JPS60121063A - Production of lead pin with spherical brazing filler metal - Google Patents
Production of lead pin with spherical brazing filler metalInfo
- Publication number
- JPS60121063A JPS60121063A JP22789383A JP22789383A JPS60121063A JP S60121063 A JPS60121063 A JP S60121063A JP 22789383 A JP22789383 A JP 22789383A JP 22789383 A JP22789383 A JP 22789383A JP S60121063 A JPS60121063 A JP S60121063A
- Authority
- JP
- Japan
- Prior art keywords
- filler metal
- brazing filler
- lead pin
- brazing
- spherical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、球状ろう材付リードビンの製造方法に関する
。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a lead bin with a spherical brazing filler metal.
リードピンを例えばセラミック基板等のろう接する際、
予め先端にろう材を取付けたリードピンを使うと作業性
が良く、均一でしかも高品質のろう接が可能である。When soldering lead pins to ceramic substrates, etc.,
Using a lead pin with a solder metal attached to the tip in advance allows for better workability and enables uniform and high-quality soldering.
従来、ＩにＬンにろう材を取付ける方法としては、ろ′
材とリードピンを接触してろう月の液相線温度玉りも高
い温度にて溶融接合する方法が作業性の面から採られて
いた。Conventionally, the method of attaching brazing filler metal to I and L is by using a filter.
From the viewpoint of workability, a method was adopted in which the material and the lead pin were brought into contact and melted and joined at a temperature well above the liquidus temperature.
しかし、溶融接合されたろう材は、形状がばらつき易く
、精密部品として位置決めする場合には、取付は治具と
リードピンとのクリアランスを必要以上にとらなければ
ならない為、ろう付は上りの位置精度が出にくいという
欠点があった。However, the shape of melted brazing filler metal tends to vary, and when positioning it as a precision component, it is necessary to provide more clearance than necessary between the mounting jig and the lead pin, so brazing has poor positioning accuracy. The drawback was that it was difficult to get out.
また、リードピンの先端にろう材を球状に取付けること
ができず、第１図ａ及びｂに夫々示す如くリードピン１
の外周面にろう材２が広がる為、リードピン１の先端の
ろう材２が少なくなり、その量にばらつきが生じる。そ
の結果、セラミック基板等にろう付けした際、安定した
ろう付は強度が得られないという欠点があった。In addition, it is not possible to attach the brazing material to the tip of the lead pin in a spherical shape, and as shown in Figure 1 a and b, respectively, the lead pin 1
Since the brazing material 2 spreads over the outer peripheral surface of the lead pin 1, the amount of the brazing material 2 at the tip of the lead pin 1 decreases, causing variations in the amount. As a result, when brazing to a ceramic substrate or the like, stable brazing has the disadvantage that strength cannot be obtained.
さらにリードピンの外周面にろうの被膜が形成されるが
、大きく広がり過ぎた場合、後めっきの表面を悪くし、
リードピンの耐食性が劣下したり、するという欠点があ
った。Furthermore, a wax film is formed on the outer peripheral surface of the lead pin, but if it spreads too much, it will deteriorate the surface of the post-plating.
This had the disadvantage that the lead pin's corrosion resistance deteriorated.
本発明は、斯かる欠点を解消すべくなされたもので、溶
融接合法の利点を生かし、しかも取付けられるろう材の
形状、大きさを均一、安定させることのできる球状ろう
材付リードビンの製造方法を提供せんとするものである
。The present invention has been made to eliminate these drawbacks, and provides a method for manufacturing lead bins with spherical brazing filler metal that takes advantage of the advantages of the fusion bonding method and also allows the shape and size of the attached brazing filler metal to be uniform and stable. We aim to provide the following.
本発明の球状ろう材付リードピンの製造方法は、Ａｇ、
Ａｕ、Ｃｕ、Ｐｄ、Ｎｉ等を主成分とするろう利を球状
となし、その球をろう材の固相線温度より高く液相線温
度より低い温度にてリードピンに接合することを特徴と
するものである。The method for manufacturing a lead pin with spherical brazing material of the present invention includes Ag,
It is characterized by forming a spherical filler metal whose main components are Au, Cu, Pd, Ni, etc., and joining the sphere to the lead pin at a temperature higher than the solidus temperature of the filler metal and lower than the liquidus temperature. It is something.
このように本発明の製造方法では、球状のろう材を同相
線温度より高く液相線温度より低い温度にて加熱してリ
ードピンに接合するのであるから、球状のろう材ば固相
と液相（共晶）の共存状態となって、その形状を変える
ことなくリードピンに接合されることになる。As described above, in the manufacturing method of the present invention, the spherical brazing material is heated at a temperature higher than the in-phase line temperature and lower than the liquidus line temperature and bonded to the lead pin. (eutectic) coexistence state, and it is bonded to the lead pin without changing its shape.
以下本発明による球状ろう材付リードピンの製造方法の
具体的な一実施例を図によって説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS A specific embodiment of the method for manufacturing a lead pin with a spherical brazing material according to the present invention will be described below with reference to the drawings.
第２図ａに示す如＜Ａｇ−Ｃｕ１５重量％合金より成る
直径１．０鰭の線材を引抜加工により直径０．６鰭の細
線３になした後、長さ０．６１に順次切断して粒片４を
作り、この粒片４をカーボントレイの上に並べて非酸化
性雰囲気の炉中にて８５０℃で１５分間加熱溶融し、そ
のまま凝固させて第２図すに示す如く直径０．６４鰭の
ろう材の球５を得た。次に第２図Ｃに示す如くカーボン
治具６の孔７内に、Ｆｅ−Ｎｉ４２重量％合金より成る
直径０．５＋ｎ負、長さ５ｍｍのリードピン８を挿入し
、且つその上端に前記ろう材の球５を載せてセットし、
カーボン治具６を非酸化性雰囲気の炉中にて８３０℃で
１０分間加熱し、その後冷却した処、ろう材の球５はそ
の形状を保ったまま第２図ｄに示す如くリードピン８と
強固に接合された。As shown in Fig. 2a, a wire rod with a diameter of 1.0 fin made of 15% by weight Ag-Cu alloy was drawn into a thin wire 3 with a diameter of 0.6 fin, and then cut into lengths of 0.61 mm. Granule pieces 4 are prepared, and the particle pieces 4 are arranged on a carbon tray, heated and melted at 850°C for 15 minutes in a furnace with a non-oxidizing atmosphere, and then solidified as shown in Fig. 2, with a diameter of 0.64. Ball 5 of waxed fin material was obtained. Next, as shown in FIG. 2C, a lead pin 8 made of an Fe-Ni 42% alloy with a diameter of 0.5+n and a length of 5 mm is inserted into the hole 7 of the carbon jig 6, and the brazing material is attached to the upper end of the lead pin 8. Place the ball 5 and set it.
The carbon jig 6 was heated at 830° C. for 10 minutes in a furnace with a non-oxidizing atmosphere, and then cooled, and the brazing filler metal ball 5 was firmly attached to the lead pin 8 while maintaining its shape, as shown in FIG. 2d. joined to.
然るに前記実施例と同様にして得たＡｇ−Ｃｕ２８重量
％合金の直径０．６４ｍ１の球を、Ｆｅ−Ｎｉ４２重量
％合金より成る直径Ｑ、５ｍ１ｉ、長さ５鰭のり−ドビ
ンに前記実施例と同様に手順にて接合した処、球は溶け
てリードピンの外周面にＡ ｇ −ｃ ｕ ２８重量％
合金のろう材が広がり、球を得ることができなかった。However, a ball with a diameter of 0.64 m1 made of a 28% by weight Ag-Cu alloy obtained in the same manner as in the above example was placed in a glue-dobin with a diameter Q of 5 m1 and a length of 5 fins made of a 42% by weight Fe-Ni alloy. When joined in the same manner, the ball melted and the outer peripheral surface of the lead pin contained 28% by weight of A g -cu.
The alloy filler material spread and it was not possible to obtain a sphere.
また球をリードピンに接合する際の加熱温度を８１０°
Ｃ，８００℃、７９０℃、７８５°Ｃと変化させて、同
様の製造試験を行った処、いずれもＡｇ−Ｃｕ２８重量
％合金のろう材の形状はまちまちで、均一な球の形状を
保ったままリードピンに接合することができなかった。Also, the heating temperature when joining the ball to the lead pin is 810°.
When similar manufacturing tests were conducted at different temperatures of C, 800°C, 790°C, and 785°C, the shape of the brazing filler metal of Ag-Cu 28% by weight alloy varied, but maintained a uniform spherical shape. It was not possible to connect it to the lead pin as it was.
上記実施例において、Ａｇ’−Ｃｕ１５重量％合金のろ
う材がその球形を保ってリードピンに接合された理由は
、固相線温度（共晶線温度）が７７９℃、液相線温度が
８４５℃であり、８３０℃というろう付は温度は、Ａ’
ｇ−Ｃｕの固相とＡｇ−Ｃｕの液相（共晶）の共存状態
にある為、粘性が高くその形状が変化することがないか
らである。これに対し、Ａ ｇ −Ｃｕ ２８重量％合
金のろう材がリードピンに接合された際、そのろう材が
リードピンの外周面に広がった理由は、Ａ ｇ −Ｃｕ
２８重量％合金が７７９℃にて固相から液相へ直接変
化する為、７７９°Ｃ以上の温度では急激に粘性が低下
し、即時にろう材の形状が変化して球形を保つことがで
きなかったからである。In the above example, the reason why the Ag'-Cu 15% alloy brazing material was joined to the lead pin while maintaining its spherical shape is that the solidus temperature (eutectic line temperature) is 779°C and the liquidus temperature is 845°C. The brazing temperature of 830℃ is A'
This is because the solid phase of g-Cu and the liquid phase (eutectic) of Ag-Cu coexist, so the viscosity is high and the shape does not change. On the other hand, when the A g -Cu 28% alloy brazing material was joined to the lead pin, the reason why the brazing material spread over the outer circumferential surface of the lead pin is because the A g -Cu
Since the 28 wt% alloy changes directly from solid phase to liquid phase at 779°C, the viscosity decreases rapidly at temperatures above 779°C, and the shape of the brazing filler metal immediately changes, making it impossible to maintain its spherical shape. That's because there wasn't.
尚、実施例ではＡｇ−Ｃｕ１５重量％合金について述べ
たが、これに限るものではなく、共晶点を対称にＣｕリ
ッチ側でも同様の結果の得られるものである。またＡｇ
−Ｃｕ合金に限らす液相線温度と固相線温度に差のある
合金であれば、Ａｕ−Ａｇ−Ｃｕ、Ａｇ−Ｃｕ−Ｐｄ、
Ａｇ−Ｃｕ−Ｎ ｉ合金等いかなる合金でもよいもので
ある。In the examples, a 15% by weight Ag-Cu alloy was described, but the alloy is not limited to this, and similar results can be obtained on the Cu-rich side with respect to the eutectic point. Also Ag
-Limited to Cu alloys.Alloys with a difference in liquidus temperature and solidus temperature include Au-Ag-Cu, Ag-Cu-Pd,
Any alloy such as Ag-Cu-Ni alloy may be used.
以上の説明で判るように本発明の製造方法によれば、ろ
う材を球状で、しかも均一な大きさで安定した状態で精
度良く接合できて、セラミ・ツク基板等にろう付けした
際、安定した高いろう付は強度を得ることのできる球状
ろう材付リードピンを容易に製造できる優れた効果があ
る。As can be seen from the above explanation, according to the manufacturing method of the present invention, it is possible to join the brazing filler metal in a spherical shape, uniform size, and in a stable state with high precision, and when brazing it to a ceramic substrate, etc., it is stable. This high degree of brazing has the excellent effect of making it possible to easily manufacture lead pins with spherical brazing material that can provide strength.
第１図ａ、ｂは夫々従来のろう材付リードピンの欠陥品
を示す図、第２図ａ乃至ｄは本発明の球状ろう材付リー
ドピンの製造方法の工程を示す図である。
３−−−−一細線、４−−−−一粒片、５−−−−−−
ろう材の球、６−−−−−−カーボン冶具、７−−−−
−・孔、８−−−−−−リードピン。
出願人 田中貴金属工業株式会社
第１図
（Ｑ）
第２図
忙）
（ｂ）
（ｂ）
了５
（ｄ）
ＱＱ−FIGS. 1a and 1b are diagrams showing defective conventional lead pins with brazing material, respectively, and FIGS. 2a to 2d are diagrams showing the steps of the method of manufacturing a spherical lead pin with brazing material of the present invention. 3---One thin wire, 4---One grain piece, 5------
Brazing metal ball, 6------ Carbon jig, 7---
-・Hole, 8---Lead pin. Applicant: Tanaka Kikinzoku Kogyo Co., Ltd. (Figure 1 (Q) Figure 2) (b) (b) Ryo5 (d) QQ-
Claims (1)
を球状となし、その球をろう材の固相線温度より高く液
相線温度より低い温度にてリードピンに接合することを
特徴とする球状ろう材付リードビンの製造方法。It is characterized by forming a spherical brazing filler metal whose main components are Ag, Au, Cu, Pd, Ni, etc., and joining the sphere to a lead pin at a temperature higher than the solidus temperature of the filler metal and lower than its liquidus temperature. A method for manufacturing a lead bottle with a spherical brazing filler metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22789383A JPS60121063A (en) | 1983-12-02 | 1983-12-02 | Production of lead pin with spherical brazing filler metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22789383A JPS60121063A (en) | 1983-12-02 | 1983-12-02 | Production of lead pin with spherical brazing filler metal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60121063A true JPS60121063A (en) | 1985-06-28 |
| JPH03151B2 JPH03151B2 (en) | 1991-01-07 |
Family
ID=16867965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22789383A Granted JPS60121063A (en) | 1983-12-02 | 1983-12-02 | Production of lead pin with spherical brazing filler metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60121063A (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63136552A (en) * | 1986-11-27 | 1988-06-08 | Kyocera Corp | Lead pin and manufacture thereof |
| JPS63157455A (en) * | 1986-12-22 | 1988-06-30 | Tokuriki Honten Co Ltd | Lead pin |
| JPS63157454A (en) * | 1986-12-22 | 1988-06-30 | Tokuriki Honten Co Ltd | Lead pin |
| JPS63157457A (en) * | 1986-12-22 | 1988-06-30 | Tokuriki Honten Co Ltd | Lead pin |
| JPS63157459A (en) * | 1986-12-22 | 1988-06-30 | Tokuriki Honten Co Ltd | Manufacture of lead pin |
| JPS63157456A (en) * | 1986-12-22 | 1988-06-30 | Tokuriki Honten Co Ltd | Lead pin and manufacture thereof |
| JPS63157458A (en) * | 1986-12-22 | 1988-06-30 | Tokuriki Honten Co Ltd | Lead pin |
| EP0457920A1 (en) * | 1989-12-07 | 1991-11-27 | Nippon Steel Corporation | Method of manufacturing minute metallic balls uniform in size |
| US5761779A (en) * | 1989-12-07 | 1998-06-09 | Nippon Steel Corporation | Method of producing fine metal spheres of uniform size |
| CN107813090A (en) * | 2016-09-13 | 2018-03-20 | 富鼎电子科技(嘉善)有限公司 | A kind of probe preparation method and the welding fixture for preparing the probe |
| CN110181136A (en) * | 2019-06-28 | 2019-08-30 | 吴忠仪表有限责任公司 | Tab (s) formula labyrinth valve cage mounted structure method for welding |
| CN110315086A (en) * | 2019-06-21 | 2019-10-11 | 广州番禺职业技术学院 | A kind of manufacture craft of silver bead |
-
1983
- 1983-12-02 JP JP22789383A patent/JPS60121063A/en active Granted
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63136552A (en) * | 1986-11-27 | 1988-06-08 | Kyocera Corp | Lead pin and manufacture thereof |
| JPS63157458A (en) * | 1986-12-22 | 1988-06-30 | Tokuriki Honten Co Ltd | Lead pin |
| JPS63157454A (en) * | 1986-12-22 | 1988-06-30 | Tokuriki Honten Co Ltd | Lead pin |
| JPS63157457A (en) * | 1986-12-22 | 1988-06-30 | Tokuriki Honten Co Ltd | Lead pin |
| JPS63157459A (en) * | 1986-12-22 | 1988-06-30 | Tokuriki Honten Co Ltd | Manufacture of lead pin |
| JPS63157456A (en) * | 1986-12-22 | 1988-06-30 | Tokuriki Honten Co Ltd | Lead pin and manufacture thereof |
| JPS63157455A (en) * | 1986-12-22 | 1988-06-30 | Tokuriki Honten Co Ltd | Lead pin |
| EP0457920A1 (en) * | 1989-12-07 | 1991-11-27 | Nippon Steel Corporation | Method of manufacturing minute metallic balls uniform in size |
| US5761779A (en) * | 1989-12-07 | 1998-06-09 | Nippon Steel Corporation | Method of producing fine metal spheres of uniform size |
| CN107813090A (en) * | 2016-09-13 | 2018-03-20 | 富鼎电子科技(嘉善)有限公司 | A kind of probe preparation method and the welding fixture for preparing the probe |
| CN107813090B (en) * | 2016-09-13 | 2021-08-31 | 富鼎电子科技(嘉善)有限公司 | Probe preparation method and welding jig for preparing probe |
| CN110315086A (en) * | 2019-06-21 | 2019-10-11 | 广州番禺职业技术学院 | A kind of manufacture craft of silver bead |
| CN110181136A (en) * | 2019-06-28 | 2019-08-30 | 吴忠仪表有限责任公司 | Tab (s) formula labyrinth valve cage mounted structure method for welding |
| CN110181136B (en) * | 2019-06-28 | 2021-08-10 | 吴忠仪表有限责任公司 | Brazing method for butterfly piece type labyrinth valve cage installation structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03151B2 (en) | 1991-01-07 |
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