JPS601836A - Die for resin sealing - Google Patents
Die for resin sealingInfo
- Publication number
- JPS601836A JPS601836A JP10941083A JP10941083A JPS601836A JP S601836 A JPS601836 A JP S601836A JP 10941083 A JP10941083 A JP 10941083A JP 10941083 A JP10941083 A JP 10941083A JP S601836 A JPS601836 A JP S601836A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- cavity
- cavities
- gate
- gates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title claims abstract description 81
- 229920005989 resin Polymers 0.000 title claims abstract description 81
- 238000007789 sealing Methods 0.000 title claims description 12
- 101100298222 Caenorhabditis elegans pot-1 gene Proteins 0.000 abstract description 5
- 239000004065 semiconductor Substances 0.000 description 13
- 238000010586 diagram Methods 0.000 description 9
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 8
- 238000005538 encapsulation Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- FGRBYDKOBBBPOI-UHFFFAOYSA-N 10,10-dioxo-2-[4-(N-phenylanilino)phenyl]thioxanthen-9-one Chemical compound O=C1c2ccccc2S(=O)(=O)c2ccc(cc12)-c1ccc(cc1)N(c1ccccc1)c1ccccc1 FGRBYDKOBBBPOI-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 210000004907 gland Anatomy 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 235000021395 porridge Nutrition 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/2669—Moulds with means for removing excess material, e.g. with overflow cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2701—Details not specific to hot or cold runner channels
- B29C45/2703—Means for controlling the runner flow, e.g. runner switches, adjustable runners or gates
- B29C45/2704—Controlling the filling rates or the filling times of two or more mould cavities by controlling the cross section or the length of the runners or the gates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C2045/2683—Plurality of independent mould cavities in a single mould
- B29C2045/2691—Plurality of independent mould cavities in a single mould sequentially filled
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、ＩＣやＬＳＩに使用される半導体を樹脂によ
って封止するための金型の改良に係り、樹脂の流速及び
充填光子を均一にし、高品質の半導体を得るようにした
樹脂封止用金製に関する。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to an improvement of a mold for sealing semiconductors used in ICs and LSIs with resin, by making the resin flow rate and filling photons uniform, This invention relates to gold for resin encapsulation to obtain high quality semiconductors.
半導体を電気的に接続する場合、例えば半導体素子と外
部リードとを電気的に接続する場合は、この両者を細い
金属線で電気的に接続し。When electrically connecting semiconductors, for example, when electrically connecting a semiconductor element and an external lead, the two are electrically connected using a thin metal wire.
この接続状態を保持するために、これを樹脂によって封
止し、熱的１機械的な強度を保つようにして製品化され
る。In order to maintain this connection state, this is sealed with resin to maintain thermal and mechanical strength, and the product is manufactured.
この樹脂封止において、樹脂モールドＩＣの原価低減を
計るためには、一度に多数の半導体を樹脂封止すること
が行なわれる。In this resin encapsulation, in order to reduce the cost of resin molded ICs, a large number of semiconductors are encapsulated with resin at one time.
このように一度に多数の半導体を樹脂封止するのに、樹
脂封止用金型が使用される。A mold for resin sealing is used to resin-seal a large number of semiconductors at once in this way.
この金型を使用した樹脂封止に際しての技術的な問題は
、各半導体の樹脂封止条件、即ち樹脂の流速と樹脂充填
完了時刻が全べての半導体に対して均一でなげればなら
ない。A technical problem in resin encapsulation using this mold is that the resin encapsulation conditions for each semiconductor, ie, the resin flow rate and resin filling completion time, must be uniform for all semiconductors.
もしも、この樹脂封止条件が不揃いであると、半導体を
電気的に接続している金線の曲りや。If the resin sealing conditions are not consistent, the gold wires that electrically connect the semiconductors may become bent.
充填圧力不足によるキャビティ内樹脂未充填。The cavity is not filled with resin due to insufficient filling pressure.
あるいは、内部微小ボイド等の不良モードが発生して高
品質の製品を得ることができないことになる。Alternatively, failure modes such as internal microvoids occur, making it impossible to obtain high-quality products.
以下第１図に示した従来の金型について説明する。第１
−０図は金型の縦断面図（側面図）、第１−Ａ図は横断
面図（平面図）である。第１−０図において、金型は、
上型６と下型４の二つ割りになっている。第１−４図に
示すように金型は、ボット１に連接されたランナ２が形
成され、このランナ２には、ゲート５を介して多数のキ
ャビティ６が接続され、このキャビティ６内に置かれた
半導体をニ一度に樹脂封止するものである。The conventional mold shown in FIG. 1 will be explained below. 1st
Figure 1-A is a vertical cross-sectional view (side view) of the mold, and Figure 1-A is a cross-sectional view (plan view). In Figure 1-0, the mold is
It is divided into two pieces, an upper mold 6 and a lower mold 4. As shown in FIGS. 1-4, the mold is formed with a runner 2 connected to a bot 1, a number of cavities 6 are connected to the runner 2 through gates 5, and the mold is placed in the cavity 6. The semiconductor is then sealed with resin in two steps.
この金型において、ポット１内にある樹脂が。In this mold, the resin in pot 1.
ランナ２を通って各ゲート５を通り、各キャビティ６内
に矢印の如く流入する。It passes through the runner 2, passes through each gate 5, and flows into each cavity 6 as shown by the arrow.
の流入及び充填を均一にするために次のような工夫がな
されている。The following measures have been taken to ensure uniform inflow and filling.
第１− ａ図において、ランナ２の流路形状では、ボッ
ト１より遠くなるに従って、上型３と下型４との間の畠
さｈを低くし、除々に樹脂の流路断面積を小さくしてい
る。In Figure 1-a, in the flow path shape of the runner 2, the height h between the upper mold 3 and the lower mold 4 is lowered as the distance from the bot 1 increases, and the cross-sectional area of the resin flow path is gradually reduced. are doing.
次に各ゲート５は、第ｉ −ｃ図に示す如く。Next, each gate 5 is arranged as shown in FIGS.
ランナ２からキャビティ６に連らなるゲート５の絞り角
度θを、ボット１１１１１がら遠ざかるに従って除々に
大きくシ、樹脂の流動抵抗を除々に小さくＬ”（いる。The aperture angle θ of the gate 5 extending from the runner 2 to the cavity 6 is gradually increased as the distance from the bot 11111 increases, and the flow resistance of the resin is gradually decreased L''.
即ちボット１に最も近いゲート５の絞り角度をθＡ、最
も遠い絞り角度をθＥとして表わすと。That is, if the aperture angle of the gate 5 closest to the bot 1 is expressed as θA, and the aperture angle farthest is expressed as θE.
θＡくθＢくθｃくθＤくθＥの関係にある。The relationship is θA * θB * θc * θD * θE.
このようにして、ランナ２の流路断面積の変化と、ゲー
ト５の紋り角度θの変化の相剰作用によって、各キャビ
ティ６に流入する樹脂の流動抵抗を等しくシ、ボクト１
に最も近いキャビティ６から最も遠ｈキャビティ６への
樹脂の光填灸件を等しくするようにしていた。In this way, the flow resistance of the resin flowing into each cavity 6 is equalized by the interaction of the change in the cross-sectional area of the flow path of the runner 2 and the change in the curvature angle θ of the gate 5.
The conditions for optical moxibustion of the resin from the cavity 6 closest to the cavity 6 to the cavity 6 furthest from the cavity 6 were made equal.
しかし７１がら、各キャピテイ６に対し、樹脂の流＆Ｉ
抵抗を等しくしているために、各キャビティ６への充填
速度は、第１−４図に示すように、ボット１に最も近い
キャビティ６が最も早く溶融ｍ加７か光愼され、ＩＨに
最も遠いものが最後に充填される。However, since 71, for each capacity 6, resin flow & I
Since the resistance is equalized, the filling speed into each cavity 6 is as shown in Fig. 1-4. Farthest items are filled last.
この関係を第２図に示すと、各キャビティ６への流動抵
抗は等しいので、キャビティＡＦ１（曲線Ａ）、５（曲
線ｆｌ）、５（曲線Ｃ）は、共に同じ勾配とｒＬって、
キャビティ６内への樹脂の流入速度は等しいが、キャビ
ティ６内への樹脂の充填完了時刻は、キャビティＡＦ１
，３．５の順に行なわれ、一定ではない。This relationship is shown in FIG. 2. Since the flow resistance to each cavity 6 is equal, cavities AF1 (curve A), 5 (curve fl), and 5 (curve C) have the same slope and rL.
Although the inflow speed of the resin into the cavity 6 is the same, the time when the filling of the resin into the cavity 6 is completed is different from that of the cavity AF1.
, 3.5, and is not constant.
このような、各キャビティでの充填完了時刻の違い釦よ
って、次のような技術的な問題が生じた。Due to the different filling completion times for each cavity, the following technical problems have arisen.
即ち、ボット１より一定量の樹脂が注入されるので、ボ
ット１に最も近いキャビティ６が充填完了後は、それ以
上該キャビティ６に樹脂が注入されないので、その分だ
け下流側の樹脂流量が増加する。That is, since a certain amount of resin is injected from the bot 1, after the cavity 6 closest to the bot 1 is filled, no more resin is injected into the cavity 6, so the resin flow rate on the downstream side increases by that amount. do.
その結果として、ボット１から遠いキャビティ６内への
樹脂の流入速度が太きくなり、キャビティ６内に置かれ
ているインサート（半導体素子、金線、リードフレーム
の一部）に大きな力が働き、金線等を曲げてしまうとい
う問題が発生した。As a result, the flow rate of the resin into the cavity 6 far from the bot 1 increases, and a large force acts on the insert (semiconductor element, gold wire, part of the lead frame) placed in the cavity 6. A problem occurred in that the gold wire etc. were bent.
又ボット１に最も近いキャビティ６は、早くから充填が
完了しているので、樹脂の硬化によってゲート５部での
シール効果が進み、ボイド発生防止のために、最終的に
加圧される圧力が。In addition, since the cavity 6 closest to the bot 1 is already filled, the sealing effect at the gate 5 increases due to hardening of the resin, and the final pressure is increased to prevent voids.
キャビティ６内に充分に伝わらず、ボイドが残存すると
いう問題が生じた。A problem arose in that the energy was not sufficiently transmitted into the cavity 6 and voids remained.
この問題を解決するために、ボット１に最も近いキャビ
ティ６から順に最も遠いキャビティ６での流動抵抗を揃
えるため−５％ １− ｄ図及び第１− ａ図に示すよ
うにゲート絞り角度を変化させ、各キャビティ６の充填
速度を同じようにしたが、第１−ｄ図のようにゲート絞
り角度θｌ１１を極端に小さくした場合は、成形後のゲ
ートブレークの際に、成形品の根本から折れないので。To solve this problem, in order to equalize the flow resistance from the cavity 6 closest to the bot 1 to the farthest cavity 6, the gate aperture angle was changed by -5% as shown in Figures 1-d and 1-a. The filling speed of each cavity 6 was made the same, but if the gate aperture angle θl11 was made extremely small as shown in Figure 1-d, the molded product would break from the base during the gate break after molding. Since there is no.
それを取除く後処理が困難であり、又第１− α図のよ
う妊、ゲートの絞り角度Ｏｔｘ＋を大きくするには、ゲ
ート５底がランナ２底よりも深くなって、金型加工が不
可能になり、実用的ではなかった０
〔発明の目的〕
本発明は、ゲートの絞り角度を大幅に変えることなく、
各キャビティでの樹脂の充填完了時刻を揃えることによ
り従来の問題点を解決した樹脂封止用金型を提供せんと
するものである。Post-processing to remove it is difficult, and in order to increase the drawing angle Otx+ of the gate as shown in Figure 1-α, the bottom of gate 5 is deeper than the bottom of runner 2, making mold machining difficult. [Objective of the Invention] The present invention makes it possible to reduce the aperture angle of the gate without significantly changing the aperture angle of the gate.
It is an object of the present invention to provide a mold for resin sealing that solves the conventional problems by aligning the filling completion time of resin in each cavity.
即ち本発明は、キャビティ内への樹脂の流入速度を、ゲ
ートの絞り角度によって調節すると共に、第２のキャピ
テイを設けて、充填完了時刻を一定に調節するようにし
たものであって、ランナよりキャビティ内に流入する樹
脂の流入速度を勇節するための第１ゲートをランチに接
続し、この第１ゲートに纂１キャビティを連接し、更に
この第１キヤビテイより流出する樹月旨の流速を調節す
るための第２ゲートを接続し。That is, in the present invention, the speed of resin flowing into the cavity is adjusted by the throttle angle of the gate, and the filling completion time is adjusted to a constant by providing a second cavity. A first gate is connected to the launch to increase the flow rate of the resin flowing into the cavity, the first cavity is connected to this first gate, and the flow rate of the resin flowing out from the first cavity is increased. Connect the second gate for adjustment.
この第２ゲートに第２キヤビテイを接続して。Connect the second cavity to this second gate.
第１キヤビテイより流出した樹脂を収容し、第１キヤビ
テイでの充填速度を調節して、各第１キヤビテイ内での
樹脂の充填完了時刻を一定にしたことを特徴とする。The present invention is characterized in that the resin flowing out from the first cavity is stored, and the filling speed in the first cavity is adjusted so that the time at which resin filling is completed in each first cavity is made constant.
以下本発明の一実施例について詳細に説明する。先ず、
詳細な説明に当って、実施例の概略を説明する。An embodiment of the present invention will be described in detail below. First of all,
For detailed explanation, an outline of the embodiment will be explained.
第３−α図は１本実施例の金型な横断面（平面図）にし
て示したものである。Figure 3-α shows a cross section (plan view) of a mold of this embodiment.
図において、ランナ２は、ボット１に連接されている。In the figure, runner 2 is connected to bot 1.
このランナ２には、第１ゲート５を介して第１キヤビテ
イ６が連接され、更にこの第１キヤビテイ６には、第２
ゲート８を介して第２キヤビテイ９が連接されている。A first cavity 6 is connected to the runner 2 via a first gate 5, and a second cavity 6 is connected to the runner 2 via a first gate 5.
A second cavity 9 is connected via a gate 8.
この金型において、ポット１内の溶融樹脂７は、ランナ
２及び第１ゲート５を通り第１キヤビテイ６内に流入す
る。In this mold, molten resin 7 in pot 1 flows into first cavity 6 through runner 2 and first gate 5 .
この時のゲート５の流入速度は、ボット１に最も近いゲ
ート５から最も遠いゲート５にわたって一定である。The inflow speed of the gate 5 at this time is constant from the gate 5 closest to the bot 1 to the gate 5 farthest.
このようにして、ゲート５より第１キヤビテイ６内釦流
入した樹脂は、第１キヤビテイ６内に充填される。In this way, the resin flowing into the first cavity 6 from the gate 5 fills the first cavity 6.
この充填状況は、ボット１に最も近い第１キヤビテイ６
かも順に充填される。This filling situation is the first cavity 6 closest to the bot 1.
They are filled in order.
このようＫして、第１キヤビテイ６に充填完了した後の
樹脂は、次に第２ゲート８によって流出速度が調節され
て第２キヤビテ（？内に流入する。After completing filling the first cavity 6 in this manner, the resin flows into the second cavity (?) with its outflow speed being adjusted by the second gate 8.
このよう忙して、順次第２キヤビテイ９に樹脂が流入し
ている間に１次々と第１キヤビテイ６忙充横され、それ
ぞれの帛２キャビティ９に樹脂が同時に充填完了した時
に、第１キヤビテイ６内への樹脂充填が同時に完了する
。In this way, while the resin is flowing into the two cavities 9 one after another, the first cavities 6 are filled one after another, and when each of the two cavities 9 is filled with resin at the same time, the first cavities 6 are filled with resin. Filling the interior with resin is completed at the same time.
このようにすることによって、各第１キヤビテイ６内で
の樹脂の光＊完了時刻が同じになる。By doing this, the resin light *completion time in each first cavity 6 becomes the same.
以下その詳細を更に詳しく説明する。第３＝ａ図におい
て、ランナ２は、ボット１に連接され、第１キヤビテイ
６は、第１ゲート５を介してランナ２に接続されている
。The details will be explained in more detail below. In FIG. 3(a), the runner 2 is connected to the bot 1, and the first cavity 6 is connected to the runner 2 via the first gate 5.
８は、第１キヤビテイ６の流出側に連接した第２ゲート
、９は、この第２グー）８に連接された第２キヤビテイ
である。8 is a second gate connected to the outflow side of the first cavity 6, and 9 is a second cavity connected to the second gate 8.
この第２キヤビテイ９の内容積は、ボット１に最も近い
側が一番大きく、ボット１から遠ざかるに従って小さく
なっており、ボット１から最も遠い第１キヤビテイ６が
充填完了と同時に。The internal volume of the second cavity 9 is largest on the side closest to the bot 1, and decreases as the distance from the bot 1 increases, and the filling of the first cavity 6 furthest from the bot 1 is completed at the same time.
各第２キヤビテイ９も同時に充填完了するよう。Filling of each second cavity 9 is also completed at the same time.
それぞれの容積比が設定されている。Each volume ratio is set.
第１ゲート５及び第２ゲート８は、第５−ｈ図忙示すよ
うに構成されている。図において。The first gate 5 and the second gate 8 are constructed as shown in Fig. 5-h. In fig.
第１ゲート５の絞り角度θと、第２ゲートの絞り角度θ
′は、共忙ボット１より遠ざかるＫつれて大きくなって
おり、ランナ２から第１キヤビテイ６に流入する速度と
、第１キヤビテイ６から第２キヤビテイ９へ流出する流
出速度が、ボット１に最も近い側から遠い側にかけてほ
ぼ一定になるようにしている。The aperture angle θ of the first gate 5 and the aperture angle θ of the second gate
' increases as K moves away from the busy bot 1, and the speed of inflow from the runner 2 to the first cavity 6 and the outflow speed from the first cavity 6 to the second cavity 9 are the highest for the bot 1. It is made to remain almost constant from the near side to the far side.
因みに、上記の絞り角度を式で表わせば次の通りである
。Incidentally, the above aperture angle can be expressed as follows.
θＡくθＢくθｃ＜ｔｉｎ＜θＥ 及びθコ〈θｚくθ２くθ２〈θシの関係にある。θA × θB × θc<tin<θE and θk<θz×θ2×θ2<θshi.
なお、ランナ２の流路は％第１−α図で示すように、ボ
ット１から遠ざがるに従って狭くなっている。Note that the flow path of the runner 2 becomes narrower as it moves away from the bot 1, as shown in Figure 1-α.
以上のように構成した本実施例の作用について、以下説
明する〇
第３−α図において、ボット１内の溶融樹脂７は、ラン
ナ２を通り、第１キヤビテイ６内に矢印の如く流入する
。この時の流入速度は、ボット１に最も近い側から最も
遠い側にある第１キヤビテイ６に対し一定である。The operation of this embodiment configured as described above will be described below in Figure 3-α. In Fig. 3-α, the molten resin 7 in the bot 1 passes through the runner 2 and flows into the first cavity 6 as shown by the arrow. The inflow velocity at this time is constant from the side closest to the bot 1 to the first cavity 6 located on the farthest side.
このようＫして、第１キヤビテイ６に流入した樹脂７は
１図に示す如くに、ボット１に最も近い第１キヤビテイ
６から順に充填されていく。In this way, the resin 7 that has flowed into the first cavity 6 is filled in order from the first cavity 6 closest to the bot 1, as shown in FIG.
図の状態では、ボット１に最も近い第１キヤビテイ６が
充填完了している。次に丁でに充填が完了した第１キヤ
ビテイ６内の樹脂は、第２ゲート８によって流出速度が
調節され、第２キヤビテイ９へと流入する。この間に他
の第１キヤビテイ６は順次充填され１次に第２ゲート８
を介して第２キヤビテイ９へと流入スる。In the state shown, the first cavity 6 closest to the bot 1 has been filled. Next, the resin in the first cavity 6, which has been completely filled, flows into the second cavity 9 with its outflow speed being adjusted by the second gate 8. During this time, the other first cavities 6 are sequentially filled, and the first and second gates 8 are filled.
It flows into the second cavity 9 through the.
この間のランナ２及び第１キヤビテイ６内の樹脂の流れ
は、連続して行なわれ、且つランナ２内の樹脂の流量は
、全域にわたり℃一定であり、従って各第１キヤビテイ
６内への流入速度も一足になっている。During this time, the flow of resin in the runner 2 and the first cavity 6 is continuous, and the flow rate of the resin in the runner 2 is constant in °C over the entire area, so that the flow rate into each first cavity 6 is constant. It's also a pair.
次に、ボット１から最も遠い第１キヤビテイ６が充填完
了と同時に、各第２キヤビテイ９も同時に充填が完了す
る。Next, when the first cavity 6 furthest from the bot 1 completes filling, the filling of each second cavity 9 also completes at the same time.
このことは、各第１キヤビテイ６が同時に充填完了した
のと同じ結果・となる。This results in the same result as if each first cavity 6 was filled at the same time.
この樹脂充填状況を第４図に示す。第４図においては、
従来の金型と対比するために併記して示し１図中実線は
本実施例の場合の充填状況を、点線は従来の金型の場合
の充填状況をそれぞれ示す。This resin filling situation is shown in FIG. In Figure 4,
For comparison with a conventional mold, they are shown together, and the solid line in Figure 1 shows the filling situation in the case of this embodiment, and the dotted line shows the filling situation in the case of the conventional mold.
本発明での光填率は第１キヤビテイ、第２キヤビテイを
合わせたものである。これから１本発明では充填完了時
刻が全てのキャピテイで一致し工いることがわかる。こ
れに対し、従来の金型の場合では、各キャビティを樹脂
が流動中は１曲線の傾き（即ちキャピテイ内樹脂充填速
度）が同じであるが、第２図で説明したように上流側の
キャビティが充填完了する度に流路が１つ減り、瞬間的
に圧力損失が太きくなり、充填速度も、それに比してス
テップ状に太キくすることがわかる。The light filling rate in the present invention is the sum of the first cavity and the second cavity. From this, it can be seen that in the present invention, the filling completion time is the same in all capacities. On the other hand, in the case of a conventional mold, the slope of one curve (that is, the resin filling speed in the cavity) is the same while the resin is flowing through each cavity, but as explained in Figure 2, the slope of the curve is the same when the resin is flowing through each cavity. It can be seen that each time the filling is completed, the number of channels decreases by one, the pressure loss increases instantaneously, and the filling speed increases in a stepwise manner.
又第５図に示すように、半導体を電気的に接続し℃いる
封止後の金腺の曲り状況は、曲ｉＡで示す従来の金型１
ｃ対し１曲線Ｂのようにほとんど変形がないことが理解
されろ。Further, as shown in Fig. 5, the bending state of the gold gland after electrically connecting the semiconductor and sealing is the same as that of conventional mold 1 shown by curve iA.
It should be understood that there is almost no deformation as in curve B for c to 1.
又第６図にボイドの発生状況を示すが、従来の金形ＣＡ
）では、キャビティＪ４６１〜５に行くに従って減少し
、ボット１に近い側で最も発生率が高いことを示してい
るが１本集施例ＣＥ）では。Figure 6 shows the occurrence of voids in the conventional mold CA.
) shows that the occurrence rate decreases as one goes to cavities J461 to J465, and the occurrence rate is highest on the side closest to bot 1, but in the first volume Example CE).
低い発生度で且つ全体にわたりニ一定していることが理
解され、ボイドの発生が低いことを示している。It is understood that the occurrence of voids is low and constant throughout, indicating that the occurrence of voids is low.
？≧お上記実施例において、第２キヤビテイ９０内容積
の比率を、樹脂充填完了時刻が各第２キヤビテイ９にお
いて同時に完了すように設定されているとして説明した
が、これは、樹脂の使用量を最少限にするための手段で
あって、これに限定するものではない。従って第２キヤ
ビテイ９の内容積を充分大きくすることによっても、同
じ結果が得られる。? ≧ In the above embodiment, the ratio of the internal volumes of the second cavities 90 was explained as being set such that the resin filling completion times were completed at the same time in each second cavity 9, but this does not mean that the amount of resin used is This is a means to minimize the number of cases, and is not limited to this. Therefore, the same result can be obtained by making the internal volume of the second cavity 9 sufficiently large.
以上詳述した通り本発明の樹脂刺止用金型によれは、第
１ゲート、第１キヤビテイ、第２ゲート及び第２キヤビ
テイを連接し、第１ゲートと第２ゲートによって樹脂の
流速を調節すると共に、第２キヤビテイによって充填速
度を調節するようにしたので、各第１中ヤビテイ内での
樹脂充填完了時刻が一定となり、半導体素子他インサー
トへの過大な樹脂流動力が加わらず。As detailed above, in the resin stabbing mold of the present invention, the first gate, the first cavity, the second gate, and the second cavity are connected, and the flow rate of the resin is adjusted by the first gate and the second gate. At the same time, since the filling speed is adjusted by the second cavity, the resin filling completion time in each first cavity becomes constant, and excessive resin flow force is not applied to the semiconductor elements and other inserts.
金線の変形が起らない。No deformation of the gold wire occurs.
又第１キヤビテイへの充填に際して、全体の第１キヤビ
テイがすべて充填完了するまで、樹脂の流動は連続的紀
行なわれ、充填完了を同時に行うようにしたので、ゲー
トシールの問題はなく％１終の加圧力が、全第１キヤビ
テイに伝達されキャビティ内樹脂未充填不良や内部微小
ボイド等の発生が防止された。Furthermore, when filling the first cavity, the resin flows continuously until the entire first cavity is completely filled, and the filling is completed at the same time, so there is no problem with gate sealing and the %1 finish is achieved. The pressurizing force was transmitted to all the first cavities, preventing the occurrence of insufficient resin filling inside the cavity and internal microvoids.
このようにして、金線の変形及びボイドの発生等の不良
モードを防止することによつ′″ＣＣ製品頼性を高める
外に、不良品の発生を少なくして歩留りを高くシ、製品
価値を向上させるなど、多大な効果を有する。In this way, by preventing failure modes such as deformation of the gold wire and generation of voids, we not only increase the reliability of CC products, but also reduce the occurrence of defective products, increase yields, and increase product value. It has great effects, such as improving
ｍ１図及び第２図は従来の樹脂封止用金型であり、第１
−α図は、縦断面図、第１−Ａ図は横断面図、第１−Ｃ
図ビ］（ロ）（ハ）μ）亦）は各々、第１−６図のＡ、
Ａ 、 Ｂ−Ｂ 、 Ｃ−Ｃ’ 、 Ｄ、Ｄ 、 Ｅ〜
Ｅ線で断面し、ゲート部分を示した図である。
第１−ｄｖは、ゲートの紋り角度を極端に小さくした場
合な又、第１− を図をま、ゲートの絞り角度を極端に
大きくした場合を断面して示した説明用図である。第２
図は、キャビティｆｆ１Ｊに充填状態を示した線図であ
る。
第６図乃至第６図は１本発明の一実施例であり、第３図
（α１は横断面図、第３図（ｂｌ（イ１（口ＩＮに））
咋１は各々、第３図（α）のＡ′〜Ａ’、Ｂ’〜Ｂ’
、 ｃ’〜Ｃ′。
Ｄ′〜Ｄ’、Ｅ’〜Ｅ′線で断面した図である。第４図
（α）は従来の金型な示した図、第４図（ｂ）（土木発
明の金型を示した図、第４図ｉＣｌは樹脂充填状態を従
来のものと併記して示した線図である。第５図（α）は
従来の金型を示した図、第５図ｉｂｌは本発明の金型な
示した図、第５図（ｃｌは、平均金線的り量を従来のも
のと併記して示した線図である。
第６図（α）は従来の金型な示した図、第６図（ｈｌ（
ま本発明の金型な示した図、第６図（Ｃｌはボイド発生
度を従来のものと併記して示した棒グラフである。
１０１．ボット ２・・・ランチ
５・・・第１グー ） ６・・・第１キヤビテイ８・・
・第２ゲート ９・・・第２キャビティ愉１目
千２図
（Ｑ：）
粥５図
Ａ’−Ａ’ Ｂ’−Ｂ’ Ｃ’−Ｃ’ Ｄ’−Ｄ’ Ｅ
’−Ｅ’〒４灰
梵５図
Ｉｈ）
″＋ｒビティＮυ。
手続補正書（方式）
％式％
発明の名称 樹脂封止用金型
補正をする者
１ｍと帳係 特許出願人
代 理 人
補正の対象 図面の第１図（ｃ） 、及び第６図Ｃ１）
）補正の内容
（１） 図面中、第１図（ｃ＋ 、及び第３図（ｂ）を
別紙のとおり訂正する。
峯１ 図
姫３図
（ｂ）Fig. m1 and Fig. 2 are conventional molds for resin sealing.
Figure -α is a longitudinal cross-sectional view, Figure 1-A is a cross-sectional view, and Figure 1-C is a cross-sectional view.
Figure B] (B) (C) μ) and
A, B-B, C-C', D, D, E~
It is a cross-sectional view taken along line E and showing a gate portion. No. 1-dv is an explanatory diagram showing a case where the curving angle of the gate is extremely small, and a cross-sectional view of the case where the aperture angle of the gate is made extremely large. Second
The figure is a diagram showing the state in which the cavity ff1J is filled. 6 and 6 show one embodiment of the present invention, and FIG. 3 (α1 is a cross-sectional view, and FIG.
Kui 1 is A'-A' and B'-B' in Figure 3 (α), respectively.
, c'~C'. It is a cross-sectional view taken along lines D'-D' and E'-E'. Figure 4 (α) is a diagram showing a conventional mold, Figure 4 (b) is a diagram showing a mold invented by civil engineering, and Figure 4 iCl is a diagram showing the resin filling state together with the conventional mold. Figure 5 (α) is a diagram showing the conventional mold, Figure 5 ibl is a diagram showing the mold of the present invention, and Figure 5 (cl is the average gold wire coverage amount). Fig. 6(α) is a diagram showing the conventional mold together with the conventional mold.
FIG. 6 is a diagram showing the mold of the present invention (Cl is a bar graph showing the degree of void generation together with that of the conventional one. 101. Bot 2... Lunch 5... First goo) 6...First cavity 8...
・Second gate 9...Second cavity number 1, 1,000, 2 (Q:) Porridge 5, A'-A'B'-B'C'-C'D'-D' E
'-E' 〒4 Haibon 5 Figure Ih) ''+r bitty Nυ. Procedural amendment (method) % formula % Title of invention 1m person who corrects resin sealing mold and bookkeeper Patent applicant's agent Person's amendment Figure 1 (c) and Figure 6 C1)
) Details of the amendment (1) In the drawings, Figure 1 (c+) and Figure 3 (b) are corrected as shown in the attached sheet.Mine 1 Figure 3 (b)
Claims (1)
分岐接続されたキャビティを、多数配設した樹脂封止用
金型において、キャビティ内に流入する樹脂の流入速度
を調節するための第１ゲートと、該第１ゲートに連接し
た第１キヤビテイと、該第１キヤビテイ内の樹脂の流出
速度を調節する第２ゲートと、＃第２ゲートに連接′し
第１キヤビテイの樹脂充填速度を調節する第２キヤビテ
イとから成り、上記第１ゲート。 第１キヤビテイ、第２ゲート及び第２キヤビテイを順次
連通して上記ランナに分岐接続し、第１キヤビテイ内に
流入する樹脂の流入速度及び第１キヤビテイ内での樹脂
充填完了時刻を各第１キヤビテイに対しほぼ同じにした
ことを特徴とする樹脂封止用金型。[Claims] In a resin sealing mold in which a large number of cavities are branched and connected via gates to a launch connected to a pot or a sprue, the inflow speed of resin flowing into the cavities is adjusted. a first gate for adjusting the flow rate of the resin in the first cavity; a second gate for adjusting the flow rate of the resin in the first cavity; and a second cavity for adjusting the filling speed, said first gate. The first cavity, the second gate, and the second cavity are sequentially communicated and branched to the runner, and the inflow speed of the resin flowing into the first cavity and the time of completion of resin filling in the first cavity are controlled by each first cavity. A mold for resin sealing, which is characterized in that the molds are made almost the same.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10941083A JPS601836A (en) | 1983-06-20 | 1983-06-20 | Die for resin sealing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10941083A JPS601836A (en) | 1983-06-20 | 1983-06-20 | Die for resin sealing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS601836A true JPS601836A (en) | 1985-01-08 |
Family
ID=14509538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10941083A Pending JPS601836A (en) | 1983-06-20 | 1983-06-20 | Die for resin sealing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS601836A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62114440U (en) * | 1986-01-09 | 1987-07-21 | ||
| CN105196484A (en) * | 2015-09-10 | 2015-12-30 | 安徽中智光源科技有限公司 | Quick-filling, equal-area and constant-pressure runner pouring gate structure |
-
1983
- 1983-06-20 JP JP10941083A patent/JPS601836A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62114440U (en) * | 1986-01-09 | 1987-07-21 | ||
| CN105196484A (en) * | 2015-09-10 | 2015-12-30 | 安徽中智光源科技有限公司 | Quick-filling, equal-area and constant-pressure runner pouring gate structure |
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