JPS6013739U - Wafer holding device - Google Patents

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来例を示す側断面図、第２図は本考案の一実
施例であるウェハ基板を示す平面図、第３図は第２図中
■−■線に沿って示す側断面図である。 １１・・・・・・基板本体、Ａ・・・・・・ウェハ、４
・・・・・・基準面、１３・・・・・・基準ピン。Fig. 1 is a side sectional view showing a conventional example, Fig. 2 is a plan view showing a wafer substrate which is an embodiment of the present invention, and Fig. 3 is a side sectional view taken along the line ■-■ in Fig. 2. It is. 11...Substrate body, A...Wafer, 4
...Reference plane, 13...Reference pin.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）ウェハを載置し、前記ウェハが加工台の基準面に
合致するように保持される基板本体を備えたものにおい
て、前記基板本体に複数個の基準ピンを前記ウェハの厚
さ寸法に対応して突設し、これら基準ピンを前記加工台
の基準面に当接させて位置決めすることを特徴とするウ
ェハ基板。(1) In a substrate body on which a wafer is placed and held so that the wafer is aligned with a reference surface of a processing table, a plurality of reference pins are attached to the substrate body in accordance with the thickness dimension of the wafer. A wafer substrate characterized in that the reference pins are provided in corresponding protrusions and are positioned by bringing these reference pins into contact with a reference surface of the processing table. （２）基準ピンの突出量は調整可能であることを特徴と
する実用新案登録請求の範囲第１項記載のウェハ基板。(2) The wafer substrate according to claim 1, wherein the amount of protrusion of the reference pin is adjustable.