30 Substrate holding device for semiconductor device assembly equipment

Publications (1)

Publication Number Publication Date
JPS60192444U true JPS60192444U (en) 1985-12-20

Family

ID=30622683

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984078581U Pending JPS60192444U (en) 1984-05-30 1984-05-30 Substrate holding device for semiconductor device assembly equipment

Country Status (1)

Country Link
JP (1) JPS60192444U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022208624A1 (en) * 2021-03-29 2022-10-06 平田機工株式会社 Wire bonding device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022208624A1 (en) * 2021-03-29 2022-10-06 平田機工株式会社 Wire bonding device

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