JPS60165746A - Composite lead pin - Google Patents
Composite lead pinInfo
- Publication number
- JPS60165746A JPS60165746A JP59020641A JP2064184A JPS60165746A JP S60165746 A JPS60165746 A JP S60165746A JP 59020641 A JP59020641 A JP 59020641A JP 2064184 A JP2064184 A JP 2064184A JP S60165746 A JPS60165746 A JP S60165746A
- Authority
- JP
- Japan
- Prior art keywords
- pin
- composite
- alloy
- pins
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Abstract
Description
【発明の詳細な説明】
本発明は、４Ｊ’＝ ４’１１１回に’Ｒやダイオ １
．セラλツクコンデンサ 等の電ｒ部品に使用されるｌ
！′）’ｌ： ７クス容器に取付けられる複合り ｌピ
ンに関する。[Detailed Description of the Invention] The present invention provides that 4J' = 4'111 times 'R and diode 1
．． Used in electric parts such as ceramic capacitors
! ')'l: Regarding the compound l pin attached to the 7x container.
従来、集禎回路やパワートラジスタ−等の電子部品に使
われるり−１＝ピンは、−１バール、パ マロイ等の１
・゛Ｃ系合金やＯｌｌを主成分とする合金で作られてい
るが、リ １ビンに要求される特性が多様化するに従っ
−（成る一面で打所であるものか他の面では短所となり
、要求される特性を備えたり一１ζピンが１Ｆｌ−られ
ないと・う問題がある。Conventionally, the pins used in electronic components such as integrated circuits and power transistors are -1 bar, 1 bar, etc.
・Although it is made of C-based alloys and alloys whose main components are Therefore, there is a problem that the required characteristics cannot be provided or the 1ζ pin cannot be made 1Fl-.
例えば、リ ｌ・ピンに１月！求される特性としＣは、
導電率、熱伝導率がＭｌｌいこと、７）う付す（＋１．
＞口１１付は性が良いこと、ワイヤーボンディング）＋
１が良いこと、めっき性が良いこと、加ｌＩＩが１１い
こと、熱膨張率が小さいこと、構造）Ａｕとじ一〇強１
１が高いこと、耐食性が良いこと、経済的であること等
多岐にわたっているが、これらを完全に持ら合わせた材
料は未だ見出されζいない。For example, in January! The required characteristic C is
Electrical conductivity and thermal conductivity must be low. 7) Add (+1.
＞The one with opening 11 has good properties, wire bonding) +
1 is good, plating property is good, lII is 11, low coefficient of thermal expansion, structure) Au binding is 10 strength 1
Although it has a wide variety of properties, such as having a high carbon content, good corrosion resistance, and being economical, a material that has all of these properties has not yet been found.
導電率の高い材料は軟らかく曲がり易いとか、（２）
耐食１Ｆ（７月スい（Ａ利１１ 一般にｉｌ′ｌｌｌ１
ｌｌｌであるとか人々欠点を兼ね備えているのが３１１
常で小心。It is said that materials with high conductivity are soft and easy to bend.
311 people who are llll or have both flaws
Always timid.
またｊ〕Ｌ来り Ｉピンをろう（−ｆ ＆Ｊするにし１
、す１−ピンとＡ［イ）うを別々に作り、第１図に小才
如（ソー１′ピン挿通孔１の内周面にメタライズＩｔ’
ｉ ２を形成したセラミックス基板３のり−ＩＳピン１
ｌＩｉ ｊ＋＋ｉ孔１に、グー１°ピン４を挿通して七
ソトし、１１１）Ａ［ろう５を１共給し°（炉中りこて
加熱し、ＡＩ！〕）ら５を溶Ｍ１ニジてり １゛ピン４
をセッミソクソ、基Ｊ）２．１にろう（Ｎｌ’ ｌする
が、ツタライスＩｒｉ ２の表面心、１凹凸があり、ま
たＡ ｇ ；’）う５とノタラ・イズ層２の金属との合
金化が進むに−）れて僅かづつ夫々の条（’Ｉにより使
用するに必要なＡ［イ）う５のボリュームは異なってく
るのであるが、予め供給した一定１１」のボリュ−Ｊ・
のへｇノ）・う５でろう伺けされる為、第２図に示ず如
く△Ｉ（ろう５のポリュ−Ｊ、不３１１とか、第３図に
示す如＜ Ａ Ｉｇろう５のボリューム過多による流れ
出し等に帰因するろう付不良、特にろ・）イ・ロノ部外
観つＴｌ’リノニスカスの形状のばらつきとろう（−Ｉ
Ｇ）強度の低下が多々発Ｌ１ｊ〜でいた。Also, when j〔L comes, connect the I pin (-f &J to 1)
, S1-pin and A[A] are made separately, and as shown in Fig.
Ceramic substrate 3 glue with i 2 formed - IS pin 1
lIi j++i Insert the goo 1 degree pin 4 into the hole 1 and tighten it 111) 1 pin 4
Semisoxo, base J) 2.1 to wax (Nl' l, but the surface center of the ivy rice Iri 2, 1 unevenness, also A g ;') 5 and alloying with the metal of the notara is layer 2 As the process progresses, the volume of A5 required for use will vary slightly depending on the volume of each column ('I), but the pre-supplied constant volume J.
As shown in Figure 2, △I (Poly-J of Wa 5, F311, etc., as shown in Figure 3) is excessive volume of Ig Rou 5. Brazing defects caused by run-off caused by brazing, especially variations in the external appearance of the solder (-I) and the shape of the solder (-I).
G) There were many decreases in strength at L1j~.
（３）
本発明ｔ、１．１−記諸事情に鑑、７ｔなされ人二ノ）
ので、ろう何部にろう相を自動的に（ｌ給でき、しがも
７）う材が多過ぎた場合でも少ない場合でもノー゛−ス
ヵスの形状を一定にし、［１一つ））’５付リノ強度を
’Ｌ’、 ’＊ｉごごせることのできる複合り Ｉビン
を提供・１！んとするものである。(3) The present invention was made in view of the circumstances described in 1.1-2.
Therefore, the wax phase can be automatically supplied to several parts of the solder, and the shape of the no-scus can be kept constant regardless of whether there is too much or too little material. Reno strength with 5 'L', '*i Composite I bottle that can be washed 1! This is what we do.
本発明の複合り Ｉピンは、第４図に示″・Ｊ−如く２
本のり １ピン４ａ、４ｈが同心に先１’ＡＩ面が対向
せしめられて、両先醋１部がろ・う１Ａ５′にて包むよ
うにろう付りて１本のり−１゛ピン４ ’ ６．１形成
されていることを特徴とする４）のである。The composite I pin of the present invention is shown in FIG.
Book glue 1 Pins 4a and 4h are concentrically placed with the AI surfaces facing each other, and one part of both ends is soldered so as to be wrapped with wax 1A5'. 4), which is characterized by the following:
前記２本のり ｌビン７Ｉａ、４ｂの少なくとも１本は
、：１バール、鉄−ニソヶル合金、ステンレス鋼等鉄系
合金とｉｌｌ＋を主成分とした合金のり １ピン、或い
はｌｉ’（Ｂ、（じｏ、Ｎｉ、Ｍｏ、Ｗ、ｉ″ｉ。At least one of the two glue bottles 7Ia and 4b is: 1 bar, alloy glue mainly composed of iron-based alloys such as iron-nisogal alloys and stainless steel, and 1 pin, or li' (B, (ji) o, Ni, Mo, W, i″i.
Ｃｕを主成分とする合金メし、１夫々のｌ゛１１体のＩ
Ｊ −１ピンであることかに丁ましい。An alloy whose main component is Cu, each of 1 and 11 I
It's quite fitting that it's the J-1 pin.
前記メ〕う材５ ′Ｉｔ、 Ａｕ、 ＡＩＢ、Ｃｕ、Ｎ
ｉ。Said material 5'It, Au, AIB, Cu, N
i.
Ｐｄ、Ｉｎ、Ｓｎ、Ｐｂの内のいずれかを１成分とする
合金又はｔ１１体のメ）う１７１であることが好Ａ：１
７（４）
い。It is preferable that it is an alloy containing one of Pd, In, Sn, and Pb as one component or a t11 body material 171 A:1
7(4) Yes.
次に斯かる構成の本発明の複合り一１ピンの使用例に−
）い゛Ｃ説Ｉリヒ・１−る。Next, let's look at an example of the use of the composite ribbon 1 pin of the present invention having such a configuration.
) Theory C I Rich 1-ru.
第５図に示ず如くり−Ｉ−ピン挿通孔１の内周面にＣＩ
Ｊのメタライス層２を形成しＡ１セラミックス基板３の
リ ドビン挿通孔１に、本発明の複合ソー１゛ピン４′
を挿Ｉｎ シて、２本のり １ピン４ａ。As shown in Fig. 5-I-I-pin insertion hole 1
Form the metal rice layer 2 of J and insert the pin 4' of the composite saw 1 of the present invention into the lid bin insertion hole 1 of the A1 ceramic substrate 3.
Insert the two glue pins 1 and 4a.
４ｂの画先端部を包むようにろ・ライ・口Ｊしたろ・う
祠５′をり−１ピン挿通孔１内に位ｉ６せしめる。次に
この状態を保持したままが中にて加熱し、ろう材５′を
溶副１して、第６図に示゛・ト如く複合り １ピン４′
叩ちり一トピン４ａ、４ｂの画先ｂ：：、１部をセラミ
ックス基板３にろう付りする。Insert the holder 5' into the pin insertion hole 1 at position i6 so as to wrap around the leading edge of the image 4b. Next, while maintaining this state, it is heated inside to melt the brazing filler metal 5' and form a composite pin 4' as shown in Fig. 6.
A portion of the tip b of the beaten pins 4a and 4b is brazed to the ceramic substrate 3.
この複合り一］′ビニ７４′のむラミソクス基板３への
ろう伺けに於いて、ろう材５′のポリｊ、 ムは一定で
はないので、ろうＩＡ５′のボリュ ノ、が多過ぎた場
合は、第７図に示す如く２本のす１゛ピン４ａ、４ｂの
先ＩＡ１面同志の隙間６が自動的に広くなり、ろう材５
′のボリューノ・が少ない場合は、第８図に示す如く−
Ｌ下２本のり一１′ビン４ａ。When soldering the laminated substrate 3 containing the vinyl 74, the polygon of the solder material 5' is not constant, so if the volume of the solder material IA 5' is too large. As shown in FIG. 7, the gap 6 between the IA1 surfaces at the tips of the two pins 4a and 4b automatically widens, and the brazing material 5
If the volume of ' is small, - as shown in Figure 8.
L lower two glue 1' bin 4a.
（５）
４ｂの先０１１１面同志の隙間６が自動的に狭くなり、
メニスカスの形状が・定に保たれ［１，＝＞ろ・う付ｏ
弓、１１度が安定する。ＩｔＩら、メニスカスの形状は
ろ・５ ＋４５′とり−Ｆビンｄａ、４ｂ及びツタライ
ス層２の表面のろうの広がりによる表面張力で決まるが
、リードビン４ａ、４ｂの先端面同志の隙間６を充たす
に十分なろう手Ａ５′が不足したり多過ぎ）、；りする
時は、リ−トピン４ａ、４ｈの位置が僅力弓に」１下し
て、均り合いが保たれる為、メニスカスの形状は富に一
定に保たれ口つろ・うイζ１り強度がｐ；定する。(5) The gap 6 between the 0111 planes ahead of 4b is automatically narrowed,
The shape of the meniscus is kept constant [1, => underlay o
The bow is stable at 11 degrees. The shape of the meniscus is determined by the surface tension due to the spread of wax on the surface of the lead bins 4a and 4b and the ivy rice layer 2, but it is sufficient to fill the gap 6 between the tip surfaces of the lead bins 4a and 4b. When the narou-te A5' is insufficient or too large, the position of the lead pins 4a and 4h is slightly lowered by 1" to maintain balance, which improves the shape of the meniscus. is held constant with wealth, and the strength of the balance and the loss of income is determined by p;
尚、本発明の複合り １：ピン４′は、に下のリードピ
ア４ａ、４ｂをろう＋Ａ５′にζろ・う伺し−（作られ
るものであるから、上下のリートピン４ａ。In addition, the composite structure of the present invention 1: The pin 4' is made by soldering the lower lead piers 4a, 4b to A5', so the upper and lower lead pins 4a.
４ｂの材質を複合リートピン４′を取イ・Ｈ）る夕・１
象物に応じて任意に選定することができる。例えばセラ
ミックス容器に取イ・ロジる場合は下部のり一１ピン４
ｂに強度の強い鉄−ニッケル合金或いはコバール等の合
金を用い、−１一部のり−トピン４ａにＡｕ線等とホン
ディング竹の良い銅合金を用いる（６）
ことができる。Using the material of 4b, remove the composite lead pin 4'.
It can be arbitrarily selected depending on the object. For example, when installing in a ceramic container, glue the bottom glue 1 pin 4.
It is possible to use a strong iron-nickel alloy or an alloy such as Kovar for b, and to use Au wire or the like and a copper alloy with good bonding properties for the gluing pin 4a (6).
１ｄ１−の説明で判る、１、つ６．二本発明の複合り
Ｉピンは、１．’＋２本のり １ピンの先端面を同心に
ＨＩり１向さ一ロて両り”Ｑ ｌ’１ｌＩＪ部を７）・
）４．ｔｌこて包むよ）Ｃに／））４＝Ｊけしたもので
あるから、＋−：、： Ｎ、ノクス基１１ジ等・・のろ
・う付（）部であるり １ピン庫１１１ｆ ｒＬに挿通
ｊ〜′（ろう材の部分をり ｌ・ピン挿通ａ内に位置干
し７めた十炉中７〕う伺しｊするごとにより、リ １ピ
ン挿通札内にシ１１ろう４」を自すリＪ的に（ｌ給゛ζ
き、）〕う）」が多過ぎた場合４；ｌニー１下のり １
゛ピンの先端面同志の隙間が自動的に広くな／）、／）
）４Ａ、／ｌＫ小４１′い１Ｊｚｌ ｉ’”； １１１
その隙間が自動的に狭＜’！ｆ−Ｊて、ノースカス形Ｉ
Ｑが一定に保たれ「１つり トピン占セソミソクスノ、
（板等とのイ）うイ（１り強度が安定する等の優れ）、
二仙果を奏する。1, which can be seen from the explanation of 1d1-6. Combination of two inventions
The I pin is 1. ' + 2 glues HI the tip of the 1st pin concentrically, 1 side in 1 direction, and both ``Q l'1lIJ part 7).
)4. tl I'll wrap it with a trowel) on C/)) 4=J Since it's a sharp one, +-:,: N, Nox group 11 di, etc... It's a glue/braze part () 1 pin storage 111f Insert the solder metal part into rL and place it inside the pin insertion hole a. As for me (I pay゛ζ
If there are too many ki,)〕u)''4; l knee 1 down 1
゛The gap between the tip surfaces of the pins will automatically widen/),/)
)4A, /lK小41′い1Jzli′”; 111
The gap will automatically narrow <'! f-J, North Cus type I
Q is kept constant,
(Compatible with boards, etc.) U (1) Superiority such as stable strength, etc.
Play the two immortal fruits.
第１］ネ目、１従来のり−Ｉピンをセラミックス基板に
ろう付けした状態を示す図、第２図は第１図のリードピ
ンのろうイ＜トノに於いＣＡ’ ｇろうが不足した場合
のろうイ」け状態を示す図、第３図は第１図（７）
のり−１ピンの７）う付＆ｊに於いてＡｇろ・）が糸屑
ぎた場合のろう付４Ｊ状態を示す図、第４図（、ＩＡイ
１）明の複合リードピンを示す図、第５図、第６図（，
１本発明の油含り一トピンをｌ！″）ミックスＪに扱に
ろうイ・トｊする−１−稈イー示”・ｊ−図、第７１ツ
ロ１１第６図の複合り Ｉピンの／〕・）（ｔ ＆Ｊに
於い゛（１）う）、（が糸屑き゛人工場合の状態を示す
図、第８図６１１第０図（７）？：Ｑ合りトピンのろう
（Ｊｉｌに於いてろう４（が不Ｊ１４シた場合の状態を
示す図である。
４ａ、４ｂ リ １ピン、５′ ろ）］７１．４′ 油
含り １ピン。
出願人 １１１中Ｐノ金属上業株式会拐（８）
第１図
第３図
第２図
第４図
第５図
第７図
第６図
第８図1] Ne, 1 Conventional glue - A diagram showing the state in which the I pin is brazed to a ceramic substrate. Fig. 3 is a diagram showing the brazing state in which thread waste occurs in Fig. 1 (7) and 7) mounting &j of the glue-1 pin. Figure 4 (,IA-1) is a diagram showing a bright composite lead pin, Figure 5, Figure 6 (,
1. The oil-containing toppin of the present invention! '') mix J to handle - 1 - culm ee indication'', j - Figure, 71st Tulo 11 Figure 6 combination of I pin /] () (t & J ゛( 1) U), (Diagram showing the state when the lint is artificial, Fig. 8 611 Fig. 0 (7)?: When the wax 4 (in the Jil is broken) 4a, 4b 1 pin, 5' ro)] 71.4' Oil-containing 1 pin. Applicant No. 111 P No Metal Industry Co., Ltd. (8) Fig. 1 Fig. 3 Figure 2 Figure 4 Figure 5 Figure 7 Figure 6 Figure 8
Claims (1)
められて、画先端部がろ・５＋Ａにて包むようにろう付
げされて１本のり一１゛ビンに形成されていることを特
徴とする複合リートピン。 ２）２本のり一１ピンの少なくとも１本が、コバール、
鉄−ニソケル合金、ステンレス鋼等鉄、盾合金と１１＃
Ｉを１°成分と１．た合金のり １ピンでＪ、イ、ｑ！
１許請求の範囲第１項記載の蝮合す ｌピン。 ３）２本のリードピンの少なくとも１本が、Ｆｅ。 Ｃｏ、Ｎ ｉ、Ｍｏ、Ｗ、 ′ｌ″ｉ、Ｃｕを主成分と
する合金又は夫々のｌｘ体のリードピンである特許請求
の範囲第１項記載の複合り−Ｉ゛ピン。 ４）ろ・う材が、Ａｕ、Ａｇ、（：ｕ、Ｎ ｉ、Ｐｄ。 Ｉｎ、Ｓｎ、ｐｂの内のいずれかを−１−成分、！、
ｌ−る合金又は単体のろう（Ａである特許請求の範囲第
１項記載の複合り ］ｌピン （１）[Scope of Claims] 1) Two glue pins are concentrically tightened in the 1st direction, and the leading edge of the image is brazed so as to be wrapped with the 5+A. A composite lead pin characterized by being formed into a bottle. 2) At least one of the two glue pins is Kovar,
Iron-Nisokel alloy, stainless steel, etc. Iron, shield alloy and 11#
Let I be the 1° component and 1. Alloy glue J, I, Q with 1 pin!
1. A mating L pin as set forth in claim 1. 3) At least one of the two lead pins is Fe. The composite I pin according to claim 1, which is a lead pin of an alloy whose main components are Co, Ni, Mo, W, 'l''i, and Cu, or the lx form of each of them.4) Filter. The filling material contains any one of Au, Ag, (:u, Ni, Pd, In, Sn, and Pb as the -1-component!)
l-alloy or single solder (composite solder according to claim 1 which is A) l-pin (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59020641A JPS60165746A (en) | 1984-02-07 | 1984-02-07 | Composite lead pin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59020641A JPS60165746A (en) | 1984-02-07 | 1984-02-07 | Composite lead pin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60165746A true JPS60165746A (en) | 1985-08-28 |
| JPH0466105B2 JPH0466105B2 (en) | 1992-10-22 |
Family
ID=12032849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59020641A Granted JPS60165746A (en) | 1984-02-07 | 1984-02-07 | Composite lead pin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60165746A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5241216A (en) * | 1989-12-21 | 1993-08-31 | General Electric Company | Ceramic-to-conducting-lead hermetic seal |
| US5273203A (en) * | 1989-12-21 | 1993-12-28 | General Electric Company | Ceramic-to-conducting-lead hermetic seal |
-
1984
- 1984-02-07 JP JP59020641A patent/JPS60165746A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5241216A (en) * | 1989-12-21 | 1993-08-31 | General Electric Company | Ceramic-to-conducting-lead hermetic seal |
| US5273203A (en) * | 1989-12-21 | 1993-12-28 | General Electric Company | Ceramic-to-conducting-lead hermetic seal |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0466105B2 (en) | 1992-10-22 |
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