JPS58164239U - semiconductor equipment - Google Patents

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の実施例を説明する組立図、第２図は第
１図の半導体装置の一部断面図、第３図は本考案による
半導体装置の斜視図である。 １；金属基板、２；蓋体、１１；凹部、１２；凸部、２
３；爪状係合部。FIG. 1 is an assembly diagram illustrating an embodiment of the present invention, FIG. 2 is a partial sectional view of the semiconductor device of FIG. 1, and FIG. 3 is a perspective view of the semiconductor device according to the present invention. 1; Metal substrate, 2; Lid body, 11; Concave portion, 12; Convex portion, 2
3; Claw-like engaging portion.

Claims (3)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）半導体素子が塔載された熱良導性の基板に蓋体を
結合して該素子を収容するものにおいて、前記基板の端
部に複数の凹部を設けるとともに、前記蓋体の該凹部に
対向する位置に凹部の幅より小さい厚みを有する爪状係
合部を設け、該係合部を前記凹部に押圧挿入して固定す
ることを特徴とする半導体装置。(1) In a device for accommodating a thermally conductive substrate on which a semiconductor element is mounted by bonding the lid to the element, a plurality of recesses are provided at an end of the substrate, and the recess of the lid is provided with a plurality of recesses. A semiconductor device characterized in that a claw-like engaging portion having a thickness smaller than the width of the recess is provided at a position facing the recess, and the engaging portion is inserted into the recess under pressure and fixed. （２）実用新案登録請求の範囲第１項記載のものにおい
て、半導体素子は樹脂にて覆われていることを特徴とす
る半導体装置。(2) Utility Model Registration A semiconductor device according to claim 1, characterized in that the semiconductor element is covered with resin. （３）実用新案登録請求の範囲第１項記載のものにおい
て、蓋体は蓋板と枠体とからなることを特徴とする半導
体装置。(3) Utility Model Registration The semiconductor device according to claim 1, wherein the lid body comprises a lid plate and a frame body.